Patent Application
20250030165
The present disclosure relates to an electronic device comprising an antenna.
A foldable electronic device may include a first housing and a second housing configured to be rotatably connected to the first housing through a hinge device. In such a foldable electronic device, at least a portion of a metal frame (e.g., a metal bezel) provided on the side surface of the first housing and/or the second housing may be used as an antenna. The antenna may be designed so that radiation performance may not be degraded according to a folding or unfolding operation of the electronic device.
An electronic device may include a foldable electronic device including a first housing and a second housing foldably connected to the first housing through a hinge device. The electronic device may include a flexible display used in an unfolding state and provided to receive support of at least a portion of the second housing from the first housing through the hinge device. The foldable electronic device may include at least one antenna (e.g., a metal frame antenna) provided in an interior space of at least one housing or using at least a portion of a conductive side surface. The volume and number of such antennas may be determined based on a frequency, a bandwidth, and/or a type for each service provided by the electronic device.
The foldable electronic device may use a metal frame to reinforce its rigidity and, in a folded state, a metal frame of the first housing and a metal frame of the second housing may form a flattened “U” shape. However, planar parasitic resonance may occur through a conductive sheet (e.g., a copper (Cu) sheet) of the flexible display provided therein. Such a parasitic resonance may degrade radiation performance of the foldable electronic device.
The first housing and conductive portions included in the first housing, such as a conductive support member provided to the first housing and in which parasitic resonance may occur according to radiation current, the ground of the flexible display, the conductive side surface, and/or the metal frame, may be collectively referred to as the first housing. Similarly, the second housing and conductive portions included in the second housing, such as a conductive support member provided to the second housing and in which parasitic resonance may occur according to radiation current, the ground of the flexible display, the conductive side surface, and/or the metal frame, may be collectively referred to as the second housing.
Various embodiments of the present disclosure may provide an electronic device including an antenna that may help improve radiation performance by guiding a parasitic resonance frequency generated in a folded state to a band other than an operating frequency band (e.g., an out band) of the antenna.
According to an aspect of the disclosure, an electronic device includes: a first housing; a second housing including a second support member; a hinge structure coupled with the first housing and the second housing so that the first housing and the second housing are foldable relative to each other using the hinge structure as a central axis; and a wireless communication circuit provided on the second support member of the second housing, wherein the second housing further includes: a sixth side portion including a first conductive portion; a fifth side portion facing the sixth side portion and including a second conductive portion; a fourth side portion facing the hinge structure and including a third conductive portion; a third corner portion between the sixth side portion and the fourth side portion and including a fourth conductive portion; a fourth corner portion between the fifth side portion and the fourth side portion and including a fifth conductive portion; and a first matching circuit provided on the second support member, electrically coupled with the sixth side portion, and configured to induce a second surface current having a second phase opposite to a first phase of a first surface current induced on the first housing, the second housing, and the hinge structure based on the electronic device being in a folded state in which the first housing and the second housing are folded with respect to each other.
According to an aspect of the disclosure, an electronic device includes: a first housing; a second housing including a second support member; a hinge structure coupled with the first housing and the second housing so that the first housing and the second housing are foldable relative to each other using the hinge structure as a central axis; and a wireless communication circuit provided on the second support member of the second housing, wherein the second housing further includes: a sixth side portion including a first conductive portion; a fifth side portion facing the sixth side portion and including a second conductive portion; a fourth side portion facing the hinge structure and including a third conductive portion; a third corner between the sixth side portion and the fourth side portion and including a fourth conductive portion; a fourth corner portion between the fifth side portion and the fourth side portion and including a fifth conductive portion; and a first matching circuit on the second support member, electrically coupled with the sixth side portion and the fourth corner portion, and configured to induce a second surface current having a second phase opposite to a first phase of a first surface current induced to the first housing, the second housing, and the hinge structure based on the electronic device being in a folded state in which the first housing and the second housing are folded with respect to each other using the hinge structure as the central axis.
In addition, various effects directly or indirectly identified herein may be provided.
The effects that may be obtained from the present disclosure are not limited to the effects mentioned above and still other effects not mentioned may be clearly understood by one of ordinary skill in the art to which the present disclosure pertains from the following description.
The above and other aspects, features, and advantages of certain embodiments of the present disclosure may be more apparent from the following description taken in conjunction with the accompanying drawings, in which:
In the following, embodiments of the present disclosure are described with reference to the drawings to facilitate practice by one of ordinary skill in the art to which the disclosure pertains. However, the disclosure may be implemented in many different forms and is not limited to the embodiments described herein. With respect to the description in the drawings, the same or similar reference numerals may be used for the same or similar components. Also, in the drawings and associated descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.
It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wired), wirelessly, or via a third element.
It is to be understood that when an element or layer is referred to as being “over,” “above,” “on,” “below,” “under,” “beneath,” “connected to” or “coupled to” another element or layer, it may be directly over, above, on, below, under, beneath, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly over,” “directly above,” “directly on,” “directly below,” “directly under,” “directly beneath,” “directly connected to” or “directly coupled to” another element or layer, there are no intervening elements or layers present.
The terms “upper,” “middle”, “lower”, and the like may be replaced with terms, such as “first,” “second,” third” to be used to describe relative positions of elements. The terms “first,” “second,” third” may be used to describe various elements but the elements are not limited by the terms and a “first element” may be referred to as a “second element”. Alternatively or additionally, the terms “first”, “second”, “third”, and the like may be used to distinguish components from each other and do not limit the present disclosure. For example, the terms “first”, “second”, “third”, and the like may not necessarily involve an order or a numerical meaning of any form.
Reference throughout the present disclosure to “one embodiment,” “an embodiment,” “an example embodiment,” or similar language may indicate that a particular feature, structure, or characteristic described in connection with the indicated embodiment is included in at least one embodiment of the present solution. Thus, the phrases “in one embodiment”, “in an embodiment,” “in an example embodiment,” and similar language throughout this disclosure may, but do not necessarily, all refer to the same embodiment. The embodiments described herein are example embodiments, and thus, the disclosure is not limited thereto and may be realized in various other forms.
The embodiments herein may be described and illustrated in terms of blocks, as shown in the drawings, which carry out a described function or functions. These blocks, which may be referred to herein as units or modules or the like, or by names such as device, logic, circuit, controller, counter, comparator, generator, converter, or the like, may be physically implemented by analog and/or digital circuits including one or more of a logic gate, an integrated circuit, a microprocessor, a microcontroller, a memory circuit, a passive electronic component, an active electronic component, an optical component, and the like.
In the present disclosure, the articles “a” and “an” are intended to include one or more items, and may be used interchangeably with “one or more.” Where only one item is intended, the term “one” or similar language is used. For example, the term “a processor” may refer to either a single processor or multiple processors. When a processor is described as carrying out an operation and the processor is referred to perform an additional operation, the multiple operations may be executed by either a single processor or any one or a combination of multiple processors.
Hereinafter, various embodiments of the present disclosure are described with reference to the accompanying drawings.
Referring to
The processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to an embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be specific to a specified function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.
The auxiliary processor 123 may control at least some functions or states related to at least one component (e.g., the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing or training. An artificial intelligence model may be generated by machine learning. Such learning may be performed (e.g., by the electronic device 101) where the artificial intelligence is performed or via a separate server (e.g., the server 108). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be and/or may include a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure. That is, the artificial intelligence model may be implemented in software, in hardware (e.g., circuitry), and/or a combination thereof.
The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134.
The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.
The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input module 150 may include one or more of the group of, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), and a digital pen (e.g., a stylus pen). That is, the input module 150 may be connected to the members of the group.
