Claims
- 1. An electronic apparatus casing comprising:
- a casing body with a roughened surface, said casing body made from a magnesium or magnesium alloy material;
- a first layer of copper formed on said casing body, said first layer having a thickness of about 2 .mu.m;
- a second layer of nickel formed on said first layer, said second layer hiving a thickness of about 30 .mu.m;
- a third layer of a transparent glass formed on said second layer; and
- a fourth layer of silica formed on said third layer.
- 2. An electronic apparatus casing as claimed in claim 1, wherein the silica forming said fourth layer is derived from an organic silicate alkyl ester.
- 3. An electronic apparatus casing as claimed in claim 1, wherein said fourth layer of silica is formed by applying a partially hydrolyzed organic silicate alkyl ester, which is then heated so as to be calcinated.
- 4. An electronic apparatus casing as claimed in claim 1, wherein said third layer has a thickness ranging from about 1 .mu.m to 5 .mu.m.
- 5. An electronic apparatus casing as claimed in claim 1, wherein the fourth layer of silica has a thickness ranging from about 1 .mu.m to 3 .mu.m.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8-313992 |
Nov 1996 |
JPX |
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Parent Case Info
This application is a division of U.S. application Ser. No. 08/974,963, filed Nov. 20, 1997 pending.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4371573 |
Januschkowetz et al. |
Feb 1983 |
|
5091224 |
Kushida et al. |
Feb 1992 |
|
5672433 |
Cook |
Sep 1997 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
974963 |
Nov 1997 |
|