Electronic Device with Antenna Connections Between Curved Conductors

FIELD

This relates generally to electronic devices, including electronic devices with wireless communications capabilities.

BACKGROUND

Electronic devices often have displays that are used to display images to users. Such devices can include head-mounted displays and can have wireless circuitry with antennas. It can be challenging to incorporate antennas that exhibit satisfactory levels of wireless performance into head-mounted displays.

SUMMARY

A head-mounted device may have a housing. The housing may have an inner conductive chassis mounted to an outer conductive chassis. A logic board may be mounted to the inner conductive chassis. Left and right displays may be mounted to the logic board and may display images at a rear of the device. A cover may be mounted to the outer conductive chassis at the front of the device. The cover may have a compound or three-dimensional curvature. A front-facing display may be mounted to the cover and may display images through the cover. The cover may have a peripheral region laterally surrounding the front-facing display.

The device may have wireless circuitry with an antenna. The antenna may have a first conductor layered onto the cover overlapping the peripheral region. The first conductor may have the compound or three-dimensional curvature. The antenna may have a second conductor that is electrically coupled to the first conductor by a pressure-activated connector. The first conductor may form part of an antenna resonating element for the antenna whereas the second conductor forms part of an antenna ground for the antenna, as one example.

The pressure activated connector may be activated upon mounting the cover to the outer conductive chassis. The pressure-activated connector may include a metal finger, a metal spring, a metal ball, a curling metal receptacle, a dimple, a metal screw, a screw receptacle, metal burs, and/or rotational locking structures. The pressure-activated connector may form a robust and/or locked connection between the first and second conductors despite the curvature of the first conductor, which minimizes electrical discontinuities that can otherwise deteriorate antenna performance over the operating life of the device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of components in an illustrative electronic device in accordance with some embodiments.

FIG. 2 is a cross-sectional top view of an illustrative electronic device in accordance with some embodiments.

FIG. 3 is a schematic diagram of illustrative wireless circuitry having an antenna in accordance with some embodiments.

FIG. 4 is a circuit diagram of illustrative wireless circuitry having transceivers that convey radio-frequency signals using antennas in accordance with some embodiments.

FIG. 5 is a front view of an illustrative electronic device having antennas disposed around the periphery of a cover glass assembly in accordance with some embodiments.

FIG. 6 is a side view of an illustrative electronic device having antennas disposed around the periphery of a cover glass assembly in accordance with some embodiments.

FIG. 7 is an exploded view showing how an antenna may be integrated into a cover glass assembly and provided with a pressure-activated antenna connection between curved conductors in accordance with some embodiments.

FIG. 8 is a diagram of an illustrative pressure-activated antenna connection formed from a compressed rigid metal finger in accordance with some embodiments.

FIG. 9 is a diagram of an illustrative pressure-activated antenna connection formed from a compressed metal spring in accordance with some embodiments.

FIG. 10 is a diagram of an illustrative pressure-activated antenna connection formed from a metal bump compressed onto a curling metal receptacle in accordance with some embodiments.

FIG. 11 is a diagram of an illustrative pressure-activated antenna connection formed from a metal bump compressed into a dimple in accordance with some embodiments.

FIG. 12 is a diagram of an illustrative pressure-activated antenna connection formed from a metal screw in accordance with some embodiments.

FIG. 13 is a diagram of an illustrative pressure-activated antenna connection formed from metal spurs in accordance with some embodiments.

FIG. 14 is a diagram of an illustrative pressure-activated antenna connection formed from rotational locking structures in accordance with some embodiments.

DETAILED DESCRIPTION

Electronic devices may be provided with components such as antennas. The electronic devices may include portable electronic devices, wearable devices, desktop devices, embedded systems, and other electronic equipment. Illustrative configurations in which the electronic devices include a head-mounted device may sometimes be described herein as an example. The head-mounted device may have first and second rear-facing displays and a front-facing display. The device may have a housing with a cover at a front side of the device. The cover may have a central region overlapping the front-facing display and a peripheral region surrounding the central region. The cover may have a compound three-dimensional curvature. The device may include an outer conductive chassis and an inner conductive chassis. A main logic board may be mounted to the inner conductive chassis. The first and second rear-facing displays may be mounted to the logic board.

The device may include wireless circuitry with an antenna that radiates through the cover. The antenna may have an antenna resonating element layered onto the cover. The antenna may have an antenna ground. A pressure-activated connector may electrically couple the antenna resonating element to the antenna ground. If desired, the pressure-activated connector may lock the antenna resonating element to the antenna ground. The pressure-activated connector may include a metal finger, a metal spring, a metal ball, a curling metal receptacle, a dimple, a metal screw, a screw receptacle, metal burs, and/or rotational locking structures. The pressure-activated connector may form a robust mechanical connection between the first and second conductors despite the curvature of the antenna resonating element, which minimizes electrical discontinuities that can otherwise deteriorate antenna performance over the operating life of the device.

FIG. 1 shows an illustrative electronic device 10. Device 10 may be operated in a system that includes external equipment 22 other than device 10. In some implementations that are described herein as an example, device 10 may include a head-mounted device (sometimes referred to herein as a head-mounted display device or simply a head-mounted display). If desired, device 10 may include a portable electronic device such as a laptop computer, a tablet computer, a media player, a cellular telephone, or a wearable electronic device such as a wristwatch, a pendant or bracelet, headphones, an earpiece, a headset, or other small portable device. Device 10 may also be larger device such as a desktop computer, display with or without an integrated computer, a set-top box, or a wireless access point or base station. If desired, device 10 may be integrated into a larger device or system such as a piece of furniture, a kiosk, a building, or a vehicle.

As shown in FIG. 1, device 10 may include a housing formed from one or more housing structures 12 (sometimes referred to herein as housing members 12). In implementations where device 10 is a head-mounted device, housing structures 12 may include support structures that are mountable or wearable on a user's head (sometimes referred to herein as head-mounted support structures), thereby allowing a user to wear device 10 while using or operating device 10.

The head-mounted support structures in housing structures 12 may have the shape of glasses or goggles and may support one or more lenses that align with one or more of the user's eyes while the user is wearing device 10. The head-mounted support structures in housing structures 12 may include one or more rigid frames that help to provide mechanical integrity, rigidity, and/or strength to device 10 during use. In some implementations that are described herein as an example, the one or more rigid frames are formed from conductive material. The rigid frame(s) may therefore sometimes be referred to herein as conductive frame(s).

If desired, housing structures 12 may include other housing structures or housing members disposed on (e.g., layered on or over, affixed to, etc.) and/or overlapping some or all of the conductive frame(s) (e.g., dielectric structures, rubber structures, ceramic structures, glass structures, fiber composite structures, foam structures, sapphire structures, plastic structures, cosmetic structures, etc.). These other housing structures may, for example, support one or more components in device 10, may help to protect the components of device 10 from damage or contaminants, may help to allow device 10 to be worn comfortably on the user's head, may help to hide portions of the conductive frame from view, may contribute to the cosmetic or aesthetic appearance of device 10, etc.

Device 10 may include input/output (I/O) components such as I/O components 14. I/O components 14 may allow device 10 to provide output and/or other information to the user of device 10 or other entities and/or may allow device 10 to receive user input and/or other information from the user and/or other entities. I/O components 14 may include one or more displays such as displays 18. Displays 18 may emit light (sometimes referred to herein as image light) that is provided to the user's eyes for viewing. The light may contain images. The images may contain image pixels. Many images may be provided over time in a sequence (e.g., as a video). The displays 18 in device 10 may include, for example, left and right displays. The left display may provide light to a user's left eye whereas the right display may provide light to the suer's right eye while the user wears device 10 on their head.

I/O components 14 may also include wireless circuitry such as wireless circuitry 16 (sometimes referred to herein as wireless communication circuitry 16). Wireless circuitry 16 may transmit radio-frequency signals 24 to external equipment 22 and/or may receive radio-frequency signals 24 from external equipment 22. External equipment 22 may include another device such as device 10 (e.g., another head-mounted device, a desktop computer, a laptop computer, a cellular telephone, a tablet computer, a tethered computer, etc.), a peripheral device or accessory device (e.g., a user input device, a stylus, a device that identifies user inputs associated with gestures or motions made by a user, a gaming controller, headphones, etc.), remote computing equipment such as a remote server or cloud computing segment, a wireless base station, a wireless access point, and/or any other desired equipment with wireless communications capabilities. In implementations that are described herein as an example, external equipment 22 includes at least first and second peripheral devices such as left and right headphone speakers or earbuds. The earbuds may be worn by a user to provide audio content to the user's ears while the user is wearing device 10 on their head. Wireless circuitry 16 may transmit the audio content to the earbuds using radio-frequency signals 24.

I/O components 14 may also include other components (not shown) such as sensors, haptic output devices (e.g., one or more vibrators), non-display light sources such as light-emitting diodes, audio devices such as speakers for producing audio output, wireless charging circuitry for receiving wireless power for charging a battery on device 10 and/or for transmitting wireless power for charging a battery on other devices, batteries and/or other energy storage devices, buttons, mechanical adjustment components (e.g., components for adjusting one or more housing structures 12 to allow device 10 to be worn comfortably on a user's head and/or on other user's heads, which may have different geometries), and/or other components.

Sensors in I/O components 14 may include image sensors (e.g., one or more visible and/or infrared light cameras, binocular three-dimensional image sensors that gather three-dimensional images using two or more cameras in a binocular configuration, sensors that emit beams of light and that use two-dimensional image sensors to gather image data for three-dimensional images from light spots that are produced when a target is illuminated by the beams, light detection and ranging (lidar) sensors, etc.), acoustic sensors such as microphones or ultrasonic sensors, gaze tracking sensors (e.g., an optical system that emits one or more beams of infrared light that are tracked using the image sensor after reflecting from a user's eyes while wearing device 10), touch sensors, force sensors (e.g., capacitive force sensors, strain gauges, resistive force sensors, etc.), proximity sensors (e.g., capacitive proximity sensors and/or optical proximity sensors), ambient light sensors, contact sensors, pressure sensors, moisture sensors, gas sensors, magnetic sensors, motion sensors for sensing motion, position, and/or orientation (e.g., gyroscopes, accelerometers, compasses, and/or inertial measurement units (IMUs) that include two or more of these), and/or any other desired sensors.

