Patent Application
20230143417
Embodiments disclosed in the disclosure relate to an electronic device including a speaker module, and a method for forming the same.
In recent years, electronic devices, such as smartphone and tablet personal computers (PCs), desktop PCs, portable multimedia players (PMPs), MP3 players, or wearable devices, provide various contents.
As the contents provided by the electronic devices are diversified, the electronic devices need to provide increasingly complex functions.
The number of components accommodated in the interior of the electronic device has increased as the functions of the electronic device provide the increasingly complex functionality. Additionally, the electronic devices have become gradually slimmer to satisfy purchase needs of consumers. Accordingly, it is difficult to sufficiently secure sufficient space for electronic components to be accommodated in the electronic device.
Provided is an electronic device that may optimize an accommodation space within the electronic device.
In accordance with an aspect of the disclosure, an electronic device includes: a housing at least partially surrounding a space between a front surface and a rear surface of the electronic device, and including a side structure having a speaker hole formed therein; a speaker configured to emit a sound signal through the speaker hole; a vibration motor structure provided adjacent the speaker, and including a plurality of side surfaces, wherein a motor ventilation hole is formed through a first side surface of the plurality of side surfaces; an enclosure provided in the housing, and surrounding at least a portion of the speaker and at least a portion of the vibration motor structure; a sound absorbing structure provided in the enclosure; and a protection structure provided in the enclosure, and overlapping at least a portion of the motor ventilation hole.
The protection structure may be spaced apart from the first side surface by a gap that is smaller than a size of the sound absorbing structure.
The protection structure may be spaced apart from the first side surface by a gap of 0.01 mm to 0.3 mm.
The enclosure may include: a first enclosure; and a second enclosure facing the first enclosure. The speaker and the vibration motor structure may be provided between the first enclosure and the second enclosure.
The protection structure may be integrally formed with the first enclosure, and the protection structure may protrude from the first enclosure toward the second enclosure.
The electronic device may further include a seating structure provided on the first enclosure, and at least partially surrounding the plurality of side surfaces. The protection structure may be spaced apart from the seating structure.
The protection structure may be one among a plurality of protection structures that are spaced apart from each other by a gap that is smaller than a size of the sound absorbing structure.
The protection structure may have a convexo-concave shape that includes a concave area and a convex area, and a width of the concave area may be less than a shortest dimension of the sound absorbing structure.
The enclosure may include: a first enclosure; and a second enclosure facing the first enclosure. The speaker and the vibration motor structure may be provided between the first enclosure and the second enclosure. The protection structure may include: a first portion attached to the first enclosure; and a second portion substantially perpendicular to the first portion, facing the motor ventilation hole, and spaced apart from the motor ventilation hole by a gap that is less than a shortest dimension of the sound absorbing structure.
The protection structure may further include a slit overlapping the motor ventilation hole, and a width of the slit may be less than the shortest dimension.
The electronic device may further include: a first circuit board electrically connected to a speaker provided in the speaker; and a second circuit board connected to a motor provided in the vibration motor structure and the first circuit board. The second circuit board may pass through the motor ventilation hole, and another motor ventilation hole may be formed through a second side surface of the plurality of side surfaces.
The protection structure may be integrally formed with the first circuit board, and may extend toward the motor ventilation hole.
The protection structure may be provided on the first circuit board within 0.3 mm of the first side surface of the vibration motor structure. The protection structure may include any one or any combination of a sponge material, a 2-dimensional or 3-dimensional mesh material, a rubber material, a stainless steel material, or a plastic material.
The electronic device may further include a plurality of adhesives provided between the enclosure and the vibration motor structure, and spaced apart from each other. An auxiliary motor ventilation hole may be formed through a surface of the vibration motor structure which faces the plurality of adhesives. Pipelines between the plurality of adhesives may connect the auxiliary motor ventilation hole, an outer space of the vibration motor structure, and an inner space of the vibration motor structure.
Each of the plurality of adhesives may be narrower than the sound absorbing structure.
In accordance with an aspect of the disclosure, an electronic device includes: a speaker that includes a speaker; an enclosure surrounding at least a portion of the speaker; a vibration motor structure provided adjacent the speaker in the enclosure, wherein a motor ventilation hole is formed through the vibration motor structure to connect a first resonance space formed between the vibration motor structure and the enclosure, and a second resonance space formed within the vibration motor structure; a sound absorbing structure provided in the enclosure; and a protection structure provided in the enclosure, and facing the motor ventilation hole.
