Patent Grant
9825357
The present invention relates to the field of electronic devices, and, more particularly, to patch antennas and related methods.
A patch antenna, for example, a microstrip patch antenna may provide a relatively a high gain for a given area using a relatively simple printed circuit construction, thus making its use widespread. One type of microstrip patch antenna has a radiation pattern that extends broadside to the patch plane. Such a microstrip antenna is commonly fed using a probe, for example, in the form of a connector pin or a circuit board via to form the probe that carries current to the patch surfaces.
However, the radiation bandwidth of a microstrip patch antenna may be limited. For example, the half power (3 dB) instantaneous gain bandwidth of microstrip patch antennas may be less than 20 percent in practice. This may be particularly disadvantageous compared to other types of antennas, such as parabolic reflector antennas, which can operate over many octaves of bandwidth. The frequency response of a simple, square, half wave edge, linearly polarized microstrip patch antenna may be described based upon the quadratic equation (ax2+bx+c=0) so there may be a “single hump” gain maxima located about a first, half wave resonance.
The bandwidth of a microstrip patch antenna increases linearly based upon the thickness of the substrate on which it is carried, so doubling the substrate thickness may double the bandwidth and halving the substrate thickness may halve the bandwidth. Unfortunately however, problems may arise in a broadband application using a relatively thick substrate microstrip antenna, as the feed probe can radiate in a manner akin to a monopole antenna. Given that the radiation pattern of a feed probe is different than that of the patch itself, the combined thick substrate patch radiation produces an asymmetric pattern and reduced realized gain.
U.S. Pat. No. 6,181,279 to Van Hoozen discloses a patch antenna with an electrically small ground plate using peripheral parasitic stubs. More particularly, Van Hoozen discloses the parasitic stubs or shielding element is for segregating electromagnetic fields between the patch antenna and the ground plate.
U.S. Pat. No. 5,515,057 to Lennen et al. is directed to a GPS receiver with an n-point symmetrical feed double-frequency patch antenna. More particularly, Lennen et al. discloses n symmetrical feed points that are placed geometrically on the patch antenna to achieve circular polarization of the GPS receiver with an n-point antenna.
Further improvements to patch antennas may be desired. For example, it may be particularly desirable to increase bandwidth, gain, directivity, and radiation pattern symmetry.
An electronic device may include wireless communications circuitry, and an antenna assembly coupled to the wireless communications circuitry. The antenna assembly may include a substrate, an electrically conductive layer defining a ground plane carried by the substrate, and an electrically conductive patch antenna element carried by the substrate and spaced from the ground plane. The electrically conductive patch antenna element may have a symmetric axis dividing the electrically conductive patch antenna element into first and second symmetric areas. The electrically conductive patch antenna element may have first and second feed openings in the first and second symmetric areas, respectively, and first and second feed pads in the first and second feed openings, respectively, defining first and second capacitive feed points. The antenna assembly may also include first and second feed lines extending through the substrate and respectively coupling the first and second feed pads to the wireless communications circuitry, and a plurality of spaced apart conductive shielding vias coupled to the ground plane and extending through the substrate surrounding the electrically conductive patch antenna element. Accordingly, the electronic device may provide increased efficiency, for example, by providing increased bandwidth, gain, and directivity.
The electrically conductive patch antenna element may have at least one bucking opening therein. The substrate may include at least one bucking recess aligned with the at least one bucking opening, for example. The antenna assembly may further include at least one conductive bucking via coupled to the ground plane and extending to the at least one bucking recess, for example.
The electronic device may further include phase delay circuitry carried by the substrate and coupled to at least one of the first and second feed lines. The phase delay circuitry may include at least one meander line, for example.
The antenna assembly may further include at least one resonator coupled to each of the first and second capacitive feed points. The at least one resonator may include at least one conductive X-shaped resonator, for example.
The electronic device may further include a dielectric cover layer carried by the electrically conductive patch antenna element. The dielectric cover layer may have a relative permittivity and a relative permittivity within 20% of each other. The substrate may have a relative permittivity and a relative permittivity within 20% of each other, for example.
