The disclosure relates to an electronic device including a rotatable antenna module structure.
Due to the remarkable developments in information and semiconductor technology, the wide use of various electronic devices including a hand-held communication device is a daily norm.
Any popular electronic device performs a specific function according to a loaded program and includes as, an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an audio/video device, a desktop/laptop computer, or an in-vehicle navigation system. These electronic devices may output sound or an image based on stored information. As the integration level of electronic devices has increased and faster, high-capacity wireless communications have become more common in recent years. Now, a single electronic device such as a mobile communication terminal may be equipped with a variety of functions. For example, in addition to a communication function, an entertainment function such as games, a multimedia function such as music and video playback, a communication and security function such as mobile banking, and other functions such as calendar management and an electronic wallet are integrated into a single electronic device. Further, these electronic devices are being miniaturized so that they may be conveniently carried around by users.
Recently, a portable electronic device such as a smartphone with a flexible display having different hinge structures are coming into market. As such, a method of satisfying various requirements according to the structural characteristics of each housing structure in the electronic device has become important.
According to an embodiment of the disclosure, an electronic device includes a display panel, a first housing at which the display panel is disposed, an input module, a second housing at which the input module is disposed. The hinge module is fixed to the second housing rotates along a rotation axis for rotation of the first housing in which an antenna unit is provided along the rotation axis of the hinge module. The antenna unit includes a connector and disposed along the rotation axis, an antenna module rotatably coupled to the connector and configured to rotate relative to the connector with respect to the rotation axis, and a weight connected to at least a portion of the antenna module to maintain a radiation surface of the antenna module substantially vertical with respect to a ground.
According to an embodiment of the disclosure, an electronic device includes a display panel, a first housing at which the display panel is disposed, an input module, a second housing at which the input module is disposed, wherein the first housing is configured to be rotatable with respect to the second housing via a hinge module along a first rotation axis, and an antenna unit connected to at least a portion of the first housing at a bottom of the display panel. The antenna unit includes a connector connected to the at least portion of the first housing and rotating around the first rotation axis, an antenna module connected to the connector and rotatable with respect to the connector around a second rotation axis different from the first rotation axis, and a weight connected to at least a portion of the antenna module and mounted to maintain a radiation surface of the antenna module substantially vertical with respect to a ground.
According to an embodiment of the disclosure, an electronic device includes a display panel, a first housing in which the display panel is disposed thereon, a second housing configured to be rotatable with respect to the first housing via a hinge module along a first rotation axis for rotation of the first housing and a second rotation axis parallel to the first rotation axis, and an antenna unit connected to at least a portion of the hinge module. The antenna unit includes a connector connected to the at least portion of the hinge module, an antenna module connected to the connector and rotatable with respect to the connector around a third rotation axis, and a weight connected to at least a portion of the antenna module and mounted to maintain a radiation surface of the antenna module substantially vertical with respect to a ground.
Referring to
The processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to an embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be specific to a specified function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.
The auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing. An artificial intelligence model may be generated by machine learning. Such learning may be performed, e.g., by the electronic device 101 where the artificial intelligence is performed or via a separate server (e.g., the server 108). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.
The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134.
The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.
The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
The display module 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the strength of force incurred by the touch.
The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.
The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
A connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).
The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.
The wireless communication module 192 may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 may support a high-frequency band (e.g., the mm Wave band) to achieve, e.g., a high data transmission rate. The wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, loss coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1 ms or less) for implementing URLLC.
The antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 101. According to an embodiment, the antenna module may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 198 or the second network 199, may be selected, for example, by the communication module 190 (e.g., the wireless communication module 192) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.
According to various embodiments, the antenna module 197 may form an mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.
At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 or 104 may be a device of a same type as, or a different type, from the electronic device 101. According to an embodiment, all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device 101 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet-of-things (IoT) device. The server 108 may be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.
The electronic device according to various embodiments may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
It should be appreciated that various embodiments of the disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B, or C”, “at least one of A, B, and C”, and “at least one of A, B, or C”, may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd”, or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with”, “coupled to”, “connected with”, or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
As used in connection with various embodiments of the disclosure, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, logic, logic block, part, or circuitry. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC).