Device 10 may also include one or more controllers 20 (sometimes referred to herein as control circuitry 20). Controller(s) 20 may include processing circuitry and storage circuitry. The processing circuitry may be used to control the operation of device 10 and may include one or more processors such as microprocessors, digital signal processors, microcontrollers, host processors, application specific integrated circuits, baseband processors, graphics processing units, central processing units (CPUs), etc. The storage circuitry in controller(s) 20 may include one or more hard disks or hard drives storage, nonvolatile memory (e.g., electrically-programmable-read-only memory configured to form a solid-state drive), volatile memory (e.g., static or dynamic random-access-memory), etc. If desired, controller(s) 20 may be configured to perform operations in device 10 using hardware (e.g., dedicated hardware or circuitry), firmware, and/or software. Software code for performing operations in device 10 may be stored on storage and may be executed by processing circuitry in controller(s) 20.

Controller(s) 20 run software on device 10 such as one or more software applications, internet browsers, gaming programs, voice-over-internet-protocol (VOIP) telephone call applications, social media applications, driving or navigation applications, email applications, media playback applications, operating system functions, etc. To support interactions with external equipment 22, controller(s) 20 may implement one or more communications protocols associated with (wireless) radio-frequency signals 24. The communications protocols may include internet protocols, wireless local area network protocols (e.g., IEEE 802.11 protocols-sometimes referred to as Wi-Fi®), protocols for other short-range wireless communications links such as the Bluetooth® protocol or other wireless personal area network (WPAN) protocols, IEEE 802.11ad protocols, cellular telephone protocols, multiple-input and multiple-output (MIMO) protocols, antenna diversity protocols, satellite navigation system protocols, IEEE 802.15.4 ultra-wideband communications protocols or other ultra-wideband communications protocols, non-Bluetooth protocols for ultra-low-latency audio streaming, etc. Each communications protocol may be associated with a corresponding radio access technology (RAT) that specifies the physical connection methodology used in implementing the protocol.

During operation, wireless circuitry 16 may be used to support communication between device 10 and external equipment 22 (e.g., using radio-frequency signals 24). For example, device 10 and/or external device 22 may transmit video data, application data, audio data, user input commands, and/or other data to each other (e.g., in one or both directions). If desired, device 10 and/or external equipment 22 may use wired and/or wireless communications circuitry to communicate through one or more communications networks (e.g., the internet, local area networks, etc.). If desired, device 10 may communicate with other end hosts over the internet via radio-frequency signals 24 and external equipment 22. Wireless circuitry 16 may allow data to be received by device 10 from external equipment 22 and/or to provide data to external equipment 22.

While controller(s) 20 are shown separately from wireless circuitry 16 for the sake of clarity, wireless circuitry 16 may include processing circuitry and/or storage circuitry that forms part of controller(s) 20 (e.g., portions of controller(s) 20 may be implemented on wireless circuitry 16). As an example, controller(s) 20 may include baseband circuitry (e.g., one or more baseband processors), digital control circuitry, analog control circuitry, and/or other control circuitry that forms part of wireless circuitry 16. The baseband circuitry may, for example, access a communication protocol stack on controller(s) 20 to: perform user plane functions at a PHY layer, MAC layer, RLC layer, PDCP layer, SDAP layer, and/or PDU layer, and/or to perform control plane functions at the PHY layer, MAC layer, RLC layer, PDCP layer, RRC, layer, and/or non-access stratum layer.

FIG. 2 is a top view of device 10. In the example of FIG. 2, device 10 is a head-mounted device. In general, device 10 may be any suitable electronic equipment. As shown in FIG. 2, device 10 may include housing structures 12. Housing structures 12 may be configured to be worn on a user's head. Housing structures 12 may have curved head-shaped surfaces, a nose-bridge portion that is configured to rest on a user's nose when device 10 is on a user's head, may have a headband such as strap 12C for supporting device 10 on the user's head, and/or may have other features that allow device 10 to be worn by a user.

Housing structures 12 may include one or more frame members such as outer chassis 12A and inner chassis 12B. Outer chassis 12A may be an outer frame surrounding the interior of device 10 and may, if desired, form exterior surfaces of device 10 (e.g., portions of outer chassis 12A may form one or more housing walls of device 10 such as housing walls that run around a periphery of device 10). Inner chassis 12B may be disposed within the interior of device 10 and may be mounted to outer chassis 12A (e.g., outer chassis 12A may surround the lateral periphery of inner chassis 12B in the X-Z plane). Strap 12C may be attached to outer chassis 12A at right side 36 of device 10 and left side 34 of device 10 (e.g., using attachment structures such as a joint, a hinge, screws, fasteners, snaps, magnets, etc.). Strap 12C may be permanently attached to outer chassis 12A or may be removable. Right side 36 may sometimes be referred to herein as right edge 36, right face 36, or right wall 36 of device 10. Left side 34 may extend opposite right side 36 and may sometimes be referred to herein as left edge 34, left face 34, or left wall 34 of device 10. Right side 36 and left side 34 may extend from front side 30 to rear side 32 of device 10.

Outer chassis 12A may be formed from conductive material such as aluminum, stainless steel, or titanium. Outer chassis 12A may therefore sometimes be referred to herein as conductive chassis 12A, conductive outer chassis 12A, outer conductive chassis 12A, conductive outer frame 12A, conductive frame 12A, conductive housing 12A, conductive outer housing 12A, or outer housing 12A. If desired, inner chassis 12B may be formed from a different conductive material than outer chassis 12A (e.g., to meet mounting requirements for the inner chassis, to meet protective requirements for the outer chassis, to meet requirements on mechanical strength and integrity, and minimize device weight). Inner chassis 12B may, for example, be formed from conductive material such as magnesium, aluminum, stainless steel, or titanium. Inner chassis 12B may therefore sometimes be referred to herein as conductive chassis 12B, conductive inner chassis 12B, inner conductive chassis 12B, conductive inner frame 12B, conductive frame 12B, conductive housing 12B, conductive inner housing 12B, inner housing 12B, or conductive support plate 12B.

Outer chassis 12A and inner chassis 12B may provide mechanical support and rigidity for device 10. In addition, one or more components within the interior of device 10 may be mounted or affixed to outer chassis 12A and/or inner chassis 12B. For example, a substrate such as logic board 38 may be mounted to inner chassis 12B. Logic board 38 may, for example, form a main logic board (MLB) for device 10. Other components in device 10 (e.g., portions of I/O components 14 and/or controller(s) 20 of FIG. 1) may be mounted to and/or formed within logic board 38. For example, one or more rear/user facing such as displays 18B may be mounted to logic board 38. Displays 18B may face rear side 32 of device 10. Rear side 32 may sometimes also be referred to herein as rear edge 32, rear wall 32, or rear face 32.

When device 10 is worn on a user's head, the user's head 33 faces rear side 32 of device 10 and the user's eyes are aligned with displays 18B, as shown by arrows 40. Displays 18B may include a left display that aligns with the user's left eye and a right display that aligns with the user's right eye (e.g., the user's left and right eyes may be located within left and right eye boxes of displays 18B). The left and right displays may include respective pixel arrays (or a single shared pixel array) and optics (e.g., one or more lenses) for directing images from the pixel arrays to the user's eyes (e.g., as binocularly fusible content).

The housing structures 12 of device 10 may also include housing structures at the front side 30 of device 10 opposite rear side 32. Front side 30 may sometimes also be referred to herein as front edge 30, front wall 30, or front face 30 of device 10. Housing structures 12 may include a cover glass assembly (CGA) 28 mounted to outer chassis 12A at front side 30 of device 10. CGA 28 may sometimes also be referred to herein as cover 28, front cover 28, or dielectric cover 28 of device 10. CGA 28 may be fully or partially transparent.

CGA 28 may include multiple layers (sometimes referred to herein as cover layers). For example, CGA 28 may include an outer cover layer for device 10 such as a glass cover layer (sometimes referred to herein as a display cover layer or a cover glass). The glass cover layer may form the exterior surface of device 10 at front side 30. CGA 28 may also include one or more dielectric layers behind and overlapping the glass cover layer (e.g., at an interior side of the glass cover layer). The dielectric layer(s) may include one or more polymer layers, plastic layers, glass layers, ceramic layers, and/or other dielectric layers. If desired, some or all of the dielectric layer(s) may be formed in a ring shape that runs along the periphery of CGA 28 in the X-Z plane and the glass cover layer (e.g., at peripheral edge portions 42 of CGA 28) or may overlap substantially all of the glass cover layer. The dielectric layer(s) behind the glass cover layer may sometimes also be referred to as a cover layer, dielectric member, dielectric cover layer, shroud, trim, and/or canopy. Peripheral edge portions 42 may sometimes also be referred to herein as peripheral region 42 or edge region 42.

CGA 28 may also include a forward-facing display such as display 18A (e.g., a flexible display panel formed from a pixel array based on organic light-emitting diodes or other display panel). CGA 28 may have a central portion or region 44 that overlaps display 18A. Peripheral edge portions 42 of CGA 28 may extend around the lateral periphery of CGA 28 and central region 44. Display 18A may emit light (e.g., images) through central region 44 of the dielectric layer(s) and the glass cover layer of CGA 28 (as shown by arrow 46) for view by persons other than the wearer of device 10. The central region 44 of the glass cover layer and the dielectric layer(s) of CGA 28 that overlap display 18A may be fully transparent or partly transparent to help hide display 18A from view when the display is not emitting light. The peripheral edge regions 42 of the glass cover layer and the dielectric layer(s) of CGA 28 may be opaque or transparent. Display 18A may sometimes be referred to herein as a front-facing display, a world-facing display, or a publicly viewable display.

Housing structures 12 may also include cosmetic covering members, polymer layers (e.g., fully or partly transparent polymer layers), and/or dielectric housing walls layered onto or over outer chassis 12A (e.g., at the exterior of device 10) if desired. Housing structures 12 may also include one or more fabric members, rubber members, ceramic members, dielectric members, curtain members, or other structures at rear side 32 of device 10 that help to accommodate the user's face while wearing device 10 and/or to block external, ambient, or scene light from the environment around the user from interfering with or washing out the light from displays 18B being viewed by the user.

Some or all of the lateral surface of CGA 28 may exhibit a curved cross-sectional profile. Within CGA 28, some or all of one or more lateral surfaces of the glass cover layer and/or some or all of one or more of the lateral surfaces of the dielectric layer(s) in CGA 28 may be characterized by a three-dimensional curvature (e.g., spherical curvature, aspherical curvature, freeform curvature, etc.). The three-dimensional curvature may be a compound curvature (e.g., the surfaces exhibiting the curvature may be non-developable surfaces).

