The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings:
The present invention pertains to an improved electromagnetic shielding (EMS) tape or electromagnetic interference (EMI) shielding tape (hereinafter collectively referred to as EMS tape) with excellent adhesion, heat resistance, and flexibility.
The EMS tape according to this invention is appropriate for use in printed circuit boards, cellular phones, computers and computer peripherals, ground stations, PDAs, disk drives, medical equipments, modems and automotive electronics, etc. The present invention EMS or EMI shielding tape is also ideal for applications such as cable and cable assembly shielding for satellites, electric vehicles, and robotics.
Other industrial and domestic uses of the subject matter of the invention will also be evident to those skilled in the art. For example, the present invention EMS tape may be used to facilitate heat conduction and for various anti-static electricity applications.
The thermosetting resin coating 14 contains a resin, which polymerizes to a permanently solid and infusible state and forms a permanent bonding interface upon the application of heat. According to the first preferred embodiment, the thermosetting resin coating 14 is preferably formed of thermosetting epoxy resin composition such as modified carboxylated NBR (modified XNBR; wherein NBR is the abbr. of acrylonitrile butadiene rubber), dimer acid-modified thermosetting epoxy resins or heat-resistive acrylic resins, and more preferably, dimer acid modified thermosetting epoxy resins.
Exemplary dimer acid modified thermosetting epoxy resins include but not limited to NPER-172 (Dimer Acid modified DGEBA) available from Nanya Plastics Corp. (NPER-172 is a product name of Nanya Plastics Corp.), HyPox DA323 (Dimer Acid Adducted to an Epoxidized Bisphenol A Resin; CAS No. 67989-52-0) available from CVC Specialty Chemicals Inc., and ERYSYS GS-120 (Dimer Acid Glycidyl Ester; CAS No. 68475-94-5) available from CVC Specialty Chemicals Inc.
In order to adjust the reactivity and/or physical properties, the aforesaid resins may be employed singly or combined with other types of additive resins. For example, the aforesaid other types of additive resins may be selected from the group consisting of Bisphenol-A epoxy resins, Brominated Bisphenol-A epoxy resins, Bisphenol-F epoxy resins, long-chain Bisphenol-A epoxy resins, long-chain Bisphenol-F epoxy resins, CTBN modified epoxy resins, carboxylated acrylonitrile-butadiene rubber, and carboxylated acrylic rubber.
To obtain adequate softness, the content of the dimer acid modified thermosetting epoxy resin preferably ranges between 40-100 phr (pars per hundred parts) of total weight of the resin mixture, while the aforesaid additive resin preferably ranges between 60-0 phr of total weight of the resin mixture.
The aforesaid resins may be mixed with proper amount of hardening agent and catalysts. For example, the hardening agent may include dicyandiamide, imidazoles or diamino-diphenyl sulfone (DDS), preferably, dicyandiamide and imidazoles. Assuming that the total weight of the prepared starting resin mixture is 100 phr, the content of dicyandiamide or imidazoles preferably ranges between 0-10 phr. According to this invention, the aforesaid catalyst may be amines, imidazoles, or BF3-MEA ranging between 0.1-10.0 phr.
Furthermore, depending on the requirements and purposes of use, other additives such as rheological agents, thixotropic reagent, fumed silica, defoamers, leveling agents, organic solvents, pigments, fire retardants and inorganic fillers may be added.
The aforesaid modified carboxylated NBR mixed with proper amount of epoxy resin may be employed to form a flexible thermosetting resin system, which is suited for applications as a bonding agent between a flexible PCB and its protection film or coverlay. The aforesaid flexible thermosetting resin system is typically based on a general type epoxy resin such as Bisphenol-A epoxy resins, Brominated Bisphenol-A epoxy resins, Bisphenol-F epoxy resins, long-chain Bisphenol-A epoxy resins, long-chain Bisphenol-F epoxy resins. Nevertheless, in order to increase the softness of the thermosetting resin coating 14, a larger amount of the aforesaid modified carboxylated NBR is added. Assuming that the total weight of the prepared starting epoxy resin is 100 phr, the content of aforesaid modified carboxylated NBR preferably ranges between 30-100 phr.
