Patent Application
20250150045
The disclosure relates to an electronic device and a method for wireless communication in the electronic device.
Electronic devices are providing more diversified services and additional functions. Steady development efforts are underway for electronic devices to meet various needs of users and to raise the usability of electronic devices. As an example of satisfying user's needs, an electronic device may transmit and receive data to/from an external electronic device. For such data transmission and reception, the radio frequency (RF) circuit of the electronic device may provide a voltage controlled by a power modulator to a power amplifier (PA), thereby transmitting and receiving signals.
In the network environment of fourth generation/fifth generation (4G/5G) communication schemes, power control of the PA for wireless communication is becoming important, and power tracking components (power tracking ICs) are being applied to electronic devices for PA power management. In the network environment of 4G/5G communication schemes, electronic devices must be able to control each PA simultaneously to support uplink (UL) carrier aggregation (CA) or evolved universal terrestrial radio access network (E-UTRAN) new radio dual connectivity (EN-DC) that supports simultaneous transmission (simultaneous 2Tx) of transmission signals for wireless communication. Simultaneous control of PAs for simultaneous 2Tx support may be limited by, e.g., the mounting space of the components (ICs), complexity of the circuit lines, and costs.
The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure.
Aspects of the disclosure are to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide an electronic device and a method for wireless communication in the electronic device.
Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.
In accordance with an aspect of the disclosure, an electronic device is provided. The electronic device includes a wireless communication circuit, memory storing one or more computer programs, and one or more processors communicatively coupled to the wireless communication circuit and the memory, wherein the wireless communication circuit includes a radio frequency processing circuit, a plurality of power amplification circuits, a first power modulator and a second power modulator configured to adjust a voltage output to at least one power amplification circuit connected among the plurality of power amplification circuits, a power switch configured to connect a first power amplification circuit among the plurality of power amplification circuits to the first power modulator or the second power modulator, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to identify power amplification circuits for amplifying, respectively, transmission signals input to the wireless communication circuit, based on the identified power amplification circuits being connected to the first power modulator, control the power switch to connect the first power amplification circuit among the identified power amplification circuits to the second power modulator to simultaneously transmit the transmission signals using the identified power amplification circuits, and based on the identified power amplification circuits being connected to the different first power modulator and second modulator, respectively, control the power switch to connect the first power amplification circuit among the identified power amplification circuits to the first power modulator to simultaneously transmit the transmission signals using the identified power amplification circuits.
In accordance with another aspect of the disclosure, a method for operation in an electronic device is provided. The method includes identifying power amplification circuits supporting different frequency bands for amplifying, respectively, transmission signals input through a wireless communication circuit of the electronic device, based on the identified power amplification circuits being connected to a first power modulator included in the wireless communication circuit, controlling a power switch included in the wireless communication circuit to connect a first power amplification circuit among the identified power amplification circuits to a second power modulator included in the wireless communication circuit to simultaneously transmit the transmission signals using the identified power amplification circuits, and based on the identified power amplification circuits being connected to the different first power modulator and second modulator, respectively, controlling the power switch to connect a first power amplification circuit among the identified power amplification circuits to the first power modulator to simultaneously transmit the transmission signals using the identified power amplification circuits.
In accordance with another aspect of the disclosure, one or more non-transitory computer-readable storage media storing one or more computer program including computer-executable instructions that, when executed by one or more processors of an electronic device individually or collectively, cause the electronic device to perform operations are provided. The operations include identifying power amplification circuits configured to support different frequency bands for amplifying, respectively, transmission signals input through a wireless communication circuit of the electronic device, based on the identified power amplification circuits being connected to a first power modulator included in the wireless communication circuit, controlling a power switch included in the wireless communication circuit to connect a first power amplification circuit among the identified power amplification circuits to a second power modulator included in the wireless communication circuit to simultaneously transmit the transmission signals using the identified power amplification circuits, and based on the identified power amplification circuits being connected to the first power modulator and second modulator, respectively, controlling the power switch to connect a first power amplification circuit among the identified power amplification circuits to the first power modulator to simultaneously transmit the transmission signals using the identified power amplification circuits.
Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.
The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:
The same reference numerals are used to represent the same elements throughout the drawings.
The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.
The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the disclosure. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the disclosure is provided for illustration purpose only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents. It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a component surface” includes reference to one or more of such surfaces.
