This application is based on and claims priority under 35 U.S.C. 119 to Korean Patent Application No. 10-2018-0156940, filed on Dec. 7, 2018, in the Korean Intellectual Property Office, the disclosure of which is herein incorporated by reference in its entirety.
Certain embodiments of the disclosure relate to electronic devices including a speaker and a microphone.
An electronic device may come with at least one or more sound effect-related components. Sound effect-related components may include, e.g., a speaker and a microphone. Such components may sit in the housing of the electronic device in various patterns or arrangements corresponding to various exterior designs of the electronic device.
Microphone-integrated in-ear earphones (or earsets, headphones, or headsets), hearing aids, or such wearable devices are example electronic devices which are equipped with a speaker and a microphone, as sound-related components of a wearable device. Wearable devices may be worn close to the users' ear and may be manufactured in compact size.
The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure.
In accordance with certain embodiments of the disclosure, a wearable device comprises a speaker, a microphone, and a housing, wherein the housing includes a protrusion configured to be insertable into a user's ear, a first sound path including a first opening formed through an area of a surface of the protrusion, extending from the first opening in a first length, and including a second opening facing the speaker, and a second sound path including a third opening formed through another area of the surface of the protrusion, extending from the third opening in a second length larger than the first length, and including a fourth opening facing the microphone.
In accordance with certain embodiments of the disclosure, a wearable device comprises a speaker, a microphone, and a housing, wherein the housing includes a protrusion configured to be insertable into a user's ear, a first sound path including a first opening formed through an area of a surface of the protrusion, extending from the first opening in a first length, and including a second opening facing the speaker, and a second sound path including a third opening formed through another area of the surface of the protrusion, extending from the third opening in a second length, and including a fourth opening facing the microphone, wherein the microphone and the speaker are arranged in an internal space of the housing, and wherein the microphone is spaced further away from the surface of the protrusion than the speaker is.
In accordance with various embodiments of the disclosure, an electronic device comprises a speaker, a microphone, and a housing, wherein the housing includes a protrusion configured to be insertable into a user's ear, a first sound path including a first opening formed through an area of a surface of the protrusion, extending from the first opening in a first length, and including a second opening facing the speaker, a second sound path including a third opening formed through another area of the surface of the protrusion, extending from the third opening in a second length, and including a fourth opening facing the microphone, and a processor configured to process a sound signal received via the microphone, wherein the microphone and the speaker are arranged in an internal space of the housing, and wherein the microphone is spaced further away from the surface of the protrusion than the speaker is, and wherein the processor is configured to perform a filtering task while processing the sound signal received via the microphone.
Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses exemplary embodiments of the disclosure.
A more complete appreciation of the disclosure and many of the attendant aspects thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:
Throughout the drawings, like reference numerals will be understood to refer to like parts, components, and structures.
A wearable device may have various sound components and electronic components arranged in a single housing.
The speaker, microphone, or other sound components inside the housing of the wearable device have a direct influence on sound performance, and they are thus required to be arranged carefully. However, simple arrangements have been conventionally adopted, such as an arrangement in which a speaker and a microphone are placed in parallel with each other.
In an example in which a microphone-equipped wearable device is worn on the user's ear for use, sound waves reflected inside the ear may be collected by the microphone. In this case, the conventional wearable device only covers a narrow frequency band (e.g., 2 kHz or less) in which sound energy is not concentrated and thus exhibits poor sound performance.
In far-end speech communications on the microphone-equipped wearable device, the echo signal may be excessively increased, resulting in voice deterioration.
According to certain embodiments of the disclosure, there is provided a wearable device with enhanced sound performance based on the arrangement between sound components, such as the speaker and microphone and the sound characteristics which are varied depending on the paths connected to the speaker and microphone (e.g., sound emission path or sound collection path).
According to certain embodiments of the disclosure, there is provided a wearable device with a mounting structure for the microphone which enables increases mass-producibility and usability.
The following embodiments are provided for one of ordinary skill in the art to easily understand the technical scope of the disclosure and the disclosure is not limited thereto. The accompanying drawings are provided to easily describe the embodiments of the disclosure and may differ from actual implementations.