A method aspect is directed to a method of making an antenna assembly. The method may include forming an electrically conductive patch antenna element on a substrate and spaced from an electrically conductive layer defining a ground plane. The electrically conductive patch antenna element may be formed to have a symmetric axis dividing the electrically conductive patch antenna element into first and second symmetric areas. The electrically conductive patch antenna element may be formed to have first and second feed openings in the first and second symmetric areas, respectively. The method may further include forming first and second feed pads in the first and second feed openings, respectively, defining first and second capacitive feed points. The method may also include forming first and second feed lines extending through the substrate and respectively coupling the first and second feed pads to wireless communications circuitry, and forming a plurality of spaced apart conductive shielding vias coupled to the ground plane and extending through the substrate surrounding the electrically conductive patch antenna element.
Another embodiment is directed to an electronic device that includes wireless communications circuitry and an antenna assembly coupled to the wireless communications circuitry. The antenna assembly may include a substrate, an electrically conductive layer defining a ground plane carried by the substrate, and an electrically conductive patch antenna element carried by the substrate and spaced from the ground plane. The electrically conductive patch antenna may have a symmetric axis dividing the electrically conductive patch antenna element into first and second symmetric areas. The electrically conductive patch may have first and second feed openings in the first and second symmetric areas, respectively, and first and second feed pads in the first and second feed openings, respectively, defining first and second capacitive feed points. The antenna assembly may also include first and second feed lines extending through the substrate, one of the first and second feed lines coupling a respective one of the first and second feed pads to the wireless communications circuitry and another of the first and second feed lines being electrically floating, and a plurality of spaced apart conductive shielding vias coupled to the ground plane and extending through the substrate surrounding the electrically conductive patch antenna element.
The ground plane may have at least one opening therein. The substrate may include at least one recess aligned with the at least one opening, for example. The another one of the first and second feed lines may extend to the at least one recess.
The antenna assembly may further include at least one resonator coupled to each of the first and second capacitive feed points. The at least one resonator may be an X-shaped resonator.
The electronic device may further include a dielectric cover layer carried by the electrically conductive patch antenna element. The dielectric cover layer may have a relative permittivity and a relative permittivity within 20% of each other. The substrate may have a relative permittivity and a relative permittivity within 20% of each other, for example.
A corresponding method of making an antenna assembly may include forming an electrically conductive patch antenna element on a substrate and spaced from an electrically conductive layer defining a ground plane ground plane. The electrically conductive patch antenna may be formed to have a symmetric axis dividing the electrically conductive patch antenna element into first and second symmetric areas. The electrically conductive patch antenna element may also be formed to have first and second feed openings in the first and second symmetric areas, respectively. The method may also include forming first and second feed pads in the first and second feed openings, respectively, defining first and second capacitive feed points and forming first and second feed lines extending through the substrate, one of the first and second feed lines coupling a respective one of the first and second feed pads to wireless communications circuitry and another of the first and second feed lines being electrically floating. The method may further include forming a plurality of spaced apart conductive shielding vias coupled to the ground plane and extending through the substrate surrounding the electrically conductive patch antenna element.
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout, and prime and multiple prime notations are used to indicate similar elements in alternative embodiments.
Referring initially to
The antenna assembly 30 may be in the form of a microstrip patch antenna for linear polarization, and illustratively includes a substrate 31 and an electrically conductive layer defining a ground plane 32 carried by the substrate. The ground plane 32 is illustratively carried within the substrate 31, for example, sandwiched between two dielectric layers of the substrate. In some embodiments, the ground plane 32 may be carried by a lower surface of the substrate 31 or by another portion of the substrate. The antenna assembly 30 may be realized as a multilayer circuit board. Additional ground plane layers may be included.
The antenna assembly 30 also includes an electrically conductive patch antenna element 33 carried by an upper surface of the substrate 31. The electrically conductive patch antenna element 33 is illustratively spaced from the ground plane 32.
The electrically conductive patch antenna element 33 illustratively is in the shape of a rectangle, and more particularly, a square. Of course the electrically conductive patch antenna element 33 may have another shape, for example, a circular shape.