Conventional pre-5G electronic devices transmitted signals through a single power modulator, and thus could not efficiently perform uplink carrier aggregation (CA) and EN-DC, which configure multiple transmission signals simultaneously. When electronic devices use techniques, such as envelope tracking (ET) or average power tracking (APT) to enhance transmission power efficiency, the power amplifier (PA) supply voltage output from the power modulator becomes dependent on the PA output power. Since the output power of each PA is independent during uplink CA operation, conventional electronic devices have difficulty efficiently supporting uplink CA operation in which multiple PAs operate with a single power modulator, and could not support uplink CA using a similar band. For example, where all of the frequencies to be used for uplink CA belong to a mid band (MB), the conventional electronic device could not perform uplink CA due to insufficient PAs for use.
According to an embodiment of the disclosure, there may be provided a method for wireless communication in which an electronic device efficiently supports an uplink CA operation in which a plurality of PAs are operated with one power modulator through a minimum power modulator configuration and supports uplink CA and EN-DC of a combination of all frequency bands to simultaneously transmit transmission signals (2Tx).
It should be appreciated that the blocks in each flowchart and combinations of the flowcharts may be performed by one or more computer programs which include instructions. The entirety of the one or more computer programs may be stored in a single memory device or the one or more computer programs may be divided with different portions stored in different multiple memory devices.
Any of the functions or operations described herein can be processed by one processor or a combination of processors. The one processor or the combination of processors is circuitry performing processing and includes circuitry like an application processor (AP, e.g. a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a Wi-Fi chip, a Bluetooth® chip, a global positioning system (GPS) chip, a near field communication (NFC) chip, connectivity chips, a sensor controller, a touch controller, a finger-print sensor controller, a display driver integrated circuit (IC), an audio CODEC chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on chip (SoC), an IC, or the like.
Various embodiments of the disclosure are now described with reference to the accompanying drawings.
Referring to
The processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to an embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be configured to use lower power than the main processor 121 or to be specified for a designated function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.
The auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing. The artificial intelligence model may be generated via machine learning. Such learning may be performed, e.g., by the electronic device 101 where the artificial intelligence is performed or via a separate server (e.g., the server 108). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.
The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134.
The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.
The input module 150 may receive a command or data to be used by other component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).
The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
The display module 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.
The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.
The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
A connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connecting terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or motion) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device 104 via a first network 198 (e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., local area network (LAN) or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify or authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.
The wireless communication module 192 may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 may support a high-frequency band (e.g., the millimeter wave (mmWave) band) to achieve, e.g., a high data transmission rate. The wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, loss coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1 ms or less) for implementing URLLC.
The antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device). According to an embodiment, the antenna module 197 may include one antenna including a radiator formed of a conductor or conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna appropriate for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas by, e.g., the communication module 190. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other parts (e.g., radio frequency integrated circuit (RFIC)) than the radiator may be further formed as part of the antenna module 197.
According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.
At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. The external electronic devices 102 or 104 each may be a device of the same or a different type from the electronic device 101. According to an embodiment, all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device 101 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet-of-things (IoT) device. The server 108 may be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or health-care) based on 5G communication technology or IoT-related technology.
Referring to
According to an embodiment, the processor 120 may be electrically connected to the memory 130, the wireless communication circuit 210 (e.g., the wireless communication module 192 of
According to an embodiment, as illustrated in
According to an embodiment, the wireless communication circuit 210 may be a device for transmission processing of a wireless signal, but is not limited thereto, and may further include components for reception processing of a wireless signal. The wireless communication circuit 210 may perform wireless communication in a scheme (e.g., an E-UTRAN new radio dual connectivity (EN-DC) scheme) for increasing the data transmission speed by supporting both the first communication scheme and the second communication scheme, and may selectively perform first communication of the first communication scheme or second communication of the second communication scheme if necessary. In an embodiment, the frequency band of the first communication scheme may use a wider broadband and a higher frequency band than the frequency band of the second communication scheme. A portion (a portion of the middle band) of the frequency band of the second communication scheme may be used in the first communication scheme, and thus a partial overlap may occur between the two frequency bands, and thus the two frequency bands may be configured to be selectively used.
