This work will investigate several polyimide precursors to choose one which will be directly imagable by electron beams and which will be a dielectric with properties suitable for use in the semiconductor industry. Phase I research demonstrated that a polyimide precursor can be made a negative or a positive resist, and the sensitivity can be enhanced, by the addition of a small percentage of a polymeric additive. One positive- and two negative-acting polyimide resists will be studied during Phase II to provide an explanation for this effect. This information will be used to improve the properties of one material. Integrated circuit process tests which include thickness and uniformity of coatings, adhesion tests, and thermal stability will be performed. Lithographic properties (electron beam sensitivity and resolution) and dielectric properties (resistivity, dielectric strength, dielectric constant, and dissipation factor) will be tested.