The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing sound, for example, multimedia or playing recordings or for communication. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
The display module 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.
The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) and/or wirelessly coupled with the electronic device 101.
The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may be and/or may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) and/or wirelessly. According to an embodiment, the interface 177 may be and/or may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, an audio interface, or the like.
A connecting terminal 178 may be and/or may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, an audio connector (e.g., a headphone connector), or the like.
The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, an electric stimulator, or the like.
The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, flashes, or the like.
The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may be and/or may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, a fuel cell, or the like.
The communication module 190 may support establishing a direct (e.g., wired) communication channel and/or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that may be operable independently from the processor 120 (e.g., the AP) and may support a direct (e.g., wired) communication and/or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) and/or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as, but not limited to, a legacy cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN and/or a wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify and/or authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) that may be stored in the subscriber identification module 196.
The wireless communication module 192 may support one or more of a 5G network, a fourth-generation (4G) network, and next-generation communication technology (e.g., new radio (NR) access technology). The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 may support a high-frequency band (e.g., a millimeter (mmWave) band) to achieve a high data transmission rate, for example. The wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, large scale antenna, or the like. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20 gigabits per second (Gbps) or more) for implementing eMBB, loss coverage (e.g., 164 dB or less) for implementing mMTC, or user plane (U-plane) latency (e.g., 0.5 milliseconds (ms) or less for each of downlink (DL) and uplink (UL), or a round trip of one (1) ms or less) for implementing URLLC.
The antenna module 197 may transmit and/or receive a signal and/or power to and/or from the outside (e.g., the external electronic device) of the electronic device 101. According to an embodiment, the antenna module 197 may include an antenna including a radiating element including a conductive material and/or a conductive pattern formed in and/or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 198 or the second network 199, may be selected, for example, by the communication module 190 (e.g., the wireless communication module 192) from the plurality of antennas. The signal and/or the power may then be transmitted and/or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.
According to various embodiments, the antenna module 197 may form an mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the PCB, or adjacent to the second surface and capable of transmitting and/or receiving signals of the designated high-frequency band.
At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
According to an embodiment, commands and/or data may be transmitted and/or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 or 104 may be and/or may include a device of a same type as, or a different type, from the electronic device 101. According to an embodiment, all or some of the operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device 101 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In an embodiment, the external electronic device 104 may include an internet-of-things (IoT) device. The server 108 may be and/or may include an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and/or IoT-related technology.
With reference to
According to various embodiments, the single pair of housings 310 and 320 may include the first housing 310 (e.g., first housing structure) configured to couple with the hinge structure 340 and the second housing 320 (e.g., second housing structure) configured to couple with the hinge structure 340. In an embodiment, in the unfolded state, the first housing 310 may include a first surface 311 configured to face a first direction (e.g., front direction) (z-axis direction) and a second surface 312 configured to face the first surface 311 and a second direction (e.g., rear direction) (−z-axis direction). In an embodiment, in the unfolded state, the second housing 320 may include a third surface 321 configured to face the first direction (z-axis direction) and a fourth surface 322 configured to face the second direction (−z-axis direction). In an embodiment, the electronic device 300 may operate in such a manner that, in the unfolded state, the first surface 311 of the first housing 310 and the third surface 321 of the second housing 320 may face a substantially similar and/or the same first direction (z-axis direction) and, in the folded state, the first surface 311 and the third surface 321 may face each other. In an embodiment, the electronic device 300 may operate so that, in the unfolded state, the second surface 312 of the first housing 310 and the fourth surface 322 of the second housing 320 may face a substantially similar and/or the same second direction (−z-axis direction) and, in the folded state, the second surface 312 and the fourth surface 322 may face opposite directions. For example, in the folded state, the second surface 312 may face the first direction (z-axis direction), and the fourth surface 322 may face the second direction (−z-axis direction).
According to various embodiments, the first housing 310 may include a first side member 313 configured to at least partially form the appearance of the electronic device 300 and a first rear cover 314 configured to couple with the first side member 313 and to form at least a portion of the second surface 312 of the electronic device 300. In an embodiment, the first side member 313 may include a first side portion 313a, a second side portion 313b configured to extend from one end of the first side portion 313a, and a third side portion 313c configured to extend from the other end of the first side portion 313a. In an embodiment, the first side member 313 may be formed in a rectangular (e.g., square or rectangular) shape through the first side portion 313a, the second side portion 313b, and the third side portion 313c.
According to various embodiments, the second housing 320 may include a second side member 323 configured to at least partially form the appearance of the electronic device 300 and a second rear cover 324 configured to couple with the second side member 323 and to form at least a portion of the fourth surface 322 of the electronic device 300. In an embodiment, the second side member 323 may include a fourth side portion 323a, a fifth side portion 323b configured to extend from one end of the fourth side portion 323a, and a sixth side portion 323c configured to extend from the other end of the fourth side portion 323a. In an embodiment, the second side member 323 may be formed in a rectangular shape through the fourth side portion 323a, the fifth side portion 323b, and the sixth side portion 323c.
According to various embodiments, the single pair of housings 310 and 320 may not be limited to the illustrated form and coupling and may be implemented by other shapes or combination and/or coupling of parts. For example, in some embodiments, the first side member 313 may be integrally formed with the first rear cover 314, and the second side member 323 may be integrally formed with the second rear cover 324.
According to various embodiments, in the unfolded state, the electronic device 300 may be positioned as if the second side portion 313b of the first side member 313 and the fifth side portion 323b of the second side member 323 extend from each other. In an embodiment, in the unfolded state, the electronic device 300 may be positioned as if the third side portion 313c of the first side member 313 and the sixth side portion 323c of the second side member 323 extend from each other. In an embodiment, the electronic device 300 may be configured so that, in the unfolded state, a combined length of the second side portion 313b and the fifth side portion 323b is longer than a length of the first side portion 313a and/or the fourth side portion 323a. Also, the electronic device 300 may be configured so that a combined length of the third side portion 313c and the sixth side portion 323c is longer than a length of the first side portion 313a and/or the fourth side portion 323a.
According to various embodiments, the first side member 313 and/or the second side member 323 may be formed of metal or may further include a polymer injected into the metal. In an embodiment, the first side member 313 and/or the second side member 323 may include one or more conductive portions (e.g., a first conductive portion 316 and/or a second conductive portion 326) that may be configured to be electrically conductive fragmentation portions through one or more fragmentation portions (e.g., a first fragmentation portion 3161, a second fragmentation portion 3162, and/or a first fragmentation portion 3261, a second fragmentation portion 3262) formed of a polymer. In such a case, the one or more conductive portions 316 and/or 326 may be used as an antenna that may operate in at least one designated band (e.g., about 400 MHz to about 6,000 MHz) through electrical connection to a wireless communication circuit included in the electronic device 300.
According to various embodiments, the first rear cover 314 and/or the second rear cover 324 may be formed of a combination of at least one or at least two of coated or colored glass, ceramic, polymer, and metal (e.g., aluminum (Al), stainless steel (STS), or magnesium (Mg)).