Various embodiments as set forth herein may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.
According to an embodiment, a method according to various embodiments of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
According to an embodiment, the housing 210 may form at least a portion of the exterior of the electronic device 101 or support a component (e.g., the touch pad 240) of the electronic device 101. For example, the housing 210 may accommodate at least one of the display 220, an input device 230, or the touch pad 240.
In operation, the electronic device 101 may be selectively open or closed. To this end, the housing 210 may include a first housing 212 and a second housing 214 rotatably connected to the first housing 212. According to an embodiment, the electronic device 101 may include a hinge module (e.g., a hinge module 510 in
According to an embodiment, the housing 210 may be formed of a rigid metallic material or non-metallic material. At least a portion of the electronic device 101 formed of the metallic material may provide a ground plane and be electrically connected to a ground line formed on a PCB (not shown). For example, a conductive plate may be disposed on an interior side of the housing 210, and the housing 210 may be electrically connected to the PCB through a connection member.
According to an embodiment, at least a portion of the display 220 may be disposed within the second housing 214. At least a portion of the display 220 may be visually exposed to the outside of the electronic device 101 through the second housing 214. According to an embodiment, the display 220 (e.g., the display module 160 in
According to an embodiment, the display 220 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer configured to detect a magnetic stylus pen.
According to an embodiment, the input device 230 (e.g., the input module 150 in
According to an embodiment, the touch pad 240 (e.g., the input module 150 in
According to an embodiment, the processor and/or the touch pad 240 may determine the position (e.g., XY coordinates) of the user input. According to an embodiment, the touch pad 240 may sense pressure on the touch pad 240. For example, the touch pad 240 may detect a force in a thickness direction (e.g., a Z-axis direction) using at least one pressure sensor (not shown). According to an embodiment, when an external object (e.g., the user's finger or stylus) is in direct contact with or proximity to a surface of the touch pad 240, the touch pad 240 may detect the external object.
According to an embodiment, the touch pad 240 may be accommodated in the housing 210. For example, the touch pad 240 may be connected to the first housing 212, and at least a portion of the touch pad 240 may be exposed to the outside of the first housing 212. According to an embodiment, the touch pad 240 may be adjacent to the input device 230, and with the electronic device 101 closed, at least a portion of the touch pad 240 may face the display 220.
Referring to
According to an embodiment, the PCB 311 may include a plurality of conductive layers and a plurality of non-conductive layers stacked alternately with the conductive layers. The PCB 311 may provide electrical connections between the PCB 311 and/or various externally disposed electronic components using wirings and conductive vias formed on the conductive layers.
According to an embodiment, the antenna array 312 may include a plurality of antenna elements 312-1, 312-2, 312-3, and 312-4 arranged to form directional beams. The antenna elements may be formed on a first surface 310a of the PCB 311, as illustrated. According to another embodiment, the antenna array 312 may be formed within the PCB 311. According to embodiments, the antenna array 312 may include a plurality of antenna arrays of the same or different shapes or types (e.g., a dipole antenna array and/or a patch antenna array).
According to an embodiment, the RFIC 313 may be disposed in another area (e.g., on a second surface 310b opposite to the first surface 310a) of the PCB 311, spaced apart from the antenna array 312. For example, the RFIC 313 may be bonded to the PCB 311 by soldering. According to an embodiment, the RFIC 313 is configured to process a signal in a selected frequency band, which is transmitted/received via the antenna array 312. According to an embodiment, the RFIC 313 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal in a specified band during transmission. The RFIC 313 may convert an RF signal received via the antenna array 312 into a baseband signal and transmit the baseband signal to the communication processor during reception.
According to another embodiment, the RFIC 313 may upconvert an IF signal (e.g., about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrated circuit (IFIC) into an RF signal in a selected band during transmission. The RFIC 313 may downconvert an RF signal obtained via the antenna array 312 to an IF signal and transmit the IF signal to the IFIC during reception.