Before describing in detail several embodiments of the disclosure, it should be noted that applications of the disclosure are not limited to the configuration and arrangements of the components described and shown in connection with the drawings.
When a component is “connected to” or “coupled to” another component, the component may be directly connected or coupled to the other component, or other component(s) may intervene therebetween. The term “connection” may refer to all physical or electrical connections, such as attachment, coupling, joining, or combining, as well as a direct or indirect connection between one member and another.
The terms as used herein are provided merely to describe some embodiments thereof, but not to limit the disclosure. It is to be understood that the singular forms “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise. It will be further understood that the terms “comprise” and/or “have,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Hereinafter, embodiments of the disclosure are described with reference to the accompanying drawings.
The processor 120 may execute, e.g., software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 connected with the processor 120 and may process or compute various data. According to one embodiment, as at least part of the data processing or computation, the processor 120 may load a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be specific to a specified function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.
The auxiliary processor 123 may control at least some of functions or states related to at least one (e.g., the display device 160, the sensor module 176, or the communication module 190) of the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state or along with the main processor 121 while the main processor 121 is an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123.
The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134.
The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.
The input device 150 may receive a command or data to be used by other component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).
The sound output device 155 may output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record, and the receiver may be used for an incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
The display device 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display device 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display device 160 may include touch circuitry adapted to detect a touch, or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch.
The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain a sound through the input device 150 or output a sound through the sound output device 155 or an external electronic device (e.g., an electronic device 102 (e.g., a speaker or a headphone) directly or wirelessly connected with the electronic device 101.
The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
A connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).
The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or motion) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
The power management module 188 may manage power supplied to the electronic device 101. According to one embodiment, the power management module 388 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
The communication module 190 may support establishing a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication through the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.
The antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 101. According to an embodiment, the antenna module may include one antenna including a radiator formed of a conductor or conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna appropriate for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas by, e.g., the communication module 190. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other parts (e.g., radio frequency integrated circuit (RFIC)) than the radiator may be further formed as part of the antenna module 197.
At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. The first and second external electronic devices 102 and 104 each may be a device of the same or a different type from the electronic device 101. According to an embodiment, all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, or client-server computing technology may be used, for example.
The audio input interface 210 may receive an audio signal corresponding to a sound obtained from the outside of the electronic device 101 via a microphone (e.g., a dynamic microphone, a condenser microphone, or a piezo microphone) that is configured as part of the input device 150 or separately from the electronic device 101. For example, if an audio signal is obtained from the external electronic device 102 (e.g., a headset or a microphone), the audio input interface 210 may be connected with the external electronic device 102 directly via the connecting terminal 178, or wirelessly (e.g., Bluetooth™ communication) via the wireless communication module 192 to receive the audio signal. According to an embodiment, the audio input interface 210 may receive a control signal (e.g., a volume adjustment signal received via an input button) related to the audio signal obtained from the external electronic device 102. The audio input interface 210 may include a plurality of audio input channels and may receive a different audio signal via a corresponding one of the plurality of audio input channels, respectively. According to an embodiment, additionally or alternatively, the audio input interface 210 may receive an audio signal from another component (e.g., the processor 120 or the memory 130) of the electronic device 101.
The audio input mixer 220 may synthesize a plurality of inputted audio signals into at least one audio signal. For example, according to an embodiment, the audio input mixer 220 may synthesize a plurality of analog audio signals inputted via the audio input interface 210 into at least one analog audio signal.
The ADC 230 may convert an analog audio signal into a digital audio signal. For example, according to an embodiment, the ADC 230 may convert an analog audio signal received via the audio input interface 210 or, additionally or alternatively, an analog audio signal synthesized via the audio input mixer 220 into a digital audio signal.
The audio signal processor 240 may perform various processing on a digital audio signal received via the ADC 230 or a digital audio signal received from another component of the electronic device 101. For example, according to an embodiment, the audio signal processor 240 may perform changing a sampling rate, applying one or more filters, interpolation processing, amplifying or attenuating a whole or partial frequency bandwidth, noise processing (e.g., attenuating noise or echoes), changing channels (e.g., switching between mono and stereo), mixing, or extracting a specified signal for one or more digital audio signals. According to an embodiment, one or more functions of the audio signal processor 240 may be implemented in the form of an equalizer.
