Patent Grant
11742133
This application is a national stage application under 35 U.S.C. 371 and claims the benefit of PCT Application No. PCT/JP2017/014612 having an international filing date of 10 Apr. 2017, which designated the United States, which PCT application claimed the benefit of Japanese Patent Application No. 2016-136736 filed 11 Jul. 2016, the entire disclosures of each of which are incorporated herein by reference.
The present disclosure relates to an electronic component, a bonding structure, a power supply device, and an electric vehicle.
Conventionally, various proposals relating to power supply units used for electronic devices have been made. For example, Patent Document 1 below describes a transformer used for a power supply unit. Incidentally, as a standard of conversion efficiency in a power supply unit when conversion from alternating current to direct current is performed, there is a standard called “80Plus”. In the standard, a highest level of conversion efficiency is required in a level of titanium (Titanium).
Patent Document 1: JP 2008-270347 A
In such a field, it is desired to reduce loss in the power supply unit and achieve high efficiency in order to satisfy a higher level in the above-described standard, for example.
Therefore, one object of the present disclosure is to provide an electronic component, a bonding structure, a power supply device, and an electric vehicle, which are capable of achieving high efficiency.
In order to achieve the above-described object, the present disclosure is, for example,
an electronic component including
a secondary side coil including a plurality of coil parts,
in which the coil part includes:
a plate-like base part;
a leg part formed on the base part; and
a pin part formed at a tip of the leg part.
Further, the present disclosure is, for example,
an electronic component including
a secondary side coil including a plurality of coil parts,
in which the coil part includes:
a plate-like base part;
a leg part formed on the base part; and
at least one of a pin part formed at a tip of the leg part or a hole formed in the vicinity of the tip.
Further, the present disclosure is, for example,
a bonding structure including:
a plurality of first members arranged in a predetermined direction; and
a second member that supports the plurality of first members,
in which a solder inflow space along the predetermined direction is formed in a state where the plurality of first members is supported by the second member.
Further, the present disclosure may be
a power supply device including the above-described electronic component.
Further, the present disclosure may be an electric vehicle including the power supply device.
According to at least one embodiment of the present disclosure, loss in a power supply unit can be reduced to achieve high efficiency. Note that effects of the present disclosure is not necessarily limited to the effect described above, but may include any effect described herein. Further, content of the present disclosure should not be interpreted as limited by the exemplary effects.
Hereinafter, an embodiment and the like of the present disclosure will be described with reference to the drawings. Note that the description will be given in the following order.
<1. One Embodiment>
<2. Application Example>
<3. Modification>
The embodiments and the like described below are preferred specific examples of the present disclosure, and content of the present disclosure is not limited to these embodiments and the like.
Further, in the following description, expressions that define directions such as upward, downward, leftward, and rightward on the basis of illustrated directions or the like may be used, but this is for facilitating understanding of the present disclosure, and the content of the present disclosure is not limited to the directions. Further, the illustrated directions or illustrated sizes of members may be appropriately changed, for facilitating the understanding of the present disclosure.
Pin parts of a secondary side coil of the transformer 10 as described later are inserted into the through holes 21a and 21b. Then, after the bus bars 31 and 32 are attached from sides of side surfaces of the substrate 20 to the pin parts exposed on the side of the back surface 20a, soldering is performed from the side of the back surface 20a. With this arrangement, each of the pin parts and the bus bars 31 and 32 are solder-bonded to be electrically connected to the circuit components 22a and 22b via the circuit pattern. Note that any method can be applied as a soldering method, including a known method such as a so-called flow method and a method which is manually performed.
Next, a configuration example of the transformer 10 according to the embodiment of the present disclosure will be described with reference to
As a material of the core 11, a magnetic material such as ferrite can be used. Depending on a use of the transformer 10, the material of the core 11 can be changed from ferrite to a silicon-containing material such as a highlight material, an orientation material, and an amorphous material, or permalloy or the like can also be used as the material of the core 11. Any shape such as an E-shape can be applied to the core 11.
The primary side coil 12 includes an insulation coated wire and the like such as a litz wire and a stranded wire, wound with a predetermined number of turns. End parts (winding start part and winding end part) of the primary side coil 12 are exposed to be connected to appropriate portions. For example, the primary side coil 12 has a configuration in which four layers are formed by connecting two layers formed by one coil in parallel. Details of the secondary side coil 13 will be described later. After each component of the transformer 10 is assembled as described later, the components are integrally fixed by the exterior tape 14.