The thermosetting resin coating 14 may be thermally processed to reach A-stage, B-stage or C-stage. According to the first preferred embodiment, the thermosetting resin coating 14 is in A-stage. At room temperature, the A-stage thermosetting resin coating 14 acts substantially as ordinary pressure-sensitive adhesives and is capable of adhering the conductive backing film 12 to a surface of an object such as a PCB or a cellular phone. As the temperature rises, crosslinking reaction occurs in the A-stage thermosetting resin coating 14 and gradually transforms itself to B-stage (partially cured) and then C-stage (fully cured), thereby forming a heat resistant permanent bonding interface between the conductive backing film 12 and the attached object. The major difference between the conventional pressure-sensitive adhesives and the A-stage thermosetting resin coating 14 is that the conventional pressure-sensitive adhesives soften and eventually peel off from the attached object when the temperature rises.
To reach the A-stage, the thermosetting resin coating 14 containing the above-described resin composition is baked to an extent that the solvent is substantially completely removed, thereby forming a dry and tacky film. At this phase, no crosslinking reaction occurs in the baked thermosetting resin coating 14, that is, the crosslinking density at his phase is substantially zero. For example, the thermosetting resin coating 14 is baked at a relatively lower temperature such as 90° C. for a time period of about 5 minutes to reach the A-stage.
The A-stage thermosetting resin coating 14 may be further thermally processed to induce crosslinking reaction therein and convert itself into the B-stage. It is advantageous to use the B-stage thermosetting resin coating in some particular circumstances because the B-stage thermosetting resin coating is tack-free at room temperature (˜25° C.) while its tack increases as the B-stage thermosetting resin coating is further thermally treated at high temperatures. For example, the B-stage thermosetting resin coating may be used in the attachment or lamination of the coverlay to the flexible PCB or in the attachment of the prepreg to the hard board PCB. In both examples, the coverlay or prepreg can move freely over the flexible PCB or hard board PCB at room temperatures, and after the coverlay or prepreg aligns with the flexible PCB or hard board PCB, a thermal pressing process is then carried out to cure the B-stage thermosetting resin coating 14 in place, thereby completing the attachment.
To reach the B-stage, the A-stage thermosetting resin coating 14 may be cured at a relatively higher temperature of about 150° C. for a time period of about 3-5 minutes. It is understood that the aforesaid processing conditions are merely for illustration purposes. In practical use, the baking conditions may be adjusted according to the content of hardening agent or catalyst in the recipe of the starting resin system.
The B-stage thermosetting resin coating may be further cured and converted to the C-stage. The C-stage thermosetting resin coating is fully cured and hardened resin, which has superior heat resistance, chemical resistance, and good adhesion. The C-stage thermosetting resin coating shows good flexibility and can function as a good protection film of metal foils. To reach the C-stage, the B-stage thermosetting resin coating may be cured at a relatively higher temperature of about 150° C. for a time period of about 10 minutes. It is understood that the aforesaid processing conditions are merely for illustration purposes. In practical use, the baking conditions may be adjusted according to the content of hardening agent or catalyst in the recipe of the starting resin system.
The definition of the A-, B-, and C-stage thermosetting resin may be summarized as follows:
A-Stage: Uncured resin. Solvent is removed from the starting resin mixture but the resin is not cured. The crosslinking density at his phase is substantially zero. The A-stage thermosetting resin coating 14 is dry but shows tack. Acting as pressure-sensitive adhesives at room temperature.
B-Stage: Partially cured resin. The A-stage resin is partially cured and baked to induce crosslinking reaction and then cooled down before it is fully cured. The B-stage resin is tack-free at room temperature but is becomes tacky when the temperature rises.
C-Stage: Fully cured resin. The B-stage resin is converted to C-stage when heated and cannot be remolded. The C-stage resin is flexible and has good heat resistance and chemical resistance. The C-stage resin may be used as a protection film or an insulating film adhered to an aluminum foil. The C-stage resin may be used as a permanent bonding interface between an aluminum foil and an attached object.
The present invention EMS tapes utilizing flexible thermosetting epoxy resins are promising materials for shielding electromagnetic radiation and reducing or elimination of electromagnetic interference (EMI) because of their relatively high flexibility, heat resistance and ease of control of physical/chemical properties through chemical processing. The crosslinking density of the thermosetting resin may be adjusted by controlling the baking temperature and baking time. The crosslinking density affects the tack of the resin.
