Patent Application
20240120643
Embodiments of the disclosure relate to an antenna assembly and an electronic device including the same.
The term “electronic device” may mean a device performing a particular function according to its equipped program, such as a home appliance, an electronic scheduler, a portable multimedia player, a mobile communication terminal, a tablet PC, a video/sound device, a desktop PC or laptop computer, a navigation for automobile, etc. For example, the electronic devices may output stored information as voices or images.
As the demand for mobile communication increases, and the degree of integration of electronic devices increases, various technologies have been developed to enhance the portability of the electronic device and user convenience in use of multimedia functions. An electronic device may include an antenna device that provides wireless communication in various frequency bands. As such an antenna device meets a high gain and wide beam coverage, communication performance of the electronic device may be provided with stable quality under a commercialized wireless communication network environment. Recently, communication such as mobile communication (e.g., 2G/3G/4G/UMTS/LTE), Bluetooth, Wi-Fi, NFC, GPS, and UWB in low/medium/high frequency bands of several GHz or less supporting multiple bands, as well as millimeter wave communication having a frequency band of several tens of GHz or more (e.g., a high-band frequency of 28 GHz or more), has been used to meet demand for soaring data traffic.
The foregoing information is provided merely as background information for a better understanding of the disclosure.
According to an aspect of the disclosure, an electronic device includes: a plate; a side frame provided at an edge of the plate, the side frame including a first sidewall extending in at least one axial direction and including at least one conductive portion; a printed circuit board provided on a surface of the plate and including at least one ground area; a key assembly provided on the side frame and including a first flexible circuit board connected to the printed circuit board; and at least one antenna module including: the at least one conductive portion; a first connection member provided inside the first sidewall, the first connection member being electrically connected to the at least one conductive portion and the first flexible circuit board; a second connection member provided inside the first sidewall and spaced apart from the first connection member, the second connection member being electrically connected to the at least one conductive portion and the first flexible circuit board; and a third connection member between the first connection member and the second connection member, the third connection member being electrically connected to the at least one conductive portion and the at least one ground area.
The at least one antenna module may further include at least one first signal line accommodated in the first flexible circuit board and configured to transmit a feeding signal, and the at least one first signal line is electrically connected to at least one of the first connection member or the second connection member.
The first flexible circuit board may include at least one second signal line configured to transmit a digital signal and electrically connecting the key assembly and the printed circuit board.
The electronic device may further include at least one electrical component disposed on the surface of the plate, and the first flexible circuit board does not overlap the electrical component.
The electrical component may include: a battery; and at least one second flexible circuit board configured to connect the battery and the printed circuit board.
The at least one first signal line may include a plurality of first signal lines connected to the first connection member and the second connection member, the at least one antenna module may include a plurality of antenna modules; and the plurality of antenna modules may include: a first antenna module electrically connected to the first connection member; and a second antenna module electrically connected to the second connection member and spaced apart from the first antenna module along the first sidewall with the third connection member interposed therebetween.
The first antenna module may include the first connection member and a first conductive portion of the at least one conductive portion, the first conductive portion being configured to receive a feeding signal from the first connection member, the second antenna module may include the second connection member and a second conductive portion of the at least one conductive portion, the second conductive portion being configured to receive a feeding signal from the second connection member, and the first conductive portion may be provided on a portion of the first sidewall, and the second conductive portion may be provided on another portion of the first sidewall spaced apart from the first conductive portion with the third connection member interposed therebetween.
The first antenna module may be grounded to the third connection member through an electrical path formed between the first connection member and the third connection member, and the second antenna module may be grounded to the third connection member through an electrical path formed between the second connection member and the third connection member.
The first sidewall may further include a slit area adjacent to the first connection member, the first connection member may be provided between the slit area and the third connection member, and the first antenna module may be a slit antenna.
The second antenna module may be a slot antenna.
The key assembly may further include: at least one key member at least partially visually exposed to an outside of the electronic device through an opening in a portion of the first sidewall;
at least one shaft member inside the first sidewall and configured to receive an external input applied to the key member; and a sensor module inside the first sidewall and configured to detect the external input transferred from the at least one shaft member, and the first flexible circuit board may be electrically connected to the sensor module and may further include at least one second signal line configured to transmit a digital signal.
The first sidewall may further include a plurality of extension members protruding toward the first connection member, the second connection member, and the third connection member, and the plurality of extension members may be electrically connected to the first connection member, the second connection member, and the third connection member.
The plurality of extension members may be electrically connected to the at least one conductive portion of the first sidewall.
The first flexible circuit board may include: a first board portion including a surface facing the first sidewall and on which at least one of the first connection member, the second connection member, or the third connection member is disposed; and a second board portion connecting the first board portion and the printed circuit board.
The electronic device may further include: an electronic component between the first sidewall and the printed circuit board; and a battery spaced apart from the electronic component in at least one axial direction in which the first sidewall extends, and at least a portion of the second board portion is between the electronic component and the battery.