The electrically conductive patch antenna element 33 has a symmetric axis 34 that divides the electrically conductive patch antenna element into first and second symmetric areas 35a, 35b. The electrically conductive patch antenna element 33 has first and second feed openings 36a, 36b in the first and second symmetric areas 35a, 35b, respectively. While a particular symmetric axis 34 is illustrated, it should be understood that the symmetric axis may be aligned differently than as illustrated, for example, it may be diagonally oriented.
The electrically conductive patch antenna element 33 also includes first and second feed pads in the first and second feed openings 36a, 36b, respectively, defining first and second capacitive feed points 37a, 37b. The electrically conductive patch antenna element 33 also includes first and second feed lines 41a, 41b extending through the substrate 31 and respectively coupling the first and second feed pads or first and second capacitive feed points 37a, 37b to the wireless communications circuitry 21. The first and second feed lines 41a, 41b may be in the form of a plated through-hole via, a metal connector pin, rivet, hookup wire, or other feed structure as will be appreciated by those skilled in the art.
The first and second capacitive feed points 37a, 37b capacitively couple currents to the electrically conductive patch antenna element 33 across the air gap therebetween. The first and second capacitive feed points 37a, 37b may cancel distributed inductance of the first and second feed lines 41a, 41b.
Distributed inductance of the first and second feed lines 41a, 41b and the distributed capacitance of the first and second capacitive feed points 37a, 37b together form a series resonant circuit which may provide a double tuned antenna system for increased bandwidth. The double tuning may form a 4th order Chebyschev response with, selected for passband ripple, a maximally flat Butterworth response, or other response shapes as will be appreciated by those skilled in the art.
The first and second capacitive feed points 37a, 37b are illustratively oriented as a diamond shape relative to the electrically conductive patch antenna element 33. This may reduce reflections to the passage of currents on the surface of the electrically conductive patch antenna element 33. Of course the first and second capacitive feed points 37a, 37b may be oriented as a square, i.e., aligned with, the electrically conductive patch antenna element 33, or have other shapes as well.
Radiation from the second feed line 41b is toward the opposite side of the electrically conductive patch antenna element 33 than radiation from the first feed line 41a. Radiation from the first and second feed lines 41a, 41b may therefore counteract each other to produce a more symmetric radiation pattern with a beam maximum more normal to the electrically conductive patch antenna element 33. It may be desirable to drive the first and second feed lines 41a, 41b at equal power and drive the second feed line at a delayed phase relative the first feed line. The delayed phase applied to the second feed line 42b is denoted by φ and approximately given by:
φ=−(360fs)/[(c√(∈rμr)] degrees
Where:
The minus sign occurs as a convention for adding phase shift (increased time delay). The equation derives from microstrip transmission line theory as this is the phase delay between the first and second feed lines 41a, 41b for a current traveling across the electrically conductive patch antenna element 33. In one prototype the first feed line 41a was at 0 degrees phase and the second feed line 41b was at −168 degrees phase.
Prior art circular polarized patches use multiple fed probes and quadrature phasing (superimposing cosine and sine current distributions) to cause a traveling wave current distribution on the patch. Additionally, prior art circular polarized patches implement quadrature phasing according to the Pythagorean identity:
φn=cos2 θ+sin2(θ+90°−90°)=cos2 θ+sin2 θ.
Differently, the embodiments described herein may use multiple feed lines with non-quadrature phasing (i.e., not 0, 90, 180 or 270 phase) and still render circularly polarized radiation on the patch.
Differently, the disclosed embodiments implement the feed line phasing according to:
φn=−(360fs)/[(c√(∈rμr)] degrees.
Spaced apart conductive shielding vias 42 are illustratively conductively connected to the ground plane 32 and extend through the substrate 31 surrounding the electrically conductive patch antenna element 33. The spaced apart conductive shielding vias 42 may provide an electrostatic shield to further attenuate unwanted radiation from the first and second feed lines 41a, 41b. The spaced apart conductive shielding vias 42 generally do not make electrical contract at their tops which may reduce capacitance between the conductive shielding vias and edges of the electrically conductive patch antenna element 33, and reduces their becoming loops or otherwise shielding radiation from the electrically conductive patch antenna element 33. The electromagnetic waves formed by the first and second feed lines 41a, 41b generally cannot pass through the comb like electrostatic shield provided by the conductive shielding vias 42. The electromagnetic wave(s) formed by edges of the electrically conductive patch antenna element 33 generally do not have to pass through the conductive shielding vias 42 so the desired radiation occurs freely.
