1. Field
Embodiments may relate to a passively cooled electronic device, such as a laptop computer or a notebook computer.
2. Background
Notebook computers and laptop computers may generate heat when operating. A fan may be provided within the notebook computer and/or the laptop computer in order to dissipate the generated heat.
Arrangements and embodiments may be described in detail with reference to the following drawings in which like reference numerals refer to like elements and wherein:
Arrangements and embodiments may be described with respect to a computer, such as a laptop computer or a notebook computer. However, arrangements and embodiments may be applicable to other electronic devices, such as mobile communication terminals.
The base 20 of the computer 10 may support various components such as a processor, a touch pad, a memory, a keyboard, a circuit board, a battery, etc. These components may generate heat during operation of the computer 10.
The lid 40 of the computer 10 may support a display 45 for a user to view during use of the computer 10. The lid 40 may support other electric components. The components of the lid 40 may further generate heat during operation of the computer 10.
When the computer 10 is in an opened state, the keyboard on the base 20 and the display 45 on the lid 40 may be exposed to a user located in front of the computer 10.
The base 20 may include a first side 22 (or top side) and a second side 24 (or bottom side). The lid 40 may include a first side 42 and a second side 44. When the computer 10 is in the opened state (such as shown in
During operation of the computer 10 while the computer 10 is in an opened state, heat generated by the components of the computer 10 may create a convection plume 50, such as a natural convection plume, over the first side 22 of the base 20 and the first side 42 of the lid 40, and to an area above the lid 40. The convection plume 50 is a flow of heat in a direction from the first side 22 toward the first side 42 and subsequently away from the first side 42 (of the lid 40). In
The hinge device 30 may allow the lid 40 to rotate (or move) about a rotational axis that is parallel to a width of the lid 40 (or a width of the base 20). The lid 40 may rotate about the rotational axis of the hinge device 30 between the closed state and the opened state.
In at least one arrangement, a passive heat exchange device 70 may be provided in an area of the hinge device 30 between the base 20 and the lid 40. The heat exchange device 70 may be adjacent to the hinge device 30 in an area between the base 20 and the lid 40, and the heat exchange device 70 may create an opening (or openings) in the area between the lid 40 and the base 20. The heat exchange device 70 may be considered passive since it does not directly include a fan.
The heat exchange device 70 may be provided in an area near or at a back end of the base 20. The hinge device 30 may include a first hinge device and a second hinge device spaced apart from the first hinge device. The heat exchange device 70 may be provided in an area between the first hinge device and the second hinge device.
The opening (or openings) created by the heat exchange device 70 may induce an air flow 60 from behind the computer 10 to in front of the computer 10, and into the convection plume 50. That is, the opening(s) of the heat exchange device 70 may allow air to pass from behind the computer 10 and into the convention plume 50. Stated differently, air behind the computer 10 may be sucked into the convection plume 50 via the opening(s) in the heat exchange device 70. This may further dissipate heat from the computer 10.
The heat exchange device 70 may be physically connected to the heat spreader 39 (or to the heat dissipating device). Heat generated by the processor 34 (on the circuit board) or other components may be distributed by the thermal attacher 38 and the heat spreader 39 to the heat exchange device 70. The heat exchange device 70 may therefore receive energy or heat generated from the processor 34 and/or other components.
The heat exchange device 70 may include at least one heat pipe and a plurality of fins that extend perpendicularly from an axis of the at least one heat pipe. The at least one heat pipe may be coupled to the heat dissipating device to receive heat from components within the base 20.
The openings of the heat exchange device 70 may allow the induced air flow 60 to flow when the computer 10 is provided in the opened state, such as shown in
As shown by the induced air flow 60, air from behind the computer 10 may pass through the heat exchange device 70 and into the convection plume 50. The air may absorb heat provided at the heat exchange device 70, and remove some of the heat from the heat exchange device 70.
When the opening angle of the lid 40 is large, the convention plume 50 may detach away from the lid 40 and the heat exchange device 70 may create its own convection plume (or natural convection plume) in order to dissipate heat.
