An embodiment of the disclosure relates to a detachable hinge cover and an electronic device including the same.
The term “electronic device” may mean a device performing a particular function according to its equipped program, such as a home appliance, an electronic scheduler, a portable multimedia player, a mobile communication terminal, a tablet PC, a video/sound device, a desktop PC or laptop computer, a navigation for automobile, etc. For example, the electronic devices may output stored information as voices or images. As the demand for mobile communication increases, and the degree of integration of electronic devices increases, various technologies have been developed to enhance the portability of the electronic device and user convenience in use of multimedia functions. For example, the electronic device is downsized while the display of the electronic device is able to deliver the same or even better usability (e.g., a larger screen). Flexible displays, e.g., foldable or rollable displays, will come in commerce and electronic devices are expected to deliver better portability and use convenience. In general, a structure in which a plurality of different structures move relative to each other, such as an electronic device that is deformable between a folded (or rolled) state and an unfolded state (hereinafter referred to as a foldable electronic device), may typically be implemented by adopting a hinge structure.
According to an embodiment of the disclosure, an electronic device may comprise a first housing, a second housing, at least one hinge module disposed between the first housing and the second housing and configured to rotatably connect the first housing and the second housing to each other, a flexible circuit board disposed in the first housing and the second housing, a hinge bracket, and/or a hinge cover. The hinge bracket may include a first surface to which the at least one hinge module is coupled and a second surface facing in a direction opposite to a direction in which the first surface faces. The hinge cover may be detachably disposed on the second surface. The flexible circuit board may be disposed on an area of the first surface spaced apart from the hinge module, and the hinge bracket is disposed to intervene between the flexible circuit board and the hinge cover.
Referring to
The processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to an embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be configured to use lower power than the main processor 121 or to be specified for a designated function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.
The auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing. The artificial intelligence model may be generated via machine learning. Such learning may be performed, e.g., by the electronic device 101 where the artificial intelligence is performed or via a separate server (e.g., the server 108). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.
The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134.
The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.
The input module 150 may receive a command or data to be used by other component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).
The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
The display module 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.
The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.
The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
A connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).
The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or motion) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device 104 via a first network 198 (e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., local area network (LAN) or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify or authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.
The wireless communication module 192 may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 may support a high-frequency band (e.g., the mm Wave band) to achieve, e.g., a high data transmission rate. The wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, loss coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1 ms or less) for implementing URLLC.
The antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna appropriate for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas by, e.g., the communication module 190. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other parts (e.g., radio frequency integrated circuit (RFIC)) than the radiator may be further formed as part of the antenna module 197.
According to an embodiment, the antenna module 197 may form a mmWave antenna module. According to an embodiment, the mm Wave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.
At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. The external electronic devices 102 or 104 each may be a device of the same or a different type from the electronic device 101. According to an embodiment, all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device 101 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In an embodiment, the external electronic device 104 may include an internet-of-things (IoT) device. The server 108 may be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or health-care) based on 5G communication technology or IoT-related technology.
In the following detailed description, a length direction, a width direction, and/or a thickness direction of the electronic device may be mentioned and may be defined as a ‘Y-axis direction,’ ‘X-axis direction’, and/or ‘Z-axis direction,’ respectively. In an embodiment, ‘negative/positive (−/+)’ may be mentioned together with the Cartesian coordinate system exemplified in the drawings with respect to the direction in which the component is oriented. For example, the front surface of the electronic device or housing may be defined as a ‘surface facing in the +Z direction,’ and the rear surface may be defined as a ‘surface facing in the −Z direction’. In an embodiment, the side surface of the electronic device or housing may include an area facing in the +X direction, an area facing in the +Y direction, an area facing in the −X direction, and/or an area facing in the −Y direction. In another embodiment, the ‘X-axis direction’ may mean including both the ‘−X direction’ and the ‘+X direction’. It should be noted that the directions are so defined with respect to the Cartesian coordinate system shown in the drawings for the sake of brevity of description, and the description of these directions or components do not limit an embodiment of the disclosure. For example, the direction in which the front surface or rear surface faces may be varied depending on the unfolded state or folded state of the electronic device, and the above-mentioned directions may be interpreted as different ones depending on the user's way to grip.
