Electron emission device and method of manufacturing the same

Information

  • Patent Application
  • 20070252507
  • Publication Number
    20070252507
  • Date Filed
    April 24, 2007
    17 years ago
  • Date Published
    November 01, 2007
    17 years ago
Abstract
An electron emission device includes a substrate, a first electrode on the substrate, a second electrode electrically insulated from the first electrode, a first insulating layer between the first electrode and the second electrode, an electron emission source hole in the first insulating layer and the second electrode to expose the first electrode, and an electron emission source having a first electron emission material layer on the first electrode in the electron emission source hole and a second electron emission material layer on the first electron emission material layer.
Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:



FIG. 1 illustrates a partial exploded perspective view of a double field emission device (FED) type of electron emission device;



FIG. 2 illustrates a cross-sectional view taken along line II-II of FIG. 1;



FIG. 3 illustrates an enlarged view of portion III of FIG. 2;



FIG. 4 illustrates a cross-sectional view of an electron emission device according to an embodiment of the present invention;



FIGS. 5 through 7 illustrate cross-sectional views of stages of a method of manufacturing an electron emission device according to an embodiment of the present invention; and



FIG. 8 illustrates a cross-sectional view of an electron emission device according to an embodiment of the present invention.





DETAILED DESCRIPTION OF THE INVENTION

Korean Patent Application No. 10-2006-0037677, filed on Apr. 26, 2006, in the Korean Intellectual Property Office, and entitled: “Electron Emission Device and Method of Manufacturing the Same,” is incorporated by reference herein in its entirety.


The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are illustrated. The invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.


In the drawing figures, the dimensions of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when a layer or element is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. Further, it will be understood that when a layer is referred to as being “under” another layer, it can be directly under, and one or more intervening layers may also be present. In addition, it will also be understood that when a layer is referred to as being “between” two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. Like reference numerals refer to like elements throughout.


The present invention provides an electron emission device in which a carbon material or a nano material forming an electron emission source may be uniformly distributed and formed facing upwards, through which uniform electron emission may be achieved and electron emission efficiency is increased, and a method of manufacturing the electron emission device.



FIG. 4 illustrates a cross-sectional view of an electron emission device 201 according to an embodiment of the present invention.


Referring to FIG. 4, the electron emission device 201 may include a first substrate 110, a cathode 120, a gate electrode 140, a first insulating layer 130, and an electron emission source 250.


The first substrate 110 may be a board member having a predetermined thickness, and may be, e.g., a glass substrate formed of quartz, glass containing small amounts of impurities such as Na, sheet glass, glass coated with SiO2, borosilicate glass, phosphate glass, an aluminum oxide substrate, a ceramic substrate, etc. In order to obtain a flexible display apparatus, the first substrate 110 may be formed of a flexible material.


The cathode 120 may extend in a direction on the first substrate 110, and may be formed of an electrically conductive material, e.g., a metal including at least one of Al, Ti, Cr, Ni, Au, Ag, Mo, W, Pt, Cu, Pd, Ru, etc. The cathode 120 may also be formed from an alloy or oxide of these metals, e.g., RuO2, Pd—Ag, etc., a printed conductive material including a metal oxide and glass, a transparent conductive material, e.g., ITO, In2O3, or SnO2, etc., or a semiconductor material, e.g., polysilicon.


The gate electrode 140 may be insulated from the cathode 120 by the first insulating layer 130. The gate electrode 140 may be formed of an electrically conductive material similar to the cathode 120. The first insulating layer 130 may be interposed between the gate electrode 140 and the cathode 120 to insulate the gate electrode 140 from the cathode 120, thereby preventing short circuits between the electrodes.