The electrically conductive patch antenna element 33 illustratively has first and second bucking openings 44a, 44b therein. The substrate 31 has respective bucking recesses 45a, 45b aligned with the bucking openings 44a, 44b.
Respective conductive bucking vias 46a, 46b are coupled to the ground plane 32, and each extends to the level of the corresponding bucking recess 45a, 45b. The bucking vias 46a, 46b reduce undesirable radiation from the first and second feed lines 41a, 41b. Each bucking via 46a, 46b and feed line 41a, 41b carry a current flow in opposite directions to reduce via radiated fields, e.g. anti-parallel current flows. The bucking vias 46a, 46b and first and second feed lines 41a, 41b may together form an open wire transmission line, as will be appreciated by those skilled in the art.
Each bucking recess 45a, 45b may have a conical shape and may be formed by drilling downwardly from above and into the substrate 31, for example. This may advantageously reduce capacitance between each bucking via 46a, 46b and the electrically conductive patch antenna element 33. The conical point of the drill bit, for example: 1) forms a hole in the electrically conductive patch antenna element 33 and 2) reduces the height of each bucking via 46a, 46b so that the bucking via does not reach the plane of the electrically conductive patch antenna element 33.
Reduced capacitance between the bucking vias 46a, 46b and the electrically conductive patch antenna element 33 may increase bucking via current. As vias may typically be formed as plated through holes, and plating only part of the hole is difficult and undesirable, the countersink drilling may advantageously allow a via of partial height to be formed, as will be appreciated by those skilled in the art.
The electronic device 20 may further include phase delay circuitry 51 carried by the substrate 31 and coupled to the first and second feed lines 41a, 41b. The phase delay circuitry 51 illustratively includes a respective meander line 52a, 52b carried along a bottom surface of the substrate 31 for each of the first and second feed lines 41a, 41b.
The antenna assembly 30 further includes a respective resonator 53a, 53b coupled to each of the first and second feed capacitive points 37a, 37b. Each resonator 53a, 53b is conductive and illustratively an X-shape and the asymmetric X-shape as illustrated in
The first and second feed lines 41a, 41b may be fed by a coaxial antenna feed line 61 from the wireless communications circuitry 21. An outer conductor 63 of the coaxial antenna feed line 61 is coupled to the ground plane 32, for example, soldered to a via filled ground pad 71 while an inner conductor 62 of the coaxial antenna feed line is coupled to a common transmission line 64. The common transmission line 64 continues to the parallel junction 69 with the first and second feed lines 41a, 41b. RF power divides at the parallel junction 69 to feed the first and second feed lines 41a, 41b. The power division may be equal in most embodiments, but may be unequal if needed to further synthesize patterns shape, overcome transmission line losses etc. Positioning transformers the first and second feed lines 41a, 41b can adjust the branched-off impedances at the parallel junction 69 and, in turn, that power division ratio. The antenna assembly 30 may be used independently from the illustrated onboard wireless communications circuitry 21.
The antenna assembly 30 may optionally include a cover layer 48 over the upper surface of the substrate and covering the first and second feed capacitive points 37a, 37b and conductive bucking vias 46a, 46b (
Referring to
Traces 504, 506 are the realized gain data in units of dBi. Realized gain includes material losses and mismatch losses. As can be seen, adding a second feed line 41a, 41b increased the radiation pattern symmetry and caused the broadside (elevation angle φ=0) gain of a specific example embodiment to increase from 5.6 dBi to 8.5 dBi for a realized gain increase of 1.9 dBi. Advantageously, the radiation pattern was righted so peak pattern amplitude occurred nearly exactly at patch plane perpendicular when the additional feed line 41a, 41b was included. An additional feed line, e.g., one of the feed lines 41a, 41b, may be added to a patch antenna at little to no cost increase at the same time as the first feed line is manufactured.