The heat exchange device 70 and the hinge device 30 may be provided between the base 20 and the lid 40. The heat exchange device 70 may be provided adjacent to the hinge device 30 such that both the heat exchange device 70 and the hinge device 30 are provide in a same area between the base 20 and the lid 40 when the computer is in the opened state. The heat exchange device 70 may be independent of the hinge device 30.
The hinge device 30 may allow the lid 40 to move relative to the base 20 between the closed state (of the computer 10) and the opened state (of the computer 10).
The heat exchange device 70 may take any of a number of specific shapes or types. For example, the heat exchange device 70 may include a number of openings and/or fins to allow the air flow 60 to flow from the rear of the computer 10 to a front of the computer 10. The fins may extend perpendicularly from a heat pipe. The opening(s) or fins may provide an air flow passage from the rear to the front of the lid 40 such that the air flow 60 joins the convection plume 50. The heat exchange device 70 may be unique in that air flows from a rear to a front and ultimately to the convection plume 50. The air from the rear of the computer 10 may be sucked into the convection plume 50 via the openings of the heat exchange device 70, and thereby dissipate the heat from the heat exchange device 70.
The heat exchange device 70 may be physically connected to the base 10, and more specifically may be connected to the heat spreader 39. The heat exchange device 70 may be a passive device since it does not specifically operate using a fan to dissipate heat. The flow of air by the convection plume 50 may receive the induced air flow 60.
The heat exchange components may include a plurality of fins, such as extending from a heat pipe, for example. The fins may be made of a metallic material such as copper or aluminum, for example. The fins may include fins of copper or fins of aluminum, for example.
The openings 72 may be provided between a rear of the heat exchange 70 and a front of the heat exchange 70. The air flowing through the openings 72 may receive heat or energy from the fins, and dissipate the heat or energy to the convection plume 50 located in front of the display 45 on the lid 40.
The openings 72 may be provided between a rear of the heat exchange 70 and a front of the heat exchange 70. The air flowing through the openings 74 may receive heat or energy from the fins, and dissipate the heat or energy to the natural convection plume 50 located in front of the display on the lid 40.
More specifically,
The base 20 of the computer 10 may be provided on a support surface 5, such as a flat surface of a desk or a table.
The base 20 of the computer 10 may support various components such as a keyboard 25 having a plurality of keys, and/or a touch pad. The base 20 of the computer 10 may also include other electronic components such as a circuit board 36 and the processor 34.
The base 20 of the computer 10 may include an opening 80 at a backside of the base 20. The opening 80 may be provided on a rear surface of the base 20.
The convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component). The air 52 may be pulled out through opening 81.
Embodiments may provide a computer (or electronic device) that includes a base having a wedged bottom portion (or wedged bottom surface). The base may have a bottom portion that includes a first bottom part and a second bottom part. The first bottom part may contact a support surface, such as a desk or table surface, when the computer is provided on the support surface. The second bottom part may be provided at a different angle than the first bottom part, such that the second bottom part may not contact the support surface when the computer is provided on the support surface. The first bottom part and the second bottom part may therefore be provided in a wedge configuration, or other configurations. In view of the wedge configuration, or other configurations, an input opening may be provided on the second bottom part (of the bottom portion) of the base. This may allow a better air flow into and through the base. The airflow may exit from the base at an output opening.
The convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component). The air 52 may be pulled out through opening 81.
More specifically,
The base 120 of the computer 100 may be provided on the support surface 5, such as a flat surface of a desk or a table.
For example, when the computer 100 (or electronic device) is provided on the support surface 5, the first bottom part 123 may contact the support surface 5 and the second bottom part 125 may be raised from the surface 5, due to the wedge configuration (or shape) of the bottom of the base 120. As one example, the second bottom part 125 may be raised such that is a sufficiently large gap between the second bottom part 125 and the support surface 5 for the air flow 60. As one example, the gap may be 10 mm, although other dimensions for the gap may also be provided. This may allow air to be provided under the second bottom part 125.