According to various embodiments, the first display 330 may be provided to extend from the first surface 311 of the first housing 310 to at least a portion of the third surface 321 of the second housing 320 across the hinge structure 340. For example, the first display 330 may substantially include a first portion 330a corresponding to the first surface 311, a second portion 330b corresponding to the third surface 321, and a third portion 330c (e.g., bendable area) configured to connect the first portion 330a and the second portion 330b and corresponding to the hinge structure 340. In an embodiment, the electronic device 300 may include a first protection cover 315 (e.g., first protection frame or first decoration member) configured to couple along the edge of the first housing 310. In an embodiment, the electronic device 300 may include a second protection cover 325 (e.g., second protection frame or second decoration member) configured to couple along the edge of the second housing 320. In an embodiment, the first protection cover 315 and/or the second protection cover 325 may be formed of metal and/or polymer material. In an embodiment, the first protection cover 315 and/or the second protection cover 325 may be used as a decoration member. In an embodiment, the first display 330 may be positioned so that the edge of the first portion 330a may be interposed between the first housing 310 and the first protection cover 315. In an embodiment, the first display 330 may be positioned so that the edge of the second portion 330b is interposed between the second housing 320 and the second protection cover 325. In an embodiment, the first display 330 may be positioned so that the edge of the first display 330 corresponding to a protection cap 335 may be protected through the protection cap 335 provided in an area corresponding to the hinge structure 340. Consequently, the edge of the first display 330 may be substantially protected from the outside. In an embodiment, the electronic device 300 may include a hinge housing 341 (e.g., hinge cover) configured to support the hinge structure 340 and exposed to the outside when the electronic device 300 is in the folded state and invisible from the outside by being introduced into a first space (e.g., interior space of the first housing 310) and a second space (e.g., interior space of the second housing 320) when the electronic device 300 is in the unfolded state. In some embodiments, the first display 330 may be provided to extend from at least a portion of the second surface 312 to at least a portion of the fourth surface 322. In such embodiments, the electronic device 300 may be folded so that the first display 330 is exposed to the outside (e.g., an out-folding method).
According to various embodiments, the electronic device 300 may include a second display 400 (e.g., sub-display) provided separate from the first display 330. In an embodiment, the second display 400 may be provided to be at least partially exposed on the second surface 312 of the first housing 310, and accordingly, may replace a display function of the first display 330 in the folded state to display status information of the electronic device 300. In an embodiment, the second display 400 may be provided to be visible from the outside through at least some areas of the first rear cover 314. In some embodiments, the second display 400 may be provided on the fourth surface 322 of the second housing 320. In such embodiments, the second display 400 may be provided to be visible from the outside through at least some areas of the second rear cover 324.
According to various embodiments, the electronic device 300 may include at least one of an input device 303 (e.g., microphone), sound output devices (e.g., a first sound output device 301 and a second sound output device 302), a sensor module 304, camera devices (e.g., a first camera device 305 and a second camera device 308), a key input device 306, and a connector port 307. In an embodiment, the input device 303 (e.g., microphone), the first and second sound output devices 301 and 302, the sensor module 304, the first and second camera devices 305 and 308, the key input device 306, or the connector port 307 may refer to a hole and/or a shape formed in the first housing 310 and/or the second housing 320, but may also include an actual electronic part (e.g., input device, sound output device, sensor module, or camera device) that may be provided inside the electronic device 300 and may operate through the hole and/or the shape.
According to various embodiments, the input device 303 may include at least one microphone 303 provided to the second housing 320. In some embodiments, the input device 303 may include the plurality of microphones 303 provided to be capable of detecting a direction of sound. In some embodiments, the plurality of microphones 303 may be provided at appropriate positions in the first housing 310 and/or the second housing 320. In an embodiment, the first and second sound output devices 301 and 302 may include first speakers 301 and second speakers 302. In an embodiment, the first and second speakers 301 and 302 may include a communication receiver provided to the first housing 310 and a speaker 302 provided to the second housing 320. In some embodiments, the input device 303, the first and second sound output devices 301 and 302, and the connector port 307 may be provided in a space formed in the first housing 310 and/or the second housing 320 of the electronic device 300, and may be exposed to an external environment through at least one hole formed in the first housing 310 and/or the second housing 320. In an embodiment, at least one connector port 307 may be used to transmit and/or receive power and/or data to and/or from an external electronic device. In some embodiments, at least one connector port (e.g., ear jack hole) may accommodate a connector (e.g., ear jack) for transmitting and/or receiving an audio signal to and/or from the external electronic device. In some embodiments, a hole formed in the first housing 310 and/or the second housing 320 may be commonly used for the input device 303 and the first and second sound output devices 301 and 302. In some embodiments, the first and second sound output devices 301 and 302 may include a speaker (e.g., piezo speaker) that may operate by producing sound through the hole formed in the first housing 310 and/or the second housing 320.
According to various embodiments, the sensor module 304 may generate an electrical signal and/or a data value corresponding to an internal operating state of the electronic device 300 and/or an external environmental state. For example, the sensor module 304 may detect an external environment through the first surface 311 of the first housing 310. In some embodiments, the electronic device 300 may further include at least one sensor module provided to detect the external environment through the second surface 312 of the first housing 310. In an embodiment, the sensor module 304 (e.g., an illuminance sensor) may be provided below the first display 330 to detect the external environment through the first display 330. In an embodiment, the sensor module 304 may include at least one of a gesture sensor, a gyro sensor, a barometric sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, a biometric sensor, an ultrasonic sensor, an illuminance sensor, or the like.
According to various embodiments, the first and second camera devices 305 and 308 may include a first camera device 305 (e.g., front camera device) provided on the first surface 311 of the first housing 310 and a second camera device 308 provided on the second surface 312 of the first housing 310. The electronic device 300 may further include a flash 309 provided near the second camera device 308. In an embodiment, the first and second camera devices 305 and 308 may include one or a plurality of lenses, image sensors, and/or image signal processors. The flash 309 may include, for example, a light emitting diode or a xenon lamp. In an embodiment, the first and second camera devices 305 and 308 may be provided so that two or more lenses (e.g., a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be positioned on one surface (e.g., first surface 311, second surface 312, third surface 321, or fourth surface 322) of the electronic device 300. In some embodiments, the first and second camera devices 305 and 308 may also include time of flight (ToF) lenses and/or image sensors.
According to various embodiments, the key input device 306 (e.g., a key button) may be provided on the third side surface 313c of the first side member 313 of the first housing 310. In some embodiments, the key input device 306 may be provided on at least one side among the other side surfaces (e.g., the first side portion 313a and the second side portion 313b) of the first housing 310 and/or the side surfaces (e.g., the fourth side portion 323a, the fifth side portion 323b, and the sixth side portion 323c) of the second housing 320. In some embodiments, the electronic device 300 may not include a portion of or all of the key input devices 306 and the key input device 306 may be implemented in a different form on the first display 330, such as, but not limited to a soft key. In some embodiments, the key input device 306 may also be implemented using a pressure sensor included in the first display 330.
According to various embodiments, some camera devices (e.g., the first camera device 305) of the first and second camera devices 305 and 308 and/or the sensor module 304 may be displayed to be exposed through the first display 330. For example, the first camera device 305 and/or the sensor module 304 may be provided to make a contact with the external environment through an opening at least partially formed on the first display 330 in the interior space of the electronic device 300. In another embodiment, some sensor modules 304 may be provided to perform the function without being visually exposed through the first display 330 in the interior space of the electronic device 300. For example, in such an embodiment, the opening may be omitted in an area of the first display 330 that faces the sensor module 304.
