One or more embodiments of the instant disclosure generally relate to technology for implementing an antenna in an electronic device that includes a conductive housing.
As mobile communication technologies have developed, electronic devices that are equipped with antennas are being widely commercially available. One such electronic device may transmit and/or receive radio frequency (RF) signals including voice signals or data (e.g., message, photo, video, music file, or games) by using its antenna. But at the same time, the electronic device may have a metallic housing that provides mechanical rigidity and other design benefits. In the electronic device, a portion of metallic side surface of the housing may be utilized as an antenna.
An electronic device may include a housing implemented with a rear cover and a side member. The rear cover and the side member may each include a conductive member. The performance of the antenna included in the electronic device may be reduced due to the rear cover or the side member, because the conductive member may serve as a shield. Similarly, a metal layer included in the display of the electronic device may also reduce antenna performance.
According to an embodiment of the disclosure, an electronic device may include a display, a rear plate including a conductive material, a side member including a conductive material and disposed to surround a space between the display and the rear plate, a printed circuit board disposed between the display and the rear plate, an antenna pattern at least partially disposed between the printed circuit board and the rear plate and disposed at a location corresponding to a slit between the rear plate and the side member, and a communication module generating a communication signal transferred to a feeding part. A portion of the antenna pattern may be electrically connected with the feeding part. Another portion of the antenna pattern may be electrically connected with a ground region of the printed circuit board. The feeding part may be connected with a portion of the side member.
According to an embodiment of the disclosure, an electronic device may include a display, a rear plate including a conductive material, a side member including a plurality of portions made of a conductive material and disposed to surround a space between the display and the rear plate, a printed circuit board disposed between the display and the rear plate, an antenna pattern at least partially disposed between the printed circuit board and the rear plate and disposed at a location corresponding to a slit between the rear plate and the side member, and a communication module generating a communication signal transferred to a feeding part. A portion of the side member may be connected with the feeding part to support communication for a first frequency band. The antenna pattern may be connected with the feeding part to support communication for a second frequency band.
The above and other aspects, features, and advantages of certain embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:
One or more embodiments of the instant disclosure are generally directed to an electronic device with improved antenna performance. This may be done by disposing an antenna pattern at a location corresponding to a slit between the rear surface and the side surface of the housing of the electronic device, where both the rear surface and the side surface including a conductive member.
In addition, various other advantages or aspects of the disclosed embodiments directly or indirectly understood through this disclosure may be provided.
Hereinafter, certain embodiments of the disclosure may be described with reference to accompanying drawings. However, those of ordinary skill in the art will recognize that modification, equivalent, and/or alternative on various embodiments described herein can be variously made without departing from the scope and spirit of the disclosure.
Referring to
According to an embodiment, the display 110 may include a conductive sheet (not illustrated). According to an embodiment, the conductive sheet may be metallic (e.g., a metal plate) and may help reinforce the rigidity of the electronic device 100, may shield ambient noise, and may be used to distribute heat from an internal component of the electronic device emitting heat. According to an embodiment, the conductive sheet may be made with Cu, Al, Mg, SUS, or CLAD (e.g., a stacked member in which the SUS and the Al are alternately disposed).
According to an embodiment, a first slit (e.g., first slit 231 of
According to an embodiment, a second slit (e.g., the first slit 231 of
Referring to
The electronic device 100 according to an embodiment may include a communication module 220 (e.g., communication module 890 of
According to an embodiment, the first slit 231 may be disposed between the rear plate 120 and the first side member 130A. In an embodiment, the first slit 231 may be disposed (or formed) between the rear plate 120 and the first side member 130A. For example, the first slit 231 may be formed as the rear plate 120 and the first side member 130A are at least partially spaced apart from each other. In an embodiment, the first slit 231 may be at least partially extended along the first side member 130A. For example, the first side member 130A may include a portion (e.g., first portion 131) extended in a first direction (e.g., the X-axis direction), and the first slit 231 may include a portion extended in the same direction as the first direction. In this example, the first slit 231 may be extended to be parallel to the first side member 130A. For example, when viewed from above the rear plate 120 or the printed circuit board 210, the first slit 231 may be extended along the longitudinal direction in which a second portion 132 of the first side member 130A, the second slit 232, the first portion 131, the third slit 233, and a third portion 133 are extended.