The DAC 250 may convert a digital audio signal into an analog audio signal. For example, according to an embodiment, the DAC 250 may convert a digital audio signal processed by the audio signal processor 240 or a digital audio signal obtained from another component (e.g., the processor (120) or the memory (130)) of the electronic device 101 into an analog audio signal.
The audio output mixer 260 may synthesize a plurality of audio signals, which are to be outputted, into at least one audio signal. For example, according to an embodiment, the audio output mixer 260 may synthesize an analog audio signal converted by the DAC 250 and another analog audio signal (e.g., an analog audio signal received via the audio input interface 210) into at least one analog audio signal.
The audio output interface 270 may output an analog audio signal converted by the DAC 250 or, additionally or alternatively, an analog audio signal synthesized by the audio output mixer 260 to the outside of the electronic device 101 via the sound output device 155. The sound output device 155 may include, for example, a speaker, such as a dynamic driver or a balanced armature driver, or a receiver. According to an embodiment, the sound output device 155 may include a plurality of speakers. In such a case, the audio output interface 270 may output audio signals having a plurality of different channels (e.g., stereo channels or 5.1 channels) via at least some of the plurality of speakers. According to an embodiment, the audio output interface 270 may be connected with the external electronic device 102 (e.g., an external speaker or a headset) directly via the connecting terminal 178 or wirelessly via the wireless communication module 192 to output an audio signal.
According to an embodiment, the audio module 170 may generate, without separately including the audio input mixer 220 or the audio output mixer 260, at least one digital audio signal by synthesizing a plurality of digital audio signals using at least one function of the audio signal processor 240.
According to an embodiment, the audio module 170 may include an audio amplifier (not shown) (e.g., a speaker amplifying circuit) that is capable of amplifying an analog audio signal inputted via the audio input interface 210 or an audio signal that is to be outputted via the audio output interface 270. According to an embodiment, the audio amplifier may be configured as a module separate from the audio module 170.
Referring to
According to an embodiment, as shown in
According to an embodiment, the wearable device 300 may be a device wearable on the user's body part, e.g., ear or head. Examples of the wearable device 300 may include an in-ear earset (or in-ear headset) or a hearing aid or may include other various products equipped with a speaker or microphone.
The description of the embodiments taken in conjunction with the drawings focuses on a kernel-type in-ear earset which sits in the external auditory meatus which connects from the auricle to the eardrum. However, it should be noted that the disclosure is not limited thereto. According to an embodiment, although not shown, the wearable device 300 may be an open-type earset that sits on the auricle.
Referring to
The wearable device 300 may be wiredly or wirelessly connected with the electronic device (e.g., 102 of
Described below is an example in which the wearable device 300 is provided separately from an electronic device (e.g., 102 of
When the wearable device 300 is wirelessly connected with the external electronic device (e.g., 102 of
The wearable device 300 may include a communication module. According to an embodiment, the wearable device 300 may further include at least one of a power management module, a sensor module, a battery, and an antenna module. In the embodiment in which the wearable device 300 wirelessly connects to the external electronic device, a wireless communication module may correspond to the communication module. According to an embodiment, the wearable device 300 may include an audio module (e.g., 170 of
According to an embodiment, the wearable device 300 may refrain from communicating with the external electronic device. In this case, the wearable device 300 may be implemented to receive signals corresponding to sounds obtained from the outside and output sound signals to the outside by the own operation (or control) of the components included in the wearable device 300, rather than controlled by the external electronic device.
Referring to
The eartip 330 may include an outside eartip surface 331 which may contact at least a body part and an inside eartip surface 332 which provides a path along which sounds are radiated and/or collected in the user's body part.
Referring to
According to an embodiment, the protrusion 320 may be disposed on one side of the housing 310. The protrusion 320 may be formed separately from the housing 310 and be then mounted on the housing 310 to form a part of the housing. According to an embodiment, a lower coupling part 321 of the protrusion 320 provided separately from the housing 310 is inserted and fastened in the recess 310c formed in one side of the housing 310, thereby becoming a part of the housing. According to an embodiment, unlike shown in the drawings, the protrusion 320 may be integrally formed with the housing 310. According to an embodiment, the first sound path 311a and the second sound path 312a, 312b, and 312c may be defined by the protrusion 320 fitted in the recess 310c, and solid material in the housing. In certain embodiments, the first sound path 311a may comprise a first cavity 311a and the second sound path 312a, 312b, and 312c may comprise a second cavity 312a, 312b, and 312c.