A method aspect is directed to a method of making the antenna assembly 30. The method includes forming an electrically conductive patch antenna element 33 on a substrate 31 and spaced from an electrically conductive layer defining a ground plane 32. The electrically conductive patch antenna element 33 is formed to have a symmetric axis 34 dividing the electrically conductive patch antenna element into first and second symmetric areas 35a, 35b. The electrically conductive patch antenna element 33 is formed to have first and second feed openings 36a, 36b in the first and second symmetric areas 35a, 35b, respectively.
The method includes forming first and second feed pads in the first and second feed openings, respectively, defining first and second capacitive feed points 37a, 37b. The method also includes forming first and second feed lines 41a, 41b extending through the substrate 31 and respectively coupling the first and second feed pads 37a, 37b to wireless communications circuitry 21. The method also includes forming a plurality of spaced apart conductive shielding vias 42 coupled to the ground plane 32 and extending through the substrate 31 surrounding the electrically conductive patch antenna element 33.
Referring now to
The electrically conductive patch antenna element 33′ has a symmetric axis 34′ dividing the electrically conductive patch antenna element into first and second symmetric areas 35a′, 35b′. The electrically conductive patch antenna element 33′ has first and second feed openings 36a′, 36b′ in the first and second symmetric areas 35a′, 35b′, respectively. First and second feed pads are in the first and second feed openings, respectively, defining first and second capacitive feed points 37a′, 37b′.
The antenna assembly 30′ also includes first and second feed lines 41a′, 41b′ extending through the substrate 31′. In the illustrated embodiment, one of the first and second feed lines 41a′ couples a respective one of the first and second feed pads 36a′ to the wireless communications circuitry 21′ (i.e., a drive feed line) and the other of the first and second feed lines 41b′ is electrically floating.
The ground plane 32′ has an opening 56′ therein. The substrate 31′ also has a recess 57′ therein aligned with the opening 56′ in the ground plane 32′. The recess 57′ may be conically shaped, for example. The electrically floating feed line 41b′ illustratively extends downwardly from the electrically conductive patch antenna element 33′ to the recess 57′.
As will be appreciate by those skilled in the art, the electrically floating feed line 41b′ may be considered a parasitic feed line and may provide useful radiation pattern symmetry without a microstrip power divider or an additional printed circuit board layer to drive it. The electrically floating feed line 41b′ makes electrical contact with first and second capacitive feed points 37a′, 37b′ at an upper end thereof and makes no electrical contact with the ground plane 32′ at a lower end thereof. An open circuit exists at the lower end of the electrically floating or parasitic feed line 41b′ due to the conically shaped recess 57′ and opening 56′ in the ground plane 32′. The capacitive feed point 37b′ adjacent the electrically floating feed line 41b′ may have the same dimensions as the other capacitive feed point 37a′. In some embodiments, the first and second capacitive feed points 37a′, 37b′ may have different sizes.
The electrically floating feed line 41b′ receives electric current from the electrically conductive patch antenna element 33′. The electric current on the electrically floating feed line 41b′ causes monopole-like radiation, which counteracts radiation by the drive feed line 41a′. Radiation from the drive feed line 41a′ squints the radiation pattern off broadside in the direction of the drive feed line, while radiation from the electrically floating feed line 41b′ squints the radiation pattern in the direction of the electrically floating feed line. Combined radiation from the first and second feed lines 41a′, 41b′ (i.e., drive and electrically floating feed lines) steers the antenna radiation pattern to broadside or nearly so.
Referring to the graphs in
The Smith Chart of
The graph of
Including one or more electrically floating feed lines is beneficial for most varieties of patch antennas, including patch elements of many shapes, including circular or polygonal shapes, and for stacked patch antennas. A plurality of electrically floating feed lines can be used to improve radiation from dual polarization patch antennas, such as antennas providing simultaneous dual linear polarization and or simultaneous dual circular polarization.