Next, details of the secondary side coil 13 according to the embodiment of the present disclosure will be described. The secondary side coil 13 includes, for example, a plurality of coil parts, more specifically, a plurality of first coil parts 13a and a plurality of second coil parts 13b.
The pin part 131d includes, for example, a plurality of pins, and in the present embodiment, the pin part 131d includes four pins (a pin 131d1, a pin 131d2, a pin 131d3, and a pin 131d4).
In the leg part 131c, notches 131g and 131h as examples of portions supported by a support part of the bus bar 31 as described later are formed. For example, the notches 131g and 131h are oval through holes formed from the outside to the inside of the leg part 131c. Of course, shapes of the notches 131g and 131h can be changed appropriately. The notches 131g and 131h are not necessarily required to communicate with the outside of the leg part 131c, and may be holes or the like formed in the leg part 131c.
A conductive material can be used as a material of the first coil part 13a, and in present embodiment, tough pitch copper is used. Surface treatment such as application of tin plating may be performed on a surface of the first coil part 13a to prevent oxidation (prevent rust).
The pin part 132d includes, for example, a plurality of pins, and in the present embodiment, the pin part 132d includes four pins (a pin 132d1, a pin 132d2, a pin 132d3, and a pin 132d4).
In the leg part 132c, notches 132g and 132h as examples of portions supported by a support part of the bus bar 32 as described later are formed. For example, the notches 132g and 132h are oval through holes formed from the outside to the inside of the leg part 132c. Of course, shapes of the notches 132g and 132h can be changed appropriately. The notches 132g and 132h are not necessarily required to communicate with the outside of the leg part 132c, and may be holes or the like formed in the leg part 132c.
A conductive material can be used as a material of the second coil part 13b, and in present embodiment, tough pitch copper is used similarly to the case of the first coil part 13a. Surface treatment such as application of tin plating may be performed on a surface of the second coil part 13b to prevent oxidation (prevent rust).
In the present embodiment, the secondary side coil 13 has a configuration including four first coil parts 13a and four second coil parts 13b, in which the first coil parts 13a and the second coil parts 13b are stacked in a vertical direction to form eight layers in the vertical direction. By adopting such a multilayered configuration, it is possible to increase an effective conductor area (an area through which current flows) of the coil part, and can apply a large current. Moreover, with the multilayered configuration, it is possible to effectively use the effective conductor area even in a case where a drive frequency for switching is a high frequency (for example, 100 kilohertz (kHz) to 200 kHz), and therefore an influence of a skin effect and the like can be reduced. Note that that the number of layers can be increased or decreased appropriately depending on an application amount of current or the like.
The coupling parts 131b and the leg parts 131c are appropriately set to have different heights (vertical lengths) in the four first coil parts 13a, and in a state where the four first coil parts 13a are stacked, positions of the pin parts 131d in a height direction are arranged at substantially the same position. Similarly, the coupling parts 132b and the leg parts 132c are appropriately set to have different heights (vertical lengths) in the four second coil parts 13b, and in a state where the four second coil parts 13b are stacked, positions of the pin parts 132d in the height direction are arranged at substantially the same position.
In a state where the first coil parts 13a and the second coil parts 13b are stacked, the leg parts 131c and 132c are arranged to face each other. Moreover, the leg parts 131c of the first coil parts 13a and the leg parts 132c of the second coil parts 13b are arranged along a predetermined direction (a direction indicated by a reference sign AA in
Further, the planted parts 131e and 132e are appropriately set to have different heights (vertical lengths), and in a state where the first and second coil parts 13a and 13b are stacked, the secondary side coil 13 includes the flange parts 131f and 132f forming eight layers in the vertical direction (see
Moreover, positions where the notches 131g and 131h are formed in each first coil part 13a are set such that the positions in the height direction of the notches 131g and 131h in the leg parts 131c are substantially the same positions when the four first coil parts 13a are stacked. Similarly, positions where the notches 132g and 132h are formed in each second coil part 13b are set such that the positions in the height direction of the notches 132g and 132h in the leg parts 132c are substantially the same positions when the four second coil parts 13b are stacked.