Referring to
According to an embodiment, the housing 201 may include a first housing 210, a second housing 220 rotatably or pivotably coupled to the first housing 210, a first rear cover 280, a second rear cover 290, and a hinge module (e.g., the hinge assembly 202 of
According to an embodiment, the first housing 210 and the second housing 220 are disposed on both sides of the folding axis A and be overall symmetrical in shape with respect to the folding axis A. As set forth below, the first housing 210 and the second housing 220 may have different angles or distances formed therebetween depending on whether the electronic device 101 is in the unfolded, folded, or an intermediate state. According to an embodiment, the second housing 220 further includes a sensor area 224 where various sensors are disposed, unlike the first housing 210 but, in the remaining area, the second housing 220 may be symmetrical in shape with the first housing 210. According to an embodiment, there may be provided a plurality of (e.g., two or more) folding axes A parallel to each other. In embodiments of the disclosure, the folding axis A is provided along the length direction (Y-axis direction) of the electronic device 101, but the direction of the folding axis A is not limited thereto. For example, according to external design or the user's usage habit, the electronic device 101 may be understood as including a folding axis A extending along the width direction (e.g., X-axis direction).
According to an embodiment, the electronic device 101 may include a structure into which a digital pen may be inserted. For example, a hole 223 into which the digital pen may be inserted may be formed in a side surface of the first housing 210 or a side surface of the second housing 220 of the electronic device 101.
According to an embodiment, the first housing 210 and the second housing 220 may at least partially be formed of a metal or non-metallic material with a rigidity selected to support the display 240. At least a portion formed of metal may provide a ground plane of the electronic device 101 and may be electrically connected with a ground conductor provided to the printed circuit board (e.g., the board assembly 260 of
According to an embodiment, the sensor area 224 may be formed to have a predetermined area, adjacent to a corner of the second housing 220. However, the placement, shape, or size of the sensor area 224 is not limited to those illustrated. For example, in an embodiment, the sensor area 224 may be provided in a different corner of the second housing 220 or in any area between the top corner and the bottom corner of the second housing or in the first housing 210. According to an embodiment, components for performing various functions, embedded in the electronic device 101, may be visually exposed through the sensor area 224 or one or more openings in the sensor area 224 to the front surface of the electronic device 101. In an embodiment, the components may include various kinds of sensors. The sensor may include, e.g., at least one of a front camera, a receiver, or a proximity sensor.
According to an embodiment, the first rear cover 280 may be disposed on one side of the folding axis A on the rear surface of the electronic device 101 and have, e.g., a substantially rectangular periphery which may be surrounded by the first housing 210. Similarly, the second rear cover 290 may be disposed on the opposite side of the folding axis A on the rear surface of the electronic device 101 and its periphery may be surrounded by the second housing 220.
According to an embodiment, the first rear cover 280 and the second rear cover 290 may be substantially symmetrical in shape with respect to the folding axis A. However, the first rear cover 280 and the second rear cover 290 are not necessarily symmetrical in shape (for example, the first rear cover 280 may have a first shape and the second rear cover 290 may have a second shape that is different to the first shape). In an embodiment, the electronic device 101 may include the first rear cover 280 and the second rear cover 290 in various shapes.
According to an embodiment, the first rear cover 280, the second rear cover 290, the first housing 210, and the second housing 220 may form a space where various components (e.g., a printed circuit board or battery) of the electronic device 101 may be disposed. According to an embodiment, one or more components may be arranged on or visually exposed through the rear surface of the electronic device 101. For example, at least a portion of a sub display (e.g., the sub display 244 of
In an embodiment, a front camera visually exposed to the front surface of the electronic device 101 through one or more openings prepared in the sensor area 224 or a camera module 206 visually exposed through a second rear surface area 292 of the second rear cover 290 may include one or more lenses, an image sensor, and/or an image signal processor. According to an embodiment, two or more lenses (an infrared (IR) camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one surface of the electronic device 101.