In an embodiment, the first side member 130A may include the first portion 131, the second portion 132, and/or the third portion 133. In an embodiment, the first portion 131, the second portion 132, and the third portion 133 may be at least partially made of a conductive material (e.g., conductive metal). In an embodiment, the first portion 131 and the second portion 132 may be at least partially spaced apart from each other. In an embodiment, the second slit 232 may be disposed (or formed) between the first portion 131 and the second portion 132. In an embodiment, the first portion 131 and the third portion 133 may be at least partially spaced apart from each other. In an embodiment, the third slit 233 may be disposed (or formed) between the first portion 131 and the third portion 133. In an embodiment, the first portion 131, the second portion 132, and/or the third portion 133 may be at least partially filled with a dielectric material.
In an embodiment, it may be understood that, since the first portion 131, the second portion 132, and the third portion 133 are at least partially made of a conductive material, the side member 130 (e.g. the first side member 130A) includes a conductive portion and the conductive portion includes the first portion 131, the second portion 132, and the third portion 133.
According to an embodiment, at least a portion (e.g., the first portion 131) of the first side member 130A may be included in the antenna. For example, the first portion 131 may be electrically connected with the feeding part 250 through a first connection member 251 (e.g., a side contact) at a first location (or first point). The first portion 131 may be electrically connected with a ground part 260 through a second connection member 261 (e.g., a side contact) at a second location (or second point) spaced apart from the first location. In an embodiment, the first connection member 251 and/or the second connection member 261 may each include a C-clip connector, but the disclosure is not limited thereto. The feeding part 250 may be connected with the communication module 220. The printed circuit board 210 may include a first region 210a and/or a second region 210b. In an embodiment, the first region 210a may at least partially overlap the rear plate 120, when viewed from above the printed circuit board 210 or the rear plate 120. In an embodiment, the second region 210b may at least partially overlap the first slit 231, when viewed from above the printed circuit board 210 or the rear plate 120. In an embodiment, the first region 210a may include a ground region 211. In an embodiment, the ground region 211 of the first region 210a may include, for example, a region, a surface, or a layer made of a conductive material (e.g., copper). A fill-cut process may be performed on the second region 210b. The second region 210b may not include a conductive layer (e.g., the ground region 211). As another example, the printed circuit board 210 may not include the second region 210b. In an embodiment, the ground part 260 may be electrically connected with the ground region 211 of the printed circuit board 210. In an embodiment, the ground region 211 may be electrically connected with the rear plate 120.
In an embodiment, the electronic device 100 may include an antenna pattern 240. According to an embodiment, the antenna pattern 240 may be disposed to at least partially overlap the first slit 231, when viewed from above the rear surface of the electronic device 100 (or when viewed in the Z-axis direction). In an embodiment, the antenna pattern 240 may be included in the antenna. For example, the antenna pattern 240 may be electrically connected with the feeding part 250 through a third connection member 252 (e.g., a C-clip) at a third location (or third point). In an embodiment, the antenna pattern 240 may be electrically connected with the ground part 260 through a fourth connection member (not illustrated) (e.g., a C-clip) at a fourth location (or fourth point) spaced apart from the third location. As an example, the antenna pattern 240 may be implemented with a flexible printed circuit board (FPCB) or laser direct structuring (LDS). In this example, the antenna pattern 240 may be implemented in such a way that a conductive pattern is formed in at least one layer of the FPCB. The conductive pattern may include a conductive material, for example, copper (but, the disclosure is not limited thereto). When the antenna pattern 240 is implemented with an FPCB, the electronic device 100 according to an embodiment may include the FPCB. In this case, it may be understood that the antenna pattern 240 may be formed in the FPCB. According to an embodiment, the first portion 131 and the antenna pattern 240 may be included in the antenna. The antenna may transmit and/or receive signals in a first frequency band and/or signals in a second frequency band. For example, the first frequency band or the second frequency band may be substantially identical to or different from each other. According to an embodiment, the first portion 131 may be connected with the feeding part 250 to support communication for the first frequency band. The antenna pattern 240 may be connected with the feeding part 250 to support communication for the second frequency band. In an embodiment, the communication module 220 may feed the first portion 131 and/or the antenna pattern 240 through the feeding part 250 and may transmit and/or receive wireless signals in the first frequency band and/or the second frequency band. For example, the communication module 220 may feed the first portion 131 and the antenna pattern 240 and may transmit/receive wireless signals in the first frequency band and the second frequency band different from the first frequency band. For example, the first frequency band may include a frequency lower than the second frequency band (but, the disclosure is not limited thereto). For example, at least a portion of the conductive portion of the first side member 130A including the first portion 131 may implement a first resonant frequency corresponding to the first frequency band, and the antenna pattern 240 may implement a second resonant frequency corresponding to the second frequency band.