As illustrated in
Next, a configuration example of the bus bars 31 and 32 will be described.
Next, an example of attaching the above-described bus bars 31 and 32 to the secondary side coil 13 will be described.
As illustrated in
In a state where the bus bar 31 is attached to the first coil part 13a, a space into which solder flows is formed between the pin part 131d and the protruded part 312. This space communicates, for example, with an internal space defined by the base 311 of the bus bar 31 along an arrangement direction AA of the leg parts 131c. Specifically, a space SP1 is formed among the pin 131d1, the pin 131d2, and the protrusion 312c. A space SP2 is formed among the pin 131d2, the pin 131d3, and the protrusion 312b. A space SP3 is formed among the pin 131d3, the pin 131d4, and the protrusion 312a.
As illustrated in
In a state where the bus bar 32 is attached to the second coil part 13b, a space into which solder flows is formed between the pin part 132d and the protruded part 322. This space communicates, for example, with an internal space defined by the base 321 of the bus bar 32 along an arrangement direction of the leg parts 132c. Specifically, a space SP1a is formed among the pin 132d1, the pin 132d2, and the protrusion 322c. A space SP2a is formed among the pin 131d2, the pin 131d3, and the protrusion 322b. A space SP3a is formed among the pin 131d3, the pin 131d4, and the protrusion 322a.
Next, a bonding structure in the embodiment of the present disclosure will be described with reference to
As illustrated in
As illustrated in
As an assumed technology (not a conventional technology), a configuration in which the pin part is not provided at the tip of the leg part of the first coil part can be considered. However, in this configuration, while the first coil part in a first layer and the first coil part in a fourth layer, which are located on front surface sides, can be solder-bonded over a large area by performing soldering to the peripheral surface, inner layer portions in a second layer and a third layer are bonded only at the peripheral surface of the pin part, and accordingly, bonding strength cannot be improved.
However, by forming solder inflow paths (for example, the spaces SP1, SP2, and SP3) along the arrangement direction of the plurality of leg parts as in the above-described solder-bonding structure, it is possible to allow the solder to flow not only onto the peripheral surface of the pin part but also inside the pin part (the surfaces between the pins). With this arrangement, it is possible to stabilize a solder-bonding state, and also to stabilize an electrical bonding state. Further, since a solder-bonding area can be increased, and a stable and uniform solder-bonding state can be achieved, loss in a solder-bonding portion can be reduced. Therefore, high efficiency can be achieved. Further, since the bonding state of the solder is stabilized, vibration resistance and impact resistance can be improved, and reliability in a long-term operation under a severe use environment (a temperature cycle and the like) can be secured.
Further, with the above-described solder-bonding structure, an entire solder-bonding portion can be sufficiently preheated, and therefore, variations in the bonding state of the solder and a failure in solder-bonding can be prevented. Further, since there is no need to change a conventional process, production cost is not increased.
Note that, although electrical bonding can be performed by mechanical contact fixation using screws, nuts, or the like, for example, high efficiency is hindered by increase in contact resistance between the coil parts and between the screws and nut parts, and additional components necessary for mechanical fixation such as the screws and the nuts are required. Thus, there is a problem that a structure becomes large-sized and cost increases due to increase in the number of components. However, in the above-described embodiment, these problems do not occur since no new components are required.
The technology according to the present disclosure is applicable to a variety of products. For example, the present disclosure can be implemented as a power supply device in which the power supply unit according to the above-described embodiment is connected to a power supply part or the like. Moreover, such a power supply device may be implemented as a device mounted on any type of moving body such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility, an airplane, a drone, a ship, a robot, a construction machine, or an agricultural machine (a tractor).
Each control unit includes a microcomputer that performs operation processing in accordance with various programs, a storage part that stores the programs, parameters used for various operations, or the like executed by the microcomputer, and a drive circuit that drives devices subjected to various types of control. Each control unit includes a network I/F that performs communication with other control units via the communication network 7010, and a communication I/F that performs communication with devices, sensors, or the like inside and outside a vehicle by wired communication or wireless communication.