According to an embodiment, the wearable device 300 may further include a speaker (e.g., 311 of
Referring to
Referring to
According to an embodiment, the microphone 312, together with the speaker 311, may be arranged in parallel inside the single housing 310. The outer wall structure of the housing 310 may form a predetermined size of internal space S, and the microphone 312 and the speaker 311 may be placed in the internal space S of the housing 310. According to an embodiment, the speaker 311 may fit into a speaker container 311′ for receiving the speaker 311, and the microphone 312 may fit into a microphone container 313 (or on a board) for receiving the microphone 312. According to an embodiment, the microphone 312 may be structured to be seated and bonded in the microphone container 313 (or on a board). Since the microphone 312 is smaller in volume than the speaker 311, the microphone 312 may be easily seated and bonded in the microphone container 313 (or on the board). Given space efficiency, the microphone 312 may be placed in various positions in light of the small volume. According to an embodiment, the position of the microphone 312 may be varied for the purpose of enhancing the sound quality by expanding the band of voice signals.
The housing 310 may include the first sound path 311a which is a path for guiding sounds from the speaker 311 and the second sound path 312a, 312b, and 312c which is a path for guiding sounds collected to the microphone 312. According to an embodiment, the rest of the internal space S, except for the spaces for receiving the first sound path 311a, the speaker 311, the second sound path 312a, 312b, and 312c, and the microphone 312, may be filled with a designated material (e.g., a resin). According to an embodiment, the internal space S of the housing 310 may further include spaces for receiving other electric components including the controller 314 and the battery 315. Although
The protrusion 320 may include at least two openings 323a and 324a in one surface (e.g., the top surface 322). Any one of the at least one two openings 323a and 324a may be a first opening 323a for externally discharging (or radiating) sounds output from the speaker (e.g., 311 of
According to an embodiment, the protrusion 320 may include the first opening 323a and the third opening 324a respectively communicating with an end of the first sound path 311a and an end of the second sound path 312a, 312b, and 312c. A sound generated from the speaker 311 may be output through the first sound path 311a and then the first opening 323a to the outside, and a portion of the sound output through the first opening 323a may be input through the third opening 324a and then collected through the second sound path 312a, 312b, and 312c to the microphone 312.
According to an embodiment, the sound collected through the third opening 324a is transferred via the microphone 312 to the speaker 311 in the form of an electrical sound signal, and the speaker 311 may amplify the sound signal and output the amplified sound signal through the first opening 323a to the outside.
According to an embodiment, the first sound path 311a has one end connected with the first opening 323a and the other end connected with the second opening 323b. The second opening 323b may be connected to the speaker 311. One end of the second sound path 312a, 312b, and 312c may be connected to the third opening 324a, and the other end may be connected to the fourth opening 324b. The fourth opening 324b may be connected to the microphone 312.
In the disclosure, there is provided a method for enhancing the sound performance based on geometrical information about the second sound path 312a, 312b, and 312c and the position of the microphone 312 according to the above-described embodiments of the wearable device 300. This is described below in detail.
According to an embodiment of the disclosure, the second sound path 312a, 312b, and 312c may be formed to be longer than the first sound path 311a. According to an embodiment, at least a segment (e.g., 312b) of the second sound path 312a, 312b, and 312c may be bent in a certain position (e.g., the position adjacent to the speaker 311), and another segment 312c may extend through a side of the speaker 311 to the microphone 312.
