Patent Application
20110089791
1. Field of the Invention
The invention relates to a bamboo film structure and, more particularly, to a bamboo film structure in which a bamboo laminate sheet is directly attached to a film layer.
2. Description of the Related Art
In recent years, it is fashion to use natural materials in electronic devices to replace the cold and hard plastic or metal materials of the conventional technology. Among the natural materials, bamboo and wood are particularly noticed. In the conventional bamboo manufacturing process, after the bamboo laminate is slit, nonwoven or fiber fabric is attached to the bamboo laminate at the back. After three-times coating, three-times baking and three-times polishing, the surface of the bamboo laminate is flatted and the color is adjusted. Finally, protective paint is coated on the bamboo laminate sheet, and the bamboo laminate sheet may be stuck to the outer surface of the electronic product.
However, after the three-times coating and three-times baking processes, the bamboo laminate may be harden to be a bamboo sheet, the subsequent manufacturing process is thus limited, and it only may be attached to the electronic product in a sticking way. In addition, since the bamboo laminate is harden, the permitted tolerance between the bamboo laminate and the electronic product is rather small, and therefore the manufacturing cost increases. Moreover, the back of the bamboo laminate includes nonwoven and fiber fabric to prevent the fiber of the bamboo laminate from peeling off. However, the nonwoven and fiber fabric can not tolerate high temperature, and they easily shrink. Therefore, the injecting mode process for manufacturing the electronic product can not be used. In practical usage, the bamboo laminate is adhered to the case of the electronic product one after another by manual labor, which costs the manufacturing time.
Moreover, the process of sticking the nonwoven, the fiber fabric to the bamboo laminate and the processes of three-times coating, three-times baking and three-times polishing are rather complex, and the manufacturing time is prolonged. Since the error is accumulated in every procedure, the yield of the bamboo laminate can not be improved.
The bamboo film structure in the invention includes a bamboo laminate sheet, an adhesive layer and a film layer. The adhesive layer is made of glue based on the PSB, and it is coated on one side of the bamboo laminate sheet and permeates through the bamboo fiber to improve the sticking effect to make it firmly attached to the film layer. The film layer is made of films such as polydiethylene terephthalate (PET), which is thin and heat-resistant. Therefore, the whole bamboo film structure can resist high temperature, and it is hard to deform or shrink. The film structure is formed due to the reduction of the whole thickness, and the modes for the subsequent manufacture may be variable. Moreover, an in-mold decoration (IMD) technique also may be used to the bamboo film structure to improve the capacity of electronic products with bamboo laminates.
Therefore, the bamboo film structure in the invention does not need to stick the bamboo laminate to the nonwoven and fiber fabric, and it also does not need the three-times coating process, three-times baking process and three-times polishing process. The bamboo film structure in the invention is directly attached to the film layer. This not only reduces the manufacturing time and simplifies process, but also makes the sequence manufacturing modes variable, which is benefit for mass production.
These and other features, aspects and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings.
Similar to a furniture surface, the conventional bamboo laminate needs to be baked and polished for several times, and the bamboo laminate is hard to be processed due to hardening. Unlike the conventional bamboo laminate, a bamboo film structure is provided in the invention to simplify the manufacturing process, save manufacturing time and facilitate the subsequent manufacturing process and mass production.
As shown in
The adhesive layer 20 at least includes rubber solvent, petroleum ether, styrene-butadiene rubber and synthetic resin. The rubber solvent occupies 5%-20% of the adhesive layer. The petroleum ether occupies 8%-30% of the adhesive layer. The styrene-butadiene rubber occupies 5%-20% of the adhesive layer. The synthetic resin occupies 15%-30% of the adhesive layer. In addition, it is preferably to add some filler to adjust the ingredient. After the adjustment, the rubber solvent occupies 10%-12% of the adhesive layer, the petroleum ether occupies 15%-20% of the adhesive layer, the styrene-butadiene rubber occupies 11%-13% of the adhesive layer, the synthetic resin occupies 20%-25% of the adhesive layer, and the filler occupies 1%-2% of the adhesive layer. Furthermore, to facilitate the combination of the bamboo laminate sheet 10 and the film layer 30, the glue may be heat transfer glue based on PSB, which may attach the bamboo laminate sheet 10 to the film layer 30 in a heat transfer mode.
The other side of the film layer 30 also may include an adhesive layer 40, and the bamboo film structure is disposed in a mould 90. A case 50 is formed in the mould 90 in the injecting molding process to make the case 50 combined with the bamboo laminate sheet 10 via the adhesive layer 40. Therefore, the bamboo laminate sheet 10 is easy to be combined with the case 50, which is shown in
Since the bamboo film structure is a film, it has higher deforming ability than the conventional hardened bamboo laminate to allow the adhesive layer 40 directly attached to the case 50. However, the above-mentioned two manufacturing ways are just taken as examples. Other manufacturing methods to achieve the attachment are all included.
In another aspect, the surface of the bamboo laminate sheet 10 also may include special patterns 60 in a laser carving mode or other manufacturing modes. In addition, a protecting layer 70 also may be disposed above to protect the surface. The protecting layer 70 also may be polyurethane (PU) by baking coating or spraying painting.
The electronic device structure includes an electronic device body 80, the case 50 and the bamboo film structure 81. The electronic device body 80 may include a printed circuit board (PCB) 82, a plurality of electric elements 84 and at least one connector 83 to perform specific functions, such as processing digital data, communicating, displaying and etc. Please see
The case 50 contains the electronic device body 80. As shown in
Therefore, in the bamboo film structure of the invention, unlike a furniture surface, the bamboo laminate sheet does not need to be baked and polished repeatedly, and it may be combined with the film layer directly via the adhesive layer made of glue to make the whole bamboo film structure to be a film. This facilitates the process of subsequent manufacture and the process of combining the bamboo film structure to the outer case of the electronic product. This not only saves the manufacturing processes and time cost, but also improves the yield to improve the possibility of mass production.
Although the present invention has been described in considerable detail with reference to certain preferred embodiments thereof, the disclosure is not for limiting the scope of the invention. Persons having ordinary skill in the art may make various modifications and changes without departing from the scope. Therefore, the scope of the appended claims should not be limited to the description of the preferred embodiments described above.
| Number | Date | Country | Kind |
|---|---|---|---|
| 098135215 | Oct 2009 | TW | national |