The drive system control unit 7100 controls operation of devices related to a drive system of a vehicle in accordance with various programs. For example, the drive system control unit 7100 functions as a control device for a drive force generation device such as an internal combustion engine or a drive motor that generates a drive force of the vehicle, a drive force transmission mechanism that transmits the drive force to wheels, a steering mechanism that adjusts a steering angle of the vehicle, a braking device that generates a braking force of the vehicle, and the like. The drive system control unit 7100 may have a function of a control device for an antilock brake system (ABS), an electronic stability control (ESC) or the like.
The drive system control unit 7100 is connected to a vehicle state detection part 7110. The vehicle state detection part 7110 includes, for example, at least one of a gyro sensor that detects an angular velocity of an axial rotation motion of a vehicle body, an acceleration sensor that detects acceleration of the vehicle, or a sensor that detects an operation amount of an accelerator pedal, an operation amount of a brake pedal, a steering angle of a steering wheel, an engine speed, a rotation speed of the wheel, or the like. The drive system control unit 7100 uses a signal input from the vehicle state detection part 7110 to perform operation processing, and controls an internal combustion engine, a drive motor, an electric power steering device, a brake device, or the like.
The body system control unit 7200 controls operation of various devices equipped to the vehicle body in accordance with various programs. For example, the body system control unit 7200 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as a head lamp, a back lamp, a brake lamp, a blinker, or a fog lamp. In this case, the body system control unit 7200 can receive radio waves transmitted from a portable machine that serves instead of a key or signals of various switches. The body system control unit 7200 receives input of these radio waves or signals, and controls a vehicle door lock device, a power window device, a lamp, or the like.
The battery control unit 7300 controls a secondary battery 7310 serving as a power supply source of the drive motor in accordance with various programs. For example, the battery control unit 7300 receives information such as a battery temperature, a battery output voltage, or a remaining battery capacity from a battery device including the secondary battery 7310. The battery control unit 7300 uses these signals to perform operation processing, and performs temperature adjustment control on the secondary battery 7310 or control on a cooling device or the like included in the battery device.
The vehicle exterior information detection unit 7400 detects information regarding the outside of the vehicle mounting the vehicle control system 7000. For example, the vehicle exterior information detection unit 7400 is connected to at least one of an imaging part 7410 or a vehicle exterior information detection part 7420. The imaging part 7410 includes at least one of a time of flight (ToF) camera, a stereo camera, a monocular camera, an infrared camera, or other cameras. The vehicle exterior information detection part 7420 includes, for example, at least one of an environmental sensor that detects current weather, or an ambient information detection sensor that detects another vehicle, an obstacle, a pedestrian, or the like around the vehicle mounting the vehicle control system 7000.
The environmental sensor may be, for example, at least one of a raindrop sensor that detects rainy weather, a fog sensor that detects fog, a sunshine sensor that detects a degree of sunshine, or a snow sensor that detects a snowfall. The ambient information detection sensor may be at least one of an ultrasonic sensor, a radar device, or a light detection and ranging, laser imaging detection and ranging (LIDAR) device. These imaging part 7410 and vehicle exterior information detection part 7420 may be installed as independent sensors or devices, or as a device into which a plurality of sensors or devices is integrated.
Here,
Note that
Vehicle exterior information detection parts 7920, 7922, 7924, 7926, 7928, and 7930 provided to a front, a rear, sides, corners, and the upper part of the windshield in the vehicle compartment of the vehicle 7900 may be, for example, ultrasonic sensors or radar devices. The vehicle exterior information detection parts 7920, 7926, and 7930 provided to the front nose, the rear bumper, the back door, and the upper part of the windshield in the vehicle compartment of the vehicle 7900 may be, for example, LIDAR devices. These vehicle exterior information detection parts 7920 to 7930 are used mainly to detect a preceding vehicle, a pedestrian, an obstacle, or the like.
The description will be continued with reference to
Further, the vehicle exterior information detection unit 7400 may perform image recognition processing of recognizing a person, an automobile, an obstacle, a traffic sign, a letter on a road, or the like, or a distance detection processing on the basis of the received image data. The vehicle exterior information detection unit 7400 may perform distortion correction processing, positioning processing, or the like on the received image data, and combine image data imaged by a different imaging part 7410 to generate an overhead image or a panoramic image. The vehicle exterior information detection unit 7400 may use the image data imaged by the different imaging part 7410 to perform viewpoint conversion processing.