According to an embodiment, the antenna pattern 240 may be adjacent to the display 110, may be adjacent to the rear plate 120, and may be located to be equidistant to the display 110 and the rear plate 120 in the Z axis direction. For example, the antenna pattern 240 may be located to be closer to the display 110 than to the rear plate 120 in the Z axis direction of
In an embodiment, the antenna pattern 240 may at least partially overlap the display 110. For example, the antenna pattern 240 may at least partially overlap the display 110, when viewed from above the printed circuit board 210 or the rear plate 120 (or when viewed in the Z-axis direction of
In an embodiment, the antenna pattern 240 may be located between the printed circuit board 210 and the first slit 231 (or the rear plate 120). In another embodiment, unlike the illustration of
Referring to
Referring to
According to an embodiment, in view 401, the printed circuit board 210 may include the first region 210a and/or the second region 210b. The first region 210a may include a ground region (e.g., the ground region 211). A fill-cut process may be performed on the second region 210b. The second region 210b may not include the conductive layer. As another example, the printed circuit board 210 may not include the second region 210b.
According to an embodiment, the printed circuit board 210 may include a first contact pad 250a and/or a second contact pad 260a in the second region 210b. The first contact pad 250a and/or the second contact pad 260a may be disposed at locations corresponding to the first portion 131 of the first side member 130A. The first contact pad 250a and/or the second contact pad 260a may be electromagnetically connected with the first portion 131 of the first side member 130A through a connection member (e.g., the first connection member 251 or the second connection member 261). As an example, the first contact pad 250a may be connected with a feeding part (e.g., the feeding part 250), and the second contact pad 260a may be connected with a ground part (e.g., the ground part 260).
According to an embodiment, in view 403, the antenna pattern 240 may be disposed adjacent to the first portion 131 of the first side member 130A. The antenna pattern 240 may be disposed at a location corresponding to a slit (e.g., the first slit 231) between the first side member 130A and the rear plate (e.g., the rear plate 120). For example, when viewed from above the rear plate, the antenna pattern 240 may at least partially overlap the slit (e.g., the first slit 231 of
According to an embodiment, the antenna pattern may be included in a flexible printed circuit board.
According to an embodiment, a length of the antenna pattern in one direction may be configured to be smaller than or equal to a thickness of the slit.
According to an embodiment, the side member may be divided into a plurality of portions, and a length of the antenna pattern in a direction parallel to the slit may be configured to be smaller than a length of at least one of the plurality of portions.
According to an embodiment, the side member may be divided into a plurality of portions including a first portion (e.g., the first portion 131). The first portion may be connected with the feeding part and the ground region to support communication for a first frequency band. The antenna pattern may be connected with the feeding part and the ground region to support communication for a second frequency band.
According to an embodiment, the first frequency band may be lower than the second frequency band.
According to an embodiment, the first portion may support communication for a legacy band. The antenna pattern may support communication for a new radio (NR) band.
