The application relates to an electronic apparatus and a method for assembling the same.
In recent years, as the technology advances, handheld devices such as mobile phones, tablet computers are more commonly used and are developed to be more convenient, multi-functional and exquisite. More and more choices like the aforementioned are provided for consumers to choose from. Users have higher demands toward the handheld devices day by day. As the time prolongs for users to hold handheld devices by hands, the feeling in holding handheld devices are getting more important.
In order to enhance the feeling in holding handheld devices, a housing surface of handheld electronic devices are often designed to have a curved surface to conform designs of ergonomics. However, according to the current stacking method of interior space of handheld devices, a battery is closer to a housing of a handheld device than a motherboard, and therefore such handheld device cannot present a smooth arc shape due to the battery disposition.
The application is directed to an electronic apparatus with a smooth and curved surface of a housing.
The application is directed to a method for assembling an electronic apparatus for assembling components in a housing.
The application provides an electronic apparatus including a housing, a motherboard, a battery module and a display module. The housing has at least an opening and an accommodating space. The motherboard is disposed in the accommodating space. The battery module is disposed in the accommodating space and stacked over the motherboard. The motherboard is located between the housing and the battery module. The display module is disposed in the accommodating space and stacked over the battery module. The battery module is located between the motherboard and the display module. At least one edge of the battery module in a width direction of the battery module is closer to a corresponding side of the housing than a corresponding edge of the motherboard in a width direction of the motherboard.
The application provides a method for assembling an electronic apparatus. A housing, a motherboard, a battery module and a display module are provided, wherein the housing has at least an opening and an accommodating space, and the battery module has assembled to the display module. The motherboard is stacked to one side of the battery module, wherein the battery module is located between the housing and the motherboard. The display module and the battery module are electrically coupled to the motherboard. An assembling operation is performed to dispose an assembly of the motherboard, the battery module and the display module in the accommodating space of the housing, such that the motherboard and the battery module are located between the housing and the display module.
In light of the foregoing, in the application, an appearance of a housing of an electronic apparatus can be presented as a smooth and curved surface to effectively utilize a space inside the housing and increase a capacity of a battery module. In addition, the method for assembling an electronic apparatus can assemble components inside a housing to effectively utilize a space inside the housing and increase a capacity of a battery module.
In order to make the aforementioned features and advantages of the application more comprehensible, embodiments accompanying figures are described in details below.
The housing 110 has at least an opening 112 and an accommodating space 114. The motherboard 120 is disposed in the accommodating space 114, wherein the motherboard 120 includes a rigid circuit board and a plurality of electronic components mounted on the rigid circuit board. The battery module 130 is disposed in the accommodating space 114 and stacked over the motherboard 120, wherein the motherboard 120 is located between the housing 110 and the battery module 130. The display module 140 is disposed in the accommodating space 114 and stacked over the battery module 130, wherein the battery module 130 is located between the motherboard 120 and the display module 140. The display module 140 can have either a plug-in or build-in touch module.
In the present embodiment, a width of the motherboard 120 is narrower than a width of the battery module 130, and the width of the battery module 130 is narrower that a width of the display module 140. Accordingly, an appearance of the housing 110 can be presented as a smooth arc shape. Meanwhile, the width of the battery module 130 is widened when the battery module 130 is moved to a location between the motherboard 120 and the display module 140. As a result, with the same length and thickness, the width of the batter module 130 is widened to increase a capacity of the battery module 130.
It should be noted that any width of any member disclosed in the application is a width in a horizontal direction of the member illustrated in
Referring to
Referring to
Referring to
Referring to
Referring to
In Step S130, the battery module 130 is stacked at the opposite side of the frame 150 at which the display module 140 is disposed. In Step S140, the motherboard 120 is stacked at one side of the battery module 130. In Step S150, the display module 140 and the battery module 130 are electrically coupled to the motherboard 120. In Step S160, an assembling operation is performed, wherein an assembly of the motherboard 120, the battery module 130, the display module 140 and the frame 150 are disposed in the accommodating space 114 of the housing 110.