According to an aspect of the disclosure, an electronic device includes: a plate; a side frame provided at an edge of the plate and extending in at least one axial direction, the side frame including a first sidewall including at least one conductive portion; a printed circuit board provided on a surface of the plate and including at least one ground area; a key assembly provided on a portion of the side frame and including a first flexible circuit board connected to the printed circuit board; and an antenna assembly including: the at least one conductive portion; a first connection member provided inside the first sidewall, the first connection member being electrically connected to the at least one conductive portion; a second connection member provided inside the first sidewall and spaced apart from the first connection member, the second connection member being electrically connected to the at least one conductive portion; and a third connection member between the first connection member and the second connection member, the third connection member being electrically connected to the at least one conductive portion, wherein the second connection member is electrically connected to the first flexible circuit board, and the third connection member is electrically connected to the at least one ground area.
The antenna assembly may further include at least one first signal line accommodated in the first flexible circuit board and configured to transmit a feeding signal, and the at least one first signal line may be electrically connected to at least one of the first connection member or the second connection member.
The first flexible circuit board may include at least one second signal line configured to transmit a digital signal and electrically connecting the key assembly and the printed circuit board.
The first connection member may be connected to the second connection member at one point through a first electrical path, and the second connection member may be connected to the at least one ground area through a second electrical path from the one point.
The first sidewall may further include a slit area adjacent to the first connection member, the first connection member may be between the slit area and the third connection member, and the antenna assembly may include a slit antenna.
The foregoing and other aspects, configurations, and/or advantages of certain embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:
Throughout the drawings, like reference numerals may be assigned to like parts, components, and/or structures.
The following description taken in conjunction with the accompanying drawings is provided to aid in understanding various embodiments of the disclosure as defined by the claims and equivalents thereto. The following description may include various specific details to aid understanding, but these may be considered exemplary only. Accordingly, one of ordinary skill in the art will recognize that various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the disclosure. Descriptions of well-known functions and configurations may be omitted for clarity and conciseness.
The terms and words used in the following description and claims are not limited to the dictionary meaning, but are used only by the inventors to enable a clear and consistent understanding of the disclosure. Accordingly, it will be apparent to one of ordinary skill in the art that the following description of various embodiments of the present disclosure is provided by way of example only and not to limit the disclosure as defined by the appended claims and equivalents thereof.
As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. For example, the phrase “surface of a component” may refer to one or more of surfaces of the component.
Referring to
The processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be configured to use lower power than the main processor 121 or to be specified for a designated function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.
The auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing. The artificial intelligence model may be generated via machine learning. Such learning may be performed, e.g., by the electronic device 101 where the artificial intelligence is performed or via a separate server (e.g., the server 108). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.
The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134.
The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.
The input module 150 may receive a command or data to be used by other component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).
The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
The display module 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.
The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.
The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
A connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).
The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or motion) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device 104 via a first network 198 (e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., local area network (LAN) or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify or authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.
The wireless communication module 192 may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 may support a high-frequency band (e.g., the mmWave band) to achieve, e.g., a high data transmission rate. The wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, loss coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1 ms or less) for implementing URLLC.
The antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device). According to an embodiment, the antenna module 197 may include one antenna including a radiator formed of a conductor or conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna appropriate for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas by, e.g., the communication module 190. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other parts (e.g., radio frequency integrated circuit (RFIC)) than the radiator may be further formed as part of the antenna module 197.
According to an embodiment, the antenna module 197 may form a mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.
At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
According to an embodiment, instructions or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. The external electronic devices 102 or 104 each may be a device of the same or a different type from the electronic device 101. According to an embodiment, all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device 101 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In an embodiment, the external electronic device 104 may include an internet-of-things (IoT) device. The server 108 may be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.
In the following detailed description, a length direction, a width direction, and/or a thickness direction of the electronic device may be mentioned and may be defined as a “Y-axis direction,” “X-axis direction”, and/or “Z-axis direction,” respectively. In one or more embodiments, “negative/positive (−/+)” may be mentioned together with the Cartesian coordinate system exemplified in the drawings with respect to the direction in which the component is oriented. For example, the front surface of the electronic device or housing may be defined as a “surface facing in the +Z direction,” and the rear surface may be defined as a “surface facing in the −Z direction”. In an embodiment, the side surface of the electronic device or housing may include an area facing in the +X direction, an area facing in the +Y direction, an area facing in the −X direction, and/or an area facing in the −Y direction. In another embodiment, the “X-axis direction” may mean including both the “−X direction” and the “+X direction”. It should be noted that the directions are so defined with respect to the Cartesian coordinate system shown in the drawings for the sake of brevity of description, and the description of these directions or components do not limit an embodiment of the disclosure. For example, the direction in which the front surface or rear surface faces may be varied depending on the unfolded state or folded state of the electronic device, and the above-mentioned directions may be interpreted as different ones depending on the user's way to grip.