The vibration motor structure may include a plurality of side surfaces, the motor ventilation hole may pass through at least any one of the plurality of side surfaces from an inner side to an outer side thereof, and the protection structure may be spaced apart from a side surface of the vibration motor structure, on which the motor ventilation hole is formed, by a gap that is smaller than a size of the sound absorbing structure being interposed therebetween.
The enclosure may include a first enclosure and a second enclosure, which face each other, and the protection structure may protrude from the first enclosure toward the second enclosure.
The enclosure may include: a first enclosure and a second enclosure, which face each other. The protection structure may be attached to the first enclosure. The protection structure may include any one or any combination of a sponge material, a 2-dimensional or 3-dimensional mesh material, a rubber material, a stainless steel material, or a plastic material.
The electronic device may further include: a first circuit board electrically connected to the speaker; and a second circuit board connected to a motor provided in the vibration motor structure and the first circuit board. The protection structure may be integrally formed with the first circuit board or is provided on the first circuit board.
The electronic device may further include a seating structure provided in the enclosure, and at least partially surrounding a side surface of any one or any combination of the vibration motor structure and the speaker. The first resonance space may include: a space between any one or any combination of the first circuit board and the second circuit board, and the enclosure; and a space between the seating structure and the enclosure.
In accordance with an aspect of the disclosure, an electronic device includes: a speaker provided within an enclosure and including a speaker; and a vibration motor structure provided within the enclosure that includes a first surface, a second surface, and a third surface which extends between the first surface and the second surface. A motor ventilation hole is formed through the third surface to allow air provided in the enclosure to flow in and out of the vibration motor structure.
The electronic device may further include a circuit board provided within the motor ventilation hole and electrically connected to a motor provided in the vibration motor structure.
The circuit board may be provided on the first surface and may include a plurality of connection terminals.
The electronic device may further include a protection structure which protrudes from the first surface.
The protection structure may be spaced apart from the third surface along a direction perpendicular to the third surface by a first distance.
The first distance may be greater than 0.01 mm and less than 0.3 mm.
In accordance with an aspect of the disclosure, a method of an electronic device that includes a speaker and a vibration motor structure is provided. The method includes: inducing air to flow through a motor ventilation hole of the vibration motor structure by controlling a speaker provided in the speaker to vibrate according to an audio signal; and controlling a motor provided in the vibration motor structure according to an alert signal.
Provided is an electronic device which may optimize an accommodation space and reduce manufacturing costs as the vibration motor module may be accommodated in an enclosure, in which a speaker module is accommodated.
Provided is an electronic device which may improve a performance of the speaker module as a volume of resonance space is enlarged due to the interior space of the vibration motor module.
Provided is an electronic device which includes a protection structure to prevent a defect of a vibration motor module due to a sound absorbing member blocking a ventilation hole.
Provided is an electronic device which includes a protection structure to prevent deterioration of low-band performance due to a sound absorbing member blocking a ventilation hole.
The disclosure may provide additional effects.
The above and other aspects, features, and advantages of certain embodiments of the present disclosure will be more apparent from the following detailed description, taken in conjunction with the accompanying drawings, in which:
Hereinafter, embodiments will be described with reference to the accompanying drawings. Like reference numerals refer to like elements and a repeated description related thereto will be omitted. As used herein, the terms “1st” or “first” and “2nd” or “second” may use corresponding components regardless of importance or order and are used to distinguish a component from another component without limiting the components. Expressions such as “at least one of” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list. For example, the expression, “at least one of a, b, and c,” should be understood as including only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c. Those of ordinary skill in the art will recognize that modification, equivalent, and/or alternative on the various embodiments described herein may be variously made without departing from the scope and spirit of the disclosure.
Referring to
In another embodiment, the housing 110 may refer to a structure that forms some of the first surface 110A, the second surface 110B, and the side surface 110C.
In one embodiment, the first surface 110A may be formed by a front surface plate 102 (e.g., a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent. The second surface 110B may be formed by a substantially opaque rear surface plate 111. The rear surface plate 111 may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 110C may be formed by a side surface bezel structure (or a “frame structure”) 118 that is coupled to the front surface plate 102 and the rear surface plate 111, and may contain metal and/or polymer.
In another embodiment, the rear surface plate 111 and the side surface bezel structure 118 may be integrally formed and may contain the same material (e.g., a metal material such as aluminum).
As illustrated, the front surface plate 102 may include two first regions 110D bent from a region of the first surface 110A in a direction of the rear surface plate 111 to seamlessly extend. The first regions 110D may be located at ends of long edges of the front surface plate 102, respectively.
