Claims
- 1. An electronic component, comprising a first diode and a second diode disposed in a common package, each of said diodes having a capacitance adjustable, through a control voltage, over a capacitance range between a minimum capacitance and a maximum capacitance, and each of said diodes having a capacitance characteristic curve depending on the control voltage, said characteristic curve of said second diode having a fixed, known relationship to said characteristic curve of said first diode.
- 2. The electronic component according to claim 1, wherein each diode has a variation ratio, defined as a quotient of the maximum capacitance and the minimum capacitance, and said variation ratio of said first diode is identical to said variation ratio of said second diode
- 3. The electronic component according to claim 1, wherein said first diode and said second diode are monolithically integrated in the component.
- 4. The electronic component according to claim 1, wherein said first diode and said second diode have mutually different adjustable capacitance ranges.
- 5. The electronic component according to claim 1, wherein said first and second diodes are adjacent diodes having opposite polarity.
- 6. The electronic component according to claim 1, wherein said diodes have cathode contacts, and resistors are connected between said cathode contacts of said diodes.
- 7. The electronic component according to claim 1, wherein said diodes have cathode contacts, and a coupling diode has a cathode contact connected to said cathode contacts of said first diode and of said second diode.
- 8. The electronic component according to claim 1, which further comprises a switching diode.
- 9. The electronic component according to claim 1, wherein said first and second diodes comprise contacts passed out of the common package.
- 10. In combination with a receiving unit having a first and a second sub-receiving unit, an electronic component according to claim 1, wherein said first diode is a tuning diode in the first sub-receiving unit, and said second diode is a tuning diode in the second sub-receiving unit.
- 11. In combination with a receiving unit having a first and a second sub-receiving unit, a plurality of electronic components each according to claim 1, wherein said first diodes are tuning diodes in the first sub-receiving unit, and said second diodes are tuning diodes in the second sub-receiving unit.
- 12. A fabrication process, comprising fabricating a wafer with a plurality of components according to claim 1 immediately adjacent one another on the wafer, and subsequently dicing the wafer and forming individual chips each with a component according to claim 1.
- 13. A tuner circuit, comprising:
at least one component according to claim 1;a first sub-tuner encompassing said first diode of said component; and a second sub-tuner encompassing said second diode of said component.
- 14. A tuner circuit, comprising:
a plurality of components each according to claim 1;a first sub-tuner encompassing said first diodes of said components; and a second sub-tuner encompassing said second diodes of said components.
Priority Claims (1)
Number |
Date |
Country |
Kind |
100 12 872.6 |
Mar 2000 |
DE |
|
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of copending International Application No. PCT/DE01/00871, filed Mar. 7, 2001, which designated the United States and which was not published in English.
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/DE01/00871 |
Mar 2001 |
US |
Child |
10244641 |
Sep 2002 |
US |