With reference to
With reference to
According to various embodiments, the electronic device 300 may include a first plate assembly 361 (e.g., first plate or main PCB), a camera assembly 363, a first battery 371, or a first bracket 351 provided in a first space between the first side member 313 and the first rear cover 314. In an embodiment, the camera assembly 363 may include a plurality of camera devices (e.g., the first and second camera devices 305 and 308 of
According to various embodiments, the electronic device 300 may include the hinge housing 341 (e.g., hinge cover) configured to support the hinge structure 340 and exposed to the outside when the electronic device 300 is in the folded state (e.g., folded state of
According to various embodiments, the electronic device 300 may include the first protection cover 315 configured to couple along the edge of the first side member 313. In an embodiment, the electronic device 300 may include the second protection cover 325 configured to couple along the edge of the second side member 323. In an embodiment, in the first display 330, the edge of a first flat portion (e.g., first portion 330a of
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According to an embodiment, the second plate 320 may physically couple with a fourth side portion 323a, a fifth side portion 323b, and a sixth side portion 323c. The second plate 320 may physically couple with a third corner portion 323d provided between the fourth side portion 323a and the sixth side portion 323c and a fourth corner portion 323e provided between the fourth side portion 323a and the fifth side portion 323b. At least one of the fourth side portion 323a, the fifth side portion 323b, the sixth side portion 323c, the third corner portion 323d, and the fourth corner portion 323e may be formed of a conductive material. The fourth side portion 323a may include a first fragmentation portion 3261 and a second fragmentation portion 3262 formed of nonconductive material. The fifth side portion 323b may include a third fragmentation portion 3263 and a fourth fragmentation portion 3264. The sixth side portion 323c may include a fifth fragmentation portion 3265 and a sixth fragmentation portion 3266.
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A phenomenon that the direction of the second surface current J2 induced on the surface of the sixth side surface 323c due to the parasitic resonance frequency with the wavelength of λ/4 and the direction of the first surface current J1 induced on the surface of the second plate 320 may be referred to as a reverse current effect. The present disclosure provides a structure capable of controlling the first parasitic resonance formed in the electronic device 300 in the folded state using the second parasitic resonance, according to the reverse current effect. That is, the present disclosure provides the electronic device 300 to improve antenna performance in a target band by shifting the frequency band of the first parasitic resonance using the second parasitic resonance.
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That is, the electric field of the first mode and the electric field of the second mode that differ from each other may be formed in the electronic device 300.
With reference to
In the shielded parallel plate model, since the second surface current J2 induced to the sixth side portion 323c grounded to the ground of the second plate 320 through the ground member 420 is formed in the direction opposite to the direction of the first surface current J1 induced on the surface of the second plate 320, a resonance-splitting phenomenon may occur between the frequency of the first parasitic resonance by the first surface current J1 formed on the surface of the second plate 320 and the frequency of the second parasitic resonance by the second surface current J2 induced to the sixth side portion 323c grounded to the ground of the second plate 320 through the ground member 420 in the shielded parallel plate model. For example, the resonance-splitting phenomenon may represent that, as shown in
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With reference to
The fifth side portion 323b may be provided in the −X-axis direction of the second housing 320 based on the X-Y plane. The fifth side portion 323b may include the third fragmentation portion 3263 and the fourth fragmentation portion 3264 formed of nonconductive material. For example, the fifth side portion 323b may be electrically separated from the hinge structure 340 through the third fragmentation portion 3263.
The sixth side portion 323c may be provided in the +X-axis direction of the second housing 320, based on the X-Y plane. For example, the sixth side portion 323c may be provided to be symmetrical to the fifth side portion 323b based on the Y-axis in the second housing 320. The sixth side portion 323c may include the fifth fragmentation portion 3265 and the sixth fragmentation portion 3266 formed of nonconductive material. For example, the sixth side portion 323c may be electrically separated from the hinge structure 340 through the sixth fragmentation portion 3266.
The third corner portion 323d may be provided between the fourth side surface 323a and the sixth side surface 323c. The third corner portion 323d may be electrically separated from the fourth side portion 323a through the second fragmentation portion 3262. The third corner 323d may be electrically separated from the sixth side portion 323c through the fifth fragmentation portion 3265. The fourth corner portion 323e may be provided between the fourth side surface 323a and the fifth side surface 323b. The fourth corner portion 323e may be electrically separated from the fourth side portion 323a through the first fragmentation portion 3261. The fourth corner portion 323e may be electrically separated from the fifth side portion 323b through the fourth fragmentation portion 3264.
With reference to
The electronic device 300 may include the wireless communication module 192. The fourth side portion 323a may be electrically connected to the wireless communication module 192. In an embodiment, the fourth side portion 323a may be electrically connected to the third corner portion 323d through a first connecting portion 821 that includes a first switch 821a and a first conductive line 821b. One end of the first connecting portion 821 may be electrically connected to the fourth side portion 323a. The other end of the first connecting portion 821 may be electrically connected to the third corner portion 323d. For example, the first connecting portion 821 may be a logical connection as a connection line for connecting the fourth side portion 323a and the third corner portion 323d. For example, the first switch 821a and the first conductive line 821b may be formed in a PCB (e.g., second plate assembly 362). For example, the fourth side portion 323a and the third corner portion 323d may operate as a radiator 720. As another example, the fourth side portion 323a may operate as the radiator 720 along with the third corner portion 323d through the first switch 821a. As yet another example, the fourth side portion 323a may operate alone as the radiator 720 through the first switch 821a.
According to an embodiment, the sixth side portion 323c may be grounded to the second support member 3231 through a first matching circuit unit 921. For example, the first matching circuit unit 921 may include a second switch 921a and at least one first inductor 921b. As another example, the first matching circuit unit 921 may electrically connect the sixth side portion 323c and the second support member 3231. As yet another example, the first matching circuit unit 921 may electrically connect the sixth side portion 323c and the second support member 3231 through the PCB (e.g., second plate assembly 362). For example, one end of the first matching circuit unit 921 may be electrically connected to the sixth side portion 323c. The other end of the second ground member 422 may be electrically connected to the second support member 3231. Second parasitic resonance 521 may be formed in the first matching circuit unit 921 and the sixth side portion 323c.
In an embodiment, the first matching circuit unit 921 may be a tunable matching circuit unit that includes a plurality of inductors having various inductance values. For example, the number of first inductors 921b included in the first matching circuit unit 921 may be plural (e.g., a positive integer greater than one (1)). For example, the plurality of first inductors 921b may be connected in parallel to a second switch 921a. The second switch 921a may be selectively connected to one inductor among the plurality of first inductors 921b. For example, an inductance value of the first matching circuit unit 921 may be determined based on a frequency of a transmission signal of the electronic device 300. As another example, the inductance value of the first matching circuit unit 921 may have a sufficient size to operate close to open at the frequency of the transmission signal of the electronic device 300. For example, the inductance value of the first matching circuit unit 921 may be set to exceed a predetermined threshold so that the sixth side portion 323c does not electromagnetically couple with the radiator 720. That is, the electronic device 300 may control the second parasitic resonance frequency 521 while minimizing the effect on the radiator 720 through the first matching circuit unit 921. For example, the inductance value of the first matching circuit unit 921 may have various values, such as, but not limited to, about 39nH, about 56nH, or about 100nH.
With reference to
In the electronic device 300, the electric field distribution of the sixth side portion 323c and a portion (a) of the second housing 320 adjacent to the sixth side portion 323c may be the same and/or may be similar in many respects to the electric field distribution described with reference to
With reference to
In the electronic device 300, since the second surface current J2 induced to the sixth side portion 323c grounded to the second support member 3231 through the first matching circuit unit 921 is formed in the direction opposite to the direction of the first surface current J1 induced on the surface of the second housing 320, a resonance-splitting phenomenon may occur between the frequency of the first parasitic resonance by the first surface current J1 formed on the surface of the second plate 320 in the electronic device 300 and the frequency of the second parasitic resonance 521 by the second surface current J2 induced to the sixth side portion 323c grounded to the second support member 3231 of the second plate 320 through the second ground member 422. For example, the resonance-splitting phenomenon may represent that the frequency of the first parasitic resonance formed by the first surface current J1 formed on the surface of the second housing 320 shifts to a specific frequency band due to the effect of the second parasitic resonance 521 formed by the second surface current J2 induced to the sixth side portion 323c grounded to the second support member 3231.