The first bottom part 123 may support the computer 100 (or electronic device) on the support surface. The second bottom part 125 may be raised from the support surface 5 when the first bottom part 123 supports the computer 100 (or electronic device) on the support surface 5.
The second bottom part 125 may include an input opening 180 that allows air to flow under the second bottom surface 125 (from the rear of the computer 10), through the input opening 180, through the base 120 and out through (or exit) an output opening 190 (of the base 120) to an area in front of the lid 40. The air flow 60 may be a vertical flow (or substantially vertical flow) through the base 120 to a convection plume (or natural convection plume) over the base 120 and in front of the lid 40.
The output opening 190 of a top portion of the base 120 may be aligned with the input opening 180 of a bottom portion of the base 120.
A heat exchange device may be provided within the base 120 and within the path of the air flow 60. The heat exchange device may include fins, for example.
The convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component). The air 52 may be pulled out through opening 190.
More specifically,
The base 120A of the computer 100 may be provided on the support surface 5, such as a flat surface of a desk or a table.
For example, when the computer 100 (or electronic device) is provided on the support surface 5, the first bottom part 123 may contact the support surface 5 and the second bottom part 125 may be raised from the support surface 5, due to the wedge configuration (or shape) of the bottom of the base 120A. As stated above, the second bottom part 125 may be raised (from the support surface) such that there is a sufficiently large gap between the second bottom part 125 and the support surface 5 for the air flow 60. This may allow air to be provided under the second bottom part 125.
The first bottom part 123 may support the computer 100 (or electronic device) on the support surface. The second bottom part 125 may be raised from the support surface 5 when the first bottom part 123 supports the computer 100 (or electronic device) on the support surface 5.
The second bottom part 125 may include an input opening 182 that allows air to flow under the second bottom surface 125 (from the rear of the computer 10), through the input opening 182, along an inside portion 130 of the base 120A, and out through (or exit) an output opening 192 (of the base 120A) to an area over the base 120A. The air flow 60 may be into the input opening 182, then in a longitudinal direction along the inside portion 130 of the base 120A, and then out of the base 120A through the output opening 192 to a convection plume (or natural convection plume) over the base 120A and in front of the lid 40.
The inside portion 130 of the base 120A may be over the processor 34 and the circuit board 36, for example. The air flow 60 may help dissipate heat from the processor 34, the circuit board 36 and/or other components.
The output opening 192 (of the base 120A) may be provided at an edge of the keyboard 25 on the base 120A. For example, the output opening 192 may be provided at one or a plurality of edge areas of the keyboard 25.
The output opening 192 (or openings) may also (or alternatively) be provided along a first side edge of the keyboard 25, a second side edge of the keyboard 25, and/or a bottom edge of the keyboard 25.
The output opening (or openings) may also (or alternatively) be provided along any edge of a touch pad on the base 120A. The output opening (or openings) may be provided at other areas of a top surface of the base 120A.
The air flow 60 that enters into the base 120A through the input opening 182 may pass through the inside portion 130 of the base 120A and may exit from the base 120A through any of the above described output openings, including the output opening 192 shown in
A heat exchange device may be provided within the base 120A and within the path of the air flow 60. The heat exchange device may include fins, for example.
More specifically,
The base 120B of the computer 100 may be provided on the support surface 5, such as a flat surface of a desk or a table.
For example, when the computer 100 (or electronic device) is provided on the support surface 5, the first bottom part 123 may contact the support surface 5 and the second bottom part 125 may be raised from the support surface 5, due to the wedge configuration (or shape) of the bottom of the base 120B. The second bottom part 125 may be raised such that there is a sufficient gap between the second bottom part 125 and the support surface 5 for the air flow 60. In this embodiment, a gap may be less than 10 mm under an input opening 184 to the support surface 5. This may allow air to be provided under the second bottom part 125.
The first bottom part 123 may support the computer 100 (or electronic device) on the support surface. The second bottom part 125 may be raised from the support surface 5 when the first bottom part 123 supports the computer 100 (or electronic device) on the support surface 5.