According to an embodiment, a portion of the first portion may be electrically connected with the feeding part through a first connection member (e.g., the first connection member 251). Another portion of the first portion may be electrically connected with a ground part (e.g., the ground part 260) connected with the ground region through a second connection member (e.g., the second connection member 261). A portion of the antenna pattern may be electrically connected with the feeding part through a third connection member (e.g., the third connection member 252). Another portion of the antenna pattern may be electrically connected with the ground part through a fourth connection member.
According to an embodiment, the printed circuit board may include a first region including the ground region and a second region in which the ground region is absent. The antenna pattern may be disposed in the second region.
According to an embodiment, the ground region may be electrically connected with the rear plate.
According to an embodiment, an electronic device includes a display, a rear plate including a conductive material, a side member including a plurality of portions including a conductive material and disposed to surround a space between the display and the rear plate, a printed circuit board disposed between the display and the rear plate, an antenna pattern at least partially disposed between the printed circuit board and the rear plate and disposed at a location corresponding to a slit between the rear plate and the side member, and a communication module generating a communication signal transferred to a feeding part. A portion of the side member may be connected with the feeding part to support communication for a first frequency band. The antenna pattern may be connected with the feeding part to support communication for a second frequency band.
According to an embodiment, the first frequency band may be lower than the second frequency band.
According to an embodiment, the portion of the side member may support communication for a legacy band. The antenna pattern may support communication for a new radio (NR) band.
According to an embodiment, the antenna pattern may be included in a flexible printed circuit board.
According to an embodiment, a length of the antenna pattern in one direction may be configured to be smaller than or equal to a thickness of the slit.
According to an embodiment, a length of the antenna pattern in a direction parallel to the slit may be configured to be smaller than a length of the one portion of the side member.
According to an embodiment, the printed circuit board may include a first region including the ground region and a second region in which the ground region is absent. The antenna pattern may be disposed in the second region.
Referring to
According to an embodiment,
According to an embodiment,
According to an embodiment,
According to an embodiment,
According to an embodiment,
According to an embodiment,
The processor 820 may execute, for example, software (e.g., a program 840) to control at least one other component (e.g., a hardware or software component) of the electronic device 801 coupled with the processor 820, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 820 may store a command or data received from another component (e.g., the sensor module 876 or the communication module 890) in volatile memory 832, process the command or the data stored in the volatile memory 832, and store resulting data in non-volatile memory 834. According to an embodiment, the processor 820 may include a main processor 821 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 823 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 821. For example, when the electronic device 801 includes the main processor 821 and the auxiliary processor 823, the auxiliary processor 823 may be adapted to consume less power than the main processor 821, or to be specific to a specified function. The auxiliary processor 823 may be implemented as separate from, or as part of the main processor 821.
The auxiliary processor 823 may control at least some of functions or states related to at least one component (e.g., the display module 860, the sensor module 876, or the communication module 890) among the components of the electronic device 801, instead of the main processor 821 while the main processor 821 is in an inactive (e.g., sleep) state, or together with the main processor 821 while the main processor 821 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 823 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 880 or the communication module 890) functionally related to the auxiliary processor 823. According to an embodiment, the auxiliary processor 823 (e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing. An artificial intelligence model may be generated by machine learning. Such learning may be performed, e.g., by the electronic device 801 where the artificial intelligence is performed or via a separate server (e.g., the server 808). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.
The memory 830 may store various data used by at least one component (e.g., the processor 820 or the sensor module 876) of the electronic device 801. The various data may include, for example, software (e.g., the program 840) and input data or output data for a command related thereto. The memory 830 may include the volatile memory 832 or the non-volatile memory 834.
The program 840 may be stored in the memory 830 as software, and may include, for example, an operating system (OS) 842, middleware 844, or an application 846.
The input module 850 may receive a command or data to be used by another component (e.g., the processor 820) of the electronic device 801, from the outside (e.g., a user) of the electronic device 801. The input module 850 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
The sound output module 855 may output sound signals to the outside of the electronic device 801. The sound output module 855 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
The display module 860 may visually provide information to the outside (e.g., a user) of the electronic device 801. The display module 860 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display module 860 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.
