BACKGROUND
1. Technical Field
The present disclosure generally relates to electronic devices, and particularly to an electronic device having a loudspeaker module.
2. Description of Related Art
Electronic devices (such as mobile phones, personal digital assistants) include loudspeakers. The electronic devices commonly define receiving chambers for receiving the loudspeakers, and resonant cavities for sounds emitted by the loudspeakers to resonate. However, the current receiving chambers and resonant cavities are bulky. As a result, the volume and/or thickness of the electronic device is enhanced.
Therefore, there is room for improvement within the art.
BRIEF DESCRIPTION OF THE DRAWINGS
Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
FIG. 1 is a schematic view of an electronic device having a speaker module in accordance with an exemplary embodiment.
FIG. 2 is an exploded view of the electronic device of FIG. 1.
FIG. 3 is another exploded view of the electronic device of FIG. 1.
FIG. 4 is an enlarged view of portion IV as shown in FIG. 3.
FIG. 5 is an exploded view of the electronic device of FIG. 2 being rotated 180°.
FIG. 6 is an enlarged view of portion VI as shown in FIG. 5.
FIG. 7 is an enlarged view of portion VII as shown in FIG. 5.
FIG. 8 is a cross-sectional view of the electronic device of FIG. 1 along line VIII-VIII.
FIG. 9 is a cross-sectional view of the electronic device of FIG. 1 along line IX-IX.
DETAILED DESCRIPTION
FIGS. 1-3 show an electronic device 100 (i.e., a mobile phone). The mobile phone is an exemplary application for the purposes of describing details of an exemplary embodiment of an electronic device. The electronic device 100 includes a housing 10, a circuit board 20, a mounting sheet 30, and a loudspeaker module 40. The circuit board 20 is caught between the housing 10 and the mounting sheet 30. The loudspeaker module 40 is mounted on the mounting sheet 30 and received in the housing 10.
Referring to FIGS. 5-7, the housing 10 may be a rear cover of the electronic device 100. The housing 10 includes a bottom wall 11 and a peripheral wall 12 protruding from the bottom wall 11. Also referring to FIG. 2, the bottom wall 11 defines a plurality of first sounding holes 13 and a plurality of second sounding holes 14, at the two ends of the bottom wall 11, respectively. The plurality of first and second sounding holes 13 and 14 transmit the sounds emitted by the loudspeaker module 40 to the outside of the housing 10.
A first rib 112 is formed on the inner surface of the bottom wall 11, corresponding to the plurality of first sound holes 13. Abutting the first rib 112, a second rib 114 is also formed on the inner surface of the bottom wall 11. The first rib 112 and the bottom wall 11 cooperate to define a first receiving chamber 1122. The first receiving chamber 1122 communicates the plurality of first sound holes 13. The second rib 114 and the bottom wall 11 cooperate to define a second receiving chamber 1142. The first receiving chamber 1122 and the second receiving chamber 1142 are communicated by a first through hole 15 which is defined by the first rib 112. A third rib 116 is formed on the inner surface of the bottom wall 11, corresponding to the second sound holes 14. The third rib 116 and the bottom wall 11 cooperate to define a third receiving chamber 1162. The third receiving chamber 1162 communicates the plurality of second sound holes 14.
FIGS. 2 and 3 show that the circuit board 20 defines a first opening 22 and a second opening 24, at the two opposite ends of the circuit board 20, respectively. The mounting sheet 30 includes a bottom wall 32 and a flange 34 protruding from the bottom wall 32. The circuit board 20 is supported by the flange 34. Also referring to FIGS. 4 and 9, the mounting sheet 30 further defines a fourth rib 36 and a fifth rib 38 abutting the fourth rib 36, near the second opening 24 of the circuit board 20. The fourth rib 36 and the bottom wall 32 cooperate to form a fourth receiving chamber 362. The fifth rib 38 and the bottom wall 32 cooperate to form a fifth receiving chamber 382. The fourth receiving chamber 362 and the fifth receiving chamber 382 communicate via a second through hole 37 which is defined by the fifth rib 38 (see FIG. 9). The fourth receiving chamber 362 and the fifth receiving chamber 382 are respectively covered by a plate 39, to seal the fourth receiving chamber 362 and the fifth receiving chamber 382. The plate 39 covering the fourth receiving chamber 362 defines a third through hole 392, which communicates the fourth receiving chamber 362 and the third receiving chamber 1162 (see FIG. 9).