The in-vehicle information detection unit 7500 detects information regarding the inside of the vehicle. The in-vehicle information detection unit 7500 is connected, for example, to a driver state detection part 7510 that detects a state of a driver. The driver state detection part 7510 may include a camera that images the driver, a biological sensor that detects biological information of the driver, a microphone that picks up a sound in the vehicle compartment, or the like. The biological sensor is provided, for example, to a seating surface or the steering wheel, and detects the biological information of a passenger sitting on a seat or the driver gripping the steering wheel. The in-vehicle information detection unit 7500 may compute a degree of tiredness or a degree of concentration of the driver or determine whether or not the driver have a doze, on the basis of the detection information input from the driver state detection part 7510. The in-vehicle information detection unit 7500 may perform processing such as noise cancelling processing on a picked-up sound signal.
The integrated control unit 7600 controls an overall operation inside the vehicle control system 7000 in accordance with various programs. The integrated control unit 7600 is connected to an input part 7800. The input part 7800 is implemented by a device on which an input operation can be performed by a passenger, for example, a touch panel, a button, a microphone, a switch, or a lever. The integrated control unit 7600 may receive data obtained by sound recognition on the sound input by the microphone. For example, the input part 7800 may be a remote control device that uses infrared light or other radio waves, or an external connection device such as a mobile phone or a personal digital assistant (PDA) corresponding to operation of the vehicle control system 7000. The input part 7800 may be, for example, a camera, and in that case, the passenger can input information through gesture. Alternatively, data obtained by detection of a movement of a wearable device worn by the passenger may be input. Moreover, the input part 7800 may include, for example, an input control circuit that generates an input signal on the basis of the information input by the passenger or the like using the above-described input part 7800, and outputs the generated input signal to the integrated control unit 7600. By operating the input part 7800, the passenger or the like inputs various data to the vehicle control system 7000 and instructs the vehicle control system 7000 to perform processing operation.
The storage part 7690 may include a read only memory (ROM) that stores various programs to be executed by the microcomputer, and a random access memory (RAM) that stores various parameters, operation results, sensor values, or the like. Further, the storage part 7690 may be implemented by a magnetic storage device such as a hard disk drive (HDD), a semiconductor storage device, an optical storage device, a magneto-optical storage device, or the like.
The general-purpose communication I/F 7620 is a versatile communication I/F that mediates communication between a variety of devices in an external environment 7750. The general-purpose communication I/F 7620 may implement a cellular communication protocol such as global system of mobile communications (GSM), WiMAX, long term evolution (LTE) or LTE-Advanced (LTE-A), or other wireless communication protocols such as a wireless LAN (also referred to as Wi-Fi (registered trademark)) or Bluetooth (registered trademark). The general-purpose communication I/F 7620 may be connected to a device (for example, an application server or a control server) on an external network (for example, the Internet, a cloud network, or a network specific to a service provider), for example, via a base station or an access point. Further, the general-purpose communication I/F 7620 may be connected to a terminal (for example, a terminal of a driver, a pedestrian, or a store, or a machine type communication (MTC) terminal) in the vicinity of the vehicle, for example, using peer-to-peer (P2P) technology.
The dedicated communication I/F 7630 is a communication I/F that supports a communication protocol defined for the purpose of use for vehicles. For example, the dedicated communication I/F 7630 may implement a standard protocol such as wireless access in vehicle environment (WAVE), which is a combination of IEEE802.11p for a lower layer and IEEE1609 for an upper layer, dedicated short range communications (DSRC), or a cellular communication protocol. The dedicated communication I/F 7630 typically carries out V2X communication, which is a concept including one or more of vehicle-to-vehicle communication, vehicle-to-infrastructure communication, vehicle-to-home communication, and vehicle-to-pedestrian communication.
The positioning part 7640 receives, for example, global navigation satellite system (GNSS) signals (for example, global positioning system (GPS) signals from a GPS satellite) from a GNSS satellite to execute positioning, and generates position information including latitude, longitude, and altitude of the vehicle. Note that the positioning part 7640 may identify a current position by exchange of signals with a wireless access point, or acquire the position information from a terminal such as a mobile phone, a PHS, or a smartphone that has a positioning function.