As illustrated, the rear surface plate 111 may include two second regions 110E bent from a region of the second surface 110B in a direction of the front surface plate 102 to seamlessly extend. The second regions 110E may be located at ends of long edges of the rear surface plate 111, respectively.
In another embodiment, the front surface plate 102 (or the rear surface plate 111) may include only one of the first regions 110D (or of the second regions 110E). In addition, in another embodiment, the front surface plate 102 (or the rear surface plate 111) may not include some of the first regions 110D (or of the second regions 110E).
In one embodiment, when viewed from the side surface of the electronic device 101, the side surface bezel structure 118 may have a first thickness (or width) in a side surface direction (e.g., a short side) in which the first regions 110D or the second regions 110E as described above are not included, and may have a second thickness smaller than the first thickness in a side surface direction (e.g., a long side) in which the first regions 110D or the second regions 110E are included.
In one embodiment, the electronic device 101 may include at least one of a display 106, an audio module (e.g., speaker module 520 in
In one embodiment, the display 106 may be exposed through a substantial portion of the front surface plate 102. For example, at least a portion of the display 106 may be exposed through the front surface plate 102 including the first surface 110A and the first regions 110D of the side surface 110C.
In one embodiment, an edge of the display 106 may be formed to have a shape that is substantially the same as a shape of an adjacent outer periphery of the front surface plate 102. In another embodiment, a distance between an outer periphery of the display 106 and the outer periphery of the front surface plate 102 may be substantially constant to expand an area to which the display 106 is exposed.
In one embodiment, a surface (or the front surface plate 102) of the housing 110 may include a screen display region defined as the display 106 is visually exposed. For example, the screen display region may include the first surface 110A and the first regions 110D of the side surface.
In another embodiment, the screen display region 110A and 110D may include a sensing region for acquiring biometric information of a user. In this connection, “the screen display region 110A and 110D includes the sensing region” may be understood to mean that at least a portion of the sensing region may overlap the screen display region 110A and 110D. For example, the sensing region may mean a region that may display visual information by the display 106 like other regions of the screen display region 110A and 110D, and additionally acquire the biometric information (e.g., a fingerprint) of the user.
In one embodiment, the screen display region 110A and 110D of the display 106 may include a region in which the first camera module 105 (e.g., a punch hole camera) may be visually exposed. For example, at least a portion of an edge of the region in which the first camera module 105 is exposed may be surrounded by the screen display region 110A and 110D. In one embodiment, the first camera module 105 may include a plurality of camera modules (e.g., the camera module 580 in
In another embodiment, the display 106 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring an intensity (a pressure) of a touch, and/or a digitizer that detects a magnetic field-type stylus pen.
In one embodiment, the audio module may include the microphone holes 103 and 104 and the speaker hole 107.
In one embodiment, the microphone holes 103 and 104 may include the microphone hole 103 defined in a region of the side surface 110C and the microphone hole 104 defined in a region of the second surface 110B. In the microphone holes 103 and 104, a microphone for acquiring an external sound may be disposed. The microphone may include a plurality of microphones to sense a direction of the sound. In one embodiment, the microphone hole 104 defined in the region of the second surface 110B may be disposed adjacent to the camera modules 105, 112, and 113. For example, the microphone hole 104 may acquire the sound when the camera modules 105, 112, and 113 are executed, or acquire the sound when another function is executed.
In one embodiment, the speaker hole 107 may include the external speaker hole 107 and a receiver hole. The external speaker hole 107 may be defined in a portion of the side surface 110C of the electronic device 101. In another embodiment, the external speaker hole 107 may be implemented as one hole with the microphone hole 103. The receiver hole may be defined in another portion of the side surface 110C. For example, the receiver hole may be defined in another portion (e.g., a portion on a +Y-axis side) of the side surface 110C facing away from the portion (e.g., a portion on a −Y-axis side) of the side surface 110C in which the external speaker hole 107 is defined.
In one embodiment, the electronic device 101 may include a speaker in communication with the speaker hole 107. In another embodiment, the speaker may include a piezo speaker in which the speaker hole 107 is omitted.
In one embodiment, the sensor module may generate an electrical signal or a data value corresponding to an internal operating state or an external environmental state of the electronic device 101. For example, the sensor module may include at least one of a proximity sensor, a HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and an illuminance sensor.
In one embodiment, the camera modules 105, 112, and 113 may include the first camera module 105 (e.g., the punch hole camera) exposed from the first surface 110A of the electronic device 101, and the second camera module 112 and/or the flash 113 exposed through the second surface 110B.