The electron emission source 250 may be in an electron emission source hole 131, which may be formed in the first insulating layer 130 and the gate electrode 140. The electron emission source hole 131 may expose a portion of the cathode 120, allowing the electron emission source 250 to be electrically connected to the cathode 120. The electron emission source 250 may include a first electron emission material layer 251 electrically connected to the cathode 120 and a second electron emission material 253 grown on an upper part of the first electron emission material layer 251. A catalyst layer 252 used for growing the second electron emission material 253 may optionally be on the upper part of the first electron emission material layer 251.


The first electron emission material layer 251 may be formed using, e.g., a chemical vapor deposition (CVD) direct growing method on the cathode 120, but the present invention is not limited thereto. The catalyst layer 252 may be formed of a metal or a metal salt. When the catalyst layer 252 is formed of a metal salt, the catalyst layer 252 may be formed by coating a solution on a predetermined seed layer, followed by drying. The solution may be formed from the metal salt dissolved in a predetermined solvent. The solution may be coated on the predetermined seed layer (not shown) using, e.g., a spin coating method, a dipping method, etc.


The metal salt may contain weak acid negative ion radicals so that the salt may be dissolved in a strong salt developing solution such as tetramethylammonium hydroxide (TMAH). The weak acid negative ion radicals may be at least one selected from, e.g., acetate radicals, oxalate radicals, formate radicals, propionate radicals, butyrate radicals, carbonate radicals, etc. Also, the metal salt may be formed from at least one of, e.g., Fe, Ni, Co, Y, etc. The solvent may be one of, e.g., ethylene glycol, propylene glycol, methanol, ethanol, etc. The metal salt may have a solubility of approximately 1 mM or more with respect to the solvent at room temperature. Also, the metal salt may be insoluble in, e.g., acetone, isopropyl alcohol, a photoresist strip, etc.


In the electron emission sources 250, an uppermost part of the second electron emission material 253 may be located lower than the top or bottom surfaces of the gate electrode 140. The first and second electron emission material layers 251 and 253 used for the electron emission sources 250 may be formed of, e.g., a carbon material, a nano material, etc. The carbon material may be, e.g., carbon nano tubes (CNTs) having a low work function and a high β function, graphite, diamond, diamond like carbon (DLC), etc. The carbon material may also be, e.g., nano materials including CNTs, nano wires, nano rods, etc. In particular, the CNTs have an electron emission characteristic, and thus permit driving of an electron emission display device at a low voltage. Therefore, the use of the CNTs as an electron emission source may be advantageous for manufacturing a large screen display device.


In the electron emission device 201 having the above-described structure, electrons may be emitted from the electron emission sources 250 due to an electric field formed between the cathode 120 and the gate electrode 140 when a negative voltage is applied to the cathode 120 and a positive voltage is applied to the gate electrode 140.


Also, the electron emission device 201 may be utilized in an electron emission display device that creates images by generating visible light. In order to function as a display device, the electron emission device 201 may further include a phosphor layer (not shown) on a front surface of the electron emission device 201. The phosphor layer may be formed together with an anode (not shown) that accelerates electrons towards the phosphor layer, and a front substrate (not shown) that supports the anode and the phosphor layer.


The second substrate, i.e., the front substrate, may be a board member having a predetermined thickness, and may be formed of the same materials as the first substrate 110. The anode may be formed of an electrically conductive material similar to the material forming the cathode 120 and the gate electrode 140.


The phosphor layer may be formed of a cathode luminescence (CL) type of phosphor material that may generate visible light when the phosphor layer is excited by accelerated electrons. The phosphor material that may be used for the phosphor layer includes, e.g., a red color phosphor material such as SrTiO3:Pr, Y2O3:Eu, Y2O3S:Eu, etc., a green color phosphor material such as Zn(Ga, Al)2O4:Mn, Y3(Al, Ga)5O12:Tb, Y2SiO5:Tb, ZnS:Cu,Al, etc., and a blue color phosphor material such as Y2SiO5:Ce, ZnGa2O4, ZnS:Ag, Cl, etc., but the phosphor material of the present invention is not limited thereto.