According to an embodiment, the PMIC 314 may be disposed in another partial area (e.g., the second surface 310b) of the PCB 311, spaced apart from the antenna array 312. For example, the PMIC 314 may be bonded to the PCB 311 by soldering. The PMIC 314 may receive a voltage from a main PCB (not shown) and supply required power to various components (e.g., the RFIC 313) on the antenna module.
According to an embodiment, the shielding member 316 may be disposed on a portion (e.g., the second surface 310b) of the PCB 311 to electromagnetically shield at least one of the RFIC 313 or the PMIC 314. According to an embodiment, the shielding member 316 may include a shield can.
Although not shown, in an embodiment, the antenna module 310 may be electrically connected to another PCB (e.g., the main circuit board) via the module interface 315. The module interface 315 may include a connection member, such as a coaxial cable connector, a board to board connector, an interposer, or a flexible PCB (FPCB). The RFIC 313 and/or the PMIC 314 of the antenna module 310 may be electrically connected to the other PCB through the connection member.
Referring to
According to an embodiment, the antenna connector 320 may connect the antenna module 310 to an electronic device (e.g., the electronic device 101 in
According to an embodiment, the weight 330 may be coupled to the antenna module 310 to keep a direction in which the first surface 310a faces constant even though the antenna module 310 is rotated by the antenna connector 320. According to an embodiment, the weight 330 may be coupled to one of surfaces perpendicular to the first surface 310a, the second surface 310b, and the third side 310c to which the antenna connector 320 is coupled, of the antenna module 310. For example, the weight 330 may be coupled to a fourth surface 310d of the antenna module 310.
According to various embodiments, the antenna module 310 may include a support member (not shown). According to an embodiment, the antenna module 310 may be fixed to the support member, and the support member may be disposed such that the antenna connector 320 and the weight 330 are coupled. The support member may be rotatably coupled to the shaft structure of the antenna connector 320.
Referring to
According to an embodiment, the second housing 214 of the electronic device 101 may rotate clockwise (a direction (3) by an angle θ that satisfies a specific range (e.g., about 0 to 90 degrees) with respect to the first housing 212 from the initial state. According to an embodiment, when the second housing 214 of the electronic device 101 rotates clockwise (the direction (3) by the angle θ, the antenna module 310 may also rotate clockwise (the direction {circle around (3)} by the angle θ because the antenna module 310 is rotatably connected to the hinge module (e.g., the hinge module 510 in
While it has been described with reference to
Referring to
Referring to
Referring to
According to an embodiment, the housing 710 may form at least a portion of the exterior of the electronic device 101 or support a component (e.g., the display 720) of the electronic device 101. For example, the housing 710 may accommodate at least one of the display 720, an input device 730, or a touch pad 740.
According to an embodiment, the electronic device 101 may be open or closed. For example, the housing 710 may include a first housing 712 and a second housing 714 configured to be rotatable with respect to the first housing 712. According to an embodiment, the electronic device 101 may include at least one hinge module 750 connected to the first housing 712 and the second housing 7140.
According to an embodiment, the first housing 712 may be configured to rotate by a specified angular range (e.g., approximately 0 degrees to 360 degrees) with respect to the second housing 714 using the hinge module 750. For example, the electronic device 101 may be operated in a first state (e.g.,
According to an embodiment, the housing 710 may be formed of a rigid metallic material or non-metallic material. According to an embodiment, at least a portion of the electronic device 101 formed of the metallic material may provide a ground plane and be electrically connected to a ground line formed on a PCB (not shown). For example, a conductive plate may be disposed on an interior side of the housing 710 and electrically connected to the PCB through a connection member.
According to an embodiment, at least a portion of the display 720 may be disposed within the second housing 714. According to an embodiment, at least a portion of the display 720 may be visually exposed to the outside of the electronic device 101. According to an embodiment, the display 720 (e.g., the display module 160 in
According to an embodiment, the display 720 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer configured to detect a magnetic stylus pen.