Similarly to the embodiment described above with respect to
A coaxial connector 65′ is carried by the bottom of the substrate 31′. The ground plane 22′ has an opening 66′ therein to allow passage of the first feed line 41a′, or drive feed line, to pass therethrough for coupling with an inner conductor of a coaxial cable, for example. The body 67′ of the coaxial connector 65′, which illustratively includes threads 68′ for coupling to a mating coaxial cable connector for example, is coupled to the ground plane 32′ and also couples the outer conductor of the coaxial cable to the ground plane. The antenna assembly 30 may be used independently from the illustrated onboard wireless communications circuitry 21.
A method aspect is directed to a method of making the antenna assembly 30′. The method includes forming an electrically conductive patch antenna element 33′ on a substrate 31′ and spaced from an electrically conductive layer defining a ground plane 32′. The electrically conductive patch antenna element 33′ is formed to have a symmetric axis 34′ dividing the electrically conductive patch antenna element into first and second symmetric areas 35a′, 35b′. The electrically conductive patch antenna element 33′ is also formed to have first and second feed openings 36a′, 36b′ in the first and second symmetric areas 35a′, 35b′, respectively.
The method includes forming first and second feed pads in the first and second feed openings 36a′, 36b′, respectively, defining first and second capacitive feed points 37a′, 37b′. The method also includes forming first and second feed lines 41a′, 41b′ extending through the substrate 31′. One of the first and second feed lines 41a′ couples a respective one of the first and second capacitive feed points 37a′ to wireless communications circuitry 21′ and another of the first and second feed lines 41b′ is electrically floating. The method also includes forming spaced apart conductive shielding vias 42′ coupled to the ground plane 32′ and extending through the substrate 31′ surrounding the electrically conductive patch antenna element 33′.
Referring now to
Moreover, the array 30″ causes symmetric, broadside radiation. The electrically conductive patch antenna elements 33″, 133″, 233″, 333″ are alternately “clocked” so half of the electrically conductive patch antenna elements are rotated 180 degrees mechanically with respect to the others. The clocking enhances radiation pattern symmetry because if individual element radiation patterns are squinted off broadside/plane normal, the alternate clocked elements will radiate in the other direction cancelling the squint. The mechanically clocked elements are fed with an additional 180 degrees of electrical phase delay using an added length from the microstrip branch from the radial power divider, or in other words, from different length meander lines 52″, 152″, 252″, 352″.
The embodiments described herein may, for example, advantageously mitigate unwanted radiation from microstrip patch antenna feed probes, increase patch antenna radiation bandwidth, reduce patch antenna size, and improve patch antenna radiation pattern symmetry. Additionally, it should be appreciated that the antenna assembly may be a circular polarization patch antenna assembly, as well as a dual channel linear polarization antenna assembly, and a dual channel circular polarization assembly.
Many modifications and other embodiments of the invention will come to the mind of one skilled in the art having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is understood that the invention is not to be limited to the specific embodiments disclosed, and that modifications and embodiments are intended to be included within the scope of the appended claims.
| Number | Name | Date | Kind |
|---|---|---|---|
| 3921177 | Munson | Nov 1975 | A |
| 5515057 | Lennen et al. | May 1996 | A |
| 6181279 | Van Hoozen | Jan 2001 | B1 |
| 6239750 | Snygg | May 2001 | B1 |
| 6882316 | McKinzie, III et al. | Apr 2005 | B2 |
| 7084815 | Phillips et al. | Aug 2006 | B2 |
| 7202818 | Anguera Pros et al. | Apr 2007 | B2 |
| 7209080 | Crouch et al. | Apr 2007 | B2 |
| 7623073 | Teshirogi | Nov 2009 | B2 |
| 20120242547 | Fujii | Sep 2012 | A1 |
| 20120287019 | Sudo | Nov 2012 | A1 |
| 20140225795 | Yu | Aug 2014 | A1 |
| Number | Date | Country |
|---|---|---|
| 2013149347 | Oct 2013 | WO |
| Number | Date | Country | |
|---|---|---|---|
| 20160261039 A1 | Sep 2016 | US |