The second bottom part 125 may include the input opening 184 that allows air to flow under the second bottom surface 125 (from the rear of the computer 10), through the input opening 184 and out of the base 120B through an output opening 194 to an area over the base 120B. The air flow 60 may be into the input opening 184, then vertically (or substantially vertically) out through the output opening 194 of the base 120B to a convection plume (or natural convection plume) over the base 120B and in front of the lid 40.
The output opening 194 (of the base 120B) may be provided at an edge of the keyboard 25 on the base 120B. For example, the output opening 194 may be provided at one or a plurality of edge areas of the keyboard 25.
The output opening 194 (or openings) may also (or alternatively) be provided along a first side edge of the keyboard 25, a second side edge of the keyboard 25, and/or a bottom edge of the keyboard 25.
The output opening (or openings) may also (or alternatively) be provided along any edge of a touch pad on the base 120B. The output opening (or openings) may be provided at other areas on a top surface of the base 120B.
The air flow 60 that enters into the base 120B through the input opening 184 may exit from the base 120B through any of the above described output openings, including the output opening 194 shown in
The output opening 194 of a top portion of the base 120B may be aligned with the input opening 184 of a bottom portion of the base 120B.
A heat exchange device may be provided within the base 120B and within the flow of the air flow 60. The heat exchange device may include fins, for example.
The convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component). The air 52 may be pulled out through opening 194.
Embodiments have been described with respect to a bottom portion (of a base) that includes a first bottom part and a second bottom part arranged in a wedge configuration. However, embodiments are not limited to this configuration.
Embodiments may include a bottom portion (of a base) that includes a first bottom part, a second bottom part and a third bottom part. As one example,
The third bottom part 127 may include the input opening 185 that allows air to flow into the input opening 185 (from the rear of the computer) and out the output opening 192 (of the base) to an area above the base 120C. The third bottom part 127 may be a surface of the bottom portion (of the base) closest to the rear side 122 of the computer 100.
In each of the above described embodiments, the input opening may be a single opening or may be a plurality of openings, such as being on the left and the right of the second bottom part and/or the third bottom part. The input and output openings may be vents or have vent surfaces within the input and output opening(s).
Embodiments may include a base that has a bottom portion with two separate surfaces, where a first surface may be substantially parallel to a support surface and the a second surface may be slanted up from the first surface so that air flow may enter thru an opening(s) provided on the second surface.
Embodiments may include a base that has a bottom portion with at least three separate surfaces, where a first surface may be substantially parallel to a support surface, a second surface may be slanted up from the first surface, and a third surface may be slanted up from the second surface. An opening (or vent) may be provided on the third surface so that air flow may enter thru the opening on the bottom of the electronic device.
An output opening of a top portion of the base may be aligned with an input opening on a bottom portion of the base such that air may flow from over a processor to dissipate heat out from the output opening.
Any reference in this specification to “one embodiment,” “an embodiment,” “example embodiment,” etc., means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with any embodiment, it is submitted that it is within the purview of one skilled in the art to affect such feature, structure, or characteristic in connection with other ones of the embodiments.
Although embodiments have been described with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More particularly, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure, the drawings and the appended claims. In addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art.