In the electronic device 300, a portion in which the surface current is not displayed may be the ground. For example, the ground may be the ground included in a support member (e.g., first support member 3131 or second support member 3231), the ground included in a PCB (e.g., first plate assembly 361 or second plate assembly 362), or the ground included in a display (e.g., first display 330 or second display 400).
With reference to
The electronic device 300 may include the wireless communication module 192. The fourth side portion 323a may be electrically connected to the wireless communication module 192. In an embodiment, the fourth side portion 323a may be electrically connected to the third corner portion 323d through the first connecting portion 821 that includes the first switch 821a and the first conductive line 821b. One end of the first connecting portion 821 may be electrically connected to the fourth side portion 323a. The other end of the first connecting portion 821 may be electrically connected to the third corner portion 323d. For example, the first connecting portion 821 may be a logical connection as a connection line for connecting the fourth side portion 323a and the third corner portion 323d. As another example, the first switch 821a and the first conductive line 821b may be formed in the PCB (e.g., second plate assembly 362). As yet another example, the fourth side portion 323a and the third corner portion 323d may operate as the radiator 720. For example, the fourth side portion 323a may operate as the radiator 720 along with the third corner portion 323d through the first switch 821a. As another example, the fourth side portion 323a may operate alone as the radiator 720 through the first switch 821a.
According to an embodiment, the sixth side portion 323c may be electrically connected to the third corner portion 323d through a second matching circuit unit 922. For example, the second matching circuit unit 922 may include a third switch 922a and at least one second inductor 922b. The second matching circuit unit 922 may electrically connect the sixth side portion 323c and the third corner portion 323d. For example, the second matching circuit unit 922 may electrically connect the sixth side portion 323c and the third corner portion 323d through the PCB (e.g., second plate assembly 362). As another example, one end of the second matching circuit unit 922 may be electrically connected to the sixth side portion 323c. The other end of the second matching circuit unit 922 may be electrically connected to the third corner portion 323d. The second parasitic resonance 522 may be formed from the first ground member 421 connected to the fourth side portion 323a to the third corner portion 323d, the second matching circuit unit 922, and the sixth side portion 323c.
In an embodiment, the second matching circuit unit 922 may be a tunable matching circuit unit that includes a plurality of inductors having various inductance values. For example, the number of second inductors 922b included in the second matching circuit unit 922 may be plural. For example, the plurality of second inductors 922b may be connected in parallel to the third switch 922a. The third switch 922a may be selectively connected to one inductor among the plurality of second inductors 922b.
For example, an inductance value of the second matching circuit unit 922 may be determined based on a frequency of a transmission signal of the electronic device 300. For example, the inductance value of the second matching circuit unit 922 may have a size sufficient to operate close to open at the frequency of the transmission signal of the electronic device 300. For example, the inductance value of the second matching circuit unit 922 may be set to exceed a predetermined threshold so that the sixth side portion 323c does not electromagnetically couple with the radiator 720. That is, the electronic device 300 may control the frequency of the second parasitic resonance 521 while minimizing the effect on the radiator 720 through the second matching circuit unit 922. For example, the inductance value of second matching circuit unit 922 may have various values, such as, but not limited to, about 39nH, about 56nH, or about 100nH.
With reference to
In the electronic device 300, the electric field distribution of the fourth side portion 323a and a portion (a) of the second housing 320 adjacent to the fourth side portion 323a may include and/or may be similar in many respects to the electric field distribution described with reference to
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In the electronic device 300, since the second surface current J2 induced to the sixth side portion 323c grounded to the second support member 3231 of the second housing 320 through the second matching circuit unit 922 is formed in the direction opposite to the direction of the first surface current J1 formed on the surface of the second housing 320 based on the X-Y plane, the same or similar resonance-splitting phenomenon as or to the resonance-splitting phenomenon described through
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The electronic device 300 may include a wireless communication circuit (e.g., wireless communication module 192 of
In an embodiment, the sixth side portion 323c may be grounded to the second support member 3231 through the first matching circuit unit 921. For example, the first matching circuit unit 921 may include the second switch 921a and at least one first inductor 921b. For example, the first matching circuit unit 921 may electrically connect the sixth side portion 323c and the second support member 3231. For example, the first matching circuit unit 921 may electrically connect the sixth side portion 323c and the second support member 3231 through the PCB (e.g., second plate assembly 362). For example, one end of the first matching circuit unit 921 may be electrically connected to the sixth side portion 323c. The other end of the first matching circuit unit 921 may be electrically connected to the second support member 3231. The second parasitic resonance 521 may be formed in the first matching circuit unit 921 and the sixth side portion 323c. In an embodiment, the fifth side surface 323b may be grounded to the second support member 3231 through a third matching circuit unit 923. For example, the third matching circuit unit 923 may include a fourth switch 923a and at least one third inductor 923b. For example, the third matching circuit unit 923 may electrically connect the fifth side portion 323b and the second support member 3231. One end of the third matching circuit unit 923 may be electrically connected to the fifth side surface 323b. For example, the third matching circuit unit 923 may be electrically connected to the fifth side portion 323b and the second support member 3231 through the PCB (e.g., second plate assembly 362). For example, one end of the third matching circuit unit 923 may be electrically connected to the fifth side portion 323b. The other end of the third matching circuit unit 923 may be electrically connected to the second support member 3231. Third parasitic resonance 523 may be formed in the third matching circuit unit 923 and the fifth side portion 323b. For example, the third matching circuit unit 923 may be provided to be substantially symmetrical to the first matching circuit unit 921 based on the Y-axis.
With reference to
The electronic device 300 may include the wireless communication circuit (e.g., wireless communication module 192 of
In an embodiment, the sixth side portion 323c may be grounded to the second support member 3231 through the first matching circuit unit 921. For example, the first matching circuit unit 921 may include the second switch 921a and at least one first inductor 921b. As another example, the first matching circuit unit 921 may electrically connect the sixth side portion 323c and the second support member 3231. One end of the first matching circuit unit 921 may be electrically connected to the sixth side portion 323c. The other end of the first matching circuit unit 921 may be electrically connected to the second support member 3231. The second parasitic resonance 521 may be formed in the first matching circuit unit 921 and the sixth side portion 323c. In an embodiment, the fifth side portion 323b may be grounded to the second support member 3231 through a fourth matching circuit unit 924. For example, the fourth matching circuit unit 924 may include a fifth switch 924a and at least one fourth inductor 924b. As another example, the fourth matching circuit unit 924 may electrically connect the fifth side portion 323b and the second support member 3231. One end of the fourth matching circuit unit 924 may be electrically connected to the fifth side surface 323b. The other end of the fourth matching circuit unit 924 may be electrically connected to the second support member 3231. Fourth parasitic resonance 524 may be formed in the fourth matching circuit unit 924 and the fifth side portion 323b. For example, the fourth matching circuit unit 924 may be provided to be substantially symmetrical to the first matching circuit unit 921 based on the X-axis and the Y-axis.
According to an embodiment, the fifth side portion 323b and the sixth side portion 323c may operate as additional radiators. For example, the electronic device 300 may further include a second feed 622 and a third feed 623. The sixth side portion 323c may be electrically connected to the wireless communication circuit through the second feed 622. The fifth side portion 323b may be electrically connected to the wireless communication circuit through the third feed 623.