The configuration of the electronic device 200 of
Referring to
Referring to
According to an embodiment, the electronic device 101 may include at least one of a display 201, audio modules 206, 207, and 214 (e.g., the audio module 170 of
According to an embodiment, the display 201 may be visually revealed through, e.g., a majority portion of the front plate 202. In an embodiment, at least a portion of the display 201 may be visually exposed through the front plate 202 forming the front surface 210A and the first edge areas 210D. In an embodiment, the edge of the display 201 may be formed to be substantially the same in shape as an adjacent outer edge of the front plate 202. In an embodiment, the interval between the outer edge of the display 201 and the outer edge of the front plate 202 may remain substantially even to give a larger area of exposure for the display 201.
According to an embodiment, the surface (or the front plate 202) of the housing 210 may include a screen display area formed as the display 201 is visually exposed. For example, the screen display area may include the front surface 210A and first edge areas 210D.
In an embodiment, a recess or opening may be formed in a portion of the screen display area (e.g., the front surface 210A or the first edge area 210D) of the display 201, and at least one or more of the audio module 214, sensor module, light emitting device, and camera module 205 may be aligned with the recess or opening. In an embodiment, at least one or more of the audio module 214, sensor module, camera module 205, fingerprint sensor, and light emitting device may be included on the rear surface of the screen display area of the display 201. In an embodiment, the display 201 may be disposed to be coupled with, or adjacent to, a touch detecting circuit, a pressure sensor capable of measuring the strength (pressure) of touches, and/or a digitizer for detecting a magnetic field-type stylus pen. According to an embodiment, at least part of the key input device 217 may be disposed in the first edge areas 210D and/or the second edge areas 210E.
According to an embodiment, the audio modules 206, 207, and 214 may include, e.g., a microphone hole 206 and speaker holes 207 and 214. A microphone for acquiring external sounds may be disposed in the microphone hole 206. In an embodiment, a plurality of microphones may be disposed to detect the direction of the sound. The speaker holes 207 and 214 may include an external speaker hole 207 and a phone receiver hole 214. In an embodiment, the speaker holes 207 and 214 and the microphone hole 206 may be implemented as a single hole, or speakers may be included without the speaker holes 207 and 214 (e.g., piezo speakers). The audio modules 206, 207, and 214 are not limited to the above-described structure. Depending on the structure of the electronic device 101, various design changes may be made, for example, only some of the audio modules may be mounted, or a new audio module may be added.
According to an embodiment, the sensor modules may generate an electrical signal or data value corresponding to an internal operating state or external environmental state of the electronic device 101. The sensor modules may include a first sensor module (e.g., a proximity sensor) and/or a second sensor module (e.g., a fingerprint sensor) disposed on the front surface 210A of the housing 210 and/or a third sensor module (e.g., an HRM sensor) and/or a fourth sensor module (e.g., a fingerprint sensor) disposed on the rear surface 210B of the housing 210. In an embodiment, the fingerprint sensor may be disposed on the rear surface 210B as well as on the front surface 210A (e.g., the display 201) of the housing 210. The electronic device 101 may include a sensor module, e.g., at least one of a gesture sensor, a gyro sensor, a barometric sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. The sensor modules are not limited to the above-described structure. Depending on the structure of the electronic device 101, various design changes may be made, for example, only some of the sensor modules may be mounted, or a new sensor module may be added.
According to an embodiment, the camera modules 205, 212, and 213 may include a first camera module 205 disposed on the first surface 210A of the electronic device 101, and a rear camera device 212 and/or a flash 213 disposed on the rear surface 210B. The camera modules 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 213 may include, e.g., a light emitting diode (LED) or a xenon lamp. In an embodiment, two or more lenses (an infrared (IR) camera, a wide-angle lens, and a telescopic lens) and image sensors may be disposed on one surface of the electronic device 101. The camera modules 205, 212, and 213 are not limited to the above-described structure. Depending on the structure of the electronic device 101, various design changes may be made, for example, only some of the camera modules may be mounted, or a new camera module may be added.
According to an embodiment, the electronic device 101 may include a plurality of camera modules (e.g., a dual camera or triple camera) having different attributes (e.g., angle of view) or functions. For example, a plurality of camera modules 205 and 212 including lenses having different angles of view may be configured, and the electronic device 101 may control to change the angle of view of the camera modules 205 and 212 performed by the electronic device 101 based on the user's selection. At least one of the plurality of camera modules 205 and 212 may form, for example, a wide-angle camera and at least another of the plurality of camera modules may form a telephoto camera. Similarly, at least one of the plurality of camera modules 205 and 212 may be a front camera and at least another of the plurality of camera modules may be a rear camera. Further, the plurality of camera modules 205 and 212 may include at least one of a wide-angle camera, a telephoto camera, and an infrared (IR) camera (e.g., a time of flight (TOF) camera, a structured light camera). According to an embodiment, the IR camera may be operated as at least a portion of the sensor module. For example, the TOF camera may be operated as at least a portion of a sensor module for detecting the distance to the subject.