According to an embodiment, the radio frequency processing circuit 310 of the wireless communication circuit 210 is an RF circuit for wireless communication, and may be a transceiver that performs signal processing for transmitting and/or receiving a wireless signal, and may be controlled by the processor 120 (e.g., the processor 120 of
According to an embodiment, the radio frequency processing circuit 310 may output the simultaneous transmission signals (e.g., the first transmission signal and the second transmission signal) input to at least two of the plurality of power amplification circuits 321, 322, and 323 of the power amplification module 320, respectively, under the control of the processor 120. The radio frequency processing module 310 may process a frequency band to transmit transmission signals, based on a combination of frequency bands for the first communication scheme and the second communication scheme. For example, the power amplification circuits may be multimode multiband (MMMB)-type power amplification circuits.
According to an embodiment, the power amplification module 320 may be electrically connected to the radio frequency processing circuit 310 and the power modulators 331 and 332. According to an embodiment, as illustrated in
According to an embodiment, the power amplification module 320 may input transmission signals output from the radio frequency processing circuit 310 to the identified power amplification circuits, respectively, based on a combination of frequency bands, and may amplify the input transmission signal. For example, the combination of frequency bands may be configured by combining frequency bands (e.g., low band (LB), middle band (MB), and high band (HB) or ultra-high band (UHB)) of the first communication scheme and frequency bands (e.g., LB, MB, and HB) of the second communication scheme. The combination of frequency bands may be set to various combinations according to the business operator, the service, etc.
According to an embodiment, the power switch 401 may be connected to one of the plurality of power amplification circuits. The power switch 401 may be configured to be connected to or included in a power amplification circuit having a low use frequency or a designated power amplification circuit, and may be selectively connected to the first power modulator 331 or the second power modulator 332 by switching to the first power modulator 331 or the second power modulator 332 under the control of the processor 120. For example, the power switch 401 may be included in and connected to the first power amplification circuit 321 as illustrated in
According to an embodiment, the first power amplification circuit 321 among the plurality of power amplification circuits may be connected to the power switch 401 and may be connected to the first power modulator 331 by default. According to an embodiment, the first power amplification circuit 321 may be selectively connected to the first power modulator 331 or the second power modulator 332 through switching of the power switch 401. For example, as illustrated in
According to an embodiment, if the power amplification circuit (e.g., the third power amplification circuit 323) for processing another transmission signal (e.g., the second transmission signal Tx2) to be simultaneously transmitted with the transmission signal (e.g., the first transmission signal Tx1) input from the radio frequency processing circuit 310 is connected to the same power modulator (e.g., the first power modulator 331), the first power amplification circuit 321 may be connected to another power modulator (e.g., the second power modulator 332) by the power switch 401.
According to an embodiment, if the power amplification circuit (e.g., the second power amplification circuit 332) for processing another transmission signal (e.g., the second transmission signal Tx2) to be simultaneously transmitted with the transmission signal (e.g., the first transmission signal Tx1) input from the radio frequency processing circuit 310 is connected to another power modulator (e.g., the second power modulator 331), the first power amplification circuit 321 may be connected to the default power modulator (e.g., the first power modulator 331) by the power switch 401.
According to an embodiment, the second power amplification circuit 322 among the plurality of power amplification circuits may be connected by default to the second power modulator 332 connected to the power switch 401. For example, as illustrated in
According to an embodiment, the third power amplification circuit 323 among the plurality of power amplification circuits may be connected to the first power modulator 331 by default. For example, as illustrated in
According to an embodiment, the first power modulator 331 may be connected to the first power amplification circuit 321 through the power switch 401, and may be connected to the third power amplifier 333 and at least one other power amplification circuit (e.g., the fourth power amplification circuit 334 and/or the fifth power amplification circuit 335 of
According to an embodiment, the second power modulator 332 may be connected to the first power amplification circuit 321 through the power switch 401, and may be connected to the second power amplification circuit 322 and at least one other power amplification circuit (e.g., the sixth power amplification circuit 336 and/or the seventh power amplification circuit 336 of
According to an embodiment, the first power modulator 331 may supply power to at least one connected power amplification circuit, and the second power modulator 332 may supply power to at least one other connected power amplification circuit, so that the wireless communication circuit 210 may simultaneously perform 2Tx transmission such as uplink CA and EN-DC having two uplink component carriers by simultaneously using the at least one power amplification circuit and at least one other power amplification circuit.
