This application claims the priority benefit of Taiwan application serial No. 109206764, filed on May 29, 2020. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.
The disclosure relates to a pivot structure.
An electronic device, such as a laptop, is often placed on a surface to facilitate user operation. During the electronic device works, the electronic device generates heat from the internal components. When the electronic device is operated and closely disposed to the abutting surface in a large area, it is not conducive to the heat dissipation of the electronic device, and it affects the performance of the operation. Therefore, electronic devices are often equipped with external heat dissipation modules to achieve a good heat dissipation effect, which needs additional space and increases the limitation of structural configuration.
An electronic device is provided, which includes a first body, a second body, and a pivot structure. The pivot structure connects the first body and the second body and configures the first body and the second body to rotate relatively between the first position and the second position. The pivot structure includes a shaft, a first assembling element and a second assembling element. The shaft includes an axis.
The first assembling element is assembled with the shaft and connected with the first body. The second assembling element is pivotally connected to the shaft and connected with the second body. The second assembling element includes an abutting portion.
In an embodiment, at the first position, the abutting portion and the first assembling element are located on the same side relative to the axis, and a bottom portion of the first body is parallel to an abutting surface. At the second position, the abutting portion rotates around the axis and is located on a different side relative to the axis from the first assembling element, and the abutting portion abuts the abutting surface to generate an abutting force. Then the first body rises and an angle relative to the abutting surface is generated.
A pivot structure suitable for an electronic device is provided. The electronic device includes a first body and a second body. The first body and the second body rotate between a first position and a second position through the pivot structure. The pivot structure includes a shaft, a first assembling element and a second assembling element. The shaft includes an axis.
The first assembling element is assembled with the shaft and connected with the first body. The second assembling element is pivotally connected to the shaft and connected with the second body. The second assembling element includes an abutting portion.
When at the first position, the abutting portion and the first assembling element are located on the same side relative to the axis, and a bottom portion of the first body is parallel to an abutting surface. When at the second position, the abutting portion rotates around the axis and is located on a different side relative to the axis from the first assembling element, and the abutting portion abuts the abutting surface to generate an abutting force, which makes the first body rise and generate an angle relative to the abutting surface.
Please refer to
Please refer to
Please refer to
Please refer to
The first assembling element 20 is assembled with the shaft 10 and used to connect with the first body M1. The second assembling element 30 is pivotally connected to the shaft 10 and used to connect the second body M2, and the second assembling element 30 includes an abutting portion A.
When at the first position P1, the abutting portion A and the first assembling element 20 are located on the same side relative to the axis O, and the bottom portion of the first body M1 is parallel to an abutting surface S. When at the second position P2, the abutting portion A rotates around the axis O and is located on a different side relative to the axis O from the first assembling element 20. The abutting portion A abuts the abutting surface S to generate an abutting force, which makes the first body M1 rise and generate an angle relative to the abutting surface S.
Please refer to
Please refer to
From the top view of
In one embodiment, the first extending segment 31, the second connecting portion 32, and the second extending segment 33 of the second assembling element 30 are integrated.
In the embodiment where the first extending segment 31, the second connecting portion 32, and the second extending segment 33 are not integrated. For the convenience, the length, shape or size of each separate member is designed for different shape of the first body M1 or the second body M2.
Referring to
Referring to
Referring to
Please refer to
Please refer to
Please refer to
In this way, since the fixing point end A3 overlaps the axis O of the shaft 10, when the second connecting portion 32 rotates with the second body M2 to move to the second position P2, the fixing point end A3 is the same as the axis O of the shaft 10 and only rotates at the same position, and the first abutting end A1 and the second abutting end A2 of the abutting portion A rotate around the axis O of the shaft 10.
Therefore, the first abutting end A1 and the second abutting end A2 of the abutting portion A moves to the other side of the axis O, so that the first abutting end A1 and the second abutting end A2 of the abutting portion A are located on different sides relative to the axis O.
Refer to
Refer to
In this way, when the angle exists between the first body M1 and the abutting surface S, a gap is formed between the abutting surface S and the first body M1 to dissipate heat, which prevents the first body M1 from overheating to affect its performance and improves the life of the first body M1. In addition to the pivot structure 100 providing the existing functions of pivoting the first body M1 and the second body M2, it further interacts with the first body M1 to make the electronic device have heat dissipation efficiency and does not affect the internal space configuration due to the heat dissipation efficiency.
It is worth noting that, in the embodiment, the interaction between the second assembling element 30 and the abutting surface S is specifically realized through changing the second abutting end A2 of the second assembling element 30 from a form that does not interact with the abutting surface S to a form that interacts with the abutting surface S to generate the abutting force to support the first body M1, which makes the first body M1 be inclined to the abutting surface S, and forms the angle relative to the abutting surface S.
In detail, at the first position P1, the second abutting end A2 of the second assembling element 30 directly or indirectly abuts the abutting surface S. When the second body M2 moves from the first position P1 to the second position P2, the second body M2 drives the second assembling element 30 to rotate, and the second assembling element 30 pivots with the shaft 10 around the rotation axis.
At this time, the second abutting end A2 of the second assembling element 30 rotates around the shaft 10. During this process, the second abutting end A2 rotates and moves approaching to the abutting surface S. As the second length L2 between the second part A2 and the axis O is greater than the first length L1 between the first abutting end A1 and the axis O, at the second position P2, the second abutting end A2 directly or indirectly abuts the abutting surface S.