In one embodiment, the first camera module 105 may be exposed through a portion of the screen display region 110A and 110D of the display 106. For example, the first camera module 105 may be exposed from a region of the screen display region 110A and 110D through an opening defined in a portion of the display 106.
In one embodiment, the second camera module 112 may include a plurality of camera modules (e.g., a dual camera, a triple camera, or a quad camera). However, the second camera module 112 may not be necessarily limited to including the plurality of camera modules, and may include one camera module.
Each of the first camera module 105 and the second camera module 112 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In another embodiment, two or more lenses (an infrared camera, and wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device 101.
In one embodiment, the key input device 117 may be disposed on the side surface 110C (e.g., in the first regions 110D and/or the second regions 110E) of the housing 110. In another embodiment, the electronic device 101 may not include a portion or an entirety of the key input device 117, and the key input device 117 that is not included may be implemented in another form, like a soft key, on the display 106. In another embodiment, the key input device may include a sensor module that forms the sensing region included in the screen display region 110A and 110D.
In one embodiment, the connector hole 108 may be configured to receive a connector. The connector hole 108 may be disposed on the side surface 110C of the housing 110. For example, the connector hole 108 may be disposed on the side surface 110C to be adjacent to at least a portion of the audio module (e.g., the microphone hole 103 and the speaker hole 107). In another embodiment, the electronic device 101 may include the first connector hole 108 capable of accommodating a connector (e.g., a universal serial bus (USB) connector) for transmitting/receiving power and/or data with an external device and/or a second connector hole capable of accommodating a connector (e.g., an earphone jack) for transmitting/receiving an audio signal with the external device.
In one embodiment, the electronic device 101 may include the light emitting device. For example, the light emitting device may be disposed on the first surface 110A of the housing 110. The light emitting device may provide state information of the electronic device 101 in a form of light. In another embodiment, the light emitting device may provide a light source that is in association with an operation of the first camera module 105. For example, the light emitting device may include a light emitting diode (LED), an IR LED, and/or a xenon lamp.
In an embodiment, at least a portion of the side surface bezel structure 118 may function as an antenna electrically connected to the communication module. According to an embodiment, the side surface bezel structure 118 may include a conductive part 202 formed of a metal material and a division part 201 formed of an insulating nonmetal material (e.g., a polymer). According to an embodiment, at least a portion of the conductive part 202 may be a radiator, for example, an antenna that is electrically connected to the communication module and is configured to radiate a radio frequency (RF) signal output from the communication module.
Referring to
In another embodiment, the electronic device 101 may omit at least one (e.g., the support member 160) of the components or additionally include other components. At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 in
In one embodiment, at least some of the front surface plate 120, the rear surface plate 180, and the bracket 140 (e.g., a frame structure 141) may form a housing (e.g., the housing 110 in
In one embodiment, the bracket 140 may include the frame structure 141 that forms a surface of the electronic device 101 (e.g., a portion of the side surface 110C in
The plate structure 142 may be located inside the electronic device 101, connected to the frame structure 141, or integrally formed with the frame structure 141. The plate structure 142 may be made of, for example, a metallic material and/or a non-metallic (e.g., polymer) material. The display 130 may be coupled to one surface of the plate structure 142 and the PCB 150 may be coupled to the other surface of the plate structure 142. A processor, a memory, and/or an interface may be mounted on the PCB 150. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing device, an image signal processor, a sensor hub processor, and a communication processor.
The memory may include, for example, a volatile memory or a non-volatile memory.
The interface may include, for example, a high definition multimedia interface (HDMI), a USB interface, a Secure Digital (SD) card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 101 to the external device, and may include a USB connector, an SD card connector, a MultiMediaCard (MMC) connector, or an audio connector.
In one embodiment, the battery 170 may be configured to supply power to at least one of the components of the electronic device 101. For example, the battery 170 may include a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. In one embodiment, at least a portion of the battery 170 may be disposed substantially coplanar with the PCB 150. In one embodiment, the battery 170 may be integrally disposed inside the electronic device 101 or may be disposed detachably from the electronic device 101.
In one embodiment, the first camera module 105 may be disposed on the plate structure 142 of the bracket 140 such that the lens thereof is exposed from a region of the front surface plate 120 (e.g., the first surface 110A in
In one embodiment, the first camera module 105 may be disposed such that an optical axis of the lens thereof is at least partially aligned with a hole or recess 137 defined in the display 130. For example, the region from which the lens is exposed may be formed on the front surface plate 120. For example, the first camera module 105 may include the punch hole camera having at least a portion disposed inside the hole or recess 137 defined in a rear surface of the display 130.
