1. Field of the Invention
This invention relates to an electronic device, more particularly to an electronic device with a grounding mechanism for fast removal of electromagnetic interference and electrostatic charges.
2. Description of the Related Art
Therefore, the object of the present invention is to provide an electronic device that can overcome the aforesaid drawback of the prior art.
According to this invention, there is provided an electronic device that comprises: a conductive housing having an upright end wall formed with an opening; a mother board mounted in the conductive housing and having an end that is disposed adjacent to the upright end wall of the conductive housing, and a grounding trace that has a first end portion disposed adjacent to the end of the mother board, and a second end portion distal from the end of the mother board; a connector mounted on the mother board adjacent to the end of the mother board, extending through the opening in the upright end wall of the conductive housing, and having a grounding pin in electrical contact with the first end portion of the grounding trace; and a ground-bridging mechanism disposed adjacent to the first end portion of the grounding trace and bridging electrically the conductive housing and the first end portion of the grounding trace.
Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments of this invention, with reference to the accompanying drawings, in which:
Before the present invention is described in greater detail with reference to the accompanying preferred embodiments, it should be noted herein that like elements are denoted by the same reference numerals throughout the disclosure.
In this embodiment, the upright end wall 42 of the conductive housing 40 has a lower end 422. The conductive housing 40 further has a board-mounting wall 41 transverse and connected to the lower end 422 of the upright end wall 42. The mother board 20 is mounted on the board-mounting wall 41. The grounding trace 27 is formed on a bottom surface of the mother board 20. The ground-bridging mechanism 60 has a first spring arm 61 that abuts resiliently against the board-mounting wall 41, and a trace-connecting plate 62 that is bent from the first spring arm 61 and that is soldered to the first end portion 271 of the grounding trace 27. A metal shield 50 is mounted on the upright end wall 42 of the conductive housing 40, and is formed with a through-hole 511 that is registered with the opening 421 in the upright end wall 42 for extension of the connector 30 therethrough.
In this embodiment, the ground-bridging mechanism 60 further has a second spring arm 63 that abuts resiliently against the lower end 51 of the metal shield 50, a fixed plate 64 bent from the second spring arm 63, and two opposite wings 65 extending respectively from two opposite sides of the fixed plate 64 through the mother board 20. At least one of the wings 65 contacts electrically the first end portion 271 of the grounding trace 27 through a solder. The grounding path 200 of this embodiment travels from the connector 30 through the first end portion 271 of the grounding trace 27, one of the wings 65, the fixed plate 64, the lower end 51 of the metal shield 50 and the first spring arm 61 to the board-mounting wall 41 of the conductive housing 40.
In this embodiment, the end 26 of the mother board 20 has an end face 261 facing the upright end wall 42 of the conductive housing 40. The first end portion 271 of the conductive trace 27 extends to and covers the end face 261 of the end 26 of the mother board 20. The grounding path 200 of this embodiment travels from the connector 30 through the first end portion 271 of the grounding trace 27, the second spring arm 63, the lower end 51 of the metal shield 50, and the first spring arm 61 to the board-mounting wall 41 of the conductive housing 40.
Since the grounding path 200 travels from the connector 30 through the first end portion 271 of the grounding trace 27 to a nearby portion of the conductive housing 40, and does not travel to the second end portion 272 of the grounding trace 27, the length thereof is much shorter than that of the grounding path 100 of the aforesaid conventional electronic device, thereby improving removal of electromagnetic interference and electrostatic charges on the connector 30.
While the present invention has been described in connection with what are considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation and equivalent arrangements.
Number | Name | Date | Kind |
---|---|---|---|
4500157 | Huffnagle et al. | Feb 1985 | A |
4755147 | Young | Jul 1988 | A |
4826442 | Douty et al. | May 1989 | A |