In order to display images, i.e., to not simply function as a lamp that generates visible light, the cathode 120 and the gate electrode 140 may be alternately arranged. Also, in regions where the cathode 120 and the gate electrode 140 are alternately arranged, the electron emission source hole 131 may be formed to contain the electron emission source 250 therein.


The electron emission device 201, which includes the first substrate 110 and the front panel 102 (see FIG. 1) that includes the second substrate 90, may form a vacuum space while maintaining a predetermined distance from each other. Spacers 60 may maintain a predetermined distance between the electron emission device 201 and the front panel 102. The spacers 60 may be formed of an insulating material. Also, the space that is formed between the electron emission device 201 and the front panel 102 may be sealed, e.g., by applying a frit around the space and exhausting air in the space to form a vacuum.


Operation of the electron emission display device 100 having the above structure will now be described.


A negative (−) voltage may be applied to the cathode 120 and a positive (+) voltage may be applied to the gate electrode 140 so that the electron emission source 250 formed on the cathode 120 may emit electrons. Also, a high positive (+) voltage may be applied to the anode 80 to accelerate the electrons toward the anode 80. When the high positive (+) voltage is applied to the anode 80, the electrons emitted from the electron emission source 250 may proceed toward the gate electrode 140 and accelerate towards the anode 80. The electrons accelerated towards the anode 80 may collide with the phosphor layer 70. Then, the phosphor material of the phosphor layer 70 may become excited and emit visible light. The portion of the electron emission source 250 that mainly emit electrons may be the upper parts of the second electron emission material 253.


A method of manufacturing an electron emission device 201 according to an embodiment of the present invention will now be described with reference to FIGS. 5 through 7.



FIGS. 5 through 7 illustrate cross-sectional views of stages of a method of manufacturing an electron emission device according to an embodiment of the present invention. The cathode 120, the insulating layer 130, and the gate electrode 140 may be formed on a substrate 110. The electron emission source hole 131 may be formed using a conventional method. In the method of manufacturing the electron emission device 201, the electron emission source 250 may be formed in the electron emission source hole 131 by the following method.


Referring to FIG. 5, the first electron emission material layer 251 may be formed on an upper part of the cathode 120 in the electron emission source hole 131. The first electron emission material layer 251 may be formed using, e.g., a printing method, a CVD direct growing method, etc. When the CVD direct growing method is used, the cathode 120 may be used as a catalyst layer. Alternately, an additional catalyst layer may be formed on the cathode 120.


Referring to FIG. 6, the catalyst layer 252 may be formed on the first electron emission material layer 251. The catalyst layer 252 may be formed using the materials as described above.


Referring to FIG. 7, a second electron emission material 253 formed of, e.g., a carbon material, a nano material, etc., may be formed on the catalyst layer 252 using, e.g., a CVD direct growing method.


Since an upper surface of the first electron emission material layer 251 has a corrugated surface, the catalyst layer 252 formed on the first electron emission material layer 251 may also have a corrugated rough upper surface. Accordingly, the second electron emission material 253 may have small grains, and a carbonization rate may thus be increased. Therefore, the density of the electron emission material formed on the catalyst layer 252 may be reduced, and accordingly, the causes that reduce the electron emission, e.g., a screen effect, may be avoided.



FIG. 8 illustrates a cross-sectional view of an electron emission device 301 according to an embodiment of the present invention.


Referring to FIG. 8, the electron emission device 301 may further include a second insulating layer 135 covering an upper part of the gate electrode 140. A focusing electrode 145 may be formed on an upper part of the second insulating layer 135. With the aid of the focusing electrode 145, electrons emitted by electron emission sources 250 may be focused on central portions of a phosphor layer (not shown) so as not to disperse laterally.


In the electron emission device 301 depicted in FIG. 8, an electron emission material layer may be formed as double layers, as is illustrated in FIG. 4. Therefore, the electron emission material may be uniformly distributed, thereby improving electron emission characteristics without the screen effect.