Referring to
According to an embodiment, as shown in
According to an embodiment, the display 240 may be disposed in a space formed by the housing 201. For example, the display 240 may be seated on a recess formed by the housing 201 and may occupy most of the front surface of the electronic device 101. Thus, the front surface of the electronic device 101 may include the display 240 and a partial area of the first housing 210 and a partial area of the second housing 220, which are adjacent to the display 240. The rear surface of the electronic device 101 may include a first rear cover 280, a partial area of the first housing 210 adjacent to the first rear cover 280, a second rear cover 290, and a partial area of the second housing 220 adjacent to the second rear cover 290.
According to an embodiment, the display 240 may mean a display of which at least a portion may be transformed into a flat or curved surface. According to an embodiment, the display 240 may include a folding area 243, a first display area 241 disposed on one side of the folding area 243 (e.g., the left side of the folding area 243 of
However, the segmentation of the display 240 is merely an example, and the display 240 may be divided into a plurality of (e.g., four or more, or two) areas depending on the structure or function of the display 200. For example, in the embodiment illustrated in
According to an embodiment, the first display area 241 and the second display area 242 may be overall symmetrical in shape with respect to the folding area 243. According to an embodiment (not shown), unlike the first display area 241, the second display area 242 may include a notch depending on the presence of the sensor area 224, but the rest may be symmetrical in shape with the first display area 241. In other words, the first display area 241 and the second display area 242 may include symmetrical portions and asymmetrical portions.
Described below are the operation of the first housing 210 and the second housing 220 and each area of the display 240 depending on the state (e.g., the unfolded state (or flat state) and folded state) of the electronic device 101.
According to an embodiment, when the electronic device 101 is in the unfolded state (flat state) (e.g.,
According to an embodiment, when the electronic device 101 is in the folded state (e.g.,
According to an embodiment, when the electronic device 101 is in the intermediate state (not shown), the first housing 210 and the second housing 220 may be disposed at a certain angle therebetween. The surface of the first display area 241 of the display 240 and the surface of the second display area 242 may form an angle which is larger than the angle in the folded state and smaller than the angle in the unfolded state. The folding area 243 may at least partially have a curved surface with a predetermined curvature and, in this case, the curvature may be smaller than that when it is in the folded state.
The electronic device 101 of
Referring to
According to an embodiment, the housing 201 may include a first housing 210 (e.g., the first housing 210 of
According to an embodiment, the first housing 210 and the second housing 220 may be assembled together to be coupled to two opposite sides of the hinge assembly 202. According to an embodiment, the first housing 210 may include a first supporting area 212 (e.g., a first supporting plate or a first supporting member) that may support the components (e.g., the first circuit board 262 and/or the first battery 252) of the electronic device 101 and a first sidewall 211 surrounding at least a portion of the first supporting area 212. The first sidewall 211 may include a first side surface (e.g., the first side surface 211a of
According to an embodiment, the hinge assembly 202 may be disposed between the display 240 and the hinge cover 203. In an embodiment, the hinge assembly 202 may include at least one hinge module 231, 232, and 233 and/or a hinge bracket 235. In an embodiment, each of the hinge modules 231, 232, and 233 may be coupled to a partial area of one surface (e.g., a surface in the +Z direction) of the hinge bracket 235.
In an embodiment, the hinge modules 231, 232, and 233 may include a first hinge module 231 and 232 providing a rotation structure and a detent structure for the first housing 210 and/or the second housing 220, and a second hinge module 233 providing an interlocking structure (for example, the second hinge module 233 may provide a means for interlocking the first housing 210 and the second housing 220 via the hinge bracket 235).
According to an embodiment, the first hinge module 231 and 232 may include at least one rotation structure (e.g., a first rotation structure 231 and/or a second rotation structure 232) that implements or guides rotation of the first housing 210 and/or the second housing 220. According to an embodiment, the first hinge module 231 and 232 may include a first rotation structure 231 and/or a second rotation structure 232 spaced apart from each other in the length direction (e.g., Y-axis direction) of the electronic device. For example, the first rotation structure 231 and/or the second rotation structure 232 may provide at least one (for example, one or two, or more) rotational axis parallel to the length direction of the electronic device or hinge bracket. For example, the at least one rotational axis may be substantially parallel to the folding axis (e.g., the folding axis A of
In an embodiment, the first rotation structure 231 and/or the second rotation structure 232 may include rotating members 231a, 231b, 232a, and 232b and a detent structure (not shown), respectively. For example, the first hinge module 231 may include a 1-1th rotating member 231a connected to the first housing 210 and/or a 1-2th rotating member 231b connected to the second housing 220. For example, the second hinge module 233 may include a 2-1st rotating member 232a connected to the first housing 210 and/or a 2-2th rotating member 232b connected to the second housing 220. For example, at least one rotating member 231a, 231b, 232a, and 232b of the first rotation structure 231 and/or the second rotation structure 232 may be connected to the hinge bracket 235. For example, the hinge bracket 235 may provide a space (not shown) in which at least one rotating member 231a, 231b, 232a, and 232b is seated and may rotate about at least one rotational axis. For example, the hinge bracket 235 may include a rail (not shown) formed to guide rotation of the at least one rotating member 231a, 231b, 232a, and 232b in a seated area to which a portion of the at least one rotating member 231a, 231b, 232a, and 232b is connected.