The beacon reception part 7650 receives radio waves or electromagnetic waves, for example, from a wireless station installed on a road, and acquires information such as the current position, traffic congestion, closed roads, or necessary time. Note that a function of the beacon reception part 7650 may be included in the above-described dedicated communication I/F 7630.
The in-vehicle device I/F 7660 is a communication interface that mediates connections between the microcomputer 7610 and a variety of in-vehicle devices 7760 in the vehicle. The in-vehicle device I/F 7660 may use a wireless communication protocol such as a wireless LAN, Bluetooth (registered trademark), near field communication (NFC), or a wireless USB (WUSB) to establish a wireless connection. Further, the in-vehicle device I/F 7660 may establish a wired connection such as a universal serial bus (USB), a high-definition multimedia interface (HDMI), or a mobile high-definition link (MHL), via a connection terminal which is not illustrated (and a cable if necessary). The in-vehicle devices 7760 may include, for example, at least one of a mobile device or a wearable device of a passenger, or an information device carried into or attached to the vehicle. Further, the in-vehicle devices 7760 may include a navigation device that performs a route search to an arbitrary destination. The in-vehicle device I/F 7660 exchanges control signals or data signals with these in-vehicle devices 7760.
The in-vehicle network I/F 7680 is an interface that mediates communication between the microcomputer 7610 and the communication network 7010. The in-vehicle network I/F 7680 transmits and receives signals or the like in compliance with a predetermined protocol supported by the communication network 7010.
The microcomputer 7610 of the integrated control unit 7600 controls the vehicle control system 7000 in accordance with various programs on the basis of information acquired via at least one of the general-purpose communication I/F 7620, the dedicated communication I/F 7630, the positioning part 7640, the beacon reception part 7650, the in-vehicle device I/F 7660, or the in-vehicle network I/F 7680. For example, the microcomputer 7610 may calculate a control target value of the drive force generation device, the steering mechanism, or the braking device on the basis of acquired information regarding the inside and outside of the vehicle, and output a control instruction to the drive system control unit 7100. For example, the microcomputer 7610 may perform cooperative control for the purpose of implementing functions of an advanced driver assistance system (ADAS) including vehicle collision avoidance or impact reduction, follow-up driving based on an inter-vehicle distance, constant vehicle speed driving, vehicle collision warning, vehicle lane departure warning, or the like. Further, the microcomputer 7610 may perform cooperative control for the purpose of automatic driving or the like for autonomous travel without depending on an operation of a driver by controlling the drive force generation device, the steering mechanism, the braking device, or the like on the basis of acquired information regarding surroundings of the vehicle.
The microcomputer 7610 may create local map information including information regarding surroundings of the current position of the vehicle on by generating three-dimensional distance information between the vehicle and surrounding structures, objects such as a person, or the like on the basis of information acquired via at least one of the general-purpose communication I/F 7620, the dedicated communication I/F 7630, the positioning part 7640, the beacon reception part 7650, the in-vehicle device I/F 7660, or the in-vehicle network I/F 7680. Further, the microcomputer 7610 may predict danger such as vehicle collisions, approaching pedestrians or the like, or entry to closed roads on the basis of acquired information, and generate a warning signal. The warning signal may be, for example, a signal used to generate a warning sound or turn on a warning lamp.
The sound/image output part 7670 transmits an output signal of at least one of a sound or an image to an output device capable of visually or aurally notifying a passenger of the vehicle or the outside of the vehicle of information. In an example of
Note that, in the example illustrated in
In the vehicle control system 7000 described above, the power supply unit 1 according to the present embodiment described with reference to
Hereinabove, specific description has been given of the embodiment and the like of the present disclosure. However, the content of the present disclosure is not limited to the above-described embodiment, and various modifications based on a technical concept of the present disclosure can be made.
For example, four pins included in each of the four first coil parts 13a and arranged at corresponding positions are assumed to be a pin 131d4-1, a pin 131d4-2, a pin 131d4-3, and a pin 131d4-4. For example, the lengths of the pins are set so that the following expression (1) holds.
pin 131d4-1>pin 131d4-2>pin 131d4-3>pin 131d4-4 (1)
Lengths of pins at other portions are set in a similar way.
