This application claims benefit of priority to Japanese Patent Application No. 2013-040587 filed Mar. 1, 2013, the entire content of which is incorporated herein by reference.
The present disclosure relates to an electronic component, and more particularly to an electronic component such as an inductor, etc.
As a conventional electronic component, there is known, for example, a chip coil 500 disclosed by Japanese Patent Laid-Open Publication No. 2003-17336 is shown in
As shown by
In the chip coil 500, around the connection part between the terminal electrode 503a and the wire 502 and the connection part between the terminal electrode 503b and the wire 502, as shown by
An object of the present disclosure is to provide an electronic component wherein the number of turns of a wire wound around a winding base is increased.
An electronic component according to an embodiment of the present disclosure comprises: a core comprising a winding base extending in an axial direction, and a first flange located at an end in the axial direction and having at least one first protruded side surface, which is protruded from the winding base, at least at an end in a first direction, which is one of perpendicular directions that are perpendicular to the axial direction; a wire wound around the winding base; and a first external electrode that is connected to the wire and that is provided on a side surface of the first flange located at an end in one of the perpendicular directions. In the electronic component, a first outer edge of the first flange that crosses the wire when viewed from the first direction has a vector having a component in the axial direction.
This and other objects and features of the present disclosure will be apparent from the following description, with reference to the accompanying drawings, in which:
Electronic components according to some embodiments of the present disclosure will be hereinafter described.
The structure of an electronic component 1A according to a first embodiment is described.
As shown by
The winding base 14, as shown in
The flanges 16A and 18A are located at both x-axis ends of the winding base 14. Specifically, as shown in
The flange 16A, as shown in
The flange 16A has a principal part 16A-1 and an extension 16A-2. The principal part 16A-1 is in the shape of a rectangular parallelepiped and is a negative x-axis part of the flange 16A. The extension 16A-2 is a positive x-axis part of the flange 16A that extends from the negative y-axis portion of the principal part 16A-1 in the positive x-axis direction (toward the center of the winding base 14). The extension 16A-2, when viewed from the z-axis direction, is in a trapezoidal shape having a base parallel to the y-axis. In the following paragraphs, the surfaces of the flange 16A that are perpendicular to the x-axis are referred to as side surfaces, and especially, the surface at the positive z-axis end of the flange 16A is referred to as a side surface S1.
The flange 18A, as shown in
The flange 18A has a principal part 18A-1 and an extension 18A-2. The principal part 18A-1 is in the shape of a rectangular parallelepiped and is a positive x-axis part of the flange 18. The extension 18A-2 is a negative x-axis part of the flange 18A that extends from the positive y-axis portion of the principal part 18A-1 in the negative x-axis direction (toward the center of the winding base 14). The extension 18A-2, when viewed in the z-axis direction, is in a trapezoidal shape having a base parallel to the y-axis. In the following paragraphs, the surfaces of the flange 18A that are perpendicular to the x-axis are referred to as side surfaces, and especially, the surface at the positive z-axis end of the flange 18A is referred to as a side surface S2.
The flanges 16A and 18A are symmetrical with each other with respect to a straight line in parallel to the z-axis that passes the center of the winding base 14. When the electronic component 1A is mounted on a circuit board, the surfaces of the flanges 16A and 18A at the positive z-axis end, that is, the side surfaces S1 and S2 will function as a mounting surface to be opposed to the circuit board.
The external electrode 22 (first external electrode), as shown in
The external electrode 24 (second external electrode), as shown in
The wire 20 is a conductive wire wound around the winding base 14. The negative x-axis end of the wire 20 is connected to the external electrode 22 on the side surface 51, and the positive x-axis end of the wire 20 is connected to the external electrode 24 on the side surface S2. The wire 20 has a core formed primarily from a conductive material such as cupper or silver, and the core is coated with an insulating material such as polyurethane.
In a plan view from the positive z-axis side, as shown by
In a plan view from the positive z-axis side, as shown by
A manufacturing method of the electronic component 1A is hereinafter described.
First, ferrite-based powder is prepared as the material of the core 12. The ferrite powder is filled in a female die, and the powder filled in the female die is pressed with a male die. Thereby, the powder is molded into the core 12 having the wiring base 14, and the flanges 16A and 18A. After the pressing process, the core 12 is sintered, whereby the core 12 is completed.
Next, the external electrodes 22 and 24 are formed on the flanges 16A and 18A, respectively, of the core 12. More specifically, in a container filled with paste of Ag or the like, the side surface S1 of the flange 16A and the side surface S2 of the flange 18A are dipped so that the Ag paste can stick to the side surfaces S1 and S2. Next, the Ag paste stuck on the side surfaces S1 and S2 is baked and dried, whereby Ag films are formed on the side surface S1 of the flange 16A and on the side surface S2 of the flange 18A as base electrodes. Further, a metal film, for example, formed from a Ni-based alloy is formed on each of the Ag films by electroplating or the like. In this way, the external electrodes 22 and 24 as shown in
Next, the wire 20 is wound around the winding base 14. In this moment, both ends of a predetermined length of the wire 20 are led out from the winding base 14. The led-out portions of the wire 20 are connected to the external electrodes 22 and 24, respectively, by thermocompression bonding. Through the processes above, the electronic component 1A is completed.
In the electronic component 1A of the above-described structure, the number of turns of the wire 20 around the winding base 14 is increased. Specifically, as shown by
In the electronic component 1A, since it is not necessary to bend the wire 20 largely in the x-axis direction as described above, the wire 20 is prevented from stresses caused by bends of the wire 20 at both ends.