According to an embodiment, the detent structure (not shown) of each of the first rotation structure 231 and/or the second rotation structure 232 may position the first housing 210 and the second housing 220 at a certain angle. For example, the detent structure (not shown) may prevent or reduce movement and/or rotation of the first housing 210 and/or the second housing 220 of the electronic device 101 by using an elastic force of a spring (not shown). For example, the detent structure (not shown) may be formed to allow rotation of the first housing 210 and/or the second housing 220 when an external force transmitted from the first housing 210 and/or the second housing 220 is equal to or greater than a designated value. According to an embodiment, the detent structure (not shown) of the first rotation structure 231 and/or the second rotation structure 232 may include a plurality of (e.g., a pair of) detent members (not shown) connected to the first housing 210 and the second housing 220, respectively.
In an embodiment, the second hinge module 233 may be configured to include an interlocking structure (not shown) that interlocks the rotation of the first housing 210 and the rotation of the second housing 220. For example, the second hinge module 233 may transfer at least a portion of the force applied to the first housing 210 to the second housing 220, or may transfer at least a portion of the force applied to the second housing 220 to the first housing 210. For example, the second hinge module 233 may rotate the second housing 220 by substantially the same angle as the angle at which the first housing 210 rotates using the helical rotating members 233a and 233b, and vice versa. According to an embodiment, the second hinge module 233 may include a first helical rotating member 233a connected to the first housing 210 and/or a second helical rotating member 233b connected to the second housing 220. For example, the at least one helical rotating member 233a or 233b of the second hinge module 233 may be connected to the hinge bracket 235. For example, the hinge bracket 235 may provide a space (not shown) in which the first rotating member 232a and/or the second rotating member 232b is seated to rotate about at least one rotational axis. For example, the hinge bracket 235 may include a rail (not shown) formed to guide rotation of the first rotating member 232a and/or the second rotating member 232b in a seated area to which a portion of the first rotating member 232a and/or the second rotating member 232b is connected.
In an embodiment, the hinge cover 203 (e.g., the hinge cover 230 of
According to an embodiment, the display 240 may include a first display area 241 (e.g., the first display area 241 of
According to an embodiment, the battery 250 may include a first battery 252 disposed in the first housing 210 and a second battery 254 disposed in the second housing 220. According to an embodiment, the first battery 252 may be disposed on the first circuit board 262, and the second battery 254 may be disposed on the second circuit board 264.
According to an embodiment, the board assembly 260 may include a first circuit board 262 disposed within the first housing 210 and a second circuit board 264 disposed within the second housing 220. According to an embodiment, the board assembly 260 may include at least one flexible printed circuit board 270 for electrically connecting the first circuit board 262 and the second circuit board 264. According to an embodiment, at least a portion of the flexible printed circuit board 270 may be disposed across the hinge assembly 202. According to an embodiment, the first circuit board 262 and the second circuit board 264 may be disposed in a space formed by the first housing 210, the second housing 220, the first rear cover 280, and the second rear cover 290. For example, components for implementing various functions of the electronic device 101 may be disposed on the first circuit board 262 and the second circuit board 264.
According to various embodiments, the electronic device 101 may include a speaker module 208 (e.g., the audio module 170 of
In the following detailed description, a configuration in which the first housing 210 and the second housing 220 are connected or coupled to be rotatable by a hinge module (or referred to as a ‘hinge structure’) may be described as an example. However, it should be noted that the electronic device according to various embodiments of the disclosure is not limited thereto. For example, according to various embodiments, the electronic device may include three or more housings. In the embodiment disclosed below, a “pair of housings” may mean two rotatably-coupled housings among three or more housings.