According to an embodiment, the first sound path 311a extending to the speaker 311 may extend straight without any bend, and the second sound path 312a, 312b, and 312c extending to the microphone 312 may have a bend in at least some segments. The second sound path may include at least two segments. According to an embodiment, the second sound path may include a first segment 312a and a second segment 312b. Alternatively, the second sound path may include a first segment 312a, a second segment 312b, and a third segment 312c. The second sound path may include more separated segments but no detailed description thereof is given below. Although
Referring back to
According to an embodiment, the housing 310 may be shaped left/right asymmetrically as viewed from above the top of the housing 310 (e.g., refer to
According to an embodiment, a sound collecting portion 312d may be formed at an end of the second sound path 312a, 312b, and 312c, on the side of the microphone 312. The sound collecting portion 312d may be a space for collecting sound signals, which are transmitted via the third opening 324a, the second sound path 312a, 312b, and 312c, and the fourth opening 324b as the air vibrates, before the sound signals are transferred to the microphone.
According to an embodiment, the microphone 312 may be positioned more internally than the speaker 311 than one surface 322 (hereinafter, the ‘top surface 322’) of the protrusion 320 in the internal space S of the housing 310. In other words, the speaker 311 may be disposed more adjacent to the top surface 322 of the protrusion 320 than the microphone 312 is.
According to an embodiment, the speaker 311 has a sound radiating surface where sounds are emitted and an end 311″ formed on the opposite side of the sound radiating surface. The sound radiating surface of the speaker 311 faces in the same direction as the top surface 322, and the end 311″ of the speaker 311 may face in the opposite direction to the top surface 322 of the protrusion 320. According to an embodiment, the microphone 312 may be disposed further away from the top surface 322 of the protrusion 320 than the end 311″ is. According to an embodiment, the sound collecting hole 313a formed in the microphone container 313 (or a board) for receiving the microphone 312 may be formed further away from the top surface 322 of the protrusion 320 than the end 311″ is. As the microphone 312 is formed further away from the top surface 322 of the protrusion 320 than the speaker 311 is, the vibration generated when the speaker 311 radiates sound may be prevented from influencing the sound received by the microphone 312. In other words, echo or oscillations of the microphone 312 by the speaker 311 may be prevented.
Referring to
According to an embodiment, the rest of the microphone 312 except for the sound collecting hole 313a may be surrounded by the microphone container (or board 313).
The microphone container 313 (or board) may be configured to be able to transfer electrical signals to the microphone 312 or function to transfer electrical signals from the microphone 312 to the other components of the wearable device 300. A terminal or connector for signal connection may be disposed on one side of the microphone container 313 (or board) to electrically connect various components. According to an embodiment, the microphone may be a microelectromechanical systems (MEMS) microphone. According to an embodiment, the board 313 may include a printed circuit board (PCB) or a flexible printed circuit board (FPCB).
According to an embodiment, the microphone container 313 (or board) where the microphone 312 is mounted may be disposed in various positions and forms inside the internal space S of the housing 310. According to an embodiment, as the microphone container 313 (or board) is repositioned, the microphone 312 may be disposed behind the end 311″ of the speaker 311 with respect to the top surface 322 of the protrusion 320, and as the sound collecting hole 313a of the microphone 312 is rendered to face in the same direction as the top surface 322 of the protrusion 320, the reception sensitivity of the microphone may be increased.
Alternatively, although not shown in the drawings, the microphone container 313 (or board) where the microphone 312 is mounted may be disposed adjacent to the inner wall of the housing 310. For example, the microphone 312 may be installed on a flat portion of the inner wall of the housing 310 which is positioned on the opposite side of the protrusion 320.
According to the above-described embodiments, the position of the microphone 312, the position of the sound collecting hole 313a, and the geometrical measurements of the second sound path 312a, 312b, and 312c communicating with the microphone 312 may be designed to have the optimal sound performance, aiming to improve the sound performance.
Certain embodiments of the disclosure may be described based on Helmholtz resonance.
Helmholtz resonance may refer to the principle for attenuating or amplifying a particular frequency of sound based on the resonance of air in an empty space. Helmholtz resonance is widely known through a Helmholtz resonator with a cavity and a neck as an example application. Here, the Helmholtz resonance frequency may be determined by geometrical information in a space with a certain configuration as shown in Equation 1 below.
Here, c, S, V, and l, respectively, may denote, c, the sound speed in air (343 m/s or 1125 ft/s), S, the cross section of the neck, V, the volume of the space, l and the length of the neck (or a corrected neck length).