In the areas of compound curvature, at least some portions of the curved surface(s) in CGA 28 may be characterized by a radius of curvature R of 4 mm to 250 mm, 8 mm to 200 mm, 10 mm to 150 mm, at least 5 mm, at least 12 mm, at least 16 mm, at least 20 mm, at least 30 mm, less than 200 mm, less than 100 mm, less than 75 mm, less than 55 mm, less than 35 mm, and/or other suitable amount of curvatures. The compound curvature may be, for example, a three-dimensional curvature in which the surface(s) have non-zero radii of curvature about two or more different axes (e.g., non-parallel axes, intersecting axes, non-intersecting axes, perpendicular axes such as the X-axis and Z-axis, etc.) and/or two or more different points within or behind device 10. If desired, one or more of the surfaces of the dielectric layer(s) in CGA 28 may be a developable surface. Display 18A may be a flexible display panel that is bent into a curved shape (e.g., a curved shape following the curved face of a user, a curved shape following the compound curvature of CGA 28, a curved shape characterized by inner and outer developable surfaces, etc.). The compound curvature may serve to provide device 10 with an attractive cosmetic appearance, may help device 10 to exhibit a compact and light weight form factor, may serve to maximize the mechanical strength of device 10, and/or may accommodate easy interaction with device 10 by the user, as examples.

During operation, device 10 may receive image data (e.g., image data for video, still images, etc.) and may present this information on displays 18B and/or 18A. Device 10 may also receive other data, control commands, user input, etc. Device 10 may also transmit data to accessories and other electronic equipment (e.g., external equipment 22 of FIG. 1). For example, image data from a forward-facing camera may be provided to an associated device, audio output may be provided to a device with speakers such as a headphone device, user input and sensor readings may be transmitted to remote equipment, etc.

Communications such as these may be supported using wired and/or wireless communications. In an illustrative configuration, wireless circuitry 16 (FIG. 1) may support wireless communications between device 10 and remote wireless equipment such as external equipment 22 of FIG. 1 (e.g., a cellular telephone, a wireless base station, a computer, headphones or other accessories, a remote control, peer devices, internet servers, and/or other equipment). Wireless communications may be supported using one or more antennas in device 10 and in the external equipment operating at one or more wireless communications frequencies. The antennas may be coupled to wireless transceiver circuitry. The wireless transceiver circuitry may include transmitter circuitry configured to transmit wireless communications signals using the antenna(s) and receiver circuitry configured to receive wireless communications signals using the antenna(s).

External equipment 22 of FIG. 1 may include at least a first accessory or peripheral device 22L and a second accessory or peripheral device 22R, as shown in the example of FIG. 2. Peripheral devices 22R and 22L may, for example, be control input devices (e.g., remote controls, gaming controllers, etc.) or audio output devices such as right and left speakers, right and left speakers of headphones worn by the user, etc. In implementations that are described herein as an example, peripheral device 22R is a right earbud and peripheral device 22L is a left earbud. Peripheral device 22R may therefore sometimes be referred to herein as right earbud 22R and peripheral device 22L may sometimes be referred to herein as left earbud 22L.

While operating device 10, the user wears device 10 on head 33. At the same time, the user wears left earbud 22L on and/or within their left ear (at the left side of head 33) and wears right earbud 22R on and/or within their right car (at the right side of head 33). Earbuds 22L and 22R may each include a speaker, a battery, one or more processors, and wireless circuitry having one or more antennas. Earbuds 22L and 22R may be wireless earbuds having batteries that are rechargeable when earbuds 22L and 22R are plugged into a power adapter, placed on or within a charging dock, or placed within a charging case, for example.

One or more antennas in device 10 may transmit audio data in radio-frequency signals 24A to earbuds 22R and 22L. Earbuds 22L and 22R may play the audio data over the speakers in earbuds 22L and 22R. The audio data may include a first stream of audio data (e.g., left audio data) for playback by left earbud 22L and a second, different, stream of audio data (e.g., right audio data) for playback by right earbud 22R (e.g., to provide the user with stereo, three-dimensional, spatial, and/or surround sound). One or more antennas in device 10 may also convey other wireless data in radio-frequency signals 24W.

Additionally or alternatively, one or both of earbuds 22L and 22R may include one or more sensors that generate sensor data. The sensors may include a microphone, a touch sensor, a force sensor, an orientation sensor (e.g., a gyroscope, inertial measurement unit, motion sensor, etc.), an ambient light sensor, a proximity sensor, a magnetic sensor, a temperature sensor, and/or other sensors. The microphone may generate microphone data (e.g., voice data from the user speaking while wearing the earbuds). The touch sensor may generate touch sensor data and the force sensor may generate force sensor data (e.g., indicative of a user input provided to device 10 via the earbuds, indicative of the earbuds being presently located in the cars of the user, etc.). The ambient light sensor may generate ambient light sensor data (e.g., indicative of the location of device 10 and/or lighting conditions around the user). In general, the sensors may generate any desired sensor data. Earbuds 22L and 22R may transmit the sensor data to one or more antennas in device 10 using radio-frequency signals 24A and/or using radio-frequency signals 24W.

FIG. 3 is a diagram of illustrative components in wireless circuitry 16 of device 10. As shown in FIG. 3, wireless circuitry 16 may include one or more transceivers (e.g., transceiver circuitry) such as transceiver (TX/RX) 66. Transceiver 66 may handle transmission and/or reception of radio-frequency signals 24 (e.g., radio-frequency signals 24A or 24W of FIG. 2) within corresponding frequency bands at radio frequencies (sometimes referred to herein as communications bands or simply as bands).

The frequency bands handled by transceiver 66 may include wireless personal area network (WPAN) frequency bands such as the 2.4 GHz Bluetooth® band or other WPAN communications bands, cellular telephone communications bands such as a cellular low band (600-960 MHZ), a cellular low-midband (1400-1550 MHZ), a cellular midband (1700-2200 MHz), a cellular high band (2300-2700 MHZ), a cellular ultra-high band (3300-5000 MHZ), or other cellular communications bands between about 600 MHz and about 5000 MHZ), 3G bands, 4G LTE bands, 3GPP 5G New Radio (NR) Frequency Range 1 (FR1) bands below 10 GHZ, 3GPP 5G NR Frequency Range 2 (FR2) bands between 20 and 60 GHz, other centimeter or millimeter wave frequency bands between 10-300 GHz, sub-THz or THz bands between around 100-1000 GHz (e.g., 6G bands), wireless local area network (WLAN) frequency bands (e.g., Wi-Fi® (IEEE 802.11) or other WLAN communications bands) such as a 2.4 GHZ WLAN band (e.g., from 2400 to 2480 MHZ), a 5 GHz WLAN band (e.g., from 5180 to 5825 MHZ), a Wi-Fi® 6E band (e.g., from 5925-7125 MHZ), and/or other Wi-Fi® bands (e.g., from 1875-5160 MHZ), near-field communications frequency bands (e.g., at 13.56 MHZ), satellite navigation frequency bands such as the Global Positioning System (GPS) bands, Global Navigation Satellite System (GLONASS) bands, and BeiDou Navigation Satellite System (BDS) bands, ultra-wideband (UWB) frequency bands that operate under the IEEE 802.15.4 protocol and/or other ultra-wideband communications protocols (e.g., a first UWB communications band at 6.5 GHz and/or a second UWB communications band at 8.0 GHZ), communications bands under the family of 3GPP wireless communications standards, communications bands under the IEEE 802.XX family of standards, satellite communications bands, unlicensed bands such as an unlicensed band at 2.4 GHz and/or an unlicensed band between 5-6 GHZ, emergency and/or public services bands, and/or any other desired frequency bands of interest. Transceiver 66 may also be used to perform spatial ranging operations if desired (e.g., using a radar sensing scheme).

As shown in FIG. 3, wireless circuitry 16 may also include one or more antennas 50. Transceiver 66 may convey (e.g., transmit and/or receive) radio-frequency signals 24 using one or more antennas 50. Each antenna 50 may include one or more antenna conductors formed from conductive material such as metal. The antenna conductors may include one or more antenna conductors that form antenna resonating element 52 (sometimes referred to as an antenna resonator, an antenna radiator, or an antenna radiating element) and one or more antenna conductors that form antenna ground 54 (sometimes referred to as a ground plane).

Antenna 50 may have an antenna feed coupled between antenna resonating element 52 and antenna ground 54. The antenna feed may have a first (positive or signal) antenna feed terminal 56 coupled to antenna resonating element 52. The antenna feed may also have a second (ground or negative) antenna feed terminal 58 coupled to antenna ground 54. Antenna resonating element 52 may be separated from antenna ground 54 by a dielectric (non-conductive) gap. Antenna resonating element 52 and antenna ground 54 may be formed from separate pieces of metal or other conductive materials or may, if desired, be formed from separate portions of the same integral piece of metal. If desired, antenna 50 may include additional antenna conductors that are not coupled to antenna feed terminals 56 and 58 (e.g., parasitic elements). For some types of antennas (e.g., in implementations where antenna 50 is a slot antenna), the antenna resonating element may be formed from a slot in a single antenna conductor that is coupled to both antenna feed terminals 56 and 58 (e.g., where antenna feed terminals 56 and 58 are coupled to opposing sides of the slot).

Each antenna feed and thus each antenna 50 in wireless circuitry 16 may be coupled to one or more transceivers 66 in wireless circuitry 16 over a corresponding radio-frequency transmission line 60. Radio-frequency transmission line 60 may include a signal conductor such as signal conductor 62 (e.g., a positive signal conductor) and a ground conductor such as ground conductor 64. Ground conductor 64 may be coupled to antenna feed terminal 58 of antenna 50. Signal conductor 62 may be coupled to antenna feed terminal 56 of antenna 50. Radio-frequency transmission line 60 may include one or more of a stripline, microstrip, coaxial cable, coaxial probes, edge-coupled microstrip, edge-coupled stripline, waveguide, radio-frequency connector, combinations of these, etc. Radio-frequency transmission line 60 may also sometimes be referred to herein as a radio-frequency transmission line path. If desired, filter circuitry, tuning components, switching circuitry, impedance matching circuitry, phase shifter circuitry, amplifier circuitry, and/or other circuitry may be disposed on radio-frequency transmission line 60 and/or may be coupled between two or more of the antenna conductors in antenna 50.