The structure of an electronic component 1B according to a second embodiment is described with reference to the accompanying drawings.
The electronic component 1B is different from the electronic component 1A in the shapes of the flanges 16A and 18A. There is no other difference between the electronic component 1A and the electronic component 1B, and the other parts of the electronic component 1B are not described here. The flanges of the electronic component 1B are denoted by 16B and 18B. In
When the electronic component 1B is viewed from the z-axis direction, an outer edge L3 of the flange 16B that crosses the wire 20 (first outer edge), as shown in
When the electronic component 1B is viewed from the z-axis direction, an outer edge L4 of the flange 18B that crosses the wire 20 (second outer edge), as shown in
The electronic component 1B of the above-described structure has the same advantageous effects as described in connection with the first embodiment.
The structure of an electronic component 1C according to a third embodiment is described with reference to the accompanying drawings.
The electronic component 1C is made different from the electronic component 1B by shifting the extension 16B-2 of the flange 16B in the y-axis direction to the center of the flange 16B and by shifting the extension 18B-2 of the flange 18B in the y-axis direction to the center of the flange 18B. There is no other difference between the electronic component 1C and the electronic component 1B, and the other parts of the electronic component 1C are not described here. In
The structure of an electronic component 1D according to a fourth embodiment is described with reference to the accompanying drawings.
The electronic component 1D is different from the electronic component 1A in the shapes of the flanges and in the positions of the connection points between the wire 20 and the external electrode 22 and between the wire 20 and the external electrode 24. There is no other difference between the electronic component 1D and the electronic component 1A, and the other parts of the electronic component 1D are not described here. The flanges of the electronic component 1D are denoted by 16D and 18D. In
As shown in
As shown in
The wire 20 is connected to the external electrodes 22 and 24 at connection points CD1 and CD2, respectively, in substantially the center of the flange 16D and in substantially the center of the flange 18D with respect to the y-axis direction.
In the electronic component 1D, an end portion of the wire 20 is drawn from the surface at the positive y-axis side of the winding base 14 to the side surface Si (side surface located at the end in the first direction) of the flange 16D through the side surface S3 of the flange 16D, and the wire 20 is connected to the external electrode 22 on the side surface S1. In a plan view from the z-axis direction, an outer edge L5 of the flange 16D that crosses the wire 20 (first outer edge) is parallel to the x-axis, that is, the vector e of the outer edge L5 has only a component in the x-axis direction.
In the electronic component 1D, the other end portion of the wire 20 is drawn from the surface at the negative y-axis side of the winding base 14 to the side surface S2 (side surface located at the end in the first direction) of the flange 18D through the side surface S4 of the flange 18D, and the wire 20 is connected to the external electrode 24 on the side surface S2. In a plan view from the z-axis direction, an outer edge L6 of the flange 18D that crosses the wire 20 (first outer edge), that is, the vector e of the outer edge L6 has only a component in the x-axis direction.
In the electronic component 1D, it is not necessary to bend the wire 20 in the x-axis direction, and the electronic component 1D does not have such a problem as in the chip coil 500 that winding base 501a has wire-unwound portions P501. Hence, in the electronic component 1D, the wire 20 can be wound around the winding base 14 from one end to the other end, and it is possible to obtain a desired inductance value. The flanges 16D and 18D are of a simpler shape than the flanges 16A and 18A of the electronic component 1A.
In the electronic component 1D, further, the connection point CD1 between the wire 20 and the external electrode 22 and the connection point CD2 between the wire 20 and the external electrode 24 are substantially in the center of the flange 16D and substantially in the center of the flange 18D, respectively, with respect to the y-axis direction. Therefore, at the time of thermocompression bonding of the wire 20 to the external electrode 22 and to the external electrode 24, even if the ends of the wire 20 are disposed out of the intended positions, the wire 20 can be certainly thermocompression-bonded to the external electrodes 22 and 24.
Electronic components according to the present disclosure are not limited to the electronic components 1A to 1D according to the embodiments above, and various changes and modifications are possible within the scope of the disclosure. For example, the connection points between the wire 20 and the external electrode 22 and between the wire 20 and the external electrode 24 do not need to be located on the mounting surface. Also, it is possible to combine the structure according to one of the embodiments with the structure according to another of the embodiments.
In the electronic component 1A, the external electrode 22 is provided on the side surface S1. However, the external electrode 22 may be provided on any other side surface of the flange 16A. Similarly, although the external electrode 24 is provided on the side surface S2, the external electrode 24 may be provided on any other side surface of the flange 18A. Also, each of the external electrodes 22 and 24 may be formed to cover two or more side surfaces. The same also applies to the external electrodes 22 and 24 of the electronic components 1B to 1D.
In the electronic component 1A, the flange 16A protrudes from the winding base 14 in all of the directions perpendicular to the x-axis direction. However, the flange 16A may be of a shape protruding from the winding base 14 at least in the positive z-direction. It is only necessary that the wire 20 runs from the winding base 14 up to the side surface S1 that is the surface located at the positive z-axis end of the flange 16A. In this regard, it is only necessary that the vector a of the outer edge L1 of the flange 16A that crosses the wire 20 when viewed from the positive z-axis direction, as shown by
Further, each of the electronic components 1A to 1D may have only one flange 16A or 18A.
Although the present disclosure has been described in connection with the preferred embodiments above, it is to be noted that various changes and modifications may be obvious to persons skilled in the art. Such changes and modifications are to be understood as being within the scope of the disclosure.
Number | Date | Country | Kind |
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2013-040587 | Mar 2013 | JP | national |