Claims
- 1. An electrolytic processing method for electrolytically processing the surface of a metallic member without requiring the use of any electrolytic solution tank, comprising the steps of:
- preparing an electrically conductive paste containing an electrolyte and having a viscosity in the range of 1,000-100,000 cp;
- placing said paste having said viscosity between said metallic member and an opposing electrode; said paste being a spreadable non-liquid material wherein said viscosity is sufficient to maintain it supported between the electrode and said metallic member without any other support; said paste extending continuously conductively between said metallic member and said opposite electrode; and
- causing an effective amount of an electrical current to flow between said metallic member and said opposing electrode through said paste to perform the electrolytic process.
- 2. The electrolytic processing method according to claim 1, comprising the further step of relatively moving the metallic member and the opposing electrode.
- 3. The electrolytic processing method according to claim 1, including the further step of causing said paste to flow during flowing of said electrical current.
- 4. The electrolytic processing method according to claim 1, including the combined steps of effecting relative movement between said metallic member and said opposing electrode, and causing said paste to flow during flowing of said electrical current.
- 5. An electrolytic processing method according to claim 1, 2, 3 or 4, wherein said opposing electrode is covered by a cover made of an electrically insulating material and having chemical resistance enough to enable said cover to hold said paste by impregnation.
- 6. An electrolytic processing method according to claim 1, wherein the electrolytic processing is conducted to effect one of electrolytic descaling, passivity treatment and electro-plating.
- 7. The electrolytic processing method according to claim 1, wherein the processing method is a passivity treatment, and wherein the electrical current is provided for an electrolytic processing time of at least about ten minutes providing electricity in an amount of at least about 1 Coulomb/cm.sup.2.
- 8. The electrolytic processing method according to claim 1, wherein the processing method is a plating method, and wherein said electrical current is caused to flow at a current density of about 15-250 mA/cm.sup.2.
- 9. The method defined in claim 1 wherein said electrically conductive paste has greater resistance than an electrolytic solution to the mobility of the electrostatic charges of the electrolyte.
- 10. The method defined in claim 1 including the step of controlling the viscosity of said electrically conductive paste to allow relief of gases generated in said electrolytic processing.
- 11. An electrolytic processing method for electrolytically passivating the surface of a metallic member, comprising the steps of:
- preparing a paste having a viscosity ranging from 1,000 to 100,000 cp containing 3 wt. % of at least one or more kinds of ions selected from the group consisting of SO.sub.4.sup.2-, NO.sub.3.sup.- and PO.sub.4.sup.3- ;
- placing said paste between said metallic member and an opposing electrode; and
- supplying electricity through said paste at a rate of at least about 1.0 Coulomb/cm.sup.2 using said metallic member and said opposing electrode as an anode and a cathode, respectively, thereby effecting a passivity treatment on said surface of said metallic member.
- 12. An electrolytic processing method for electrolytically processing the surface of a metallic member, comprising the steps of:
- preparing a plating paste and having a viscosity ranging from 1,000 to 100,000 and containing an electrolyte;
- placing said paste between said metallic member and said opposing electrode; and
- causing an electrical current to flow between said metallic member and said opposing electrode through said paste, by connecting said metallic member and said opposing electrode to the anode and cathode of a power supply.
Parent Case Info
This application is a continuation of application Ser. No. 07/403,266, filed Sep. 6, 1989, now abandoned.
US Referenced Citations (10)
Continuations (1)
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Number |
Date |
Country |
Parent |
403766 |
Sep 1989 |
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