The term “convey radio-frequency signals” as used herein means the transmission and/or reception of the radio-frequency signals (e.g., for performing unidirectional and/or bidirectional wireless communications with external wireless communications equipment). During transmission of radio-frequency signals 24, transceiver 66 transmits radio-frequency signals 24 (e.g., as modulated using wireless data such as audio data, control data, etc.) over radio-frequency transmission line 60. The radio-frequency signals may excite antenna currents to flow around the edges of antenna resonating element 52 and antenna ground 54 (via antenna feed terminals 56 and 58). The antenna currents may radiate radio-frequency signals 24 into free space (e.g., based at least on a resonance established by the radiating length of antenna resonating element 52 and/or antenna ground 54).

During the reception of radio-frequency signals 24 (e.g., as modulated by external equipment using wireless data such as voice data, sensor data, image data, etc.), incident radio-frequency signals 24 may excite antenna currents to flow around the edges of antenna resonating element 52 and antenna ground 54. The antenna currents may pass radio-frequency signals 24 to transceiver 66 over radio-frequency transmission line 60. Transceiver 66 may downconvert the radio-frequency signals to baseband and may demodulate wireless data from the signals (e.g., using baseband circuitry such as one or more baseband processors).

Antennas 50 may be formed using any suitable antenna structures. For example, antennas 50 may include antennas with antenna resonating elements that are formed from patch antenna structures (e.g., shorted patch antenna structures), slot antenna structures, loop antenna structures, stacked patch antenna structures, antenna structures having parasitic elements, inverted-F antenna structures, planar inverted-F antenna structures, helical antenna structures, monopole antenna structures, dipole antenna structures, Yagi (Yagi-Uda) antenna structures, surface integrated waveguide structures, hybrids of two or more of these designs, etc. If desired, one or more antennas 50 may be cavity-backed antennas. Antenna 50 may include one or more antenna conductors that form a parasitic antenna resonating element. Whereas antenna resonating element 52 is directly fed (e.g., via positive antenna feed terminal 56), parasitic antenna resonating elements are not directly fed (e.g., are indirectly fed by antenna resonating element 52) and/or serve to modify the radiation pattern and/or radiative characteristics of antenna 50. Two or more antennas 50 may be arranged in a phased antenna array if desired (e.g., for conveying centimeter and/or millimeter wave signals within a signal beam formed in a desired beam pointing direction that may be steered/adjusted over time). Earbuds 22R and 22L may also have wireless circuitry such as wireless circuitry 16 of FIG. 3.

Device 10 may include a first set of one or more antennas that convey radio-frequency signals 24A with earbuds 22R and 22L (FIG. 2). Device 10 may also include a second set of one or more antennas that convey radio-frequency signals 24W with other external equipment 22. Radio-frequency signals 24A may, for example, be conveyed through or towards rear side 32 of device 10, as shown in FIG. 2 (e.g., to and from the expected location of earbuds 22L and 22R while the user wears device 10). Radio-frequency signals 24W may be conveyed through front side 30 of device 10, through rear side 32, and/or through other sides of device 10. Radio-frequency signals 24A may be conveyed using a first radio access technology (RAT), a first communications protocol, a first transceiver in device 10, and/or a first set of frequencies or frequency bands. Radio-frequency signals 24W may be conveyed using a second RAT different from the first RAT, a second communications protocol different from the first communications protocol, a second transceiver in device 10 different from the first transceiver, and/or a second set of frequencies or frequency bands different from the first set of frequencies or frequency bands.

FIG. 4 is a diagram showing how wireless circuitry 16 may include different components for conveying radio-frequency signals 24A and 24W. As shown in FIG. 4, wireless circuitry 16 may use at least one antenna 50A to convey radio-frequency signals 24A and may use at least two antennas 50W (e.g., at least a first antenna 50W-1 and a second antenna 50W-2) to convey radio-frequency signals 24W (FIG. 2). While radio-frequency signals 24A may, in general, convey any desired wireless data between device 10 and multiple peripheral devices, an implementation in which radio-frequency signals 24A convey audio data and sensor data between device 10 and earbuds 22L and 22R is described herein as an example.

Antennas 50W-1 and 50W-2 may be coupled to a first transceiver 66W over respective radio-frequency transmission lines. Antenna 50A may be coupled to a second transceiver 66A over a corresponding radio-frequency transmission line. Transceivers 66W and 66A may be formed using different respective radios, modems, chips, integrated circuits, integrated circuit (IC) packages, and/or modules. Transceiver 66W may convey radio-frequency signals 24W (FIG. 2) with external equipment other than earbuds 22R and 22L and/or with earbuds 22R and 22L using antennas 50W-1 and 50W-2. Transceiver 66W may, for example, have respective first and second transmit chains and respective first and second receive chains (e.g., respective first and second ports) coupled to antennas 50W-1 and 50W-2.

Transceiver 66W may convey radio-frequency signals 24W using at least a first communications protocol, at least a first RAT, and a first set of frequency bands. An implementation in which radio-frequency signals 24W include WLAN signals conveyed using a WLAN protocol (e.g., a Wi-Fi protocol), the WLAN RAT, and WLAN frequency bands is described herein as an example. If desired, radio-frequency signals 24W may also include Bluetooth signals conveyed using a Bluetooth protocol and Bluetooth frequency bands. Transceiver 66W may therefore sometimes be referred to herein as WLAN transceiver 66W, Wi-Fi transceiver 66W, or WLAN/Bluetooth transceiver 66W. Radio-frequency signals 24W may sometimes be referred to herein as WLAN or Wi-Fi signals 24W. This is merely illustrative and, in general, radio-frequency signals 24W may be conveyed using any desired protocol(s).

In some scenarios, Bluetooth signals conveyed by transceiver 66W are used to convey streams of audio data between device 10 and earbuds 22L and 22R. However, Bluetooth signaling can involve an excessive amount of latency and an excessive glitch rate. This can be disruptive to the user experience while listening to audio on earbuds 22L and 22R, particularly for audio data with a relatively high data rate (e.g., as may be required for immersive, high definition, three-dimensional audio presented to the user along with virtual reality content on displays 18B of FIG. 2). The high latency and excessive glitch rate associated with Bluetooth signaling may be caused by the Bluetooth protocol's requirement for time division duplexing between earbuds 22L and 22R (e.g., where audio data packets are transmitted to right earbud 22R and then to left earbud 22L in a time-alternating manner), frequency hopping between different Bluetooth frequencies, and a relatively large tolerance for packet retransmissions, for example.

To mitigate these issues, transceiver 66A may convey radio-frequency signals 24A (FIG. 2) using a second communications protocol, a second RAT, and a second set of frequency bands different from those used by transceiver 66W. For example, transceiver 66A may convey radio-frequency signals 24A using a non-Bluetooth, ultra-low-latency audio (ULLA) communications protocol optimized to support low latency and high data rate audio streaming from device 10 to earbuds 22L and 22R. Radio-frequency signals 24A may be conveyed in different frequency bands than radio-frequency signals 24W. For example, radio-frequency signals 24A may be conveyed using an unlicensed band at 2.4 GHz and/or an unlicensed band between 5-6 GHz. The band between 5-6 GHz may allow for a larger bandwidth than the 2.4 GHz band. In addition, the band between 5-6 GHz may allow for fewer coexistence/interference issues than the 2.4 GHz band, which coexists with the Bluetooth band, household appliances such as microwaves that emit around 2.4 GHz, etc.

The ultra-low-latency audio protocol may involve communications without performing time division duplexing between earbuds 22L and 22R and may involve communications with a lower packet re-transmission count limit, lower latency, lower glitch rate (e.g., 1 glitch per hour or fewer), more stability, and less interference than the Bluetooth protocol. Further, the ultra-low-latency audio protocol requires both earbuds 22R and 22L to convey radio-frequency signals 24A directly with device 10 rather than relaying signals or data between earbuds 22R and 2L and has a wireless fading channel selected to have a tighter distribution and shorter tail at the low power end than the Bluetooth protocol. Transceiver 66A may therefore sometimes be referred to herein as audio transceiver 66A. Radio-frequency signals 24A may sometimes be referred to herein as audio signals 24A. The example in which transceiver 66A conveys audio data is merely illustrative and, in general, transceiver 66A may use radio-frequency signals 24A to convey any desired wireless data.

During transmission, transceiver 66A may transmit audio data AUD in radio-frequency signals 24A (e.g., radio-frequency signals 24A may be modulated to carry audio data AUD). Antenna 50A may transmit the radio-frequency signals 24A including audio data AUD. Audio data AUD may include a stream of audio data packets. The stream of audio data packets may include a first set of audio data packets (or any desired first portion of the stream of audio data as distributed across one or more packets) for playback by left earbud 22L (e.g., a stream of left speaker audio data). The stream of audio data packets may also include a second set of audio data packets (or any desired second portion of the stream of audio data as distributed across one or more packets) for playback by right earbud 22R (e.g., a stream of right speaker audio data). The first and second sets may be interspersed or interleaved in time, for example.

Since the ultra-low-latency audio communications protocol governing transmission of radio-frequency signals 24A does not involve time division duplexing (TDD) between earbuds 22R and 22L, the same audio data AUD (e.g., the stream of audio data packets including both left and right speaker audio data) is concurrently (e.g., simultaneously) transmitted to both earbuds 22R and 22L and is concurrently received by both earbuds 22R and 22L. The controllers on earbuds 22R and 22L may demodulate the received audio data to recover the first and second sets of audio data packets. Left earbud 22L may then play the first set of audio data packets without playing (e.g., while discarding) the received second set of audio data packets. Right earbud 22R may play the second set of audio data packets without playing (e.g., while discarding) the received first set of audio data packets. Earbuds 22L and 22R may also transmit radio-frequency signals 24A to antenna 50A on device 10 to confirm/acknowledge receipt of audio data AUD, to convey voice/sensor data to device 10, etc. Since the sensor data gathered by earbuds 22R and 22L may not be subject to the same strict latency requirements as the audio data conveyed by transceiver 66A, earbuds 22L and 22R may, if desired, include additional wireless circuitry that transmits some or all of the sensor data to device 10 using the Bluetooth protocol or other protocols.

In some situations, using the same antenna 50A to convey radio-frequency signals 24A with both earbuds 22R and 22L can cause an excessive glitch rate due to random transmission nulls and the fading channel between antenna 50A and the earbuds. To improve link quality and glitch rate, wireless circuitry 16 may include different respective antennas 50A for conveying radio-frequency signals 24A with earbuds 22R and 22L, if desired.