With this arrangement, as illustrated in
Note that, in the present Modification 1, it is not necessary that the lengths of all the pins are different, and there may be portions having the same length. For example, the lengths of the pins may be set so that the following expression (2) holds.
pin 131d4-1=pin 131d4-4>pin 131d4-2=pin 131d4-3 (2)
With this arrangement, kinds of the lengths of the pins can be reduced to two kinds.
Note that the present Modification 1 can be similarly applied to a pin part 132d of a second coil part 13b.
A circular hole 135 is formed in the vicinity of a tip of a leg part 131c (in the vicinity of a pin part 131d) of each of the four first coil parts 13a. In the present Modification 2, four holes 135a, 135b, 135c, and 135d are formed. Note that the number of the holes may be one, or a plurality of numbers other than four.
Positions of the holes 135 formed in the leg parts 131c are substantially the same. With this arrangement, as illustrated in
An oval hole 136 as an inflow path of solder is formed in the vicinity of a tip of a leg part 131c (in the vicinity of a pin part 131d) of each of the four first coil parts 13a. In the present Modification 3, sizes of shapes of the four holes 136 are set to be different. With this configuration, a step-shaped portion 137 can be formed along an arrangement direction of the four leg parts 131c. The step-shaped portion 137 is also soldered. Therefore, a solder-bonding area can be increased, and an effect similar to that in the embodiment can be obtained. Note that the step-shaped portion 137 may be formed by appropriately shifting positions where the holes 136 are formed, or the step-shaped portion 137 may be formed by making both the positions where the holes 136 are formed and the sizes of the holes 136 different.
In the above-described embodiment, the configuration using a bus bar has been described. In recent years, thickness of a circuit pattern on a substrate has become thinner. A thickness of a circuit pattern is generally about 35 μm to 100 μm. Even in a case where the number of coil layers in a transformer 10 is increased to increase an effective conductor area of a coil part or the like, the effective conductor area of a substrate circuit pattern part is too small to ensure a sufficient conductor area, and accordingly, loss in the circuit pattern part is increased. As a result, conversion efficiency is reduced. By using a bus bar, a conductor part of the circuit pattern can be complemented, and a circuit impedance can be lowered even in a case where a large current is applied to a circuit. With this arrangement, loss in a circuit part can be minimized and high efficiency can be achieved. As described above, it is possible to cope with a case where a large current is applied by using the bus bar. However, the bus bar may not be used depending on an application amount of current, a use of a power supply unit 1, or the like.
A shape of a secondary side coil can be appropriately changed. For example, a shape of a base part may be a rectangular shape or a polygonal shape instead of a disc shape, and a coupling part may not be provided.
A shape of the bus bar can be appropriately changed. For example, the shape of the bus bar may include only a configuration attached to a back surface side of a substrate, without a support part. In this case, a configuration corresponding to the support part may be formed in first and second coil parts. For example, protruded parts or the like may be formed on the first and second coil parts, and positioning of the first and second coil parts may be performed by engagement and the like of the protruded parts and the substrate.
A multilayered coil part as a solder-bonding portion may be integrated beforehand by welding or caulking. With this arrangement, a cost can be reduced as a result of reduction in the number of working steps.
The configurations, methods, processes, shapes, materials, numerical values, and the like in the above-described embodiment are merely examples, and different configurations, methods, processes, shapes, materials, numerical values, and the like may be used as necessary. Further, matters described in the embodiment and the modifications can be combined with one another as long as technical contradiction does not occur.
Note that the present disclosure can further include the following configurations.
(1)
An electronic component including
a secondary side coil including a plurality of coil parts,
in which each of the coil parts includes:
a plate-like base part;
a leg part formed on the base part; and
a pin part formed at a tip of the leg part.
(2)
The electronic component according to (1), in which lengths of the leg parts of the plurality of coil parts are different from one another.
(3)
The electronic component according to (1) or (2), in which
the secondary side coil includes a plurality of first coil parts and a plurality of second coil parts,
each of the first coil parts includes:
a plate-like first base part;
a first leg part formed on the first base part; and
a first pin part formed at a tip of the first leg part, and
each of the second coil parts includes:
a plate-like second base part;
a second leg part formed to face the first leg part with respect to the second base part; and
a second pin part formed at a tip of the second leg part.