In one embodiment, the second camera module 112 may be disposed on the PCB 150 such that the lens thereof is exposed from a camera region 184 of the rear surface plate 180 (e.g., the second surface 110B in
In one embodiment, the camera region 184 may be formed on a surface (e.g., the second surface 110B in
According to an embodiment, the electronic device 101 may include an integral assembly 300 including a speaker module (or speaker) and a vibration motor module disposed in an inner space thereof. A sound signal emitted from the speaker module may be emitted to an outside of the electronic device through a path for delivery of a sound, which is provided in an interior of the electronic device 101. The vibration motor module may generate vibrations in an operation process of the electronic device 101.
The integral assembly 300 may be disposed in a space between the support member 160, and the front surface plate 120 or the rear surface plate 180.
The electronic device 101 according to various embodiments may include an electronic device, such as a bar type, a foldable type, a rollable type, a sliding type, a wearable type, a tablet PC, and/or a notebook PC. The electronic device 101 according to various embodiments of the disclosure is not limited to the above-described example, and may include other various electronic devices.
Referring to
The speaker module 520 and the vibration motor module 510 may be formed in one assembly. The speaker module 520 and the vibration motor module 510 may be electrically connected to each other through a first circuit board 560. For example, the first circuit board 560 may be a flexible printed circuit board (FPCB).
According to an embodiment, the speaker module 520 and the vibration motor module 510 may be accommodated in an interior of the enclosure 401. The enclosure 401 may include a first enclosure 410 and a second enclosure 420. Any one of the first enclosure 410 and the second enclosure 420 may face the front plate (e.g., the front surface plate 120 of
At least any one of the first enclosure 410 and the second enclosure 420 may be formed of a material, such as a material for injection-molding, stainless steel, or rubber.
According to an embodiment, a space for accommodating the speaker module 520 and the vibration motor module 510 may be formed in the first enclosure 410. The first enclosure 410 may include a seating structure 411 to prevent deviation of the speaker module 520 and the vibration motor module 510. The seating structure 411 may be formed to surround at least a partial area of a side surface of at least any one of the speaker module 520 and the vibration motor module 510. The second enclosure 420 may be coupled to the first enclosure 410, in which the speaker module 520 and the vibration motor module 510 are accommodated. Because the first enclosure 410 and the second enclosure 420 are coupled to each other, a resonance space surrounded by the first enclosure 410 and the second enclosure 420 may be formed.
According to an embodiment, a sound emission hole 430 connected to the speaker hole (e.g., the speaker hole 107 of
According to an embodiment, a space for accommodating a sound absorbing member 540 may be formed in at least any one of the first enclosure 410 and the second enclosure 420. The sound absorbing member 540 may be formed of an air suction material 541 in a form of grains. For example, the grains may be larger than 0.01 mm to 0.3 mm. For example, the sound absorbing member 540 may be formed by mixing an air adsorbing material of at least one of a diatomite-based element, pearlite, or a silicon dioxide-based element, or a zeolite-based element, and a binder. The sound absorbing member 540 may alleviate compression of air in the resonance space due to vibrations of the vibration plate disposed in the speaker module 520. The sound absorbing member 540 may absorb air in an interior of the enclosure 401 or discharge the air into an interior of the enclosure 401. According to an embodiment, when a pressure in the interior of the enclosure 401 is increased by the vibrations of the vibration plate disposed in the speaker module 520, the sound absorbing member 540 may absorb the air into the interior of the enclosure 401. When the pressure in the interior of the enclosure 401 is decreased by the vibrations of the vibration plate disposed in the speaker module 520, the air in the interior of the enclosure 401 may be discharged. Due to the sound absorbing member 540, limitations in a magnitude of the vibration plate in the enclosure 401 may be alleviated. Because the same effect as enlargement of a volume (that is, a resonance space) in the enclosure 401 may be obtained by the sound absorbing member 540, a low-band reproduction ability of the speaker module 520 may be enhanced.
Referring to
The speaker components may include at least one magnet disposed in an inner space of a speaker housing 630, a coil member, and a vibration plate 610.
The vibration plate 610 may be formed to cover one surface (e.g., a surface that faces the +Z axis) of the speaker housing 630. The vibration plate 610 may include a first vibration plate 611 having a plate shape, and a second vibration plate 612 that surrounds the first vibration plate 611. At least a portion of the second vibration plate 612 may have a curved surface. For example, the first vibration plate 611 and the second vibration plate 612 may have different thicknesses as illustrated in
The vibration plate 610 may vibrate according to movement of at least one coil member disposed in the inner space of the speaker housing 630. The coil member may be disposed at a location, at which it is influenced by a magnetic force of the at least one magnet disposed in the inner space of the speaker housing 630.