Given the compact and lightweight form factor of device 10 and the presence of conductive structures in device 10 such as outer chassis 12A, inner chassis 12B, conductive portions of logic board 38, displays 18B, and display 18A, it can be challenging to place antennas 50 at locations device 10 that allow the antennas to exhibit satisfactory levels of radio-frequency performance. To help maximize the wireless performance of antennas 50, antennas 50 may be mounted at the front of device 10 and may overlap peripheral edge portions 42 of CGA 28. FIG. 5 is a front view of device 10 (e.g., as viewed in the direction of arrow 31 of FIG. 2) showing how antennas 50 may be mounted at the front of device 10 and overlapping peripheral edge portions 42 of CGA 28.

As shown in FIG. 5, the front-facing display 18A on device 10 may overlap central region 44 of CGA 28 but not peripheral edge portions 42 of CGA 28. Display 18A (central region 44) may be laterally surrounded by peripheral edge portions 42 of CGA 28. In other words, peripheral edge portions 42 may extend around the lateral periphery of display 18A (e.g., when viewed in the X-Z plane). Peripheral edge portions 42 may, for example, form an inactive (conductor-free) portion of CGA 28 that extends around or along the lateral periphery of CGA 28, central region 44 of CGA 28, and display 18A.

Device 10 may have a top side 80 and a bottom side 81 opposite top side 80. Top side 80 may sometimes also be referred to herein as top edge 80, top wall 80, or top face 80 of device 10. Bottom side 81 may sometimes also be referred to herein as bottom edge 81, bottom wall 81, or bottom face 81 of device 10. Right side 36 and left side 34 may extend from top side 80 to bottom side 81 of device 10.

Device 10 may have corners 72 such as a bottom-right corner 72R where right side 36 meets bottom side 81 and a bottom-left corner 72L where left side 34 meets bottom side 81. Display 18A may have corners 74 such as a bottom-right corner 74R facing corner 72R of device 10 and a bottom-left corner 74L facing corner 74L of device 10.

The housing structures of device 10 may have a nose bridge portion such as nose bridge region 85. Nose bridge region 85 may rest on the user's nose while wearing device 10 on their head. Nose bridge region 85 may be laterally interposed between the left and right displays 18B in device 10 (FIG. 2), for example. Nose bridge region 85 may vertically extend from top side 80 to bottom side 81 at the center of device 10.

Display 18A may include pixel circuitry and other conductive components that can block radio-frequency signals conveyed by the antennas in device 10. As such, antennas 50W-1, 50W-2, and one or more antennas 50A may be disposed within device 10 at locations overlapping peripheral edge portions 42 of CGA 28. As shown in FIG. 5, antennas 50W-1 and 50W-2 may be mounted within device 10 and overlapping an upper region or area of peripheral edge portions 42 (e.g., antennas 50W-1 and 50W-2 may be interposed between display 18A and top side 80 of device 10).

Antennas 50W-1 and 50W-2 may convey radio-frequency signals 24W through the dielectric material in CGA 28 and/or the top, bottom, right, left, and/or rear sides of device 10. Antennas 50W-1 and 50W-2 may be disposed at opposing sides of device 10 (e.g., antenna 50W-1 may be disposed at or adjacent right side 36 whereas antenna 50W-2 is disposed at or adjacent left side 34 of device 10) to maximize spatial diversity for transceiver 66W. Antennas 50W-1 and 50W-2 may, for example, be mounted at opposing sides of nose bridge region 85.

The antennas 50A in device 10 may be mounted within device 10 and overlapping a lower region or area of peripheral edge portions 42 (e.g., antenna(s) 50A may be interposed between display 18A and bottom side 81 of device 10). Disposing antenna(s) 50A along the bottom edge of device 10 may serve to minimize the amount of conductive material in device 10 that lies between antenna(s) 50A and the location of earbuds 22R and 22L (FIG. 2) while device 10 is being worn by the user.

In implementations where device 10 includes a single antenna 50A, antenna 50A may convey radio-frequency signals 24A with both earbuds 22R and 22L (FIG. 2) through the dielectric material in CGA 28 and/or the top, bottom, right, left, and/or rear sides of device 10. Antenna 50A may be mounted at or adjacent the center of device 10. For example, antenna 50A may overlap nose bridge portion 85 of device 10 (e.g., antenna 50A may be disposed at the center of device 10 along the X-axis). This may allow antenna 50A to exhibit optimal and balanced channel conditions with both right earbud 22R at right side 36 of device 10 and left earbud 22L at left side 34 of device 10.

In implementations where device 10 includes multiple antennas 50A such as at least a first antenna 50A-L and a second antenna 50A-R, antenna 50A-R may be mounted at or adjacent to corner 74R of display 18A and/or corner 72R of device 10 (e.g., antenna 50A-R may be laterally interposed between corner 74R of display 18A and corner 72R of device 10). Antenna 50A-L may be mounted at or adjacent to corner 74L of display 18A and/or corner 72L of device 10 (e.g., antenna 50A-L may be laterally interposed between corner 74L of display 18A and corner 72L of device 10). In this way, display 18A may be vertically interposed between the antennas 50W (FIG. 9) and the antenna(s) 50A in device 10, thereby maximizing physical separation and thus isolation between antennas 50W and antenna(s) 50A.

Device 10 may have a central longitudinal axis 70 extending from right side 36 to left side 34 (parallel to the X-axis and perpendicular to nose bridge region 85 of FIG. 9). If desired, antennas 50A-L and 50A-R (e.g., the lateral surfaces of antenna resonating elements 52 (FIG. 3) in antennas 50A-L and 50A-R) may be tilted at non-parallel and non-perpendicular angles with respect to longitudinal axis 70. When placed and oriented in this way, antenna 50A-R may exhibit optimal channel characteristics in conveying radio-frequency signals 24A-R with right earbud 22R (e.g., with minimal blockage by the user's head, display 18A, and/or the other conductive structures of device 10). Similarly, antenna 50A-L may exhibit optimal channel characteristics in conveying radio-frequency signals 24A-R with left earbud 22L (e.g., with minimal blockage by the user's head, display 18A, and/or the other conductive structures of device 10).

The example of FIG. 5 in which antennas 50W and 50A are mounted in device 10 at locations overlapping CGA 28 are merely illustrative. If desired, antennas 50W and/or 50A may be disposed within strap 12C of device 10 and/or at rear side 32 of device 10 (FIG. 2). FIG. 6 is a side view (e.g., taken in the direction of arrow 78 of FIG. 5) showing how antennas 50W and 50A may be disposed at front side 30 of device 10.

As shown in FIG. 6, an antenna 50W (e.g., antenna 50W-1 and/or antenna 50W-2 of FIG. 5) may be mounted at or adjacent to front side 30 and top side 80 of device 10. An antenna 50A (e.g., antenna 50A, antenna 50A-R, and/or antenna 50A-L of FIG. 5) may be mounted at or adjacent to front side 30 and bottom side 81 of device 10. Antenna 50W and antenna 50A may be pressed against, mounted to, mounted (e.g., embedded) within, printed on, adhered to, affixed to, or mounted adjacent to CGA 28.

Antenna 50W may be tilted, rotated, or oriented at a non-parallel and non-perpendicular angle A2 with respect to longitudinal axis 70 (FIG. 5), the rear side of device 10, and/or the X-Z plane. Angle A2 may be 45 degrees, 30-60 degrees, 1-30 degrees, 1-45 degrees, 5-35 degrees, or other angles. Similarly, antenna 50A may be tilted, rotated, or oriented at a non-parallel and non-perpendicular angle A1 with respect to longitudinal axis 70 (FIG. 5), the rear side of device 10, and/or the X-Z plane. Angle A1 may be 45 degrees, 30-60 degrees, 1-30 degrees, 1-45 degrees, 5-35 degrees, or other angles. Angle A1 may be equal to angle A2 or may be different from angle A2.

If desired, the lateral surface of the antenna resonating elements 52 (FIG. 3) in antennas 50W and 50A may extend parallel to the curved surface(s) of CGA 28 (e.g., the antenna resonating elements may exhibit the same compound curvature as CGA 28). This may serve to provide a uniform separation between all points on the lateral surface of the antenna resonating elements and the overlapping portions of CGA 28, which minimizes antenna impedance mismatch across the antenna resonating elements and thus maximizes antenna efficiency.

When placed and oriented in this way, antenna(s) 50A may exhibit optimal channel characteristics in conveying radio-frequency signals 24A with right earbud 22R and left ear bud 22L (e.g., with minimal blockage by the user's head, display 18A, and/or the other conductive structures of device 10). Mounting the antennas at the rear side of device 10 may subject the antennas to undesirable detuning when displays 18B (FIG. 2) move over time and/or due to impedance loading from the user's head. Mounting the antennas at front side 30 of device 10 (as shown in FIGS. 5 and 6) may minimize the impact of displays 18B (FIG. 2) on the antennas (e.g., such that movement of displays 18B does not detune the antennas). In addition, mounting the antennas at front side 30 of device 10 may minimize fading channel path loss, may minimize user-to-user variation in the impedance loading of the antennas by the user's head, and may minimize and the amount of radio-frequency energy exposure produced by the antennas on the user's body, helping device 10 to comply with regulatory limits on radio-frequency energy exposure or absorption (e.g., without requiring transmit power level backoffs for the antenna) while meeting the strict latency and glitch rate requirements of the ultra-low-latency audio communications protocol.

When antenna(s) 50 are integrated into CGA 28, one or more of the antenna conductors in the antenna(s) may be curved (e.g., three-dimensionally curved, curved with a compound curvature, etc.). The curvature of the antenna conductor(s) may, for example, follow or extend parallel to the compound or three-dimensional curvature of one or more layers and/or surfaces of CGA 28. When an antenna conductor in an antenna 50 is provided with a three-dimensional curvature, it can be challenging to provide a mechanically and electrically robust connection between that antenna conductor and other conductors in device 10 (e.g., another antenna conductor in antenna 50).

For example, when the antenna conductor used to form antenna resonating element 52 and/or the antenna conductor used to form antenna ground 54 (FIG. 3) have three-dimensional curvature, it can be challenging to provide an electrically continuous grounding path or structure for antenna 50 (e.g., from antenna resonating element 52 to antenna ground 54, between antenna conductors in antenna ground 54, etc.). Electrical discontinuities between antenna conductors such as an electrical discontinuity to ground can produce undesirable impedance discontinuities between the antenna conductors (e.g., discontinuities that produce undesired signal or current reflections that can undesirably alter the radiation pattern and/or efficiency of the antenna), can produce failures in electromagnetic shielding for the antenna (e.g., can subject the antenna to electromagnetic interference from other components in device 10), can increase desense noise, can produce coexistence issues for the antenna, and/or can produce a loss-prone resonance in the antenna due to undesirable electromagnetic couplings between the antenna conductors and/or elsewhere in device 10. The three-dimensional curvature of the antenna conductor(s) can also create mechanical vulnerabilities between the antenna conductors, which can produce or exacerbate the electrical discontinuities over the operating life of device 10.