According to an embodiment, the cross section of the first sound path 311a and the second sound path 312a, 312b, and 312c may correspond to the cross section S of the neck, and the length of the first sound path 311a and the second sound path 312a, 312b, and 312c may correspond to the neck length l. The volume of the space formed by the first sound path 311a and the second sound path 312a, 312b, and 312c may correspond to the volume V.
According to an embodiment, an embodiment to which Helmholtz resonance is applied may be disclosed further with reference to
According to an embodiment, at least some segments of the first sound path 311a and the second sound path 312a, 312b, and 312c may be formed to be parallel with each other. At least some segments of the first sound path 311a and the second sound path 312a, 312b, and 312c may face in the same direction (e.g., towards the top surface 322 of the protrusion 320). According to an embodiment, the first sound path 311a may be formed to be straight, and at least some segments of the second sound path 312a, 312b, and 312c may be formed of curved segments. According to an embodiment, the width (or cross section) of at least a segment of the first sound path 311a or second sound path 312a, 312b, and 312c may be smaller than the width (or cross section) of the other segments. For example,
Referring back to
According to an embodiment, the first sound path 311a may be designed for the resonance frequency f1 for the first sound path 311a to cover an overall, normal human audible frequency band. In contrast, the second sound path 312a, 312b, and 312c may be designed for the resonance frequency f2 for the second sound path 312a, 312b, and 312c to amplify the quantity of obtaining voice signals of a band from 1 kHz to 4 kHz (hereinafter, a ‘low band’) of the human audible frequency band. Since the second sound path 312a, 312b, and 312c collects sounds of the inside of the external auditory meatus or auricle, voice energy may be concentrated in low band signals of 4 kHz or less but rather than signals of a medium/high band which is larger than 4 kHz. The electronic device disclosed herein may provide a structure for the microphone 312 which is specified to collect such low-band signals.
According to an embodiment, as an example for amplifying the magnitude of, and collecting, sound signals near the low band, the second sound path 312a, 312b, and 312c may be formed to be longer than the first sound path 311a as shown in
According to an embodiment, the volume of the second sound path 312a, 312b, and 312c may be increased to increase the magnitude of near-low band voice signals. As set forth above, the volume V may be determined by the width W and length L of the path. According to an embodiment, the total volume V2 may be increased by placing the microphone 312 behind the speaker 311 and expanding the second sound path 312a, 312b, and 312c. If the total volume V2 of the second sound path 312a, 312b, and 312c is increased, the resonance frequency f2 of the electronic device may be rendered to be able to cover signals of a much lower frequency band than the prior art, thus enabling sound signals near the low band to be obtained more effectively.
According to an embodiment, the cross section (or width) of at least a segment (e.g., 312a) of the second sound path 312a, 312b, and 312c may be reduced to increase the magnitude of near-low band voice signals. The resonance frequency f2 may be reduced by decreasing the cross section of some segment (e.g., 312a) of the second sound path 312a, 312b, and 312c and, thus, the resonance frequency f2 of the electronic device may be rendered to be able to cover signals of a much lower frequency band than the prior art, thus enabling sound signals near the low band to be obtained more effectively.
As set forth above, according to an embodiment, there may be provided the optimal design and method for the position of the microphone 312, and the geometrical measurements and shapes of the sound collecting hole 313a and the second sound path 312a, 312b, and 312c considering Helmholtz resonance. This leads to an increase in the magnitude of voice signals in the low band where voice signals are concentrated.
Now described are certain embodiments of the sound collecting path 312e and the shape of the protrusion 320 with reference to
According to an embodiment, the wearable device 300 may further include an eartip 330 which may be disposed to surround at least a portion of the protrusion 320. The eartip 330 may be formed to surround the rest of the protrusion 320 except for the coupling part (e.g., 321 of
Referring to
According to an embodiment, as the first opening 323a projects and is positioned at a different height than the third opening 324a to thus form a step, the size of the first opening 323a and the third opening 324a may be expanded. For example, if the first opening 323a and the second opening 324a are positioned on the same plane (e.g., the top surface 322 of the protrusion 320), a separate barrier may need between the first opening 323a and the third opening 324a. As the barrier is provided, the size of the first opening 323a and the third opening 324a may be reduced. However, according to an embodiment, as the first opening 323a projects and is positioned at a different height than the second opening 324a, the barrier between the first opening 323a and the second opening 324a may be replaced by the projecting inner wall of the first opening 323a.