According to an embodiment, the key input device 217 may be disposed on the side surface 210C of the housing 210. In an embodiment, the electronic device 101 may exclude all or some of the above-mentioned key input devices 217 and the excluded key input devices 217 may be implemented in other forms, e.g., as soft keys, on the display 201. In an embodiment, the key input device may include the sensor module disposed on the rear surface 210B of the housing 210.
According to an embodiment, the light emitting device may be disposed on, e.g., the front surface 210A of the housing 210. The light emitting device may provide, e.g., information about the state of the electronic device 101 in the form of light. In an embodiment, the light emitting device may provide a light source that interacts with, e.g., the front camera module 205. The light emitting device may include, e.g., a light emitting diode (LED), an infrared (IR) LED, and/or a xenon lamp.
According to an embodiment, the connector holes 208 and 209 may include, e.g., a first connector hole 208 for accommodating a connector (e.g., a universal serial bus (USB) connector) for transmitting or receiving power and/or data to/from an external electronic device and/or a second connector hole (e.g., an earphone jack) 209 for accommodating a connector for transmitting or receiving audio signals to/from the external electronic device.
According to an embodiment, some of the camera modules 205 and 212 and/or some of the sensor modules may be disposed to be exposed to the outside through at least a portion of the display 201. For example, the camera module 205 may include a punch hole camera disposed inside a hole or recess formed in the rear surface of the display 201. According to an embodiment, the camera module 212 may be disposed inside the housing 210 so that the lens is exposed to the rear surface 210B of the electronic device 101. For example, the camera module 212 may be disposed on a printed circuit board (e.g., the printed circuit board 240 of
According to an embodiment, the camera module 205 and/or the sensor module may be disposed to contact the external environment through a transparent area from the internal space of the electronic device 101 to the front plate 202 of the display 201. Further, some sensor module may be disposed to perform its functions without being visually exposed through the front plate 202 in the internal space of the electronic device.
Referring to
According to an embodiment, the electronic device 101 may omit at least one of the components or may add another component. At least one of the components of the electronic device 101 may be the same or similar to at least one of the components of the electronic device 101 of
According to an embodiment, the plate 230 may be disposed inside the electronic device 101 to be connected with the side frame 220 or be integrated with the side frame 220. The plate 230 may be formed of, e.g., a metal and/or non-metallic material (e.g., polymer). The display module 201 may be coupled to one surface of the plate 230 and the printed circuit board 240 may be coupled to the opposite surface of the plate 230.
According to an embodiment, a processor, a memory, and/or an interface may be mounted on the printed circuit board 240. The processor may include one or more of, e.g., a central processing unit, an application processor, a graphic processing device, an image signal processing, a sensor hub processor, or a communication processor. According to an embodiment, the printed circuit board 240 may include a flexible printed circuit board type radio frequency cable (FRC). For example, the printed circuit board 240 may be disposed on at least a portion of the plate 230 and may be electrically connected with an antenna 292 (e.g., the antenna module 197 of
According to an embodiment, the memory may include, e.g., a volatile or non-volatile memory.
According to an embodiment, the interface may include, e.g., a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and/or an audio interface. The interface may electrically or physically connect, e.g., the electronic device 101 with an external electronic device and may include a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector.
According to an embodiment, the battery 250 may be a device for supplying power to at least one component of the electronic device 101. The battery 250 may include, e.g., a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell. At least a portion of the battery 250 may be disposed on substantially the same plane as the printed circuit board 240. The battery 250 may be integrally or detachably disposed inside the electronic device 101.
According to one or more embodiments, the second supporting member 291 (e.g., a rear structure) may be disposed between the printed circuit board 240 and the antenna 292. For example, the second supporting member 291 may include one surface to which at least one of the printed circuit board 240 and the battery 250 is coupled, and another surface to which the antenna is coupled.
According to an embodiment, the antenna 292 may be disposed between the rear plate 204 and the battery 250. The antenna may include, e.g., a near-field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna may perform short-range communication with, e.g., an external device or may wirelessly transmit or receive power necessary for charging. According to an embodiment, an antenna 292 may be formed by a portion or combination of the side frame 220 and/or the plate 230. For example, a portion or combination of the side frame 220 and/or the plate 230 may include a conductive portion. The conductive portion may function as a radiator of the antenna 292.