The speaker ventilation hole 620 may be used as a path for air flow between an inside and an outside of the speaker module 520. The air outside the speaker module 520 may be introduced into the interior of the speaker module 520 through the speaker ventilation hole 620, and the air in the interior of the speaker module 520 may be discharged to the outside of the speaker module 520 through the speaker ventilation hole 620. A change of the pressure, which is generated when the vibration plate 610 is moved upwards and downwards may be alleviated by the speaker ventilation hole 620.
The speaker ventilation hole 620 may be disposed on an opposite surface (a surface that faces the −Z axis) of the speaker housing 630 as illustrated in
According to an embodiment, the speaker module 520 may include a speaker impact absorbing member 640 disposed on the opposite surface of the speaker housing 630. The speaker impact absorbing member 640 may be disposed between the second enclosure (e.g., the second enclosure 420 of
Referring to
The motor housing 500 of the vibration motor module 510 according to an embodiment, as illustrated in
The motor housing 500 of the vibration motor module 510 according to another embodiment, as illustrated in
According to various embodiments, the motor ventilation hole 700 may have a circular shape, an elliptical shape, or a polygonal shape. The motor ventilation hole 700 may connected an inner space of the vibration motor module 510 and an outer space of the vibration motor module 510. Because the air in the outer space of the vibration motor module 510 may be introduced into the inner space of the vibration motor module 510 through the motor ventilation hole 700, a difference of the pressures in the outer space of the vibration motor module 510 and the inner space of the vibration motor module 510 may be eliminated. Accordingly, because the change in the pressure in the interior of the vibration motor module 510 may be alleviated, degradation of a performance of the vibration motor module 510 may be prevented.
According to various embodiments, a second circuit board 570 for transmitting a driving signal to the vibration motor module 510 may be accommodated in at least any one of the motor ventilation hole 700. The motor ventilation hole 700, as illustrated in
According to various embodiments, the second circuit board 570 may include a plurality of signal terminals 571 and 572. For example, the second circuit board 570 may include the first signal terminal 571, to which a positive polarity driving signal is supplied, and the second signal terminal 572, to which a negative polarity driving signal is supplied. The first signal terminal 571 and the second signal terminal 572 may be electrically connected to the first circuit board (e.g., the first circuit board 560 of
According to various embodiments, the second circuit board 570 may be disposed to pass via the first motor ventilation hole 710. A partial area of the second circuit board 570 may be inserted into the interior of the motor housing 500. The remaining area of the second circuit board 570 may be disposed outside the motor housing 500. In this regard, a length of the first motor ventilation hole 710 may be larger than a width of the second circuit board 570 accommodated in the first motor ventilation hole 710, and a width of the first motor ventilation hole 710 may be larger than a thickness of the second circuit board 570.
According to various embodiments, the vibration motor module 510 may include a motor impact absorbing member 740 disposed on the opposite surface (e.g., the −Z axis direction) of the motor housing 500. The motor impact absorbing member 740 may be disposed between the second enclosure (e.g., the second enclosure 420 of
Referring to
In this way, the inner space 901 of the vibration motor module 510 connected to the outer space 902 of the vibration motor module 510 through the at least one motor ventilation hole 700 may be used as the resonance space. Accordingly, because the plurality of resonance spaces 901 and 902 are formed in the enclosure 401 of the limited volume, the total volume of the resonance space may be substantially enlarged. Thus, the performance of the speaker module may be improved.
According to various embodiments, a protection structure 921 may be disposed around the at least one motor ventilation hole 700. The protection structure 921 may overlap the at least one motor ventilation hole 700. The protection structure 921 may be spaced apart from the side surface 514, on which the motor ventilation hole 700 is formed, while a gap that is smaller than a size of the sound absorbing member (e.g., the sound absorbing member 540 of
According to various embodiments, an adhesive member 910 may be disposed between the first enclosure 410 and the first surface 501 of the motor housing 500. The adhesive member 910 may be an adhesive tape, poron, or a bonding adhesive.
Referring to
The protection structure 1021 may be formed to face the second motor ventilation hole 720 around the second motor ventilation hole 720. The protection structure 1021 may be disposed to fully overlap the second motor ventilation hole 720. The protection structure 1021 may be disposed to be spaced apart from the side surface of the motor housing 500 including the second motor ventilation hole 720. The protection structure 1021 may be a part of the seating structure 411, and may be formed as one structure with the seating structure 411 or may be formed to be separated and spaced apart from the seating structure 411.