With reference to
The electronic device 300 may include the wireless communication circuit (e.g., wireless communication module 192 of
In an embodiment, the sixth side portion 323c may be grounded to the second support member 3231 through the first matching circuit unit 921. For example, the first matching circuit unit 921 may electrically connect the sixth side portion 323c and the second support member 3231. One end of the first matching circuit unit 921 may be electrically connected to the sixth side portion 323c. One end of the first matching circuit unit 921 may be electrically connected to the sixth side portion 323c. The other end of the first matching circuit unit 921 may be electrically connected to the second support member 3231.
In an embodiment, the sixth side portion 323c may be electrically connected to the third corner portion 323d through a second connecting portion 822. One end of the second connecting portion 822 may be electrically connected to the sixth side portion 323c. The other end of the second connecting portion 822 may be electrically connected to the third corner portion 323d. The second connecting portion 822 may include a sixth switch 822a and a second conductive line 822b. For example, the sixth switch 822a may be turned on when the electronic device 300 is in the folded state and the sixth switch 822a may be turned off when the electronic device 300 is in the unfolded state.
Fifth parasitic resonance 525 may be formed in the first matching circuit unit 921, the sixth side portion 323c, the second connecting portion 822, and the third corner portion 323d.
With reference to
The electronic device 300 may include the wireless communication circuit (e.g., wireless communication module 192 of
In an embodiment, the third corner portion 323d may be grounded to the second support member 3231 through a fifth matching circuit unit 925. For example, the fifth matching circuit unit 925 may electrically connect the first corner portion 313d and the second support member 3231. The fifth matching circuit unit 925 may include a seventh switch 925a and at least one fifth inductor 925b. For example, the seventh switch 925a may be turned on when the electronic device 300 is in the folded state and the seventh switch 925a may be turned off when the electronic device 300 is in the unfolded state. For example, the fifth matching circuit unit 925 may electrically connect the fourth side portion 323a and the second support member 3231 through the PCB (e.g., second plate assembly 362). For example, one end of the fifth matching circuit unit 925 may be electrically connected to the first corner portion 313d. The other end of the fifth matching circuit unit 925 may be electrically connected to the second support member 3231.
In an embodiment, the sixth side portion 323c may be electrically connected to the third corner portion 323d through the second connecting portion 822. The second connecting portion 822 may include the sixth switch 822a and the second conductive line 822b. For example, the sixth switch 822a may be turned on when the electronic device 300 is in the folded state and the sixth switch 822a may be turned off when the electronic device 300 is in the unfolded state. One end of the second connecting portion 822 may be electrically connected to the sixth side surface 323c. The other end of the second connecting portion 822 may be electrically connected to the third corner portion 323d.
Sixth parasitic resonance 526 may be formed in the fifth matching circuit unit 925, the third corner portion 323d, the second connecting portion 822, and the sixth side portion 323c. For example, a length of frequency of the fifth parasitic resonance 525 may be about V/4.
With reference to
The electronic device 300 may include the wireless communication circuit (e.g., wireless communication module 192 of
In an embodiment, the sixth side portion 323c may be electrically connected to the third corner portion 323d through the second matching circuit unit 922. The second matching circuit unit 922 may include the third switch 922a and at least one second inductor 922b. For example, the third switch 922a may be turned on when the electronic device 300 is in the folded state and the third switch 922a may be turned off when the electronic device 300 is in the unfolded state. One end of the second matching circuit unit 922 may be electrically connected to the sixth side portion 323c. The other end of the second matching circuit unit 922 may be electrically connected to the third corner portion 323d.
In an embodiment, the third corner portion 323d may be electrically connected to the second support member 3231 through a fifth matching circuit unit 925. For example, the fifth matching circuit unit 925 may include the seventh switch 925a and at least one fifth inductor 925b. The third corner portion 323d may be grounded to the second support member 3231 through the fifth matching circuit unit 925. One end of the fifth matching circuit unit 925 may be electrically connected to the third corner portion 323d. The other end of the fifth matching circuit unit 925 may be electrically connected to the second support member 3231.
Seventh parasitic resonance 527 may be formed in the fifth matching circuit unit 925, the third corner portion 323d, the second matching circuit unit 922, and the sixth side portion 323c.
With reference to
The second housing 320 may include the first fragmentation portion 3261, the third fragmentation portion 3263, the fourth fragmentation portion 3264, the fifth fragmentation portion 3265, and the sixth fragmentation portion 3266. For example, the first fragmentation portion 3261 may be provided between the fourth corner portion 323e and the third corner portion 323d. The fourth corner portion 323e and the third corner portion 323d may be electrically separated from each other through the first fragmentation portion 3261. The third fragmentation portion 3263 may be provided between the fifth side portion 323b and the hinge structure 340. The fifth side portion 323b and the hinge structure 340 may be electrically separated through the third fragmentation portion 3263. The fourth fragmentation portion 3264 may be provided between the fifth side portion 323b and the fourth side portion 323a. The fifth side portion 323b and the fourth side portion 323a may be electrically separated through the fourth fragmentation portion 3264. The fifth fragmentation portion 3265 may be provided between the sixth side portion 323c and the first corner portion 313d. The sixth side portion 323c and the first corner portion 313d may be electrically separated through the fifth fragmentation portion 3265. The sixth fragmentation portion 3266 may be provided between the sixth side portion 323c and the hinge structure 340. The sixth side portion 323c and the hinge structure 340 may be electrically separated through the sixth fragmentation portion 3266.
In an embodiment, in the electronic device 300, the third corner portion 323d may be grounded to the second support member 3231 through the second ground member 422. For example, the second ground member 422 may electrically connect the third corner portion 323d and the second support member 3231. For example, the second ground member 422 may electrically connect the third corner portion 323d and the second support member 3231 through the PCB (e.g., second plate assembly 362).
The electronic device 300 may include the wireless communication circuit (e.g., wireless communication module 192 of
In an embodiment, the sixth side portion 323c may be electrically connected to the third corner portion 323d through a sixth matching circuit unit 926. For example, the sixth matching circuit unit 926 may include a seventh switch 926a and at least one sixth inductor 926b. As another example, the seventh switch 926a may be turned on when the electronic device 300 is in the folded state and the seventh switch 926a may be turned off when the electronic device 300 is in the unfolded state. One end of the sixth matching circuit unit 926 may be electrically connected to the sixth side portion 323c. The other end of the sixth matching circuit unit 926 may be electrically connected to the third corner portion 323d.
Eighth parasitic resonance 528 may be formed in the second ground member 422, the third corner portion 323d, the sixth matching circuit unit 926, and the sixth side portion 323c.
With reference to
In an embodiment, in the electronic device 300, the third corner portion 323d may be grounded to the second support member 3231 through the third ground member 423. For example, the third ground member 423 may electrically connect the third corner portion 323d and the second support member 3231. For example, the third ground member 423 may electrically connect the third corner portion 323d and the second support member 3231 through the PCB (e.g., second plate assembly 362). The electronic device 300 may include the wireless communication circuit (e.g., wireless communication module 192 of
In an embodiment, the sixth side portion 323c may be electrically connected to the second support member 3231 through the first matching circuit unit 921. A ninth parasitic resonance 529 may be formed in the first matching circuit unit 921 and the sixth side portion 323c.
In an embodiment, the fifth side portion 323b may be electrically connected to the fourth corner portion 323e through a seventh matching circuit unit 927. The seventh matching circuit unit 927 may include an eighth switch 927a and at least one seventh inductor 927b. For example, the eighth switch 927a may be turned on when the electronic device 300 is in the folded state and the eighth switch 927a may be turned off when the electronic device 300 is in the unfolded state. One end of the seventh matching circuit unit 927 may be electrically connected to the fifth side portion 323b. The other end of the seventh matching circuit unit 927 may be electrically connected to the fourth corner portion 323e.