The audio module 870 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 870 may obtain the sound via the input module 850, or output the sound via the sound output module 855 or a headphone of an external electronic device (e.g., an electronic device 802) directly (e.g., wiredly) or wirelessly coupled with the electronic device 801.
The sensor module 876 may detect an operational state (e.g., power or temperature) of the electronic device 801 or an environmental state (e.g., a state of a user) external to the electronic device 801, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 876 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The interface 877 may support one or more specified protocols to be used for the electronic device 801 to be coupled with the external electronic device (e.g., the electronic device 802) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 877 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
A connecting terminal 878 may include a connector via which the electronic device 801 may be physically connected with the external electronic device (e.g., the electronic device 802). According to an embodiment, the connecting terminal 878 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).
The haptic module 879 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 879 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
The camera module 880 may capture a still image or moving images. According to an embodiment, the camera module 880 may include one or more lenses, image sensors, image signal processors, or flashes.
The power management module 888 may manage power supplied to the electronic device 801. According to one embodiment, the power management module 888 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
The battery 889 may supply power to at least one component of the electronic device 801. According to an embodiment, the battery 889 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
The communication module 890 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 801 and the external electronic device (e.g., the electronic device 802, the electronic device 804, or the server 808) and performing communication via the established communication channel. The communication module 890 may include one or more communication processors that are operable independently from the processor 820 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 890 may include a wireless communication module 892 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 894 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 898 (e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 899 (e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 892 may identify and authenticate the electronic device 801 in a communication network, such as the first network 898 or the second network 899, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 896.
The wireless communication module 892 may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 892 may support a high-frequency band (e.g., the mmWave band) to achieve, e.g., a high data transmission rate. The wireless communication module 892 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 892 may support various requirements specified in the electronic device 801, an external electronic device (e.g., the electronic device 804), or a network system (e.g., the second network 899). According to an embodiment, the wireless communication module 892 may support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, loss coverage (e.g., 864 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round trip of 8 ms or less) for implementing URLLC.
The antenna module 897 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 801. According to an embodiment, the antenna module 897 may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 897 may include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 898 or the second network 899, may be selected, for example, by the communication module 890 (e.g., the wireless communication module 892) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module 890 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 897.
According to various embodiments, the antenna module 897 may form a mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.
At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
According to an embodiment, commands or data may be transmitted or received between the electronic device 801 and the external electronic device 804 via the server 808 coupled with the second network 899. Each of the electronic devices 802 or 804 may be a device of a same type as, or a different type, from the electronic device 801. According to an embodiment, all or some of operations to be executed at the electronic device 801 may be executed at one or more of the external electronic devices 802, 804, or 808. For example, if the electronic device 801 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 801, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 801. The electronic device 801 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device 801 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In another embodiment, the external electronic device 804 may include an internet-of-things (IoT) device. The server 808 may be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device 804 or the server 808 may be included in the second network 899. The electronic device 801 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.
The electronic device according to various embodiments may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
It should be appreciated that various embodiments of the present disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
As used in connection with various embodiments of the disclosure, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC).
Various embodiments as set forth herein may be implemented as software (e.g., the program 840) including one or more instructions that are stored in a storage medium (e.g., internal memory 836 or external memory 838) that is readable by a machine (e.g., the electronic device 801). For example, a processor (e.g., the processor 820) of the machine (e.g., the electronic device 801) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a compiler or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.
According to an embodiment, a method according to various embodiments of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
Number | Date | Country | Kind |
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10-2020-0097660 | Aug 2020 | KR | national |
This application is a continuation of International Application No. PCT/KR2021/010103, which was filed on Aug. 3, 2021, and claims priority to Korean Patent Application No. 10-2020-0097660, filed on Aug. 4, 2020, in the Korean Intellectual Property Office, the disclosure of which are incorporated by reference herein their entirety.
Number | Date | Country | |
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Parent | PCT/KR2021/010103 | Aug 2021 | US |
Child | 18096111 | US |