According to an embodiment, the rear plate 204 may form at least a portion of the rear surface (e.g., the second surface 210B of
The configuration of the electronic device 101 of
Referring to
In an embodiment, the housing 203 (e.g., the housing 210 of
In an embodiment, the side frame 220 (e.g., the side bezel structure 220 of
According to an embodiment, the side frame 220 (e.g., the first sidewall 221) may at least partially include a conductive (e.g., metal) portion. According to an embodiment, at least a portion of the conductive portion of the side frame 220 may be a radiator of the antenna assembly 280 (e.g., the antenna module 197 of
In an embodiment, the plate 230 may be disposed in an inner space surrounded by the front plate (e.g., the front plate 202 of
Referring to
In an embodiment, the camera structure 260 (e.g., the camera module 180 of
Referring to
Referring to
Referring to
Referring to
According to an embodiment, the key member 271 may include a plurality (e.g., two) key members 271a and 271b. For example, the plurality of key members 271 may include a first key member 271a and a second key member 271b spaced apart from each other in one direction (e.g., the length direction or the Y-axis direction of the electronic device 101). In an embodiment, each of the first key member 271a and the second key member 271b may be exposed to the outside of the electronic device 101 through a plurality of openings formed in the first sidewall 221. For example, the first key member 271a may correspond to a volume key of the electronic device 101, and the second key member 271b may correspond to a power key of the electronic device 101. According to an embodiment, the first key member 271a and/or the second key member 271b may at least partially include a conductive (e.g., metal) portion. According to an embodiment, the conductive portion of the first key member 271a and/or the second key member 271b may function as a radiator of at least one antenna assembly 280 (e.g., the antenna module 197 of
In an embodiment, the first flexible circuit board 272 may include a first board portion 272a facing the key members 271 and a second board portion 272b extending from the first board portion 272a.
According to an embodiment, the first board portion 272a may be disposed in parallel with the first sidewall 221 in a mounting space formed by the first sidewall 221 and/or the plate 230. For example, the first board portion 272a may be electrically connected to at least one connection member (e.g., a first connection member 281 and/or a second connection member 283) of the antenna assembly 280. For example, the first board portion 272a may include both an analog signal line and a digital signal line (or “second signal line”). According to an embodiment, the second board portion 272b may be provided in a form extending between the first board portion 272a and the printed circuit board 240. For example, one end of the second board portion 272b may be connected to the first board portion 272a and the other end thereof may be connected to the printed circuit board 240. In an embodiment, the second board portion 272b may include both an analog signal line and a digital signal line. For example, the digital signal line may be electrically connected to a sensor module of the key assembly 270. According to an embodiment, the analog signal line may include at least one feeding signal line (or “first signal line”) connected to a portion of the antenna assembly 280. In this disclosure, “feed” or “feeding” may refer to a “power supply”.
In an embodiment, the second board portion 272b may connect the board assembly (e.g., the first board portion 272a) and the printed circuit board 240, and may be disposed so as not to overlap other electrical components in the electronic device 101. Referring to
Referring to
As used herein, the phrase “the second board portion 272b of the first flexible circuit board 272 and the second flexible circuit board 251 do not overlap” may collectively mean a case in which one surface of the second board portion 272b and one surface of the second flexible circuit board 251 do not overlap each other, a case in which a thickness of the first flexible circuit board 272 and one surface of the second flexible circuit board 251 overlap each other, and a case in which one surface of the first flexible circuit board 272 and a thickness of the second flexible circuit board 251 overlap each other. For example, the thickness of the second board portion 272b described above may refer to the Y-axis direction dimension of
According to an embodiment of the disclosure, when the second board portion 272b is disposed not to overlap another electrical component (e.g., the second flexible circuit board 251), electromagnetic interference that may occur between it and the other electrical component may be suppressed as compared to when the second board portion 272b is disposed to overlap the other electrical component (e.g., the second flexible circuit board 251). However, in an embodiment, the placement of the second board portion 272b is not limited to the above-described example, and may be changed according to an arrangement relationship with another electrical component such as a flexible circuit board. The placement of the board portion may be applied in various forms to avoid overlap with other electrical components to prevent electromagnetic interference.
According to an embodiment, the shaft member 273 may be disposed on the first board portion 272a to protrude toward the key member 271. For example, the shaft member 273 may be configured to receive an external input (e.g., a touch or a pressing force) such as a click applied to the key member 271. For example, the key member 271 may include an elastically deformable material. For example, when an external input (e.g., a pressing force) applied to the key member 271 is transferred to the shaft member 273, the shaft member 273 may be deformed in the pressing direction (e.g., the −X direction). For example, when the pressing force is removed, the shaft member 273 may be restored to its original form to move the key member 271 in a direction (e.g., the +X direction) opposite to the pressing direction, and the key member 271 may be returned to its original position.
According to an embodiment, each shaft member 273 may be electrically connected to the first board portion 272a of the first flexible circuit board 272. For example, the key assembly 270 may include a sensor module that detects an external input transferred to the shaft member 273. For example, the sensor module may convert the external input into an electrical signal (e.g., a digital signal). The first board portion 272a and/or the second board portion 272b may transfer the external input converted into an electrical signal to the key circuit board 278. For example, the key circuit board 278 may be connected to the printed circuit board 240, and may include, e.g., a circuit that processes the electrical signal and transfers the electrical signal to the printed circuit board 240. According to an embodiment, the key circuit board may be omitted, and the second board portion 272b may be electrically connected to the printed circuit board 240. For example, the processor disposed on the printed circuit board 240 may detect an electrical signal from the second board portion 272b and/or the key circuit board.