In an embodiment, the fourth corner portion 323e may be grounded to the second support member 3231 through an eighth matching circuit unit 928. For example, the eighth ground member 928 may electrically connect the fourth corner portion 323e and the second support member 3231. For example, the eighth matching circuit unit 928 may electrically connect the fourth corner portion 323e and the second support member 3231 through the PCB (e.g., second plate assembly 362). The eighth matching circuit unit 928 may include a ninth switch 928a and at least one eighth inductor 928b. For example, the ninth switch 928a may be turned on when the electronic device 300 is in the folded state and turned off when the electronic device 300 is in the unfolded state. One end of the eighth matching circuit unit 928 may be electrically connected to the fourth corner portion 323e. The other end of the eighth matching circuit unit 928 may be electrically connected to the second support member 3231.
With reference to
With reference to
For example, the second housing 1012 and the third housing 1013 may be folded so that the respective first surfaces face each other using the second hinge structure 1022 as the central axis. The first housing 1011 may be folded so that the first surface of the first housing 1011 faces the second surface of the third housing 1013 using the first hinge structure 1021 as the central axis.
With reference to
For example, in the electronic device 3000 in the folded state, the surface current may flow from one side surface of the third housing 1013 into the second hinge structure 1022, from the second hinge structure 1022 into the one side surface of the second housing 1012, from one side surface of the second housing 1012 into the first hinge structure 1021, and from the first hinge structure 1021 into one side surface of the first housing 1011.
The electronic device 3000 may be and/or may include a foldable terminal having conductive side surfaces or metal frames (e.g., first side surface 313a, second side surface 313b, third side surface 313c, first corner 313d, second corner 313e, fourth side surface 323a, fifth side surface 323b, sixth side surface 323c, third corner 323d, and fourth corner 323e). For example, each of the first housing 1011, the second housing 1012, and the third housing 1013 may include conductive side surfaces. At least one of the conductive side surfaces may be grounded to at least one support member of the first housing 1011, the second housing 1012, or the third housing 1013. When the electronic device 3000 is in the folded state, the surface current may be electromagnetically induced on at least one of the conductive side surfaces as a portion of at least one of the first housing 1011, the second housing 1012, and the third housing 1013. A direction of the surface current induced on at least one conductive side surface may be the same as a direction of the surface current induced to the first housing 1011 or a direction of the surface current induced to at least one of the second housing 1012 and the third housing 1013. The surface current induced on the surface of the electronic device 3000 in the folded state may cause the first parasitic resonance. The first parasitic resonance may be referred to as PPW resonance.
In the electronic device 3000 in the folded state, when at least one of the conductive side surfaces is grounded to at least one support member of the first housing 1011, the second housing 1012, or the third housing 1013, the direction of the surface current (e.g., first surface current J1) induced on the surface of the electronic device 3000 and the direction of the surface current (e.g., second surface current J2) induced on the grounded at least one conductive side surface may be opposite to each other. The second surface current J2 induced on the grounded at least one conductive side surface may cause the second parasitic resonance. The second parasitic resonance may shift the frequency band of the first parasitic resonance. For example, the second parasitic resonance may cause the resonance-splitting phenomenon with respect to the first parasitic resonance.
With reference to
With reference to
The first housing 1031 and the second housing 1032 may be folded so that the respective first surfaces face each other using the first hinge structure 1041 as the central axis. The second housing 1032 and the third housing 1033 may be folded so that the respective second surfaces face each other using the second hinge structure 1042 as the central axis.
With reference to
The surface current (e.g., first surface current J1) induced on the surface of the electronic device 3100 in the folded state may flow from one side surface of the third housing 1033 into the second hinge structure 1042, from the second hinge structure 1042 into one side surface of the second housing 1032, from one side surface of the second housing 1032 into the first hinge structure 1041, and from the first hinge structure 1041 into one side surface of the first housing 1031.
The electronic device 3100 may be a foldable terminal having conductive side surfaces or metal frames (e.g., first side surface 313a, second side surface 313b, third side surface 313c, first corner 313d, second corner 313e, fourth side surface 323a, fifth side surface 323b, sixth side surface 323c, third corner 323d, and fourth corner 323e). For example, each of the first housing 1031, the second housing 1032, and the third housing 1033 may include conductive side surfaces. At least one of the conductive side surfaces may be grounded to at least one support member of the first housing 1031, the second housing 1032, or the third housing 1033. The surface current may be induced on at least one of the conductive side surfaces as a portion of the first housing 1031, the second housing 1032, or the third housing 1033. A direction of the surface current induced on at least one of the conductive side surfaces may be the same as a direction of the surface current induced to the first housing 1031 or a direction of the surface current induced to at least one of the second housing 1032 and the third housing 1033. The surface current induced on the surface of the electronic device 3100 in the folded state may cause the first parasitic resonance. The first parasitic resonance may be referred to as PPW resonance.
In the electronic device 3100 in the folded state, when at least one of the conductive side surfaces is grounded to at least one support member of the first housing 1031, the second housing 1032, or the third housing 1033, the direction of the surface current (e.g., first surface current J1) induced on the surface of the electronic device 3100 and the direction of the surface current (e.g., second surface current J2) induced on the grounded at least one conductive side surface may be opposite to each other. The surface current (e.g., second surface current J2) induced on the grounded at least one conductive side surface may cause the second parasitic resonance. The second parasitic resonance may shift the frequency band of the first parasitic resonance. For example, the second parasitic resonance may cause the resonance-splitting phenomenon with respect to the first parasitic resonance.
With reference to
With reference to
With reference to
For example, the first housing 1051, the hinge structure 1061, and the second housing 1052 of the electronic device 3200 in the folded state may become equivalent to the form of a shielded parallel plate. Since the electric field (E-Field) of the electronic device 3200 in the folded state is proportional to potential, the potential may be zero (0) in the hinge structure 1061 to which the first housing 1051 and the second housing 1052 are grounded and magnitude of the electric field may be zero (0) accordingly. Alternatively, in the electronic device 3200 in the folded state, since the potential increases as a distance away from the hinge structure 1061 increases, the magnitude of the electric field may also increase.
The surface current induced on the surface of the electronic device 3200 in the folded state may flow from the hinge structure 1061 into one side surface of the first housing 1051, from one side surface of the first housing 1051 into the other side surface of the first housing 1051, from the other side surface of the first housing 1051 into the other side surface of the second housing 1052, from the other side surface of the second housing 1052 into the one side surface of the second housing 1052, and from one side surface of the second housing 1052 back into the hinge structure 1061 in a circulative manner.
In an embodiment, the electronic device 3200 may be and/or may include a foldable terminal having conductive side surfaces or metal frames (e.g., first side surface 313a, second side surface 313b, third side surface 313c, first corner 313d, second corner 313e, fourth side surface 323a, fifth side surface 323b, sixth side surface 323c, third corner 323d, and fourth corner 323e). For example, each of the first housing 1051 and the second housing 1052 may include conductive side surfaces. The surface current may be induced on at least one of the conductive side surfaces as a portion of at least one of the first housing 1051 and the second housing 1052. A direction of the surface current induced on at least one of the conductive side surfaces may be the same as a direction of the surface current induced to the first housing 1051 or a direction of the surface current induced to the second housing 1052. The surface current induced to the first housing 1051 or the second housing 1052 may cause the first parasitic resonance. At least one of the conductive side surfaces may be grounded to at least one support member of the first housing 1051 or the second housing 1052. When at least one of the conductive side surfaces is grounded to at least one support member of the first housing 1051 or the second housing 1052, the surface current (e.g., second surface current J2) that flows in a direction opposite to that of the surface current (e.g., first surface current J1) induced to the first housing 1051 or the second housing 1052 may be induced on the surface of the grounded conductive side. The surface current induced on the surface of the grounded conductive side surface may cause the second parasitic resonance. The second parasitic resonance may shift the frequency band of the first parasitic resonance. For example, the resonance-splitting phenomenon may occur between a frequency of the second parasitic resonance and a frequency of the first parasitic resonance.