Referring to
According to an embodiment, if it is identified that the identified power amplification circuits are connected to the same power modulator (e.g., the first power modulator 331 of
According to an embodiment, when it is identified that the identified power amplification circuits are connected to different power modulators (e.g., the first power modulator 331 and the second power modulator 332 of
According to an embodiment, as illustrated in
According to an embodiment, when the first power amplification circuit 321 supporting the LB and the third power amplification circuit 323 supporting the MB (e.g., the first PA (LB)+the third PA (MB)) are identified according to the combination of the LB and the MB (TX0 (LB)+TX1 (MB)), the processor 120 may identify that the first power amplification circuit 321 and the second power amplification circuit 323 are connected by default to the first power modulator 331, as the same power modulator, as shown in Table 1 below, and control the power switch 401 to connect the first power amplification circuit 321 to the second power modulator 332 and connect the third power amplification circuit 323 to the first power modulator 331. Here, the third power amplification circuit 323 may support an MB (e.g., MB1 or HB1), and may be connected to the second power modulator 332 by default.
According to an embodiment, the processor 120 may identify the first power amplification circuit (first PA) and another power amplification circuit PA (e.g., one of the fourth PA 334 to the seventh PA 337 of
According to an embodiment, the signal processing circuit 340 may simultaneously transmit the first transmission signal and the second transmission signal, which are simultaneously input from the identified power amplification circuits, through the antenna circuit 220.
Referring to
According to an embodiment, the power switch 501 (e.g., the power switch 401 of
According to an embodiment, the fourth power amplification circuit 324 may be selectively connected to the first power modulator 331 or the second power modulator 332 by the power switch 501 to receive power. According to an embodiment, the fifth power amplification circuit 325 may be selectively connected to the first power modulator 331 or the second power modulator 332 by the power switch 503 to receive power.
According to an embodiment, the processor 120 may identify power amplification circuits for amplifying, respectively, the input transmission signals, and if it is identified that the identified power amplification circuits are identically connected to the first power modulator 331, the processor 120 may control to connect the second power modulator 332 to the fourth power amplification circuit 324 connected to the power switch 501 and/or the fifth power amplification circuit 325 connected to the power switch 503.
According to an embodiment, the processor 120 may identify power amplification circuits for amplifying, respectively, the input transmission signals, and if it is identified that the identified power amplification circuits are connected to the first power modulator 331 and the second power modulator 3322, respectively, which are different from each other, the processor 120 may control to connect the first power modulator 331 to the fourth power amplification circuit 324 connected to the power switch 501 and/or the fifth power amplification circuit 325 connected to the power switch 503.
As such, in an embodiment, the main components of the electronic device have been described through the electronic device 101 of
According to an embodiment, an electronic device (e.g., the electronic device 101 of
According to an embodiment, the processor may identify power amplification circuits for amplifying, respectively, transmission signals input through the radio frequency processing circuit. Here, the power amplification circuits may support different frequency bands.
According to an embodiment, the processor may, based on the identified power amplification circuits being connected to the first power modulator, control the power switch to connect the first power amplification circuit among the identified power amplification circuits to the second power modulator to simultaneously transmit the transmission signals using the identified power amplification circuits.
According to an embodiment, the processor may, based on the identified power amplification circuits being connected to the different first power modulator and second modulator, respectively, control the power switch to connect the first power amplification circuit among the identified power amplification circuits to the first power modulator to simultaneously transmit the transmission signals using the identified power amplification circuits.
According to an embodiment, the power switch may be connected to the first power amplification circuit, the first power modulator may be connected to the power switch and a third power amplification circuit (e.g., the third power amplification circuit 323 of
According to an embodiment, the processor may control the first power amplification circuit connected to the second power modulator to amplify a first transmission signal among the transmission signals and control the second power amplification circuit connected to the first power modulator to amplify a second transmission signal among the transmission signals. According to an embodiment, the processor may control the wireless communication circuit to simultaneously transmit the first transmission signal amplified by the first power amplification circuit and the second transmission signal amplified by the second power amplification circuit.
According to an embodiment, the processor may control the first power amplification circuit connected to the first power modulator to amplify a first transmission signal among the transmission signals and control the second power amplification circuit connected to the second power modulator to amplify a second transmission signal among the transmission signals. According to an embodiment, the processor may control the wireless communication circuit to simultaneously transmit the first transmission signal amplified by the first power amplification circuit and the second transmission signal amplified by the third power amplification circuit.