To mitigate these issues, an antenna 50 having one or more curved antenna conductors may be provided with an antenna connection between the antenna conductors that minimizes electrical discontinuity. FIG. 7 is a cross-sectional top view showing one example of an antenna 50 that is integrated into CGA 28 and that includes an antenna connection that minimizes electrical discontinuity between curved antenna conductors.

As shown in FIG. 7, CGA 28 may include an outermost layer such as cover glass layer 92. If desired, CGA 28 may also include a dielectric cover layer such as dielectric layer 94 on, at, or adjacent to the interior side of cover glass layer 92. While CGA 28 may have multiple dielectric layers 94 stacked under cover glass layer 92, a single dielectric layer 94 is shown in FIG. 7 for the sake of clarity.

In the example of FIG. 7, dielectric layer 94 is shown as being layered onto (e.g., adhered or molded onto) the inner surface of cover glass layer 92 for the sake of clarity. However, if desired, some or all of the lateral area of dielectric layer 94 may be separated from cover glass layer 92 by an air gap (not shown) and/or one or more intervening structures or layers (not shown). The outer lateral surface of dielectric layer 94 may have the same curvature as cover glass layer 28 or a different curvature and the inner lateral surface of dielectric layer 94 may have the same curvature as cover glass layer 28 or a different curvature. The outer lateral surface of dielectric layer 94 may have the same curvature as the inner lateral surface of dielectric layer 94 (e.g., the inner and outer lateral surfaces may extend parallel to each other) or the outer lateral surface of dielectric layer 94 may have a different curvature than the inner lateral surface of dielectric layer 94 (e.g., the inner and outer lateral surfaces may be non-parallel).

Cover glass layer 92 may be formed from glass, sapphire, or other transparent materials. Cover glass layer 92 may be replaced with an outermost plastic cover layer if desired. Cover glass layer 92 may sometimes be referred to herein as cover layer 92, display cover layer 92, cover glass 92, layer 92, or exterior layer 92. Dielectric layer 94 may be formed from polymer, plastic, glass, ceramic, and/or other dielectric materials.

If desired, dielectric layer 94 may exhibit a dielectric constant that is lower than the dielectric constant of cover glass layer 92. This may configure dielectric layer 94 to form an impedance transition layer between air and cover glass layer 92 for the radio-frequency signals conveyed by antenna 50, helping to minimize signal reflections between the interior of device 10 and cover glass layer 92 and thus maximizing antenna efficiency. Dielectric layer 94 may also serve to limit radio-frequency exposure or absorption by external objects at the exterior of device 10, helping device 10 to satisfy regulatory requirements on radio-frequency energy exposure or absorption without backing off transmit power level.

If desired, dielectric layer 94 may include multiple plastic or polymer sub-layers that are molded, adhered, or coupled together. As one example, dielectric layer 94 may include a shroud having a ring-shaped trim portion that laterally surrounds the pixels in display 18A of FIG. 2 (e.g., that only extends around peripheral edge portions 42 of CGA 28 and that does not overlap central region 44 of CGA 28) and may include a canopy portion that is coupled/adhered to the shroud portion and that overlaps or covers the pixels of display 18A (e.g., that overlaps central region 44 of CGA 28 as shown in FIG. 2). Dielectric layer 94 may sometimes also be referred to herein as dielectric member 94, dielectric cover layer 94, mask 94, shroud 94, trim 94, and/or canopy 94.

Antenna 50 (e.g., antenna 50W-1, 50W-2, 50W, 50A, 50A-R, and/or 50A-L of FIGS. 4-6) may include an antenna conductor 100 layered onto a curved surface of CGA 28 (e.g., a three-dimensionally or compound curved surface). Antenna conductor 100 may form some or all of antenna resonating element 52 and/or some or all of antenna ground 54 of antenna 50 (FIG. 3). Antenna conductor 100 may be formed from conductive traces patterned onto the curved surface, metal foil or sheet metal layered onto the curved surface, conductive portions of display 18A (FIG. 2), and/or any other desired conductive (metal) materials disposed at, on, or along the curved surface. Antenna conductor 100 may include aluminum, stainless steel, copper, gold, silver, titanium, chromium, and/or any other desired metals and/or alloys.

In the example of FIG. 7, antenna conductor 100 is a curved conductor (e.g., a three-dimensionally curved or compound curved conductor) layered onto a curved interior surface of dielectric layer 94 (e.g., a three-dimensionally curved or compound curved surface of dielectric layer 94). As such, antenna conductor 100 extends parallel to and exhibits the same curvature as the interior surface of dielectric layer 94 or of dielectric layer 94 as a whole. This is merely illustrative. Alternatively, antenna conductor 100 may be layered directly onto the interior surface of cover glass layer 92 (e.g., dielectric layer 94 may be omitted or antenna conductor 100 may be sandwiched between dielectric layer 94 and cover glass layer 92) or may be layered between the curved surfaces of two different dielectric layers 94. In these scenarios, antenna conductor 100 may extend parallel to and exhibit the same curvature as the interior surface of cover glass layer 92 and/or the surface(s) of dielectric layer(s) 94 (e.g., a three-dimensional or compound curvature). If desired, antenna conductor 100 may include conductive traces on a flexible printed circuit that is layered onto and/or adhered to a curved surface of dielectric layer 94, a curved surface of cover glass layer 92, sandwiched between multiple dielectric layers 94, or sandwiched between cover glass layer 92 and dielectric layer 94.

During manufacture or assembly of device 10, CGA 28 is mounted to outer chassis 12A by pressing the interior surface of CGA 28 onto outer chassis 12A, as shown by arrow 28. After CGA 28 has been mounted to outer chassis 12A (as shown by arrow 104), the interior surface of CGA 28 contacts chassis 12A. The entire interior surface of CGA 28 (e.g., dielectric layer 94) may contact outer chassis 12A or, if desired, a peripheral ring-shaped region of CGA 28 (e.g., as viewed in the X-Z plane) may contact outer chassis 12A. If desired, adhesive (e.g., pressure sensitive adhesive), a gasket, prongs, tabs, springs, locking features/structures, pins, clips, and/or other mounting structures may help to attach, affix, and/or secure CGA 28 in place on outer chassis 12A.

Antenna 50 may include one or more antenna connections such as antenna connection 102. Antenna connection 102 may couple (e.g., electrically and/or mechanically connect) antenna conductor 100 to another antenna conductor in antenna 50 (e.g., upon pressing CGA 28 against outer chassis 12A as shown by arrow 98). For example, when CGA 28 is mounted to outer chassis 12A, antenna connection 102 may couple antenna conductor 100 to another antenna conductor 108 in antenna 50, as shown in exploded region 106. Antenna conductor 108 may form some or all of antenna resonating element 52 and/or some or all of antenna ground 54 of antenna 50 (FIG. 3).

In implementations where antenna conductor 100 forms part of antenna resonating element 52 and antenna conductor 108 forms part of antenna ground 54, antenna connection 102 may form a ground connection, a ground connector, or a path to ground between antenna conductors 100 and 108. In implementations where both antenna conductors 100 and 108 form part of antenna resonating element 52, antenna connection 102 may form a part of antenna resonating element 52. In implementations where both antenna conductors 100 and 108 form part of antenna ground 54, antenna connection 102 may form part of antenna ground 54.

Antenna conductor 108 may be curved conductor (e.g., a three-dimensionally curved or compound curved conductor). As such, the surface or interface where antenna conductor 100 meets antenna conductor 100 is also curved (e.g., three-dimensionally or compound curved). If desired, antenna conductor 108 may extend parallel to antenna conductor 100 and may have the same curvature as antenna conductor 100. Alternatively, antenna conductor 108 may have a different curvature than antenna conductor 100 (e.g., a different radius of curvature, curvature about a different axis or point, etc.).

Antenna conductor 108 may include conductive traces (e.g., on logic board 38 of FIG. 3, on another flexible or rigid printed circuit board in device 10, in display 18A of FIG. 2, etc.), metal foil, sheet metal, conductive portions of one or more components on or within device 10, conductive portions of the housing of device 10 (e.g., outer chassis 12A and/or inner chassis 12B of FIG. 2), and/or any other desired conductive structures in device 10. As another example, antenna conductor 108 may form part of the signal conductor 62 or the ground conductor 64 of the radio-frequency transmission line 60 used to feed antenna 50 (FIG. 3). When antenna conductor 108 forms part of signal conductor 62 and antenna conductor 100 forms part of antenna resonating element 52, antenna connection 102 may couple antenna conductor 108 to antenna conductor 100 at positive antenna feed terminal 56 (FIG. 3), for example. When antenna conductor 108 forms part of ground conductor 64 and antenna conductor 100 forms part of antenna ground 54, antenna connection 102 may couple antenna conductor 108 to antenna conductor 100 at ground antenna feed terminal 58 (FIG. 3), for example. Antenna conductor 108 may include aluminum, stainless steel, copper, gold, silver, titanium, chromium, and/or any other desired metals and/or alloys.

Antenna connection 102 may couple a single point on antenna conductor 100 to a single point on antenna conductor 108, may couple a region or area of antenna conductor 100 to a single point or a region (area) of antenna conductor 108, or may couple a single point on antenna conductor 108 to a region (area) of antenna conductor 100. Antenna connection 102 may form an open circuit (infinite) impedance between antenna conductors 100 and 108 prior to assembly of CGA 28 onto outer chassis 12A.

When CGA 28 is mounted to outer chassis 12A, the pressure exerted by CGA 28 against outer chassis 12 causes antenna connection 102 to contact both antenna conductors 100 and 108, forming a non-open circuit impedance (e.g., a short circuit impedance or some other non-infinite impedance) between antenna conductors 100 and 108 at the frequencies handled by antenna 50. In this way, the pressure that is used to assemble device 10 may also be used to establish an electrical and mechanical coupling between antenna conductors 100 and 108 through antenna connection 102. If desired, the pressure may also serve to mechanically activate antenna connection 102 in a manner that ensures that antenna connection 102 forms a robust and reliable mechanical connection (e.g., attaching, securing, or holding antenna conductor 100 to antenna conductor) and thus a robust and reliable electrical connection between antenna conductors 100 and 108.

