1. Technical Field
The disclosure relates to electronic devices and, particularly, to an electronic device comprising an air duct for guiding airflow.
2. Description of Related Art
In a server system with multiple central processing units (CPUs), the CPUs may be placed in an airflow channel, so that the CPUs in a rear portion of the server system are easily preheated by heat from the CPUs in a front portion of the server system. However, the CPUs of the sever system may be blocked by additional components of the server system, such as memories, which results in inefficient heat-dissipation of the CPUs in the rear portion.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one”.
Referring to
Each of the front and back ends of the top board 112 defines an arc-shaped cutout 1120, thereby making a middle portion of the top board 112 between the cutouts 1120 easy to be grasped. Each side board 114 defines an opening 1140 communicating with the air intake 116. The top board 112 defines two slots 1442, each of which communicates with a corresponding opening 1140. Front and rear sidewalls bounding each slot 1142 define pivot holes 1144 in alignment with each other. The slots 1442 are defined at a side of the openings 1140 away from the air intake 116.
Each air baffle 120 comprises a substantially rectangular sheet 1200 and two pivots 1220. The two pivots 1220 extend substantially perpendicularly from respective opposite surfaces of a top corner portion of the sheet 1200.
In assembly, the pivots 1220 are pivotably received in the corresponding pivot holes 1144, so that the air baffles 120 are pivotably mounted to the sides of the main body 110. The air duct 100 is placed on the motherboard 200 between the first and second heat sinks 30 and 30a, such that the air intake 116 faces the first heat sink 30, and the air outlet 118 faces the second heat sink 30a. The air baffles 120 are located adjacent to ends of the memories 50 adjacent to the second heat sink 30a.
The air baffles 120 of the air duct 100 can guide airflow flowing through the memories 50 to enter the airflow channel 113 through the openings 1140, thereby dissipating heat for the second heat sink 30a. In addition, the air baffles 120 can be pivoted up to facilitate removing or mounting of the memories 50 easily.
It is to be understood, however, that even though numerous characteristics and advantages of certain embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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2013101695200 | May 2013 | CN | national |