The electronic device 101 disclosed in
Hereinafter, various examples of specific configurations of a hinge assembly and a hinge cover of an electronic device are described with reference to
The flexible printed circuit board of
Referring to
In an embodiment, the hinge assembly 301 may include a hinge bracket 350 (e.g., the hinge bracket 235 of
In an embodiment, the hinge bracket 350 may include a first surface 350a (e.g., a surface in the +Z direction) facing the hinge modules 310, 320, and 330 and a second surface 350b (e.g., a surface in the −Z direction) facing in the direction opposite to the direction where the first surface 350a faces and facing the hinge cover 370. For example, the hinge bracket 350 may extend in the length direction (e.g., the Y-axis direction) of the electronic device 101. For example, the first surface 350a and/or the second surface 350b may be formed to include a curved shape and/or a flat shape. For example, the hinge bracket 350 may include a side surface surrounding between the first surface 350a and the second surface 350b. For example, the first surface 350a and/or the second surface 350b may form at least a portion of the side surface. In an embodiment, when the connection assembly 360 is coupled to the hinge cover 370, the hinge bracket 350 may include a connection opening 351 where at least a portion of the connection assembly 360 is accommodated. In an embodiment, when the connection assembly 360 is coupled to the hinge bracket 350 (e.g., see
In an embodiment, at least one first hinge module 310 and 320 (e.g., the first rotation structure 231 and/or the second rotation structure 232 of
For example, the at least one flexible circuit board 270 may be disposed to cross the hinge bracket 350 in a direction (e.g., the width direction or the X-axis direction of the electronic device 101) crossing the length direction of the electronic device 101 (for example, the at least one flexible circuit board 270 may be disposed to cross the hinge bracket 350 such that the at least one flexible circuit board 270 electrically connects the first circuit board 262 and the second circuit board 264). For example, an area of the first surface 350a of the hinge bracket 350 that overlaps the flexible circuit board 270 may be positioned outside the area of the first surface 350a that overlaps the first hinge module 310 and 320 and the second hinge module 330.
According to an embodiment, the hinge bracket 350 may include at least one seating area 352 where a portion of the at least one flexible circuit board 270 is seated. According to an embodiment, a pair of flexible circuit boards 270 may be provided which are disposed side by side with the second hinge module 330 interposed therebetween. For example, the seating area 352 may include a plurality (e.g., two) seating areas 352 where the flexible circuit board 270, respectively, are disposed. For example, a portion of the flexible circuit board 270 disposed in the seating area 352 may vary between a curved shape and a flat shape based on rotation of the hinge module,
Referring to
Referring to
Referring to
Referring to
Referring to
The hinge bracket 350 of
In an embodiment, the hinge cover 370 may be detachably coupled to the hinge bracket 350 by using the connection assembly 360 and the release hole 371a. Hereinafter, an example where the connection assembly 360 is coupled to the hinge cover 370 will be mainly described, but in an embodiment (e.g., see
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In an embodiment, the latch member 361 may include a support portion 361a seated inside the latch cover 362 and/or a first connection portion 361b extending from the support portion 361a. According to an embodiment, the first connection portion 361b may include a portion extending from the support portion 361a toward the hinge bracket 350 (e.g., in the +Z-axis direction) and/or an end portion of the connection assembly 360 protruding outward of the member (e.g., in the +Y-axis direction). According to an embodiment, a portion (e.g., an end portion) of the first connection portion 361b may hang on an end portion of the second connection portion 353 of the hinge bracket 350. For example, in a state where the hinge cover 370 is attached to the hinge bracket 350, the first connection portion 361b may protrude through the connection opening 351 of the hinge bracket 350, and an end portion of the first connection portion 361b may be engaged with the second connection portion 353 in a manner to hang on the end portion of the second connection portion 353.