The seating structure 411 may be formed to overlap at least a portion of the side surface of the motor housing 500, except for the second motor ventilation hole 720. The seating structure 411 and the protection structure 1021 may be formed parallel to the side surface 514 of the motor housing 500 while being spaced apart from the side surface 514 of the motor housing 500. The protection structure 1021 may have a height that is the same as or different from that of the seating structure 411. A gap “g” between the protection structure 1021 and the side surface 514 of the motor housing 500 may be the same as or different from a gap “g” between the seating structure 411 and the side surface 514 of the motor housing 500. As an example, the protection structure 1021 may be disposed to be closer to or farther from the side surface of the motor housing 500 than the seating structure 411.
The protection structure 1021 may be disposed to be spaced apart from the side surface 514 of the motor housing 500 having the motor ventilation hole 700, while the gap “g” that is smaller than the size of the sound absorbing member (e.g., the sound absorbing member 540 of
According to various embodiments, as illustrated in
Referring to
For example, one protection structure 1121, as illustrated in
For example, a plurality of protection structure 1121, as illustrated in
As another example, the protection structure 1121, as illustrated in
In the electronic device having the protection structure 1121 illustrated in
Referring to
The protection structure 1221 may be disposed to be spaced apart from the side surface 514 of the motor housing 500, in which the second motor ventilation hole 720 is formed, while the specific gap “g” is interposed therebetween. The protection structure 1221 may be disposed to be spaced apart from the side surface 514 of the motor housing 500, in which the second motor ventilation hole 720 is formed, while the specific gap “g” that is smaller than the size of the sound absorbing member being interposed therebetween. For example, the protection structure 1221 may be spaced apart from the side surface 514 of the motor housing 500, in which the second motor ventilation hole 720 is formed, while the specific gap “g” of 0.01 mm to 0.3 mm being interposed therebetween.
The protection structure 1221 may be disposed to contact or be spaced apart from the seating structure 411 by a spacing distance that is smaller than the size of the sound absorbing member. For example, the protection structure 1221 may be spaced apart from the seating structure 411 by a spacing distance of 0.01 mm to 0.3 mm.
Due to the protection structure 1221, the sound absorbing member cannot pass between the side surface 514 of the motor housing 500 and the protection structure 1221. Furthermore, the sound absorbing member cannot pass between the protection structure 1221 and the seating structure 411. Due to the protection structure 1221, the sound absorbing member cannot pass through the second motor ventilation hole 720. Even when the sound absorbing member is broken, the broken sound absorbing member cannot pass through the second motor ventilation hole 720. Accordingly, a defect caused as the second motor ventilation hole 720 is blocked by the sound absorbing member may be prevented, and the sound absorbing member may be prevented from being introduced into the interior of the motor housing 500 through the second motor ventilation hole 720.
Referring to
The seating structure 411 may be formed to overlap at least a portion of the side surface 514 of the motor housing 500, except for the second motor ventilation hole 720. The seating structure 411 may be formed to extend from at least any one of the first enclosure 410 and the second enclosure 420 substantially perpendicularly. The seating structure 411 may be formed parallel to the side surface 514 of the motor housing 500 while being spaced apart from the side surface 514 of the motor housing 500.
The protection structures 1321, 1421, and 1521 may have a height that is the same as or different from that of the seating structure 411. The gaps “g” of the protection structures 1321, 1421, and 1521 and the seating structure 411 from the side surface 514 of the motor housing 500 having the second motor ventilation hole 720 may be the same or different.
The protection structures 1321, 1421, and 1521 may be formed of a sponge material, a 2-dimensional or 3-dimensional mesh material, a rubber material, a stainless steel material, a plastic material, or a material, in which at least two thereof are mixed. The protection structures 1321, 1421, and 1521 may be formed through a dispensing scheme, for example, by using bonding or expandable sponge.
The protection structures 1321, 1421, and 1521 may be formed in various forms. As an example, the protection structure 1321 illustrated in
As another example, the protection structure 1421 illustrated in
As another example, the protection structure 1521 illustrated in
Referring to
A protection structure 1621 may be disposed on the first circuit board 560 and the second circuit board 570. The protection structure 1621 may be formed in the first motor ventilation hole 710 to face a residual space of the first motor ventilation hole 710, which is left after the second circuit board 570 is accommodated. The protection structure 1621 may be formed of a sponge material, a 2-dimensional or 3-dimensional mesh material, a rubber material, a stainless steel material, a plastic material, or a material, in which at least two thereof are mixed. The protection structure 1621 may be formed through a dispensing scheme, for example, by using bonding or expandable sponge.
