Electronic component cooling apparatus

Information

  • Patent Grant
  • D516526
  • Patent Number
    D516,526
  • Date Filed
    Tuesday, December 23, 2003
    20 years ago
  • Date Issued
    Tuesday, March 7, 2006
    18 years ago
  • US Classifications
    Field of Search
    • US
    • D13 179
    • 165 080300
    • 165 121000
    • 165 122000
    • 165 146000
    • 165 104330
    • 165 180000
    • 165 185000
    • 174 016300
    • 257 706000
    • 257 707000
    • 257 718-722
    • 361 271000
    • 361 274300
    • 361 695000
    • 361 697000
    • 361 700000
    • 361 702000
    • 361 704000
    • 361 709000
    • 361 710000
    • 361 711000
    • 361 514000
    • 361 719000
  • International Classifications
    • 1303
    • Term of Grant
      14Years
      Disclaimer
      This patent is subject to a terminal disclaimer.
Abstract
Description

FIG. 1 is a front side elevation view.


FIG. 2 is a rear side elevation view.


FIG. 3 is a right side elevation view.


FIG. 4 is a left side elevation view.


FIG. 5 is a top plan view.


FIG. 6 is a bottom plan view; and,


FIG. 7 is a perspective view.


Claims
  • The ornamental design for an electronic component cooling apparatus, as shown and described.
Priority Claims (1)
Number Date Country Kind
2003-018124 Jun 2003 JP national
US Referenced Citations (15)
Number Name Date Kind
5597034 Barker et al. Jan 1997 A
D403760 Kodaira et al. Jan 1999 S
D441724 Chou et al. May 2001 S
D441725 Chou et al. May 2001 S
D442565 Chou et al. May 2001 S
D442566 Chou et al. May 2001 S
D450306 Lin et al. Nov 2001 S
6407919 Chou Jun 2002 B1
6418020 Lin Jul 2002 B1
6419007 Ogawara et al. Jul 2002 B1
D464939 Chuang et al. Oct 2002 S
6480383 Kodaira et al. Nov 2002 B1
D476958 Tsai Jul 2003 S
6671172 Carter et al. Dec 2003 B1
D501450 Watanabe et al. Feb 2005 S
Foreign Referenced Citations (1)
Number Date Country
1019375 Aug 1998 JP