Antenna connection 102 is sometimes also referred to herein as connector 102, interconnect 102, interconnect structure 102, conductive interconnect 102, antenna path 102, coupling structure 102, pressure-activated antenna connection 102, pressure-activated connection 102, pressure-activated connector 102, pressure-activated structure 102, or pressure-activated interface 102. In implementations where one or both of antenna conductors 100 and 108 form part of the antenna ground of antenna 50, antenna connection 102 is sometimes also referred to herein as ground connector 102, ground connection 102, ground connection structure 102, grounding structure 102, grounding path 102, grounding interconnect 102, grounding interconnect structure 102, grounding interface 102, pressure-activated grounding structure 102, pressure-activated ground path 102, pressure-activated grounding 102, or pressure-activated grounding interconnect 102.

After CGA 28 has been mounted to outer chassis 12A (activating antenna connection 102), antenna 50 may be used to convey radio-frequency signals. Antenna current may flow between antenna conductors 100 and 108 through antenna connection 102 while antenna 50 conveys the radio-frequency signals. Antenna connection 102 may be structured to form a mechanically robust connection between antenna conductors 100 and 108 despite the curvature (e.g., three-dimensional curvature) of one or both of antenna conductors 100 and 108. In this way, antenna connection 102 may form an electrically continuous and smooth impedance transition between antenna conductors 100 and 108 that serves to minimize signal reflections between antenna conductors 100 and 108, maximizes electromagnetic shielding, decreases desense noise, decreases coexistence issues, and/or minimizes loss-prone resonances due to electromagnetic couplings between antenna conductors 100/108 and other conductive structures in device 10.

FIGS. 8-14 illustrate different examples of structures that may be used to form antenna connection 102. The structures in antennas connection 102 of FIGS. 8-14 are pressure-activated when CGA 28 is pressed against outer chassis 12A. As such, the electrical connection between antenna conductors 100 and 108 through antenna connection 102 is also pressure-activated. Antenna conductors 100 and 108 are illustrated as planar conductors in FIGS. 8-14 for the sake of clarity. However, in practice, one or both of antenna conductors 100 and 108 are curved (e.g., three-dimensionally or compound curved).

FIGS. 8 and 9 show two examples in which antenna connection 102 includes spring structures that exert an outward force F (e.g., a spring force) against antenna conductors 100 and 108 after CGA 28 has been mounted to outer chassis 12A. Outward force F may help to ensure that antenna conductors 100 and 108 remain electrically coupled together through antenna connection 102 over the operating life of device 10 (even as device 10 is subjected to external forces or wear) despite the curvature of antenna conductors 100 and/or 108.

In the example of FIG. 8, antenna connection 102 includes a compressible rigid metal member as metal finger 112. Metal finger 112 may be mounted, affixed, or coupled to antenna conductor 108 using solder, welds, conductive adhesive, conductive screws, a conductive bracket, or other conductive structures. Alternatively, metal finger 112 may be formed from an integral portion of antenna conductor 108 (e.g., a rigid prong or extension of antenna conductor 108). Alternatively, metal finger 112 may be coupled to antenna conductor 100 or formed from an integral portion of antenna conductor 100.

As shown in FIG. 8, metal finger 112 is in an uncompressed state prior to mounting CGA 28 to outer chassis 12A (FIG. 7). When CGA 28 is mounted to outer chassis 12A (as shown by arrow 110), antenna conductor 100 is pressed onto metal finger 112 and antenna conductor 108. This causes metal finger 112 to contact antenna conductor 100, thereby forming an electrical connection between antenna conductors 100 and 108, while also compressing metal finger 112 downwards towards antenna conductor 108. The compression of metal finger 112 causes metal finger 112 to exert force F upwards against antenna conductor 100 and downwards against antenna conductor 108. Metal finger 112 is sometimes also be referred to herein as spring finger 112, elongated metal member 112, or elongated metal finger 112.

In the example of FIG. 9, antenna connection 102 includes a metal spring 114 that hard stacks under maximum compression. Metal spring 114 may be coupled, mounted, or affixed to antenna conductor 108 using solder, welds, conductive adhesive, conductive screws, a conductive bracket, or other conductive structures. Alternatively, metal spring 114 may be formed from an integral portion of antenna conductor 108. Alternatively, metal spring 114 may be coupled to antenna conductor 100 or formed from an integral portion of antenna conductor 100.

As shown in FIG. 9, prior to mounting CGA 28 to outer chassis 12A (FIG. 7), metal spring 114 is in an uncompressed state. When CGA 28 is mounted to outer chassis 12A (as shown by arrow 110), antenna conductor 100 is pressed onto metal spring 114 and antenna conductor 108. This causes metal spring 114 to contact antenna conductor 100, thereby forming an electrical connection between antenna conductors 100 and 108, while also compressing metal spring 114 downwards onto antenna conductor 108. The compression of metal spring 114 causes metal spring 114 to exert force F upwards against antenna conductor 100 and downwards against antenna conductor 108.

Under maximum compression, metal spring 114 is hard stacked between antenna conductors 100 and 108 (e.g., metal spring 114 cannot be further compressed). The rigid metal used to form metal spring 114 ensures that antenna conductors 100 and 108 remain separated by at least the hard stacked length of metal spring 114 at antenna connection 102. The force F produced by metal finger 112 (FIG. 8) and metal spring 114 may help to ensure that a robust electrical connection is maintained between antenna conductors 100 and 108 even as antenna conductors 100 and 108 move relative to each other over the operating life of device 10.

FIGS. 10-14 show five examples in which the pressure-activated structures of antenna connection 102 include pressure-activated locking (retention) structures. The pressure-activated locking structures (features) are activated (locked) upon mounting CGA 28 to outer chassis 12A. The pressure-activated locking structures and thus antenna connection 102 may help to secure, attach, affix, or hold antenna connection in place on antenna conductors 100 and/or 102 despite the curvature of antenna conductors 100 and/or 102. This helps to ensure that a robust electrical connection is maintained between antenna conductors 100 and 108 even as antenna conductors 100 and 108 move relative to each other over the operating life of device 10.

In the example of FIG. 10, the pressure-activated locking structures in antenna connection 102 include a metal bump 116 and a curling metal receptacle 118. Metal bump 116 may be coupled, mounted, or affixed to antenna conductor 100 using solder, welds, conductive adhesive, conductive screws, a conductive bracket, or other conductive structures. Alternatively, metal bump 116 may be formed from an integral portion of antenna conductor 100. Curling metal receptacle 118 may be coupled, mounted, or affixed to antenna conductor 108 using solder, welds, conductive adhesive, conductive screws, a conductive bracket, or other conductive structures. Alternatively, curling metal receptacle 118 may be formed from an integral portion of antenna conductor 108. This is merely illustrative and, if desired, curling metal receptacle 118 may be mounted to or formed from antenna conductor 100 whereas metal bump 116 is mounted to or formed from antenna conductor 108. Metal bump 116 may also sometimes be referred to as metal contact 116. If desired, metal bump 116 may be replaced with a metal pin, ball, or other protrusion.

As shown in FIG. 10, metal bump 116 is separated from curling metal receptacle 118 prior to mounting CGA 28 to outer chassis 12A (FIG. 7). When CGA 28 is mounted to outer chassis 12A (as shown by arrow 110), antenna conductor 100 is pressed towards antenna conductor 108 until metal bump 116 is inserted into or received by curling metal receptacle 118. Curling metal receptacle 118 may include curling metal that deforms around metal bump 116 when metal bump 116 is pressed into curling metal receptacle 118. This pressure-activated deformation of curling metal receptacle 118 causes curling metal receptacle 118 to hold, lock, or snap metal bump 116 in place within curling metal receptacle 118. This forms a robust mechanical connection between antenna conductors 100 and 108 (e.g., snapping, locking, or holding antenna conductors 100 and 108 in place at antenna connection 102) while also forming a robust electrical connection between antenna conductors 100 and 108 through metal bump 116 and curling metal receptacle 118.

In the example of FIG. 11, the pressure-activated locking structures in antenna connection 102 include a metal bump 120 and a dimple 122. Metal bump 120 may be coupled, mounted, or affixed to antenna conductor 100 using solder, welds, conductive adhesive, conductive screws, a conductive bracket, or other conductive structures. Alternatively, metal bump 120 may be formed from an integral portion of antenna conductor 100. Alternatively, metal bump 120 may be mounted to or formed from antenna conductor 108. Metal bump 120 may also sometimes be referred to as metal contact 120. If desired, metal bump 120 may be replaced with a metal pin, ball, or other protrusion.

As shown in FIG. 11, metal bump 120 is separated from antenna conductor 108 prior to mounting CGA 28 to outer chassis 12A (FIG. 7). When CGA 28 is mounted to outer chassis 12A (as shown by arrow 110), antenna conductor 100 is pressed towards antenna conductor 108 until metal bump 120 presses onto antenna conductor 108. The pressure exerted by metal bump 120 onto antenna conductor 108 may form dimple 122 in antenna conductor 108. Dimple 122 is sometimes also referred to herein as cavity 122, recess 122, notch 122, depression 122, or hole 122. This pressure-activated deformation of antenna conductor 108 causes antenna conductor 108 to hold, lock, or snap metal bump 120 in place within dimple 122. This forms a robust mechanical connection between antenna conductors 100 and 108 (e.g., snapping, locking, or holding antenna conductors 100 and 108 in place at antenna connection 102) while also forming a robust electrical connection between antenna conductors 100 and 108 through metal bump 120. The example of FIG. 11 in which dimple 122 is formed by pressing metal bump 120 onto antenna conductor 108 is merely illustrative. Alternatively, antenna conductor 108 may include dimple 122 prior to pressing metal bump 120 onto antenna conductor 108.

In the example of FIG. 12, the pressure-activated locking structures in antenna connection 102 include a metal screw 124 and a screw receptacle 126. Metal screw 124 may, for example, be a back-drivable screw. Screw receptacle 126 may be a screw boss or other threaded hole/recess for receiving metal screw 124. Metal screw 124 may be coupled, mounted, or affixed to antenna conductor 100 using solder, welds, conductive adhesive, conductive screws, a conductive bracket, or other conductive structures. Alternatively, metal screw 124 may be formed from an integral portion of antenna conductor 100. Alternatively, metal screw 124 may be inserted or driven through an opening in antenna conductor 100. Screw receptacle 126 may be formed from an opening, notch, cavity, hole, or recess in antenna conductor 108 or may, if desired, be formed from a screw boss that is mounted to antenna conductor 108 using solder, welds, conductive adhesive, conductive screws, a conductive bracket, or other conductive structures. Alternatively, metal screw 124 may be mounted to, formed from, or driven through antenna conductor 108 whereas screw receptacle 126 is formed from or mounted to antenna conductor 100.