The gap “g” between the protection structure 1621 and the side surface 514 of the motor housing 500 having the first motor ventilation hole 710 may be smaller than the size of the sound absorbing member (e.g., the sound absorbing member 540 of
As an example, the protection structure 1621, as illustrated in
As another example, the protection structure 1621, as illustrated in
Referring to
The gap “g” between the protection structure 1721 and the side surface 514 of the motor housing 500 having the first motor ventilation hole 710 may be smaller than the size of the sound absorbing member (e.g., the sound absorbing member 540 of
Referring to
The first protection structure 1801 may be formed as a partial area of the first circuit board 560, which is adjacent to the first motor ventilation hole 710, extends to face the first motor ventilation hole (e.g., the first motor ventilation hole 710 of
The second protection structure 1802 may be disposed on the first protection structure 1801. The second protection structure 1802 may be formed to face a residual space of the first motor ventilation hole, which does not face the second circuit board 570 and the first protection structure 1801 to be left. The second protection structure 1802 may be formed of a material that is the same as or different from that of the first protection structure 1801. For example, the second protection structure 1802 may be formed of a sponge material, a 2-dimensional or 3-dimensional mesh material, a rubber material, a stainless steel material, a plastic material, or a material, in which at least two thereof are mixed. The second protection structure 1802 may be formed through a dispensing scheme, for example, by using bonding or expandable sponge.
The spacing distance between the protection structure 1821 and the side surface of the motor housing having the first motor ventilation hole 710 may be smaller than the size of the sound absorbing member (e.g., the sound absorbing member 540 of
Referring to
A plurality of adhesive members 1950 may be provided, and the adjacent adhesive members 1950 may be disposed to be spaced apart from each other. The spacing spaces between the adhesive members 1950 may be used as a pipeline that connect the auxiliary motor ventilation hole 1900, the first resonance space that is the outer space (e.g., the outer space 902 of
A thickness of the adhesive member 1950 corresponding to the gap between the first enclosure 410 and the first surface 501 of the vibration motor module 510 may be smaller than the size of the sound absorbing member (e.g., the sound absorbing member 540 of
Referring to
According to various embodiments of the disclosure, although the enclosure 401, in which the speaker module (e.g., the speaker module 520 of
According to various embodiments of the disclosure, although the protection structure (e.g., the protection structure 1121 of
In the disclosure, if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
In the disclosure, the expression “configured to” may be interchangeably used with, for example, “suitable for”, “capable of”, “modified to”, “made to”, “able to”, or “designed to” according to a situation in a hardware or software way. In some situations, the expression “a device configured to” may mean that the device is “capable of” operating together with another device or other components. For example, a “processor configured to (or set to) perform A, B, and C” may mean a dedicated processor (e.g., an embedded processor) for performing a corresponding operation or a generic-purpose processor (e.g., a central processing unit (CPU) or an application processor) which may perform corresponding operations by executing one or more programs which are stored in a memory device.
The term “module” used in the disclosure may indicate a unit configured in a hardware, software, or firmware way, and for example, may be used interchangeably with the terms such as logic, a logic block, a component, or a circuit. The “module” may be an integral component, or a minimum unit or a part which performs one or more functions. The “module” may be implemented mechanically or electronically, and for example, may include an application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGSs), or a programmable logic device that is known or to be developed in the future, which performs some operations.
At least some of the devices (e.g., modules or functions) or methods (e.g., operations) according to various embodiments of the disclosure may be implemented by an instruction stored in a computer-readable storage medium (e.g., the memory), for example, in the form of a program module. When the instruction is executed by a processor, the processor may perform a function corresponding to the instruction. The computer-readable recording medium may be non-transitory, and may include a hard disk, a floppy disk, a magnetic medium (e.g., a magnetic tape), an optical recording medium (e.g., a CD-ROM or a DVD), an magneto-optical medium (e.g., a floptical disk), and an embedded memory. The instruction may include a code made by a compiler or a code that may be executed by an interpreter.
According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
While aspects of embodiments have been particularly shown and described, it will be understood that various changes in form and details may be made therein without departing from the spirit and scope of the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2021-0151106 | Nov 2021 | KR | national |
This application is a bypass continuation application of International Application No. PCT/KR2022/016450, filed on Oct. 26, 2022, which is based on and claims priority to Korean Patent Application No. 10-2021-0151106, filed on Nov. 5, 2021, in the Korean Intellectual Property Office, the disclosures of which are incorporated by reference herein in their entireties.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/KR2022/016450 | Oct 2022 | US |
| Child | 17980940 | US |