(4)
The electronic component according to any one of (1) to (3), in which
each of the leg parts of the plurality of coil parts is arranged along a predetermined direction.
(5)
The electronic component according to (4), further including
a bus bar bonded to a substrate and the pin part via solder.
(6)
The electronic component according to (5), in which
the bus bar includes a protruded part intersecting with the pin part, and
a space into which the solder flows is formed between the pin part and the protruded part along the predetermined direction.
(7)
The electronic component according to (6), in which
the bus bar includes a support part that integrally supports the plurality of coil parts.
(8)
The electronic component according to (7), in which
a notch supported by the support part is formed in the leg part of each of the coil parts.
(9)
The electronic component according to any one of (1 to (8), in which
each of the coil parts includes:
a planted part planted from the base part; and
a flange part formed at a tip of the planted part.
(10)
The electronic component according to (9), in which lengths of the planted parts of the plurality of coil parts are different from one another.
(11)
The electronic component according to any one of (1 to (10), in which
a hole is formed in a vicinity of the tip of the leg part.
(12)
The electronic component according to (11), in which
a plurality of the holes is formed.
(13)
The electronic component according to (11) or (12), in which
at least one of a position where the hole is formed in each of the coil parts or a size of the hole is different.
(14)
The electronic component according to any one of (1) to (13), in which
lengths of the pin parts of the coil parts are different.
(15)
The electronic component according to any one of (1) to (14), in which
the base part has a disc shape.
(16)
The electronic component according to (15), in which
the leg part extends from one end side of the disk-shaped base part and the planted part is planted from another end side of the disk-shaped base part.
(17)
An electronic component including
a secondary side coil including a plurality of coil parts,
in which each of the coil parts includes:
a plate-like base part;
a leg part formed on the base part; and
at least one of a pin part formed at a tip of the leg part or a hole formed in a vicinity of the tip.
(18)
A bonding structure including:
a plurality of first members arranged in a predetermined direction; and
a second member that supports the plurality of first members,
in which a solder inflow space along the predetermined direction is formed in a state where the plurality of first members is supported by the second member.
(19)
A power supply device including
the electronic component according to any one of (1) to (17).
(20)
An electric vehicle including
the power supply device according to (19).
10 Transformer
13 Secondary side coil
13
a First coil part
13
b Second coil part
31, 32 Bus bar
131
a, 132a Base part
131
c, 132c Leg part
131
d, 132d Pin part
131
e, 132e Planted part
131
f, 132f Flange part
135 Hole
312, 322 Protruded Part
313, 323 Support Part
131
g, 131h, 132g, 132h Notch
SP Space
| Number | Date | Country | Kind |
|---|---|---|---|
| 2016-136736 | Jul 2016 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2017/014612 | 4/10/2017 | WO |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2018/012065 | 1/18/2018 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 6522233 | Kyoso | Feb 2003 | B1 |
| 9000878 | Lazzerini | Apr 2015 | B1 |
| 9378883 | Tsai | Jun 2016 | B2 |
| 20100033282 | Hsu | Feb 2010 | A1 |
| 20100188830 | Tsai | Jul 2010 | A1 |
| 20110221558 | Yeh | Sep 2011 | A1 |
| 20130141878 | Wu | Jun 2013 | A1 |
| 20130188329 | Chang | Jul 2013 | A1 |
| 20140062634 | Hsu | Mar 2014 | A1 |
| 20160086718 | Tsai | Mar 2016 | A1 |
| Number | Date | Country |
|---|---|---|
| H07-038260 | Feb 1995 | JP |
| 2004-303823 | Oct 2004 | JP |
| 2008-270347 | Nov 2008 | JP |
| 2009-032992 | Feb 2009 | JP |
| 2014-233192 | Dec 2014 | JP |
| Entry |
|---|
| Extended European Search Report for European Patent Application No. 17827199.5, dated Jul. 4, 2019, 11 pages. |
| Official Action (with English translation) for Chinese Patent Application No. 201780042015.6, dated Oct. 28, 2020, 15 pages. |
| International Search Report prepared by the Japan Patent Office dated Jun. 21, 2017, for International Application No. PCT/JP2017/014612. |
| Number | Date | Country | |
|---|---|---|---|
| 20190252112 A1 | Aug 2019 | US |