In an embodiment, the latch cover 362 may include an accommodation space 362a that accommodates the release member 365, the first spring 363, the second spring 364, and/or at least a portion (e.g., the support portion 361a) of the latch member 361. For example, at least a portion of one sidewall (e.g., a wall in the −Z direction) of the latch cover 362 may be open in the accommodation space 362a. According to an embodiment, a portion of the opening of the latch cover 362, the release member 365, and the release hole 371a formed in the hinge cover 370 may overlap and/or be aligned with respect to one axis (e.g., the thickness direction or the Z axis of the electronic device 101).
For example, a portion of the accommodation space 362a may be formed to guide an ascending/descending motion (e.g., the Z-axis motion) of the release member 365. For example, the release member 365 may be positioned between the release hole 371a and the second spring 364 while being accommodated in the accommodation space 362a. For example, the second spring 364 may be disposed between the release member 365 and one sidewall (e.g., a wall in the +Z direction) of the latch cover 362. For example, the second spring 364, the release member 365, and the release hole 371a may overlap and/or be aligned with respect to one axis (e.g., the thickness direction or the Z axis of the electronic device 101). According to an embodiment, the second spring 364 may provide the release member 365 with an elastic force acting in the thickness direction (e.g., the Z-axis direction) of the electronic device 101.
For example, a portion of the accommodation space 362a of the latch cover 362 may be formed to accommodate and/or support a portion (e.g., the support portion 361a) of the latch member 361. A space where the latch member 361 is accommodated in a portion of the accommodation space 362a may be formed to guide a horizontal movement (e.g., a Y-axis movement) of the latch member 361. For example, a portion of the accommodation space 362a may be open to, at least, one sidewall (e.g., a wall in the +Z direction) of the latch cover 362. For example, the first connection portion 361b of the latch member 361 may protrude through the opening of the latch cover 362. For example, the latch member 361 may be disposed to face one sidewall (e.g., a wall in the +Y direction) of the latch cover 362 with the first spring 363 interposed therebetween. According to an embodiment, the first spring 363 may provide an elastic force acting in the length direction (e.g., the Y-axis direction) of the electronic device 101 to the latch member 361. For example, protrusions supporting the first spring 363 may be formed on one sidewall (e.g., a wall in the +Y direction) of the latch cover 362 and one surface of the latch member 361, respectively, which face each other.
Referring to
However, the configuration of the hinge cover 370 is not limited to the above-described embodiment. In an embodiment, the hinge cover 370 may include a plurality (e.g., two) connection assemblies 360 spaced apart from each other in the length direction of the electronic device 101. For example, the first coupling portion 372 of the hinge cover 370 and/or the second coupling portion 354 of the hinge bracket 350 may be omitted.
The hinge cover 370 of
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In an embodiment, the separation of the hinge cover 370 may be performed by changing the release member 365 to the raised position using, for example, the insertion tool T. Referring to
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The hinge bracket 350 of
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The configuration of the hinge bracket 350 of
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In an embodiment, the latch member 361 may include a support portion 361a seated inside the latch cover 362 and/or a first connection portion 361b extending from the support portion 361a. According to an embodiment, the first connection portion 361b may include a portion extending from the support portion 361a toward the hinge cover 370 (e.g., in the −Z-axis direction) and/or an end portion of the connection assembly 360 protruding outward of the member (e.g., in the +Y-axis direction). According to an embodiment, a portion (e.g., an end portion) of the first connection portion 361b may hang on an end portion of the third connection portion 375 (e.g., see
In an embodiment, the first connection portion 361b and the third connection portion 375 may be formed to include hook structures in which end portions thereof are engaged with each other. However, the form of the first connection portion 361b and/or the third connection portion 375 is not limited to the example disclosed herein, and may be formed in various forms that may be detachably coupled to each other.
In an embodiment, the latch cover 362 may include an accommodation space 362a that accommodates at least a portion of the release member 365, the first spring 363, the second spring 364, and/or the latch member 361. For example, at least a portion of one sidewall (e.g., a wall in the −Z direction) of the latch cover 362 may be open in the accommodation space 362a. According to an embodiment, a portion of the opening of the latch cover 362, the release member 365, and the release hole 371a formed in the hinge cover 370 may overlap and/or be aligned with respect to one axis (e.g., the thickness direction or the Z axis of the electronic device 101).