According to an embodiment, a plurality (e.g., three) of shaft members 273 may be provided. According to an embodiment, the plurality of shaft members 273 may be disposed on the key bracket 275 to be spaced apart from each other in one axial direction (e.g., in the length direction or the Y-axis direction of the electronic device 101). For example, the shaft members 273 may include a first shaft member 273a, a second shaft member 273b, and a third shaft member 273c. For example, the first shaft member 273a, the second shaft member 273b, and the third shaft member 273c may be sequentially disposed along the first sidewall 221 from the upward direction (+Y direction). For example, the at least one shaft member 273 may overlap the one key member 271, e.g., in one axis (e.g., the width direction or the X axis direction of the electronic device 101). According to an embodiment, the first shaft member 273a and the second shaft member 273b may overlap and be connected to different areas of the first key member 271a. For example, the first shaft member 273a may be activated when a portion of the first key member 271a overlapping the first shaft member 273a is pressed, and the second shaft member 273b may be activated when another partial area of the first key member 271a overlapping the second shaft member 273b is pressed. For example, the third shaft member 273c may be connected to the second key member 271b, and when the second key member 271b is pressed, the third shaft member 273c may be activated.
According to an embodiment, the key waterproof member 274 may be disposed on one surface (e.g., a surface in the +X direction) facing the key member 271 of the first board portion 272a. For example, the key waterproof member 274 may be opened in areas overlapping the key shaft member 273. The key shaft member 273 may be disposed to protrude toward the key member 271 through the opening of the key waterproof member 274. According to an embodiment, the key bracket 275 may be disposed on another surface (e.g., the surface in the −X direction) of the first board portion 272a that faces the key waterproof member 274. For example, the key bracket 275 may support and/or protect the first board portion 272a. According to an embodiment, some components (e.g., the key waterproof member 274 and/or the key bracket 275) may be omitted.
According to an embodiment, the key supporting member 276 may be disposed farther from the first sidewall 221 than other components of the key assembly 270. For example, the key member 271 may be disposed between the printed circuit board 240 or the key supporting member 276 and the camera structure 260. For example, the key supporting member 276 may be formed to be elastically deformable. For example, when the shaft member 273 overlapping the key member 271 is deformed and/or moved in the pressing direction (e.g., the −X-axis direction) due to the external input (e.g., a pressing force) applied to the key member 271, the key supporting member 276 may also be displaced and/or elastically deformed in the pressing direction. For example, when the pressing force is removed, the key supporting member 276 may return to its original form and move and/or deform the key waterproof member 274 and/or the key bracket 275, including the first flexible circuit board 272 disposed on one side (e.g., the +X direction), to its original position in a direction (e.g., the +X direction) opposite to the pressing direction. According to an embodiment, the shape and/or position of the key supporting member 276 may be changed or omitted.
In an embodiment of the disclosure, various communication methods, such as 2/3/4G communication, Bluetooth, Wi-Fi, and/or ultra-wide band (UWB) as well as short-range communication such as near field communication (NFC), magnetic secure transmission (MST), and wireless charging, may be performed by utilizing the conductive portion of the side frame 220 as an antenna radiator.
Referring to
In an embodiment, the antenna assembly 280 may include a first connection member 281, a second connection member 283, and/or a third connection member 282 disposed between the first connection member 281 and the second connection member 283, which are spaced apart from each other along the first sidewall 221. Each of the connection members 281, 282, and 283 may be electrically connected to a conductive portion of the first sidewall 221. For example, the first connection member 281 and/or the second connection member 283 may be connected to a feeding signal line disposed on the first flexible circuit board 272. For example, the third connection member 282 may be electrically connected to a ground area disposed on the printed circuit board 240. For example, the connection members 281, 282, and 283 may be electrically connected to conductive portions, respectively, disposed in different areas on the first sidewall 221. For example, the connection members 281, 282, and 283 may include a conductive material such as metal, and may be, e.g., a clip member (e.g., C-clip).
