1. Field of the Invention
The present invention relates to an electromechanical transducer.
2. Description of the Related Art
In recent years, electromechanical transducers produced by a micromachining process have been researched actively. In particular, capacitive electromechanical transducers called capacitive micromachined ultrasonic transducers (CMUT) have attracted attention, because they can transmit and receive ultrasonic waves with a lightweight membrane and can obtain wider band characteristics than piezoelectric electromechanical transducers of the related art.
A CMUT includes a plurality of elements arranged in an array in a one-dimensional or two-dimensional direction. Elements serve to transmit and receive ultrasonic waves.
U.S. Pat. No. 6,958,255 discloses an example of a CMUT having such an element structure. In this CMUT, a substrate penetrating line 304 is provided in a support substrate 303, as shown in
Unfortunately, the displacement amount of the membrane varies among the cells of the element. It can be conceived that this variation among the cells is caused by warping of the substrate due to the difference in coefficient of thermal expansion between the membrane and the insulating layer and internal stresses of the membrane and the insulating layer. The variation is undesirable because it appears as differences in transmission efficiency and detection sensitivity for the ultrasonic wave.
The transmission efficiency and detection sensitivity of the CMUT increase as the gap between the upper and lower electrodes decreases. Since electrostatic attractive force between the upper and lower electrodes is increased by increasing the bias voltage, the transmission efficiency and detection sensitivity of the CMUT can be enhanced by increasing the bias voltage. However, when the bias voltage excessively increases, the upper electrode is attracted to the lower electrode together with the membrane the instant that the bias voltage reaches a certain voltage, so that it is difficult to obtain a desired vibration characteristic. This phenomenon is referred to as a pull-in, and a voltage at which a pull-in occurs is referred to as a pull-in voltage. A pull-in voltage is determined by the initial displacement amount of the membrane. Thus, since the upper limit value of the bias voltage applied between the upper and lower electrodes is limited by variation in initial displacement amount of the membrane among the cells, the receiving sensitivity of the CMUT is limited.
The present invention provides an electromechanical transducer that reduces variation in displacement amount of a membrane among cells.
An electromechanical transducer according to an aspect of the present invention includes an element. The element includes a plurality of cells each including a first electrode and a second electrode provided with a cavity being disposed therebetween. A groove is provided at a predetermined distance from the cavity of the cell on the outermost periphery of the element.
The presence of the groove on the outer side of the cell on the outermost periphery of the element can provide an electromechanical transducer that reduces variation in displacement amount of a membrane among cells.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
FIGS. 6B1 and 6B2 are schematic views illustrating another method for producing a CMUT to which the present invention can be applied.
An electromechanical transducer according to the present invention includes an element having a plurality of cells. A groove is provided at a position at a predetermined distance from a cavity of a cell on the outermost periphery of the element. In each of the cells, a lower electrode serving as a first electrode and an upper electrode serving as a second electrode are provided with a cavity being disposed therebetween. Further, a thin film (hereinafter referred to as a membrane) serving as a vibrating film to be deformed by the potential difference between the upper and lower electrodes is provided on the cavity.
In the present invention, the term “a position at a predetermined distance” refers to a position that satisfies the following two conditions. The first condition is that the position is provided on an outer side of a cell on the outermost periphery of the element. The second condition is that, when a groove is formed at the position, a difference in initial displacement amount of the membrane between the outermost cell and a center cell in the element is smaller than when the groove is not formed. Although details will be described below, the distance from the cavity of the cell on the outermost periphery is preferably within a range of 50 to 200% of the inter-cavity distance. Further, the term “groove” refers to a structure that meets any of the following four definitions (1) to (4): (1) a recess formed in the membrane from an upper surface of the membrane (a surface opposite the cavity); (2) a recess formed in the membrane and an insulating layer serving as a support portion supporting the membrane; (3) a recess defined by the absence of the membrane around the cell on the outermost periphery of the element; and (4) a recess defined in an upper surface of the support portion (a surface opposite the bottom of the cavity) by the absence of the membrane on the outer periphery of the element. That is, in the electromechanical transducer of the present invention, a portion of the membrane provided at the position at a predetermined distance from the cavity of the cell on the outermost periphery of the element is thinner than a portion of the membrane provided on the cavity, or is removed.
In the present invention, the term “membrane” refers not only to a vibrating portion provided on the cavity, but also to a portion provided between the cavities and a portion provided on the outer side of the cell on the outermost periphery, because they are formed as one thin film.
In the present invention, the upper electrode can be formed by a film made of a choice from metal, a low-resistance amorphous silicon, and a low-resistance oxide semiconductor. The membrane may also function as the upper electrode. Further, when the upper electrode is provided at the membrane, it may be located on any of the upper and lower sides of the membrane, or may be provided between membranes.