For example, the accommodation space 362a of the latch cover 362 may be formed to guide the ascending/descending motion (e.g., the Z-axis motion) of the release member 365. For example, the release member 365 may be positioned between the release hole 371a and the second spring 364 while being accommodated in the accommodation space 362a. For example, the second spring 364 may be disposed between the release member 365 and one sidewall (e.g., a wall in the +Z direction) of the latch cover 362. According to an embodiment, the second spring 364 may provide the release member 365 with an elastic force acting in the thickness direction (e.g., the Z-axis direction) of the electronic device 101.
For example, a portion of the accommodation space 362a of the latch cover 362 may be formed to accommodate and/or support a portion (e.g., the support portion 361a) of the latch member 361. A space where the latch member 361 is accommodated in a portion of the accommodation space 362a may be formed to guide a horizontal movement (e.g., a Y-axis movement) of the latch member 361. For example, the latch member 361 may be disposed to face one sidewall (e.g., a wall in the −Y direction) of the latch cover 362 with the first spring 363 interposed therebetween. According to an embodiment, the first spring 363 may provide an elastic force acting in the length direction (e.g., the Y-axis direction) of the electronic device 101 to the latch member 361. For example, protrusions supporting the first spring 363 may be formed on one sidewall (e.g., a wall in the −Y direction) of the latch cover 362 and one surface of the latch member 361, respectively, which face each other.
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In a foldable electronic device, a waterproof structure is generally applied to internal electrical and electronic components that are vulnerable to water penetration. For example, the waterproof structure may block external foreign substances, including fine dust, as well as external moisture. For example, in the foldable electronic device, the area where the hinge assembly and the hinge cover are disposed is relatively less vulnerable to water penetration, and thus the waterproof structure may not be applied. Therefore, foreign substances introduced from the outside of the electronic device may penetrate the hinge assembly, and the foreign substances may accumulate in gaps in hinge components (e.g., rails, cams, and spring members). Since the foreign substance may adversely affect the operation of the hinge assembly, it is necessary to remove it through washing. The hinge assembly may be generally disposed between the display assembly disposed on the front surface of the electronic device and the hinge cover disposed on the rear surface of the electronic device. Therefore, access to the hinge assembly is generally followed by a hassle to remove the display assembly. For example, to wash hinge components such as a rail, a cam, or a spring member, it is necessary to separate a rotating member disposed in front of the hinge component and coupled (e.g., screwed) to the housing.
An embodiment of the disclosure provides a hinge cover that is detachably connected to the hinge assembly so that the hinge assembly may be accessed through the rear surface of the electronic device, and an electronic device including the hinge cover.
An embodiment of the disclosure provides a hinge bracket and a device including the hinge bracket, in which the hinge bracket is formed as a single component where a plurality of hinge components (or hinge modules) are disposed to be spaced apart and coupled together to protect the flexible circuit board not to be exposed to the outside of the electronic device when the hinge cover is removed, and the area of the hinge bracket overlapping the flexible circuit board is formed to have a smaller thickness than that of the other areas to secure a space for disposing the flexible circuit board.
According to an embodiment of the disclosure, an electronic device 101 may comprise a first housing 210, a second housing 220, at least one hinge module (the first hinge module 231 and 232 and/or the second hinge module 233 of
In an embodiment, the flexible circuit board may be exposed to the second surface of the hinge bracket. For example, the flexible circuit board may be exposed to the second surface of the hinge bracket through an opening formed to penetrate from the first surface of the hinge bracket to the second surface of the hinge bracket. For example, the opening at least partially overlapping the flexible circuit board may be formed in a seating area (the seating area 352 of
According to an embodiment, the hinge bracket includes at least one seating area (the seating area 352 of
According to an embodiment, the seating area may include an opening formed to penetrate from the first surface to the second surface and/or at least one plate member (the plate member 340 of
According to an embodiment, a portion of the plate member overlapping the seating area may be formed to close the seating area. A remaining portion of the plate member that does not overlap the seating area may surround a portion of the first surface.
According to an embodiment, a portion of the plate member overlapping the seating area may be formed to close the seating area. A remaining portion of the plate member that does not overlap the seating area may surround a portion of the second surface. According to an embodiment, a plurality of hinge modules may be provided. The plurality of hinge modules are spaced apart from each other on the first surface of the hinge bracket.
