Patent Application
20070290597
Below, a DLC film layer fabrication process according to the first embodiment of the present invention is described.
First, a reaction chamber 100 capable of performing sputtering is provided. The reaction chamber 100 includes a heater 10 and lamp 1 for heating a substrate 111, a loading platform 11 for supporting the substrate 111, a power supply 13 for applying voltage on a target material 12, and a plurality of gas supplying units A, B, and C for supplying reactant gas. During formation of the DLC film layer, the number of the gas supplying units can be increased or decreased depending on the gas conditions required for the process.
Then, the surface of the substrate 111 is cleaned and the substrate 111 is thereafter disposed on the loading platform 11 in the reaction chamber 100 so as to secure the substrate 111. In this embodiment, the substrate 111 is a semiconductor silicon wafer. Then, a vacuum pump device 14 removes air from the reaction chamber 100 to leave a pressure of under 1×10−5 torr, and lamp 1 the heater 10 heats the substrate 111 up to a temperature of 500° C. Then, the gases required for reaction are supplied by the gas supplying units A, B, C into the reaction chamber 100, and a mass flow controller (not shown) is provided for controlling the flow rates of the gases into the reaction chamber 100. The gas-supplying units A, B, and C in the embodiment are gas-supplying sources containing argon, methane, and hydrogen, respectively. Whether the gases are introduced into the reaction chamber 100 is determined by the manufacturing conditions, and the flow of the gases is regulated by gas supplying valves a1, b1 and c1. In this embodiment, the gases introduced into the reaction chamber 100 are argon, methane and hydrogen, with a ratio of 2:1:1, as indicated in table 1.
In this embodiment, when the reactant gases are introduced into the reaction chamber 100, the internal pressure is controlled to 9×10−3 torr. Of course, the surrounding pressure for a sputtering reaction according to this embodiment is not to be limited, but can be adjustable upon manufacturing needs.
Thereafter, the graphite target material 12 is pre-sputtered for 30 minutes with 200W of RF power so as to remove possible pollutants from the surface of the target material 12 as the shutter 15 is closed. Then, the shutter 15 is opened and the surface of substrate 111 undergoes sputtering for 70 minutes to grow a DLC layer on substrate surface.
The DLC layer deposited on the substrate surface according to the first embodiment is removed for obtaining a DLC powder. The DLC powder is then mixed together with a silver powder and adhesives into a paste for use as an electron emission source material.
A composition with 8.7% DLC powder, 8.7% glass powder and 82.6% silver powder is evenly mixed together, with addition of ethyl cellulose as adhesives, to form a paste for use as an electron emission source material. In this embodiment, a glass substrate with a conductive silver paste thereon is taken as a cathode plate. The above-mentioned electron emission source paste is coated on the silver paste surface so as to complete the cathode plate structure. In this embodiment, an anode plate is structurally equivalent to the one in the first embodiment.
The above-described structural combination is then tested through a diode type field emission testing apparatus for field emission effects.
First, a cathode plate 301 is emplaced in a container 35, and above which is covered with an anode plate 302. The container 35 is then placed inside a vacuum chamber and the pressure is reduced to below 1×10−6 torr. A voltage is applied between the two electrode plates 301 and 302 for measuring the magnitude of the current produced by the electron emission source of the cathode plate 301.
As shown in
The electron emission source paste of this embodiment is coated over the surface of the cathode layer 71, and a voltage potential is applied between the two electrode plates 701 and 702 for testing field emission effects. Meanwhile, a voltage difference is applied between the cathode layer 71 and the gate electrode layer 74 so as to enhance the electron emission effects of the electron emission source.
Thus, as indicated in the above embodiments, the DLC structure manufactured according to the present invention aids to increase the field emission effects. The DLC not only can be evenly distributed in the electron emission source material, but also the film structure formed on the substrate can be used as the electron emission source. The field emission effects achieved by the two different methods both bear a low starting voltage, a quality favorable for a good cathode electron emission source.
The following is a description about a field emission display according to a preferred embodiment of the invention. The field emission display in this embodiment is similar to the triode-type field emission testing apparatus described in the third embodiment. Aside from an additional phosphor layer and a photo-mask layer on the anode plate, the structure of a lower substrate in this embodiment is the same as that of the third embodiment.
The electron emission source of the field emission display in this embodiment is an electron emission source paste formed by mixing DLC powder, glass powder, silver powder and ethylene cellulose, and coated on the surface of a cathode layer having conductive silver paste, which are then sintered to form an electron emission layer.
In this embodiment, when an electric field is applied between the two electrode plates of the field emission display, where a voltage difference is simultaneously applied between the gate electrode player and the cathode layer, the electron emission source emits electrons to impinge on the phosphor layer of the anode plate so as to cause luminescence.
Aside from the difference in the electron emission sources of the lower substrate, the field emission display in this embodiment is structurally similar to the one shown in the fourth embodiment.
In this embodiment, the surface of the lower substrate includes a molybdenum/titanium metal layer that acts as a cathode layer. The material of the substrate used in this embodiment is glass. Also, the surface of the cathode layer in this embodiment includes a patterned insulating layer and gate electrode layer to partially expose the surface of the cathode. The insulating layer in this embodiment is disposed between the cathode layer and the gate electrode layer to provide electrical insulation.
The above-mentioned lower substrate structure is placed in a sputtering reaction chamber, and undergone a sputtering reaction as described in the first embodiment so as to grow an electron emission layer having a DLC film layer on the exposed cathode surface. Finally, the DLC film layer deposited on the surface of the gate electrode is removed so as to obtain the lower substrate of the field emission display of the present embodiment. The structural characteristic of the DLC film layer in this embodiment is similar to that of the first embodiment.
As described above, according to the present invention, a DLC with micro-scale film structures can be manufactured, that have a high aspect ratio favorable in use as electron emission source material applied in a cold cathode emitting source, such as field emission elements, field emission displays, or flat panel light sources.
Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the scope of the invention as hereinafter claimed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 095121848 | Jun 2006 | TW | national |