According to an embodiment, the eartip 330 may be mounted in the structure in which the first opening 323a externally projects from the top surface (e.g., 322 of
According to the above-described embodiments, as the first opening 323a and the third opening 324a are sealed by the eartip 330, with the first opening 323a further projecting to the outside, a more length may be secured for the second sound path (e.g., 312a, 312b, and 312c of
According to an embodiment, at least some segment (e.g., 312e) of the second sound path may be formed on the outer surface of the housing 310.
According to an embodiment, as shown in
According to an embodiment, for the housing 310 asymmetrically shaped, the second sound path 312e may be formed along a longer edge (e.g., 301a of
Although not shown in
While sound paths are formed inside the housing according to the conventional art, the second sound path may be formed adjacent to the surface of the housing 310 so that a sufficient length may be secured for at least a segment (e.g., 313e) of the second sound path 312e according to the above-described embodiments. As a mounting structure for the microphone 312 is provided at the outside of the housing 310, the space where the microphone 312 is disposed may easily be processed, thus leading to enhanced mass producibility.
Geometrical varieties of microphones (e.g., 312 of
Referring to
The top graph of
Referring to
Referring to
The pre-processing may be carried out by a processor included in the electronic device. The processor may execute, for example, software (e.g., a program) to control at least one other component (e.g., a hardware or software component) of the electronic device coupled with the processor, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor may load a command or data received from another component (e.g., the sensor module or communication module or a sensor module 190) onto a volatile memory, process the command or the data stored in the volatile memory, and store resulting data in a non-volatile memory. According to an embodiment, the processor may include a main processor (e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor. Additionally or alternatively, the auxiliary processor may be adapted to consume less power than the main processor, or to be specific to a specified function. The auxiliary processor may be implemented as separate from, or as part of the main processor.
According to the above-described embodiments, there may be provided the optimal design for the position of the microphone (e.g., 312 of
Further, echo for remote voice signals may be minimized.
The electronic device according to certain embodiments may be one of various types of electronic devices. The electronic devices may include, e.g., a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic device is not limited to the above-listed embodiments.
It should be appreciated that certain embodiments of the disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC).
Certain embodiments as set forth herein may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.
According to an embodiment, a method according to certain embodiments of the disclosure may be included and provided in a computer program product. The computer program products may be traded as commodities between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., Play Store™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
According to certain embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities. According to certain embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to certain embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to certain embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
According to certain embodiments of the disclosure, a wearable device comprises a speaker, a microphone, and a housing, the housing including a protrusion insertable into a user's ear, a first sound path including a first opening formed through an area of a surface of the protrusion, extending from the first opening in a first length, and including a second opening facing the speaker, and a second sound path including a third opening formed through another area of the surface of the protrusion, extending from the third opening in a second length larger than the first length, and including a fourth opening facing the microphone.
According to certain embodiments, the microphone and the speaker may be arranged in an internal space of the housing. The microphone may be spaced further away from the surface of the protrusion than the speaker is.
According to certain embodiments, the housing may be formed in a left/right asymmetrical shape with respect to the protrusion as viewed from the side.
According to certain embodiments, the first sound path and the second sound path may include at least some segments which are parallel with each other.
According to certain embodiments, the first sound path may be formed of a straight line path, and the second sound path may include at least a curved segment.
According to certain embodiments, a width of at least a segment of the first sound path or the second sound path may be smaller than a width of another segment.
According to certain embodiments, a width of at least a segment of the second sound path may be smaller than a width of the first sound path.
According to certain embodiments, a sound collecting portion may be formed between the second sound path and the microphone.
According to certain embodiments, the area of the protrusion may externally project further than the other area.
According to certain embodiments, the wearable device may further include an ear tip coupled to the protrusion.
According to certain embodiments, a portion of the first opening or the third opening may be sealed by the ear tip.
According to certain embodiments, the first sound path may be formed inside the housing, and at least a portion of the second sound path may be formed along an outer surface of the housing.
