Claims
- 1. In a mold device comprising pin members provided projecting from an upper mold or a lower mold in order to form a frame having pores arranged at given pitches,
the lower mold or the upper mold opposed to the respective projecting end portions of the pin members having a depression such that said pin members can be formed projecting longer than the wall thickness of the frame and that an inflow bypass portion kept at a given space from the respective projecting end portions of said pin members can be provided in positions for the pin members.
- 2. An electronic apparatus manufacturing method for molding a frame of an electronic apparatus having pores arranged at given pitches, by means of the mold device according to claim 1, comprising:
a flowing process for causing a molten metal to flow in said inflow bypass portion and diffuse throughout the interior of the mold device; a solidifying process for solidifying the molten metal introduced into the mold device in said flowing process, thereby forming a molded piece; and a working process for forming penetrating pores by machining a raised portion corresponding to said depression of the molded piece formed in said solidifying process and making the raised portion flush with the other portion.
- 3. In an electronic apparatus comprising a frame formed having pores arranged at given pitches,
said pores being initially surrounded by a raised portion formed having pore shapes deeper than the wall thickness of said frame, the electronic apparatus having a machined surface around the penetrating pores formed by machining the raised portion so that the raised portion is flush with the other portion of the frame.
- 4. In an electronic apparatus comprising a frame formed having pores arranged at given pitches,
said pores being initially surrounded by a raised portion formed having pore shapes deeper than the wall thickness of said frame, said penetrating pores being formed by removing the raised portion by machining.
- 5. An electronic apparatus according to claim 3, wherein said frame is formed of a magnesium alloy as a material.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-173019 |
Jun 1998 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a Continuation Application of PCT Application No. PCT/JP99/01762, filed Apr. 2, 1999, which was not published under PCT Article 21(2) in English.
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/JP99/01762 |
Apr 1999 |
US |
Child |
09737870 |
Dec 2000 |
US |