As described above, in the electron emission device according to the present invention, the electron emission characteristics of an electron emission material may be greatly improved and uniform electron emission may be achieved.


Exemplary embodiments of the present invention have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. Accordingly, it will be understood by those of ordinary skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the following claims.

Claims
  • 1. An electron emission device, comprising: a substrate;a first electrode on the substrate;a second electrode electrically insulated from the first electrode;a first insulating layer between the first electrode and the second electrode;an electron emission source hole in the first insulating layer and the second electrode to expose the first electrode; andan electron emission source having a first electron emission material layer on the first electrode and a second electron emission material layer on the first electron emission material layer.
  • 2. The electron emission device as claimed in claim 1, wherein the first electron emission material layer is electrically connected to the first electrode.
  • 3. The electron emission device as claimed in claim 1, further comprising a catalyst layer on the first electron emission material layer.
  • 4. The electron emission device as claimed in claim 3, wherein the catalyst layer comprises a metal or a metal salt.
  • 5. The electron emission device as claimed in claim 4, wherein the metal or metal salt comprises at least one of Fe, Ni, Co, or Y.
  • 6. The electron emission device as claimed in claim 1, wherein a catalyst layer is formed between the first electrode and the first electron emission material layer.
  • 7. The electron emission device as claimed in claim 6, wherein the catalyst layer comprises a metal or a metal salt.
  • 8. The electron emission device as claimed in claim 4, wherein the metal or metal salt comprises at least one of Fe, Ni, Co, or Y.
  • 9. The electron emission device as claimed in claim 1, wherein the second electron emission material layer has an electron emission material density smaller than the density of the first electron emission material layer.
  • 10. The electron emission device as claimed in claim 1, further comprising: a second insulating layer covering an upper part of the second electrode; anda focusing electrode that is insulated from the second electrode by the second insulating layer and is parallel to the second electrode.
  • 11. The electron emission device as claimed in claim 1, wherein the first electrode comprises at least one material selected from Al, Ti, Cr, Ni, Au, Ag, Mo, W, Pt, Cu, Pd, Ru, RuO2, ITO, In2O3, SnO2, or polysilicon.
  • 12. The electron emission device as claimed in claim 1, wherein the first and second electron emission material layers comprises at least one of a carbon material or a nano material.
  • 13. The electron emission device as claimed in claim 12, wherein the carbon material or the nano material comprises at least one of carbon nano tubes having a low work function and a high β function, graphite, diamond, diamond like carbon, carbon nano wires, or carbon nano rods.
  • 14. A method of manufacturing an electron emission device, comprising: forming a first electron emission material layer electrically connected to an electrode;forming a catalyst layer on the first electron emission material layer; andgrowing a second electron emission material from the catalyst layer.
  • 15. The method as claimed in claim 14, wherein the forming of the first electron emission material or the growing of the second electron emission material from the catalyst layer is performed using a chemical vapor deposition direct growing method.
  • 16. The method as claimed in claim 14, wherein, in the forming of the catalyst layer on the first electron emission material layer, the catalyst layer is formed to have a corrugated rough upper surface so that the second electron emission material has a density smaller than that of the first electron emission material layer when the second electron emission material is grown.
  • 17. The method as claimed in claim 14, wherein the catalyst layer is formed by coating a solution on a seed layer, and drying the solution.
  • 18. The method as claimed in claim 17, wherein the solution comprises at least one metal salt formed from at least one of Fe, Ni, Co, or Y.
  • 19. The method as claimed in claim 17, wherein the solution comprises at least one of acetate, oxalate or carbonate.
  • 20. The method as claimed in claim 17, wherein the solution comprises at least one solvent selected from ethylene glycol or ethanol.
Priority Claims (1)
Number Date Country Kind
10-2006-0037677 Apr 2006 KR national