With reference to
With reference to
With reference to
One end of the high-pass filter 1300 may be electrically connected to a feed (e.g., Main 3 Feed) of the second housing 320. For example, the feed may include and/or may be similar in many respects to the wireless communication module 192 of
One end of the capacitor 1410 may be electrically connected to the other end of the high-pass filter 1300 and one end of the first inductor 1420. The other end of the capacitor 1410 may be electrically connected to one end of the second inductor 1430 and one end of the first connection element 1471.
One end of the first inductor 1420 may be electrically connected to the other end of the high-pass filter 1300 and one end of the capacitor 1410. The other end of the first inductor 1420 may be electrically connected to the first port 1441.
One end of the second inductor 1430 may be electrically connected to the other end of the capacitor 1410 and one end of the first connection element 1471. The other end of the second inductor 1430 may be electrically connected to the second port 1442.
One end of the first connection element 1471 may be electrically connected to the other end of the capacitor 1410 and one end of the second inductor 1430. The other end of the first connection element 1471 may be electrically connected to the fifth side surface 323b.
One end of the first ground element 1450 may be electrically connected to the third port 1443. The other end of the first ground element 1450 may be electrically connected to the second plate assembly 362 of the second housing 320.
One end of the second ground element 1460 may be electrically connected to the fourth port 1444. The other end of the second ground element 1460 may be grounded to the second plate assembly 362 of the second housing 320.
One end of the second connection element 1472 may be electrically connected to the switch 1440. For example, the other end of the second connection element 1472 may be electrically connected to the third corner 323d.
An electronic device 300, according to an embodiment of the present disclosure, may include a first housing 310; a hinge structure 340 configured to couple with one side surface of the first housing 310; a second housing 320 configured to couple with the hinge structure 340 to face the first housing 310 using the hinge structure 340 as the central axis; and a wireless communication circuit 192 provided to a second support member 3231 provided to the second housing 320. The second housing 320 may include a sixth side portion 323c including a conductive portion; a fifth side portion 323b provided to face the sixth side portion 323c and including a conductive portion; a fourth side portion 323a provided to face the hinge structure 340 and including a conductive portion; a third corner portion 323d provided between the sixth side portion 323c and the fourth side portion 323a and including a conductive portion; a fourth corner portion 323e provided between the fifth side portion 323b and the fourth side portion 323a and including a conductive portion; and a first matching circuit unit 921 provided to the second support member 3231 and electrically connected to the sixth side portion 323c to induce second surface current J2 of which phase is opposite to that of first surface current J1 induced to the first housing 310, the second housing 320, and the hinge structure 340 when the electronic device 300 is in a folded state in which the first housing 310 and the second housing 320 are folded with respect to each other using the hinge structure 340 as the central axis.
Second parasitic resonance 521 formed by the second surface current J2 may be configured to shift a frequency band of first parasitic resonance induced by the first surface current.
The electronic device 300 may further include a first ground member 421 configured to ground the fourth side surface portion 323a to the second support member 3231.
The electronic device 300 may further include a first connecting portion 821 configured to electrically connect the fourth side portion 323a and the corner portion 323d.
The first connecting portion 821 may include a first switch 821a provided to the second support member 3231.
The first switch 821a may be turned on when the electronic device 300 is in the folded state and the first switch 821a may be turned off when the electronic device 300 is not in the folded state.
The fourth side portion 323a may be configured to receive an electrical signal from the wireless communication circuit 192 and to operate as a radiator 700 along with the first corner portion 313d.
One end of the first matching circuit unit 921 may be electrically connected to a first point of the second support member 3231. The other end of the first matching circuit unit 921 may be electrically connected to a first point of the sixth side portion 323c.
The first matching circuit unit 921 may include a second switch 921a and at least one first inductor 921b, and the second switch 921a may be turned on when the electronic device 300 is in the folded state and turned off when the electronic device 300 is not in the folded state.
A frequency of the second parasitic resonance 521 may have an electrical length from one end to the other end of the sixth side portion 323c in the first matching circuit unit 921.
An electronic device 300, according to an embodiment of the present disclosure, may include a first housing 310; a hinge structure 340 configured to couple with one side surface of the first housing 310; a second housing 320 configured to couple with the hinge structure 340 to face the first housing 310 using the hinge structure 340 as the central axis; and a wireless communication circuit 192 provided to a second support member 3231 provided to the second housing 320. The second housing 320 may include a sixth side portion 323c including a conductive portion; a fifth side portion 323b provided to face the sixth side portion 323c and including a conductive portion; a fourth side portion 323a provided to face the hinge structure 340 and including a conductive portion; a first corner portion 313d provided between the sixth side portion 323c and the fourth side portion 323a and including a conductive portion; a second corner portion 313e provided between the fifth side portion 323b and the fourth side portion 323a and including a conductive portion; and a first matching circuit unit 921 provided to the second support member 3231 and electrically connected to the sixth side portion 323c and the first corner portion 313d to induce second surface current J2 of which phase is opposite to that of first surface current J1 induced to the first housing 310, the second housing 320, and the hinge structure 340 when the electronic device 300 is in a folded state in which the first housing 310 and the second housing 320 are folded with respect to each other using the hinge structure 340 as the central axis.
Second parasitic resonance 521 formed by the second surface current J2 may be configured to shift a frequency band of first parasitic resonance induced by the first surface current.
The electronic device 300 may further include a first ground member 421 configured to ground the fourth side portion 323a to the second support member 3231.
The electronic device 300 may further include a first connecting portion 821 configured to electrically connect the fourth side portion 323a and the first corner portion 313d.
The first connecting portion 821 may include a first switch 821a provided to the second support member 3231.
The first switch 821a may be turned on when the electronic device 300 is in the folded state and the first switch 821a may be turned off when the electronic device 300 is not in the folded state.
The fourth side portion 323a may be configured to receive an electrical signal from the wireless communication circuit 192 and to operate as a radiator 700 along with the third corner portion 323d.
One end of the first matching circuit unit 921 may be electrically connected to a second point of the sixth side portion 323c. The other end of the first matching circuit unit 921 may be electrically connected to a second point of the third corner portion 323d.
The first matching circuit unit 921 may include a second switch 921a and at least one first inductor 821b.
The second switch 921a may be turned on when the electronic device 300 is in the folded state and turned off when the electronic device 300 is not in the folded state.
While this invention has been described with reference to illustrative embodiments, this description is not intended to be construed in a limiting sense. Various modifications and combinations of the illustrative embodiments, as well as other embodiments of the invention, may be apparent to persons skilled in the art upon reference to the description. It is therefore intended that the appended claims encompass any such modifications or embodiments.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2023-0094644 | Jul 2023 | KR | national |
| 10-2023-0097076 | Jul 2023 | KR | national |
This application is a continuation application of International Application No. PCT/KR2024/010552, filed on Jul. 22, 2024, which claims priority to Korean Patent Application No. 10-2023-0094644, filed on Jul. 20, 2023, and Korean Patent Application No. 10-2023-0097076, filed on Jul. 25, 2023, in the Korean Intellectual Property Office, the disclosures of which are incorporated by reference herein in their entireties.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/KR2024/010552 | Jul 2024 | WO |
| Child | 18788993 | US |