According to certain embodiments, the housing may include a first edge extending from an outer surface of the housing to a side with respect to the protrusion and a second edge extending to an opposite side of the side. The first edge may be formed to be longer than the second edge to form an asymmetrical shape. The second sound path may be formed along the first edge.
According to certain embodiments, the wearable device may further include an ear tip sealing at least a portion of the second sound path.
According to certain embodiments, the second sound path may have a length at which a sound signal has a resonance point in a band from 1 kHz to 4 kHz.
According to certain embodiments of the disclosure, a wearable device comprises a speaker, a microphone, and a housing, the housing including a protrusion insertable into a user's ear, a first sound path including a first opening formed through an area of a surface of the protrusion, extending from the first opening in a first length, and including a second opening facing the speaker, and a second sound path including a third opening formed through another area of the surface of the protrusion, extending from the third opening in a second length, and including a fourth opening facing the microphone, wherein the microphone and the speaker are arranged in an internal space of the housing, and wherein the microphone is spaced further away from the surface of the protrusion than the speaker is.
According to certain embodiments, the housing may be formed in a left/right asymmetrical shape with respect to the protrusion as viewed from the side.
According to certain embodiments, the first sound path may be formed inside the housing, and at least a portion of the second sound path may be formed along an outer surface of the housing.
According to certain embodiments of the disclosure, an electronic device comprises a speaker, a microphone, and a housing, the housing including a protrusion insertable into a user's ear, a first sound path including a first opening formed through an area of a surface of the protrusion, extending from the first opening in a first length, and including a second opening facing the speaker, a second sound path including a third opening formed through another area of the surface of the protrusion, extending from the third opening in a second length, and including a fourth opening facing the microphone, and a processor configured to process a sound signal received via the microphone, wherein the microphone and the speaker are arranged in an internal space of the housing, and wherein the microphone is spaced further away from the surface of the protrusion than the speaker is, and wherein the processor is configured to perform a filtering task while processing the sound signal received via the microphone.
The processor may be configured to selectively extract and filter a remote voice signal from the sound signal received via the microphone.
As is apparent from the foregoing description, according to certain embodiments of the disclosure, there is provided the optimal design of measurement and shape of sound paths and the position of the sound collecting hole and the particular space of the microphone, thereby increasing the magnitude of sound signals in a low frequency band where voice signals are concentrated.
According to certain embodiments of the disclosure, echo of remote voice signals may be minimalized.
According to certain embodiments, a wearable device, comprises a housing having a surface, the surface having an area and another area proximate to the surface; a speaker disposed in the housing at a distance from the surface; and a microphone disposed in the housing at a further distance from the surface than the distance of the speaker to the surface; and wherein the housing comprises solid material defining a first cavity from the area of the surface to the speaker and a second cavity from the another area of the surface to the microphone.
According to certain embodiments, the housing comprises a protrusion configured to be received in a human ear, and wherein the area of the surface is an area of the surface of the protrusion and the another area of the surface is another area of the surface of the protrusion.
According to certain embodiments, a wearable device comprises a speaker; a microphone; and a housing, wherein the housing includes a protrusion configured to be insertable into a user's ear, and solid material defining a first cavity from an area of a surface of the protrusion, extending in a first length to face the speaker, and a second cavity formed from another area of the surface of the protrusion, extending a second length, and opening facing the microphone, wherein the microphone and the speaker are arranged in an internal space of the housing, and wherein the microphone is spaced further away from the surface of the protrusion than the speaker is.
According to certain embodiments, an electronic device comprises a speaker; a microphone; and a housing, wherein the housing includes a protrusion configured to be insertable into a user's ear, and solid material defining a first cavity formed through an area of a surface of the protrusion, extending in a first length facing the speaker, a second cavity from another area of the surface of the protrusion, extending in a second length facing the microphone, and a processor configured to process a sound signal received via the microphone, wherein the microphone and the speaker are arranged in an internal space of the housing, and wherein the microphone is spaced further away from the surface of the protrusion than the speaker is, and wherein the processor is configured to perform a filtering task while processing the sound signal received via the microphone.
While the disclosure has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those of ordinary skill in the art that various changes in form and detail may be made thereto without departing from the spirit and scope of the disclosure as defined by the following claims.
Unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments of the disclosure belong. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
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