According to an embodiment, the electronic device may further comprise a connection assembly (the connection assembly 360 of
According to an embodiment, the connection assembly may be coupled to a portion of the hinge cover. The connection assembly may include a latch member 361 including a first connection portion (the first connection portion 361b of
According to an embodiment, the hinge bracket may include a connection opening (the connection opening 351 of
According to an embodiment, the release member may be aligned with the release hole in a first direction.
According to an embodiment, the latch member and the release member, respectively, may include inclined surfaces formed to be engaged with each other in areas contacting each other. The engaged inclined surfaces may be formed so that when the release member moves in the first direction away from the release hole, the latch member moves in a second direction crossing the first direction.
According to an embodiment, the second connection portion may include an end portion protruding in the second direction. The first connection portion may include an end portion protruding in a third direction opposite to the second direction to hang on the end portion of the second connection portion.
According to an embodiment, the connection assembly may be coupled to a portion of the hinge bracket. The connection assembly may include a latch member including a first connection portion extending toward the hinge cover and/or a release member at least partially contacting the latch member. The hinge cover may include a third connection portion (375) protruding to be engaged with the first connection portion on one surface (370a) facing the hinge bracket.
According to an embodiment, the release member may be aligned with the release hole in a first direction. The latch member and the release member, respectively, may include inclined surfaces formed to be engaged with each other in areas contacting each other. The engaged inclined surfaces may be formed so that when the release member moves in the first direction away from the release hole, the latch member moves in a second direction crossing the first direction.
According to an embodiment, the first connection portion may include an end portion protruding in a third direction opposite to the second direction. The third connection portion may include an end portion protruding in the second direction to hang on the end portion of the first connection portion.
According to an embodiment of the disclosure, an electronic device 101 may comprise a first housing 210, a second housing 220, at least one hinge module (the first hinge module 231 and 232 and/or the second hinge module 233 of
According to an embodiment, the hinge bracket may include at least one seating area (the seating area 352 of
According to an embodiment, a plurality of hinge modules may be provided. The plurality of hinge modules are spaced apart from each other on the first surface of the hinge bracket.
According to an embodiment, the hinge cover may include at least one release hole (the release hole 371a of
According to an embodiment, the connection assembly may include a latch member (the latch member 361 of
According to an embodiment of the disclosure, as the hinge cover is detachably connected to the hinge assembly, the separation of the rotation member coupled to the housing and the display assembly to wash the hinge assembly may be replaced with removing the hinge cover, allowing for easier washing of the hinge assembly.
According to an embodiment of the disclosure, as the hinge bracket in which a plurality of hinge components (or hinge modules) are disposed to be spaced apart and coupled together is formed as a single component, it is possible to suppress an error in rotational axis and radius of rotation between components that may occur when the hinge bracket is composed of a plurality of components.
Effects derived from the embodiments of the disclosure are not limited to the foregoing effects, and may be expanded in various ways without departing from the spirit and scope of the disclosure.
The electronic device according to an embodiment of the disclosure may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
An embodiment of the disclosure and terms used therein are not intended to limit the technical features described in the disclosure to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).
An embodiment of the disclosure may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Wherein, the term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.
According to an embodiment, a method according to an embodiment of the disclosure may be included and provided in a computer program product. The computer program products may be traded as commodities between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., Play Store™), or between two user devices (e.g., smartphones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
According to an embodiment, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities. Some of the plurality of entities may be separately disposed in different components. According to an embodiment, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or Further, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to an embodiment, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
Number | Date | Country | Kind |
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10-2022-0121717 | Sep 2022 | KR | national |
10-2022-0131679 | Oct 2022 | KR | national |
This application is a continuation of International Application No. PCT/KR2023/014294 designating the United States, filed on Sep. 20, 2023, in the Korean Intellectual Property Receiving Office and claiming priority to Korean Patent Application Nos. 10-2022-0121717, filed on Sep. 26, 2022, and 10-2022-0131679, filed on Oct. 13, 2022, in the Korean Intellectual Property Office, the disclosures of each of which are incorporated by reference herein in their entireties.
Number | Date | Country | |
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Parent | PCT/KR2023/014294 | Sep 2023 | WO |
Child | 19030921 | US |