According to an embodiment, the first power amplification circuit may include at least one amplifier for amplifying the first transmission signal and a front-end circuit configured to output the first transmission signal output from the at least one amplifier to an antenna connected to the at least one amplifier.
According to an embodiment, the second power amplification circuit or the third power amplifier may include at least one amplifier configured to amplify the second transmission signal. According to an embodiment, the second power amplification circuit or the third power amplifier may include a front-end circuit connected to an antenna connected to the at least one amplifier.
According to an embodiment, the first power amplification circuit may be configured to support any one of a first frequency band, a second frequency band, or a third frequency band, and be connected to the first power modulator or the second power modulator by the power switch based on a combination of frequency bands related to input transmission signals.
According to an embodiment, the second power amplification circuit may be configured to support a different frequency band from the first power amplification circuit and be connected to the first power modulator, and the third power amplification circuit may be configured to support a different frequency band from the first power amplification circuit and be connected to the second power modulator.
According to an embodiment, the processor may control the wireless communication circuit to transmit a first transmission signal among the transmission signals using a first communication scheme. According to an embodiment, the processor may control the wireless communication circuit to transmit a second transmission signal among the transmission signals using a second communication scheme.
According to an embodiment, the wireless communication circuit may further include a power switch configured to be included in or connected to a power amplification circuit configured to support a frequency band of a low output frequency among the plurality of amplification circuits.
Referring to
In operation 603, the electronic device may identify power amplification circuits for processing, respectively, the transmission signals (e.g., the converted RF signals). The electronic device may identify a power amplification circuit to process, respectively, the transmission signals using a designated frequency band combination.
In operation 605, the electronic device may identify whether the identified power amplification circuits are connected to the same power modulator (e.g., the first power modulator 331 of
In operation 607, based on identifying that the identified power amplification circuits are connected to the same power modulator, the electronic device may connect one first power amplification circuit among the power amplification circuits identified by the power switch (e.g., the power switch 401 of
In operation 609, based on identifying that the identified power amplification circuits are connected to different power modulators, the electronic device may connect the first power amplification circuit to the first power modulator by the power switch. According to an embodiment, the electronic device may control the power switch to connect the first power amplification circuit (the first power amplification circuit 321 of
In operation 611, the electronic device may transmit transmission signals (e.g., amplified RF signals) amplified by the identified power amplification circuits to the external electronic device through the antenna circuit. For example, the electronic device may transmit the first transmission signal among the transmission signals using the first communication scheme, and may transmit the second transmission signal among the transmission signals using the second communication scheme. Here, the first communication scheme may be a 5G communication scheme, and the second communication scheme may be a 4G communication scheme.
According to an embodiment, a method for operation in an electronic device (e.g., the electronic device 101 of
According to an embodiment, the power switch may be connected to the first power amplification circuit, the first power modulator may be connected to the power switch and a third power amplification circuit (e.g., the second power amplification circuit 323 of
According to an embodiment, the method may further comprise controlling the first power amplification circuit connected to the second power modulator to amplify a first transmission signal among the transmission signals. According to an embodiment, the method may further comprise controlling the third power amplification circuit connected to the first power modulator to amplify a second transmission signal among the transmission signals. According to an embodiment, the method may further comprise controlling the wireless communication circuit to simultaneously transmit the first transmission signal amplified by the first power amplification circuit and the second transmission signal amplified by the third power amplification circuit.
According to an embodiment, the method may further comprise controlling the first power amplification circuit connected to the first power modulator to amplify a first transmission signal among the transmission signals. According to an embodiment, the method may further comprise controlling the second power amplification circuit connected to the second power modulator to amplify a second transmission signal among the transmission signals. According to an embodiment, the method may further comprise controlling the wireless communication circuit to simultaneously transmit the first transmission signal amplified by the first power amplification circuit and the second transmission signal amplified by the second power amplification circuit.
According to an embodiment, controlling the wireless communication circuit to simultaneously transmit the first transmission signal amplified by the first power amplification circuit and the second transmission signal amplified by the third power amplification circuit may include controlling the wireless communication circuit to transmit the first transmission signal among the transmission signals using a first communication scheme and controlling the wireless communication circuit to transmit the second transmission signal among the transmission signals using a second communication scheme.
