1. Field of the Invention
The invention generally relates to an electronic connector, and more particularly, to an electronic connector module with electrostatic discharge (ESD) component.
2. Description of Related Art
For accessing wired Internet, most types of PC are equipped with a port of local area network (LAN) so as to connect a local network cable. The most common LAN port nowadays is an RJ45 female connector (RJ45 is referred to as a registered jack connector standard), which can be connected to a corresponding RJ45 male connector disposed at the end of a network cable by plugging the male one into the female one.
In an environment where lightning may occur, the external high-voltage current may be transferred into the PC via the RJ45 female connector, so that four pairs of differential signal wires belonging to LAN in the motherboard of the PC must keep a certain distance from the ground and from other signal wires to prevent the high-voltage current on the LAN signal wires from jumping to the ground or other signal wires of the motherboard. The testing to achieve the above-mentioned object is called as Hi-POT testing.
In addition, in a dry environment where static electricity is likely produced, the external static charges may be transferred into the PC via the RJ45 female connector, so that every signal wire belonging to the LAN in the motherboard needs to be grounded through electrostatic discharge (ESD) diode, which enables static charges on any LAN signal wire flowing to the ground via the ESD diode through the shortest path. The testing to achieve the above-mentioned object is called as ESD testing.
According to the requirement of Hi-POT testing, the distance between the LAN signal wires and the ground is designed by taking the maximum impedance as object; on the contrary, according to the requirement of ESD testing, the distance between the LAN signal wires and the ground is designed by taking the minimum impedance as object. However, it is impossible for a single PC to simultaneously satisfy the requirements of both Hi-POT testing and ESD testing.
A PC must pass Hi-POT testing or ESD testing to follow the local law/regulations of market. If the manufacturer is forced by the above-mentioned requirements to design and produce two motherboards respectively passing Hi-POT testing and ESD testing for a same PC, the manufacturer must pay higher cost.
Accordingly, the invention is directed to an electronic connector module for selectively providing ESD protection function.
The invention discloses an electronic connector module. The electronic connector module includes a connector for selectively coupling an ESD protection component. When the connector receives a static electricity, the connector is grounded through the motherboard via the ESD protection component.
Based on the above description, the invention integrates an ESD protection component to an electronic connector and provides ESD protection function by selectively enabling the ESD protection component.
Referring to
In the embodiment, the first electrical contact 112 of the connector 110 is coupled to a ground 12 of a motherboard 10, and the first signal contacts 114 of the connector 110 are respectively coupled to a plurality of signal wires 14 of the motherboard 10 of an electronic apparatus. In this way, when the external static electricity arrives at the first signal contacts 114, the static charges can be directly guided to the ground of the motherboard 10 via the ESD protection circuit 126 without flowing to the signal wires 14 of the motherboard 10.
In summary, in the invention, the ESD protection component is integrated to the electronic connector, and the invention can, according to practical need, provide ESD protection function by enabling the ESD protection component or not through controlling the ESD protection component. In this way, when the motherboard of an electronic apparatus has a circuit architecture conforming with Hi-POT testing standard in advance, the invention is able to switch the above-mentioned circuit architecture conforming with Hi-POT testing standard to a circuit architecture conforming with ESD testing standard so as to lower down the cost.
It will be apparent to those skilled in the art that the descriptions above are several preferred embodiments of the invention only, which does not limit the implementing range of the invention. Various modifications and variations can be made to the structure of the invention without departing from the scope or spirit of the invention. The claim scope of the invention is defined by the claims hereinafter.
This application claims the priority benefits of U.S. provisional application Ser. No. 61/411,457, filed on Nov. 8, 2010. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
| Number | Date | Country | |
|---|---|---|---|
| 61411457 | Nov 2010 | US |