The loudspeaker module 40 includes a first loudspeaker 42 and a second loudspeaker module 44, located on the two opposite ends of the bottom wall 32 of the mounting sheet 30, respectively. Further, the first loudspeaker 42 is positioned in the first opening 22 of the circuit board 20, and the second loudspeaker 44 is positioned in the second opening 24 of the circuit board 20. The loudspeaker module 40 further includes two mounting bases 46 electrically connected to the circuit board 20. The first loudspeaker 42 and the second loudspeaker 44 are mounted on the bottom wall 32 by the two mounting bases 46. The first loudspeaker 42 and the second loudspeaker 44 are for emitting sounds. The first loudspeaker 42 has a rear surface facing to the bottom wall 32 of the mounting sheet 30, and a front surface opposite to the bottom wall 32. The second loudspeaker 44 also has a rear surface facing to the bottom wall 32 of the mounting sheet 30, and a front surface opposite to the bottom wall 32.
During assembly of the electronic device 100, the circuit board 20 is mounted to the flange 34 of the mounting sheet 30 (see FIG. 2). The two mounting bases 46 are mounted on the bottom wall 32 of the mounting sheet 30, at the location corresponding to the first opening 22 and the second opening 24 of the circuit board 20, and electrically connected to the circuit board 20. The first loudspeaker 42 and the second loudspeaker 44 are respectively mounted to one of the mounting bases 46. The housing 10 is engaged to the mounting sheet 30, allowing the peripheral wall 12 of the housing 10 to abut the peripheral portion of the bottom wall 32 of the mounting sheet 30. At this time, the first rib 112 surrounds the first loudspeaker 42 (see FIG. 8). The side of the first rib 112 that abuts the second rib 114 also abuts the circuit board 20, and the side of the first rib 112 opposite to the second rib 114 resists to the bottom wall 32 of the mounting sheet 30. As such, the first loudspeaker 42 is received in the first receiving chamber 1122. The first loudspeaker 42 is adjacent to the side of the first rib 112 opposite to the second rib 114. The front surface of the first loudspeaker 42 faces the first sound holes 13 of the housing 10 (see FIG. 8), and the first receiving chamber 1122 communicates with the first sound holes 13 to form a front resonant cavity of the first loudspeaker 42. The sounds emitted by the front surface of the first loudspeaker 42 transmit to the outside of the housing 10 through the first sound holes 13. The second rib 114 abuts the circuit board 20 (see FIG. 8). As such, a sealed cavity is formed between the first receiving chamber 1122 and the bottom wall 32, and another sealed cavity is formed between the second receiving chamber 1142 and the circuit board 20. The two sealed cavities are communicated by the first through hole 15. The two sealed cavities define a rear resonant cavity of the first loudspeaker 42. The sounds emitted by the rear surface of the first loudspeaker 42 resonate in the rear resonant cavity to improve the quality of the sound transmitted to the outside of the housing 10.
FIGS. 4, 5, 7 and 9 show that the third rib 116 of the housing 10 surrounds the second loudspeaker 44. In addition, the third rib 116 abuts the bottom wall 32 of the mounting sheet 30, and one side of the third rib 116 abuts the fourth rib 36 and the plate 39, allowing the third through hole 392 of the plate 39 to position beside the inner surface of the third rib 116. As such, the third receiving chamber 1162 and the fourth receiving chamber 362 are communicated by the third through hole 392. The second loudspeaker 44 is received in the third receiving chamber 1162, and positioned near the end of the third receiving chamber 1162 away from the fourth receiving chamber 362 (see FIG. 9). The front surface of the second loudspeaker 44 aim at the second sound holes 14, and the third receiving chamber 1162 communicates the second sound holes 14 to form a front resonant cavity of the second loudspeaker 42. The sounds emitted by the front surface of the second loudspeaker 44 transmit to the outside of the housing 10 through the second sound holes 14. The third receiving chamber 1162, the third through hole 392, the fourth receiving chamber 362, the second through hole 37, and the fifth receiving chamber 382 communicate with each other and define a rear resonant cavity of the second loudspeaker 44. The sounds emitted by the rear surface of the second loudspeaker 44 resonate in the rear resonant cavity to improve the quality of the sound transmitted to the outside of the housing 10.
The exemplary electronic device 100 defines resonant cavities of the first loudspeaker 42 and the second loudspeaker 44 by using the cavities between the loudspeakers and the housing 10, circuit board 20, and mounting sheet 30, which reduces the volume and/or thickness of the electronic device 100.
It is believed that the exemplary embodiment and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its advantages, the examples hereinbefore described merely being preferred or exemplary embodiment of the disclosure.
Patent Grant
9119001