Hereinafter, a configuration of the antenna assembly 280 is described in greater detail with reference to
Referring to
Referring to
Referring to
Referring to
According to an embodiment, the second antenna module 280B may include a second antenna pattern PB formed on the second conductive portion. For example, the second antenna module 280B may radiate a frequency signal in a second designated range through an electrical path of the second antenna pattern PB. The second antenna module 280B may transmit and/or receive the frequency signal in the second designated range to/from the external electronic device 101 (e.g., the electronic device 102 or the electronic device 104 of
Referring to
Referring to
The following description focuses primarily on differences of the embodiment of
Referring to
According to an embodiment, the antenna assembly 280 may include a third antenna pattern Pc formed on the conductive portion. For example, the antenna assembly 280 may radiate a frequency signal in a third designated range by an electrical path of the third antenna pattern Pc. For example, the third designated range may differ from, or may at least partially overlap, the first designated range and/or the second designated range of the embodiment of
Graph S0 of
An electronic device may include a housing including a conductive material such as metal. For example, the housing may include a sidewall (or a side frame) on which a side key assembly is disposed. In this case, a portion (hereinafter, referred to as a “side radiator”) of the sidewall adjacent to the side key assembly may be utilized as an antenna radiator. When the conductive sidewall is used as a radiator, isotropic characteristics may be enhanced as compared to a laser direct structuring (LDS) antenna, leading to better communication performance. However, when a structure or an electronic component (e.g., a camera module) that does not have a separate circuit board is disposed between the side key assembly and the main circuit board, the feeding signal line of the side radiator may be provided to extend to the main circuit board. However, since the feeding signal line includes an analog signal line, electromagnetic interference may occur when the feeding signal line is disposed to overlap another electrical component (e.g., a flexible circuit board of a side key assembly) including the digital signal line.
Aspects of the disclosure are to address at least the above-described problems and/or disadvantages, and to provide at least the advantages described below. An antenna assembly according to an embodiment of the disclosure is to use a portion of a conductive sidewall as an antenna radiator. In particular, there are provided an antenna assembly that suppresses electromagnetic interference by placing a feeding signal line of an antenna radiator extending to the main circuit board not to overlap another electrical component including a digital, signal line when the other electrical component is disposed between it and the main circuit board and an electronic device including the antenna assembly. According to an embodiment of the disclosure, an antenna structure may be formed by utilizing an existing electrical component, e.g., in a method of including a signal line for feeding an antenna radiator of a sidewall in a flexible circuit board of a side key assembly.
According to an embodiment of the disclosure, there are provided an antenna assembly that prevents deterioration of radiation performance and provides enhanced communication quality by reducing interference between two antenna modules by forming an electrical path connecting the antenna modules with the ground area of the printed circuit board and disposed between the two antenna modules spaced apart from each other along the side frame and an electronic device including the antenna assembly.
Effects of the disclosure are not limited to the foregoing, and other unmentioned effects would be apparent to one of ordinary skill in the art from the following description.
An electronic device 101 according to an embodiment of the disclosure may include a plate 230, a side frame 220, a printed circuit board 240, a key assembly 270, and/or at least one antenna module 280; 280A; 280B. The side frame may disposed at an edge of the plate and include a first sidewall. The first sidewall may extend in at least one axial direction and including at least one conductive portion. The printed circuit board may be disposed on one surface of the plate and may include at least one ground area. The key assembly may be disposed on a portion of the side frame and may include a first flexible circuit board connected to the printed circuit board. The antenna module may include the at least one conductive portion and a plurality of connection members. The plurality of connection members may include a first connection member 281 disposed inside the first sidewall, a second connection member 283 disposed inside the first sidewall to be spaced apart from the first connection member and a third connection member 282 disposed between the first connection member and the second connection member. Each of the first connection member and the second connection may be electrically connected to at least one conductive portion and the first flexible circuit board. The third connection member may be electrically connected to at least one the conductive portion and the ground area.
In an embodiment, the antenna module may include at least one first signal line accommodated in the first flexible circuit board and configured to transmit a feeding signal. The at least one first signal line may be electrically connected to at least one of the first connection member or the second connection member.
In an embodiment, the first flexible circuit board may include at least one second signal line configured to transmit a digital signal and electrically connecting the key assembly and the printed circuit board.
In an embodiment, the electronic device may include at least one electrical component disposed on the one surface of the plate. The first flexible circuit board may not overlap the electrical component.
In an embodiment, the electrical component may include a battery 250 and at least one second flexible circuit board 251 configured to connect the battery and the printed circuit board.
In an embodiment, at least one first signal line may include a plurality of the first signal lines connected to the first connection member and the second connection member. The antenna module may include a first antenna module 280A electrically connected to the first connection member and/or a second antenna module 280B spaced apart from the first antenna module along the first sidewall with the third connection member interposed therebetween and electrically connected to the second connection member.
In an embodiment, the first antenna module may include the first connection member; and a first conductive portion of the at least one conductive portion, the first conductive portion configured to receive a feeding signal from the first connection member. The second antenna module may include the second connection member; and a second conductive portion of the at least one conductive portion, the second conductive portion configured to receive a feeding signal from the second connection member. The first conductive portion may be formed on a portion of the first sidewall. The second conductive portion may be formed on another portion of the first sidewall spaced apart from the first conductive portion with the third connection member interposed therebetween.
In an embodiment, the first antenna module may be grounded to the third connection member through an electrical path formed between the first connection member and the third connection member. The second antenna module may be grounded to the third connection member through an electrical path formed between the second connection member and the third connection member.
In an embodiment, the first sidewall may include a slit area 2211 formed through an area of the first sidewall adjacent to the first connection member. The first connection member is disposed between the slit area and the third connection member. The first antenna module may be a slit antenna.