According to an embodiment, the electronic device 101 may include the input device 730 (e.g., the input module 150 in
According to an embodiment, the electronic device 101 may include the touch pad 740 (e.g., the input module 150 in
According to an embodiment, the processor and/or the touch pad 740 may determine the position (e.g., XY coordinates) of the user input. According to an embodiment, the touch pad 740 may sense pressure on the touch pad 740. For example, the touch pad 740 may detect a force in a thickness direction (e.g., a Z-axis direction) using at least one pressure sensor (not shown). According to an embodiment, the touch pad 740 may detect an external object (e.g., the user's finger or stylus), when the external object is in direct contact with or proximity to a surface of the touch pad 740.
According to an embodiment, the touch pad 740 may be accommodated in the housing 710. For example, the touch pad 740 may be connected to the first housing 712, and at least a portion of the touch pad 740 may be exposed to the outside of the first housing 712. According to an embodiment, the touch pad 740 may be adjacent to the input device 730. According to an embodiment, when the electronic device 101 is closed, at least a portion of the touch pad 740 may face the display 720.
Referring to
According to an embodiment, when the electronic device 101 is used in the closed state (e.g.,
According to an embodiment, when the electronic device 101 is used in a third state (e.g.,
An electronic device with communication functionality, such as a portable terminal, becomes smaller and lighter to maximize portability and convenience for a user and increasingly has integrated components in a smaller space for high performance. An electronic device (e.g., a laptop) may provide information to a user using a display in an unfolded state, and may be closed for portability when the electronic device is not in use.
An electronic device may include a main body, a display, and an antenna module electrically connected to the main body, for communication between the electronic device and the outside. When the antenna module is configured in such a way that it is mounted within the electronic device, a plurality of antenna modules may be arranged in consideration of the state of the electronic device and the radiation direction of an antenna. For example, the plurality of antenna modules may be arranged on both side surfaces of a set of multiple ports in the main body of the electronic device. Accordingly, a mounting space of the multiple ports may be obstructed by the plurality of antenna modules, or it may be necessary to secure a separate space for mounting the antenna modules.
Further, when the antenna module is configured in such a way that it is mounted in a spare space (e.g., a hinge) of the display of the electronic device, the orientation of the antenna module may change depending on the opening angle of a screen of the electronic device. Accordingly, there may be a need for disposing an additional antenna module.
According to an embodiment of the disclosure, it an electronic device with an antenna module mounted in a space adjacent to a hinge of the electronic device may be provided.
According to one embodiment of the disclosure, a structure of an antenna module that maintains the orientation of the antenna module regardless of the opening angle of an electronic device may be provided.
However, the problems to be solved by the disclosure are not limited to the above-mentioned problems, and may be extended in various ways without departing from the spirit and scope of the disclosure.
An electronic device according to an embodiment of the disclosure may maximize space utilization of the electronic device by mounting an antenna module in a spare space adjacent to a hinge of the electronic device.
An electronic device according to an embodiment of the disclosure may improve its communication performance by allowing an antenna module to have an intended radiation direction without increasing the number of antenna modules.
In addition, various other effects identified herein, either directly or indirectly, may be provided.
According to an embodiment of the disclosure, an electronic device (e.g., the electronic device 101 in
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According to an embodiment of the disclosure, an electronic device (e.g., the electronic device 101 in
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According to an embodiment of the disclosure, an electronic device (e.g., the electronic device 101 in
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The above-described electronic device according to an embodiment of the disclosure is not limited by the foregoing embodiments and drawings, and it will be apparent to those skilled in the art that many replacements, changes, and modifications can be made within the technical scope of the disclosure.
Number | Date | Country | Kind |
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10-2021-0148193 | Nov 2021 | KR | national |
This application is a continuation of International Application No. PCT/KR2022/014096, filed on Sep. 21, 2022, which claims priority to Korean Patent Application No. 10-2021-0148193, filed on Nov. 1, 2021 in the Korean Intellectual Property Office, the disclosures of which are herein incorporated by reference.
Number | Date | Country | |
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Parent | PCT/KR2022/014096 | Sep 2022 | WO |
Child | 18651727 | US |