When the second abutting end A2 abuts the abutting surface S, the second abutting end A2 exerts a force on the abutting surface S, and the abutting surface S also generates the abutting force relative to the second abutting end A2. Then, the abutting force is the reaction force produced by the abutting surface S relative to the second abutting end A2.
As the pivot structure 100 is disposed on the first body M1, the abutting force generated by the abutting surface S relative to the second assembling element 30 is equivalent to the force applied to the first body M1, and then the first body M1 is propped up to form the angle with the abutting surface S.
Please refer to
Please refer to
Moreover, the second assembling element 30 is changed to the second abutting end A2 facing towards the abutting surface S after pivoted, and the second abutting end A2 extends from the first opening M11 of the first body M1 and abuts against the abutting surface S.
When the second assembling element 30 protrudes from the first opening M11, the second assembling element 30 props up the side of the first body M1 with the pivot structure 100, which makes a part of the first body M1 separate from the abutting surface S to generate a gap with the abutting surface S, and improves the heat dissipation effect.
Please refer to
Therefore, the electronic device maintains a complete appearance which achieves the dustproof effect. In this way, when located at the second position P2, the second abutting end A2 of the second assembling element 30 applies force on the first cover M12, keeping the first cover M12 away from the first opening M11 and supported by the abutting surface S. In this state, the first opening M11 is opened, so that the internal space of the first body M1 is connected to the outside through the first opening M11 to quickly dissipate heat.
Please refer to
In this way, when the second assembling element 30 rotates along with the second body M2, the other end of the second assembling element 30 connected with the second body M2 slips into the guiding portion 41 of the guiding element 40, and applies a force to the guiding element 40, which makes the guiding element 40 incline to support the first body M1 and the first body M1 is propped up to form a gap relative to the abutting surface S to achieve the effect of heat dissipation.
Please refer to
In this way, when the second assembling element 30 pivotally connected with the second body M2, the pivoting action of the second assembling element 30 drives the guiding rod 34. Then the guiding rod 34 is guided by the guiding portion 41 of the guiding element 40 and slips in the guiding portion 41 to move along a specific path. And, while the guiding rod 34 slips in the guiding portion 41, the guiding rod 34 applies force on the guiding portion 41, which makes the guiding element 40 drive the first cover M12 to pivot away from the first opening M11, and the first opening M11 becomes an open state to facilitate the heat dissipation of the first body M1.
It is worth noting that, in the foregoing embodiments, the guiding portion 41 of the guiding element 40 is a groove, and the second assembling element 30 is provided on the guiding portion 41 with the guiding rod 34. However, the guiding portion 41 and the structure matching the guiding portion 41 are not limited to this. It is also realized by setting the guiding portion 41 as a convex portion and setting the groove on the second assembling element 30 to match the convex portion in other embodiments.
Please refer to
Therefore, the electronic device maintains a complete appearance which achieves the dustproof effect. Moreover, when located at the second position P2, the first abutting end A1 of the second assembling element 30 protrudes from the second opening M13 and pushes against the second cover M14, which makes the second cover M14 move away from the second opening M13, the second opening M13 becomes open, so that the internal space of the first body M1 is connected to the outside through the first opening M11 and the second opening M13 at the same time, providing better heat dissipation effect.
Although the present disclosure has been described in considerable detail with reference to certain preferred embodiments thereof, the disclosure is not for limiting the scope. Persons having ordinary skill in the art may make various modifications and changes without departing from the scope. Therefore, the scope of the appended claims should not be limited to the description of the preferred embodiments described above.
Number | Date | Country | Kind |
---|---|---|---|
109206764 | May 2020 | TW | national |
Number | Name | Date | Kind |
---|---|---|---|
6053589 | Lin | Apr 2000 | A |
6097595 | Cipolla | Aug 2000 | A |
6961240 | Janicek | Nov 2005 | B2 |
7679905 | Wu | Mar 2010 | B2 |
7813122 | Wang | Oct 2010 | B2 |
8693181 | Tseng | Apr 2014 | B2 |
8891231 | Okuley | Nov 2014 | B2 |
9507376 | Kontkanen | Nov 2016 | B2 |
9519309 | Okuley | Dec 2016 | B2 |
9727091 | Chen | Aug 2017 | B2 |
10120412 | Chen | Nov 2018 | B2 |
10599179 | Okuley | Mar 2020 | B2 |
10824191 | Okuley | Nov 2020 | B2 |
20050024822 | Janicek | Feb 2005 | A1 |
20080283711 | Wu | Nov 2008 | A1 |
20090237878 | Chen | Sep 2009 | A1 |
20100118481 | Wang | May 2010 | A1 |
20110292605 | Chen | Dec 2011 | A1 |
20120162871 | Tseng | Jun 2012 | A1 |
20130155598 | Kontkanen | Jun 2013 | A1 |
20140029187 | Okuley | Jan 2014 | A1 |
20150124389 | Okuley | May 2015 | A1 |
20170139439 | Okuley | May 2017 | A1 |
20200142444 | Okuley | May 2020 | A1 |
20210149443 | Okuley | May 2021 | A1 |
Number | Date | Country |
---|---|---|
102235421 | Nov 2011 | CN |
109582093 | Apr 2019 | CN |
Number | Date | Country | |
---|---|---|---|
20210373613 A1 | Dec 2021 | US |