In an embodiment, the second antenna module may be a slot antenna.
In an embodiment, the key assembly may include at least one key member 271, 271a, and 271b at least partially visually exposed to an outside of the electronic device through an opening formed in a portion of the first sidewall. The key assembly may include at least one shaft member 273; 273a, 273b, and 273c disposed inside the first sidewall to receive an external input applied to the key member. The key assembly may include a sensor module disposed inside the first sidewall to detect an external input transmitted from the shaft member. The first flexible circuit board includes at least one second signal line configured to transmit a digital signal and electrically connected to the sensor module.
In an embodiment, the first sidewall may include a plurality of extension members 221a, 221b, and 221c protruding toward the first connection member, the second connection member, and the third connection member. The extension members may be electrically connected to the first connection member, the second connection member, and the second connection member.
In an embodiment, the extension members may be electrically connected to the at least one conductive portion of the first sidewall.
In an embodiment, the first flexible circuit board may include a first board portion 272a where at least some of the first connection member, the second connection member, or the third connection member are disposed on one surface of the first board portion facing the first sidewall. The first flexible circuit board may include a second board portion 272b connecting the first board portion and the printed circuit board.
In an embodiment, the electronic device may include an electronic component disposed between the first sidewall and the printed circuit board. At least a portion of the second board portion may be disposed on the battery and the electronic component.
An electronic device according to an embodiment of the disclosure may include a plate 230, a side frame 220, a printed circuit board 240, a key assembly 270, and/or an antenna assembly 280. The side frame may include a first sidewall 221 disposed at an edge of the plate, extending in at least one axial direction, and including at least one conductive portion. The printed circuit board may be disposed on one surface of the plate and may include at least one ground area. The key assembly may be disposed on a portion of the side frame and may include a first flexible circuit board 272 connected to the printed circuit board. The antenna assembly may include a first connection member 281 disposed inside the first sidewall, a second connection member 283 disposed inside the first sidewall to be spaced apart from the first connection member and a third connection member 282 disposed between the first connection member and the second connection member. Each of the first connection member, the second connection and the third connection member may be electrically connected to at least one conductive portion. The second connection member 283 may be electrically connected to the first flexible circuit board. The third connection member 282 may be electrically connected to the ground area.
In an embodiment, the antenna assembly may at least one first signal line accommodated in the first flexible circuit board and configured to transmit a feeding signal. The at least one first signal line may be electrically connected to at least one of the first connection member or the second connection member.
In an embodiment, the first flexible circuit board may include at least one second signal line configured to transmit a digital signal and electrically connecting the key assembly and the printed circuit board.
In an embodiment, the first connection member may be connected to the second connection member at one point through a first electrical path. The second connection member may be connected to the ground area through a second electrical path from the one point.
In an embodiment, the first sidewall may include a slit area 2211 formed through an area of the first sidewall adjacent to the first connection member. The first connection member may be disposed between the slit area and the third connection member. The antenna assembly may be a slit antenna.
An electronic device 101 according to an embodiment of the disclosure may comprise a frame comprising at least one conductive portion, a printed circuit board within the frame and comprising at least one ground area, a key assembly on a portion of the frame and comprising a first flexible circuit board connected to the printed circuit board and a plurality of antenna modules. The plurality of antenna modules may comprise the at least one conductive portion, a first connection member inside the frame, the first connection member being electrically connected to the at least one conductive portion and the first flexible circuit board, a second connection member inside the frame and spaced apart from the first connection member, the second connection member being electrically connected to the at least one conductive portion and the first flexible circuit board, a third connection member between the first connection member and the second connection member, the third connection member being electrically connected to the at least one the at least one conductive portion and the at least one ground area, a first antenna module electrically connected to the first connection member and a second antenna module spaced apart from the first antenna module along the frame with the third connection member interposed therebetween, the second antenna module being electrically connected to the second connection member.
While the disclosure has been illustrated and described with reference to one or more embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made thereto without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.
The electronic device according to an embodiment of the disclosure may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
An embodiment of the disclosure and terms used therein are not intended to limit the technical features described in the disclosure to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC).
According to an embodiment, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities. Some of the plurality of entities may be separately disposed in different components. According to an embodiment, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or Further, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2022-0127899 | Oct 2022 | KR | national |
| 10-2022-0146152 | Nov 2022 | KR | national |
This application is a by-pass continuation application of International Application No. PCT/KR2023/015437, filed on Oct. 6, 2023, which is based on and claims the benefit of a Korean Patent Application No. 10-2022-0127899, filed on Oct. 6, 2022, in the Korean Intellectual Property Office, and to a Korean Patent Application No. 10-2022-0146152, filed on Nov. 4, 2022, in the Korean Intellectual Property Office, the disclosures of each of which are incorporated by reference herein in their entireties.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/KR2023/015437 | Oct 2023 | US |
| Child | 18377628 | US |