The lower electrode can be formed of any material that has a low electrical resistance, for example, a doped single-crystal silicon substrate, a doped polycrystal silicon film, a single-crystal silicon substrate having a doped region serving as a lower electrode, a doped amorphous silicon, an oxide semiconductor, or a metal film. The substrate can also function as the lower electrode.
It is conceivable that variation in displacement amount of the membrane among the cells is reduced by the configuration of the electromechanical transducer of the present invention for the following reason: In a peripheral edge portion of the cell on the outermost periphery of the element, the structures of the membrane and the insulating layer (e.g., the joint area between the membrane and the insulating layer) are identical or close to those of the other cells. Thus, the distribution of internal stress of the membrane in the cell on the outermost periphery is identical or close to that of the other cells. Hence, it is conceivable that the effect of reducing variation in displacement amount of the membrane among the cells can be obtained by forming a groove in a portion of the membrane on the outer periphery of the element.
In the following first to fourth embodiments, a groove is provided around each cell (grooves are provided between cavities). However, in the present invention, the difference in initial displacement amount can be reduced as long as a groove is provided on an element basis (the groove is provided at a position at a predetermined distance from the cavities of the cells on the outermost periphery of the element), instead of being provided on a cell basis.
A first embodiment of the present invention will be described below.
To verify the advantages of the present invention, the initial displacement amount of the membrane was calculated using a finite element method. The initial displacement amount of the membrane is the amount of displacement caused by a resultant force of the internal stress in the membrane and the pressure applied by the difference in atmospheric pressure between the interior and exterior of the cavity (about one atmospheric pressure=101325 Pa). As the internal stress to be applied, a thermal contraction stress generated by the temperature difference caused between the times before and after formation of the membrane was assumed. A model of an element in which eleven cells were arranged along each side was prepared, and the amounts of initial displacement of the membrane caused in the cells when the internal stress due to thermal contraction was applied to the membrane and the insulating layer were calculated. Analysis using the finite element method was performed by commercially available software (ANSYS 11.0 from ANSYS, Inc.).
Next, it was examined how the variation in initial displacement amount of the membrane was changed by the difference in shape of a groove formed on the outer side of the cell on the outermost periphery of the element.
In addition, the difference in initial displacement corresponding to the distance between the groove and the cell on the outermost periphery (“cavity-groove distance” in
In the present invention, as shown in
Referring to
In a third embodiment, grooves 109 are intermittently provided in portions of lines surrounding cavities 105 on peripheral edge portions of cells 102, as in the second embodiment shown in
In a fourth embodiment, the present invention is applied to a CMUT in which cells 102 have a shape different from the square shape. When the cells 102 are circular, as shown in
With reference to
(a) Silicon oxide layers 202 and 203 are respectively formed on opposite surfaces of a SOI (Silicon On Insulator) substrate 201.
(b) Through holes 204 are formed in portions of the silicon oxide layer 202 where cavities of cells are to be formed, thereby forming a device substrate 205.
(c) A silicon oxide layer 210 is formed on an upper surface of a through line substrate 209 including a lower electrode 206, a through line 207, and a pad 208.
(d) The portion of the silicon oxide layer 202 remaining on the device substrate 205 is joined to the silicon oxide layer 210 on the upper surface of the through line substrate 209.
(e) The layers other than the silicon oxide layer 202 of the device substrate 205 and a membrane 211 of the SOI substrate 201 are removed so that the silicon oxide layer 202 and the device layer 211 remain on the through line substrate 209, and upper electrodes 212 are formed on an upper surface of the membrane 211.
(f) Portions of the membrane 211 on the outer peripheries of the cells are at least partly etched to form grooves 215. In this case, the depth of the grooves 215 is smaller than the thickness of the membrane 211. To form grooves 215 having a desired depth, for example, the etching time can be adjusted in accordance with the etching rate of the membrane 211 checked beforehand.
(g) The pad 208 on a lower surface of the through line substrate 209 is joined to a pad 214 on an upper surface of a circuit board 213.
In the above-described step (f), the grooves 215 can be formed so as to have a depth equal to the thickness of the membrane 211, as shown in FIG. 6B1. When the membrane 211 is formed of single-crystal silicon and the silicon oxide layer 202 is formed of silicon oxide, an etching material, such as carbon tetrafluoride, which is insensitive to silicon oxide and sensitive to single-crystal silicon is used. This allows grooves penetrating the membrane 211 to be formed easily. By further etching the silicon oxide layer 202 subsequently to the step shown in FIG. 6B1, deeper grooves 215 can be formed as shown in FIG. 6B2. When the membrane 211 and the silicon oxide layer 202 are formed by the same materials as above, an etching material, such as silicon hexafluoride, which is insensitive to single-crystal silicon and sensitive to silicon oxide is used. This allows grooves 215 to be formed by etching portions of the silicon oxide layer 202 under the grooves 215 in the membrane 211, with the membrane 211 used as a mask.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2009-096145 filed Apr. 10, 2009, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | Kind |
---|---|---|---|
2009-096145 | Apr 2009 | JP | national |