According to an embodiment, controlling the wireless communication circuit to simultaneously transmit the first transmission signal amplified by the first power amplification circuit and the second transmission signal amplified by the second power amplification circuit may include controlling the wireless communication circuit to transmit the first transmission signal among the transmission signals using a first communication scheme and controlling the wireless communication circuit to transmit the second transmission signal among the transmission signals using a second communication scheme.
According to an embodiment, the first power amplification circuit may be configured to support any one of a first frequency band, a second frequency band, or a third frequency band, and be selectively connected to the first power modulator or the second power modulator by the power switch.
According to an embodiment, the second power amplification circuit may support a different frequency band from the first power amplification circuit and be connected to the first power modulator, and the third power amplification circuit may be configured to support a different frequency band from the first power amplification circuit and be connected to the second power modulator.
According to an embodiment, in a non-transitory storage medium storing a program, the program may include instructions that, when executed by a processor (e.g., the processor 120 of
According to an embodiment, the program may include instructions to enable the electronic device to control the first power amplification circuit connected to the second power modulator to amplify a first transmission signal among the transmission signals. According to an embodiment, the program may include instructions to enable the electronic device to control the third power amplification circuit 323 connected to the first power modulator to amplify a second transmission signal among the transmission signals. According to an embodiment, the program may include instructions to enable the electronic device to control the wireless communication circuit to simultaneously transmit the first transmission signal amplified by the first power amplification circuit and the second transmission signal amplified by the third power amplification circuit.
The electronic device and the method for operation in the electronic device according to an embodiment described above may reduce the costs incurred in implementing a wireless communication circuit, downsize the wireless communication circuit to save the space for mounting in the electronic device, and perform more efficient wireless communication. Other various effects may be provided directly or indirectly in the disclosure.
The embodiments disclosed herein are proposed for description and understanding of the disclosed technology and does not limit the scope of the disclosure. Accordingly, the scope of the disclosure should be interpreted as including all changes or various embodiments based on the technical spirit of the disclosure.
The electronic device according to various embodiments of the disclosure may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
It should be appreciated that various embodiments of the disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC).
Various embodiments as set forth herein may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Wherein, the term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.
According to an embodiment, a method according to various embodiments of the disclosure may be included and provided in a computer program product. The computer program products may be traded as commodities between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., Play Store™), or between two user devices (e.g., smartphones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities. Some of the plurality of entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
It will be appreciated that various embodiments of the disclosure according to the claims and description in the specification can be realized in the form of hardware, software or a combination of hardware and software.
Any such software may be stored in non-transitory computer readable storage media. The non-transitory computer readable storage media store one or more computer programs (software modules), the one or more computer programs include computer-executable instructions that, when executed by one or more processors of an electronic device individually or collectively, cause the electronic device to perform a method of the disclosure.
Any such software may be stored in the form of volatile or non-volatile storage such as, for example, a storage device like read only memory (ROM), whether erasable or rewritable or not, or in the form of memory such as, for example, random access memory (RAM), memory chips, device or integrated circuits or on an optically or magnetically readable medium such as, for example, a compact disk (CD), digital versatile disc (DVD), magnetic disk or magnetic tape or the like. It will be appreciated that the storage devices and storage media are various embodiments of non-transitory machine-readable storage that are suitable for storing a computer program or computer programs comprising instructions that, when executed, implement various embodiments of the disclosure. Accordingly, various embodiments provide a program comprising code for implementing apparatus or a method as claimed in any one of the claims of this specification and a non-transitory machine-readable storage storing such a program.
While the disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2022-0085515 | Jul 2022 | KR | national |
| 10-2022-0118082 | Sep 2022 | KR | national |
This application is a continuation application, claiming priority under § 365 (c), of an International application No. PCT/KR2023/009525, filed on Jul. 5, 2023, which is based on and claims the benefit of a Korean patent application number 10-2022-0085515, filed on Jul. 12, 2022, in the Korean Intellectual Property Office, and of a Korean patent application number 10-2022-0118082, filed on Sep. 19, 2022, in the Korean Intellectual Property Office, the disclosure of each of which is incorporated by reference herein in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/KR2023/009525 | Jul 2023 | WO |
| Child | 19016810 | US |