Referring to
Referring to
In light of the foregoing, the application presents an appearance of an electronic apparatus as a smooth arc shape, and a stacking method inside a space of the electronic apparatus allows interior components to be disposed in a housing with a design of a curved surface or an inclined plane. Accordingly, the application can effectively utilize an interior space of a housing to increase a capacity of a battery module.
Although the application has been described with reference to the above embodiments, it is not intended to limit the application. It will be apparent to people of ordinary skill in the art that modifications and variations to the described embodiments may be made without departing from the spirit and scope of the application. Accordingly, the scope of the application will be defined by the attached claims not by the above detailed descriptions.
Number | Name | Date | Kind |
---|---|---|---|
7336228 | Lu et al. | Feb 2008 | B2 |
8280463 | Hori et al. | Oct 2012 | B2 |
8390255 | Fathollahi | Mar 2013 | B1 |
8456847 | Hwang et al. | Jun 2013 | B2 |
8520373 | Liu | Aug 2013 | B2 |
8619422 | Lim et al. | Dec 2013 | B2 |
8654084 | Hong et al. | Feb 2014 | B2 |
8737052 | Cho et al. | May 2014 | B2 |
20030234897 | Ozawa | Dec 2003 | A1 |
20040204009 | Cheng et al. | Oct 2004 | A1 |
20040263482 | Goertz | Dec 2004 | A1 |
20050122669 | Lee | Jun 2005 | A1 |
20050141186 | Shimizu | Jun 2005 | A1 |
20060181841 | Chen et al. | Aug 2006 | A1 |
20060233356 | Lu et al. | Oct 2006 | A1 |
20060250762 | Yang et al. | Nov 2006 | A1 |
20090015565 | Hong et al. | Jan 2009 | A1 |
20090082073 | Hori et al. | Mar 2009 | A1 |
20090175018 | Zaitsu | Jul 2009 | A1 |
20090257189 | Wang et al. | Oct 2009 | A1 |
20090316351 | Zadesky et al. | Dec 2009 | A1 |
20090323292 | Hwang et al. | Dec 2009 | A1 |
20100061040 | Dabov et al. | Mar 2010 | A1 |
20100134961 | Huang et al. | Jun 2010 | A1 |
20100258626 | Watanabe et al. | Oct 2010 | A1 |
20100273537 | Jiang | Oct 2010 | A1 |
20100279694 | Yagi et al. | Nov 2010 | A1 |
20110032668 | Lee | Feb 2011 | A1 |
20110058320 | Kim et al. | Mar 2011 | A1 |
20110077063 | Yabe et al. | Mar 2011 | A1 |
20110164361 | Yoon et al. | Jul 2011 | A1 |
20110199721 | Allen et al. | Aug 2011 | A1 |
20110216485 | Kang et al. | Sep 2011 | A1 |
20110222219 | Bae et al. | Sep 2011 | A1 |
20110222260 | Goro et al. | Sep 2011 | A1 |
20110261510 | Liu | Oct 2011 | A1 |
20110261514 | Lee et al. | Oct 2011 | A1 |
20110279947 | Peng | Nov 2011 | A1 |
20110292578 | Lim et al. | Dec 2011 | A1 |
20110317343 | Shin et al. | Dec 2011 | A1 |
20120050988 | Rothkopf et al. | Mar 2012 | A1 |
20120111711 | Cho et al. | May 2012 | A1 |
Number | Date | Country |
---|---|---|
101416473 | Apr 2009 | CN |
101080876 | Jul 2012 | CN |
2006065934 | Jun 2006 | WO |
Entry |
---|
“Office Action of Taiwan Counterpart Application”, issued on Sep. 26, 2014, p. 1-p. 8. |
“Office Action of European Counterpart Application”, issued on Nov. 22, 2013, p. 1-p. 8. |
“Office Action of Taiwan Counterpart Application”, issued on Sep. 26, 2014, pp. 1-8, in which the listed references were cited. |
“Office Action of European Counterpart Application”, issued on Nov. 22, 2013, pp. 1-8, in which the listed references were cited. |
Number | Date | Country | |
---|---|---|---|
20140092564 A1 | Apr 2014 | US |