The thermosetting resin coating 14 at different stages may be coated on one side or two sides of the conductive backing film 12, thus generating a variety of composite film products and combinations, which are suited for EMI shielding, thermal conduction, or anti-static electricity applications, and meet different requirements of different situations.
By way of example, the EMS tape 40 can be manufactured by coating a layer of starting thermosetting resin system on one side of the conductive backing film 12, backing and fully curing the layer of starting thermosetting resin system to C-stage, thereby forming an insulating protection film. After this, another layer of starting thermosetting resin system is coated on the other side of the conductive backing film 12 and is baked to remove solvent (uncured) to form the tacky A-stage thermosetting resin coating 14. The EMS tape 40 has good solder resistance and good insulation property. The EMS tape 40 can be used to replace silver glue in the manufacturing process of flexible PCB. The advantages at least include ease of use and low cost.
The thermosetting resin coatings 14, 24 and 34 at different stages may be coated on one side or two sides of the conductive backing film 12, thus generating a variety of composite film products and combinations, which are suited for EMI shielding, thermal conduction, or anti-static electricity applications, and meet different requirements of different situations.
In order to adjust the reactivity and/or physical properties, the dimer acid modified thermosetting epoxy resin may be employed singly or combined with other types of additive resins. For example, the additive resins may be selected from the group consisting of Bisphenol-A epoxy resins, Brominated Bisphenol-A epoxy resins, Bisphenol-F epoxy resins, long-chain Bisphenol-A epoxy resins, long-chain Bisphenol-F epoxy resins, CTBN modified epoxy resins, carboxylated acrylonitrile-butadiene rubber, and carboxylated acrylic rubber.
To obtain adequate softness, the content of the dimer acid modified thermosetting epoxy resin ranges between 40-100 phr of total weight of the resin mixture, while the additive resin ranges between 60-0 phr of total weight of the resin mixture.
The starting resin mixture system is mixed with proper amount of hardening agent and catalysts. The hardening agent includes dicyandiamide or imidazoles, preferably, combination of dicyandiamide and imidazoles. Assuming that the total weight of the prepared starting resin mixture is 100 phr, the content of dicyandiamide preferably ranges between 0-15.0 phr and the content of imidazole preferably ranges between 0.1-10.0 phr. According to this invention, the aforesaid catalyst may be amines, imidazoles, or BF3-MEA ranging between 0.1-10.0 phr. Other types of hardening agents such as Diamino diphenyl sulfone (DDS) and BF3-MEA may be employed, wherein the content of DDS preferably ranges between 3-30 phr and the content of BF3-MEA preferably ranges between 0-5.0 phr.
Other additives such as rheological agents, thixotropic reagent, fumed silica, defoamers, leveling agents, organic solvents, pigments, fire retardants and inorganic fillers may be added.
The modified carboxylated NBR mixed with proper amount of epoxy resin is employed to form a flexible thermosetting resin system, which is suited for applications as a bonding agent between a flexible PCB and its protection film or coverlay. The flexible thermosetting resin system is typically based on a general type epoxy resin such as Bisphenol-A epoxy resins, Brominated Bisphenol-A epoxy resins, Bisphenol-F epoxy resins, long-chain Bisphenol-A epoxy resins, long-chain Bisphenol-F epoxy resins. In order to increase the softness of the thermosetting resin coating, a larger amount of modified carboxylated NBR is added. Assuming that the total weight of the prepared starting epoxy resin is 100 phr, the content of modified carboxylated NBR preferably ranges between 30-100 phr.
The hardening agent includes dicyandiamide or imidazoles, preferably, combination of dicyandiamide and imidazoles. Assuming that the total weight of the prepared starting resin mixture is 100 phr, the content of dicyandiamide preferably ranges between 0-15.0 phr and the content of imidazole preferably ranges between 0.1-10.0 phr. According to this invention, the aforesaid catalyst may be amines, imidazoles, or BF3-MEA ranging between 0.1-10.0 phr. Other types of hardening agents such as Diamino diphenyl sulfone (DDS) and BF3-MEA may be employed, wherein the content of DDS preferably ranges between 3-30 phr and the content of BF3-MEA preferably ranges between 0-5.0 phr.
Likewise, other additives such as rheological agents, thixotropic reagent, fumed silica, defoamers, leveling agents, organic solvents, pigments, fire retardants and inorganic fillers may be added.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.