Number | Name | Date | Kind |
---|---|---|---|
5621613 | Haley et al. | Apr 1997 | A |
5732765 | Drolen et al. | Mar 1998 | A |
5880929 | Bhatia | Mar 1999 | A |
5882929 | Fofonoff et al. | Mar 1999 | A |
5910883 | Cipolla et al. | Jun 1999 | A |
6118655 | Mecredy et al. | Sep 2000 | A |
6125035 | Hood et al. | Sep 2000 | A |
6167949 | Langley et al. | Jan 2001 | B1 |
6185102 | Shou et al. | Feb 2001 | B1 |
6250378 | Kobayashi | Jun 2001 | B1 |
6253836 | Mitchell | Jul 2001 | B1 |
6341062 | Patel | Jan 2002 | B1 |
6493222 | DiFonzo et al. | Dec 2002 | B2 |
7505255 | Wu | Mar 2009 | B2 |
8355248 | Nishi | Jan 2013 | B2 |
8363392 | Tanaka | Jan 2013 | B2 |
20020012228 | Ozaki et al. | Jan 2002 | A1 |
20020018335 | Koizumi | Feb 2002 | A1 |
20020075647 | DiFonzo et al. | Jun 2002 | A1 |
20040042172 | Kusaka et al. | Mar 2004 | A1 |
20050105273 | Tanaka et al. | May 2005 | A1 |
20060028795 | Furuya | Feb 2006 | A1 |
20060082966 | Lev et al. | Apr 2006 | A1 |
20060171113 | Wu | Aug 2006 | A1 |
20060243878 | Saad | Nov 2006 | A1 |
20080074842 | Tracy et al. | Mar 2008 | A1 |
20080212278 | DeLuga et al. | Sep 2008 | A1 |
20090268392 | Cheng et al. | Oct 2009 | A1 |
20100079945 | Wang | Apr 2010 | A1 |
20100097764 | Iikubo | Apr 2010 | A1 |
20100134976 | Kuo | Jun 2010 | A1 |
20100134977 | Chang et al. | Jun 2010 | A1 |
20100165567 | Shih et al. | Jul 2010 | A1 |
20100214743 | Huang et al. | Aug 2010 | A1 |
20100220439 | Qin | Sep 2010 | A1 |
20100238619 | Shirasaka | Sep 2010 | A1 |
20100296946 | Chen et al. | Nov 2010 | A1 |
20110075352 | Tye et al. | Mar 2011 | A1 |
20110134605 | Chou et al. | Jun 2011 | A1 |
20110149495 | Mongia et al. | Jun 2011 | A1 |
20110205699 | Iijima | Aug 2011 | A1 |
20110242757 | Tracy et al. | Oct 2011 | A1 |
20110279974 | Fujiwara | Nov 2011 | A1 |
20110279977 | Tanaka | Nov 2011 | A1 |
20110292592 | Senatori | Dec 2011 | A1 |
20110310557 | Ooe | Dec 2011 | A1 |
20120113593 | Hsu et al. | May 2012 | A1 |
20120127652 | Lin et al. | May 2012 | A1 |
20120127663 | Mochizuki et al. | May 2012 | A1 |
20120130545 | Haugh et al. | May 2012 | A1 |
20120236517 | Nakajima | Sep 2012 | A1 |
20120327581 | Pais et al. | Dec 2012 | A1 |
20130003284 | Massaro et al. | Jan 2013 | A1 |
20130027873 | Chen et al. | Jan 2013 | A1 |
20130027877 | Yang et al. | Jan 2013 | A1 |
20130063889 | Yee et al. | Mar 2013 | A1 |
20130077241 | Senatori | Mar 2013 | A1 |
20130175018 | Huang | Jul 2013 | A1 |
20130225065 | Lee | Aug 2013 | A1 |
20130286292 | Yamaguchi et al. | Oct 2013 | A1 |
20140009888 | MacDonald et al. | Jan 2014 | A1 |
20140092544 | Nishi et al. | Apr 2014 | A1 |
Number | Date | Country |
---|---|---|
2000-148304 | May 2000 | JP |
10-2002-0032737 | May 2002 | KR |
WO 2013100946 | Jul 2013 | WO |
2014052185 | Apr 2014 | WO |
Entry |
---|
Written Opinion and International Search Report for Application PCT/US2011/067514 dated Sep. 25, 2012. |
U.S. Appl. No. 13/630,947, filed Sep. 28, 2012, Nishi et al. |
International Search Report and Written Opinion dated Jan. 7, 2014 for PCT/US2013/060963. |
International Search Report dated Dec. 26, 2013 for corresponding Application No. PCT/US2013/060879. |
International Preliminary Report on Patentability and Written Opinion received for PCT Patent Application No. PCT/US2011/067514, mailed on Jul. 10, 2014, 6 Pages. |
Number | Date | Country | |
---|---|---|---|
20140092542 A1 | Apr 2014 | US |