As shown in FIG. 12, metal screw 124 is separated from screw receptacle 126 prior to mounting CGA 28 to outer chassis 12A (FIG. 7). When CGA 28 is mounted to outer chassis 12A (as shown by arrow 110), antenna conductor 100 is pressed towards antenna conductor 108 until metal screw 124 is inserted within or received by screw receptacle 126. Metal screw 124 may include threads that mate with threads in screw receptacle 126 if desired (e.g., metal screw 124 may be driven or rotated while or after being inserted into screw receptacle 126 by the pressure of CGA 28 being mounted to outer chassis 12A). In this way, the pressure-activated locking structures of antenna connection 102 (e.g., metal screw 124 and/or screw receptacle 126) are also rotationally-activated. While inserted in screw receptacle 126, metal screw 124 serves to hold, lock, or secure antenna conductor 100 to antenna conductor 108 at antenna connection 102. This forms a robust mechanical connection between antenna conductors 100 and 108 while also forming a robust electrical connection between antenna conductors 100 and 108 through metal screw 124. If desired, metal screw 126 may be driven or screwed into screw receptacle 126 after antenna conductor 100 has been pressed against antenna conductor 108.

In the example of FIG. 13, the pressure-activated locking structures in antenna connection 102 include a set of one or more metal spurs such as metal spurs 128. Metal spurs 128 are sometimes also referred to herein as metal teeth 128, metal prongs 128, metal burs 128, or metal barbs 128. Metal spurs 128 may have a triangular shape as shown in FIG. 12, may have narrowed tips, may have serrated edges, may have sharp or jagged edges/tips, and/or may have other shapes. Metal spurs 128 may be coupled, mounted, or affixed to antenna conductor 108 using solder, welds, conductive adhesive, conductive screws, a conductive bracket, or other conductive structures. Alternatively, metal spurs 128 may be formed from an integral portion of antenna conductor 108. Alternatively, metal spurs 128 may be mounted to or formed from antenna conductor 100.

As shown in FIG. 13, metal spurs 128 are separated from antenna conductor 100 prior to mounting CGA 28 to outer chassis 12A (FIG. 7). When CGA 28 is mounted to outer chassis 12A (as shown by arrow 110), antenna conductor 100 is pressed towards antenna conductor 108 until metal spurs 128 press onto antenna conductor 100. The pressure exerted by metal spurs 128 onto antenna conductor 100 may cause metal spurs 128 to dig, bite, or cut into antenna conductor 100. This pressure-activated digging into antenna conductor 100 causes antenna metal spurs 128 to hold, lock, or secure antenna conductor 108 in place against antenna conductor 100 at antenna connection 102. This forms a robust mechanical connection between antenna conductors 100 and 108 while also forming a robust electrical connection between antenna conductors 100 and 108 through metal spurs 128.

In the example of FIG. 14, the pressure-activated locking structures in antenna connection 102 include rotational locking structures 130 and 132. Rotational locking structures 130 and 132 may be formed from metal or other conductive materials. Rotational locking structure 130 may be coupled, mounted, or affixed to antenna conductor 100 using solder, welds, conductive adhesive, conductive screws, a conductive bracket, or other conductive structures. Alternatively, rotational locking structure 130 may be formed from an integral portion of antenna conductor 100. Rotational locking structure 132 may be coupled, mounted, or affixed to antenna conductor 108 using solder, welds, conductive adhesive, conductive screws, a conductive bracket, or other conductive structures. Alternatively, rotational locking structure 132 may be formed from an integral portion of antenna conductor 108.

As shown in FIG. 14, rotational locking structures 130 and 132 are separated from each other prior to mounting CGA 28 to outer chassis 12A (FIG. 7). When CGA 28 is mounted to outer chassis 12A (as shown by arrow 110), antenna conductor 100 is pressed towards antenna conductor 108 until rotational locking structure 130 is inserted within and/or mates with rotational locking structure 132 (e.g., as shown by arrow 134). After rotational locking structure 130 has been inserted into rotational locking structure 132, a rotational (twisting) force 136 may be applied to rotational locking structure 130, rotational locking structure 132, antenna conductor 100, and/or antenna conductor 108. Rotational force 126 may, for example, be applied about or around arrow 134.

Prior to applying the rotational force, rotational locking structure 130 may be freely removed from rotational locking structure 130. The rotational force may serve to lock rotational locking structure 130 in place within rotational locking structure 132 (e.g., rotational locking structures 130 and 132 are rotationally activated), thereby securing or holding antenna conductor 100 to antenna conductor 108 at antenna connection 102 (through rotational locking structures 132 and 130). This forms a robust mechanical connection between antenna conductors 100 and 108 while also forming a robust electrical connection between antenna conductors 100 and 108 through antenna connection 102. If desired, antenna connection 102 may include a metallic wire lock.

If desired, antenna connection 102 may include any desired combination of the structures of FIGS. 8-14. For example, antenna connection 102 may include one or more metal fingers 112 (FIG. 8), one or more metal springs 114 (FIG. 9), one or more metal bumps 116 and curling metal receptacles 118 (FIG. 10), one or more metal bumps 120 and dimples 122 (FIG. 11), one or more metal screws 124 and screw receptacles 126 (FIG. 12), one or more sets of metal spurs 128 (FIG. 13), and/or one or more rotational locking structures 130/132 (e.g., for coupling different respective points on antenna conductor 108 to antenna conductor 100 through antenna connection 102).

As used herein, the term “concurrent” means at least partially overlapping in time. In other words, first and second events are referred to herein as being “concurrent” with each other if at least some of the first event occurs at the same time as at least some of the second event (e.g., if at least some of the first event occurs during, while, or when at least some of the second event occurs). First and second events can be concurrent if the first and second events are simultaneous (e.g., if the entire duration of the first event overlaps the entire duration of the second event in time) but can also be concurrent if the first and second events are non-simultaneous (e.g., if the first event starts before or after the start of the second event, if the first event ends before or after the end of the second event, or if the first and second events are partially non-overlapping in time). As used herein, the term “while” is synonymous with “concurrent.”

Devices such as device 10 may gather and/or use personally identifiable information. It is well understood that the use of personally identifiable information should follow privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for maintaining the privacy of users. In particular, personally identifiable information data should be managed and handled so as to minimize risks of unintentional or unauthorized access or use, and the nature of authorized use should be clearly indicated to users.

Physical environment: A physical environment refers to a physical world that people can sense and/or interact with without aid of electronic systems. Physical environments, such as a physical park, include physical articles, such as physical trees, physical buildings, and physical people. People can directly sense and/or interact with the physical environment, such as through sight, touch, hearing, taste, and smell.

Computer-generated reality: in contrast, a computer-generated reality (CGR) environment refers to a wholly or partially simulated environment that people sense and/or interact with via an electronic system. In CGR, a subset of a person's physical motions, or representations thereof, are tracked, and, in response, one or more characteristics of one or more virtual objects simulated in the CGR environment are adjusted in a manner that comports with at least one law of physics. For example, a CGR system may detect a person's head turning and, in response, adjust graphical content and an acoustic field presented to the person in a manner similar to how such views and sounds would change in a physical environment. In some situations (e.g., for accessibility reasons), adjustments to characteristic(s) of virtual object(s) in a CGR environment may be made in response to representations of physical motions (e.g., vocal commands). A person may sense and/or interact with a CGR object using any one of their senses, including sight, sound, touch, taste, and smell. For example, a person may sense and/or interact with audio objects that create 3D or spatial audio environment that provides the perception of point audio sources in 3D space. In another example, audio objects may enable audio transparency, which selectively incorporates ambient sounds from the physical environment with or without computer-generated audio. In some CGR environments, a person may sense and/or interact only with audio objects. Examples of CGR include virtual reality and mixed reality.

Virtual reality: A virtual reality (VR) environment refers to a simulated environment that is designed to be based entirely on computer-generated sensory inputs for one or more senses. A VR environment comprises a plurality of virtual objects with which a person may sense and/or interact. For example, computer-generated imagery of trees, buildings, and avatars representing people are examples of virtual objects. A person may sense and/or interact with virtual objects in the VR environment through a simulation of the person's presence within the computer-generated environment, and/or through a simulation of a subset of the person's physical movements within the computer-generated environment.

Mixed reality: In contrast to a VR environment, which is designed to be based entirely on computer-generated sensory inputs, a mixed reality (MR) environment refers to a simulated environment that is designed to incorporate sensory inputs from the physical environment, or a representation thereof, in addition to including computer-generated sensory inputs (e.g., virtual objects). On a virtuality continuum, a mixed reality environment is anywhere between, but not including, a wholly physical environment at one end and virtual reality environment at the other end. In some MR environments, computer-generated sensory inputs may respond to changes in sensory inputs from the physical environment. Also, some electronic systems for presenting an MR environment may track location and/or orientation with respect to the physical environment to enable virtual objects to interact with real objects (that is, physical articles from the physical environment or representations thereof). For example, a system may account for movements so that a virtual tree appears stationery with respect to the physical ground. Examples of mixed realities include augmented reality and augmented virtuality. Augmented reality: an augmented reality (AR) environment refers to a simulated environment in which one or more virtual objects are superimposed over a physical environment, or a representation thereof. For example, an electronic system for presenting an AR environment may have a transparent or translucent display through which a person may directly view the physical environment. The system may be configured to present virtual objects on the transparent or translucent display, so that a person, using the system, perceives the virtual objects superimposed over the physical environment. Alternatively, a system may have an opaque display and one or more imaging sensors that capture images or video of the physical environment, which are representations of the physical environment. The system composites the images or video with virtual objects, and presents the composition on the opaque display. A person, using the system, indirectly views the physical environment by way of the images or video of the physical environment, and perceives the virtual objects superimposed over the physical environment. As used herein, a video of the physical environment shown on an opaque display is called “pass-through video,” meaning a system uses one or more image sensor(s) to capture images of the physical environment, and uses those images in presenting the AR environment on the opaque display. Further alternatively, a system may have a projection system that projects virtual objects into the physical environment, for example, as a hologram or on a physical surface, so that a person, using the system, perceives the virtual objects superimposed over the physical environment. An augmented reality environment also refers to a simulated environment in which a representation of a physical environment is transformed by computer-generated sensory information. For example, in providing pass-through video, a system may transform one or more sensor images to impose a select perspective (e.g., viewpoint) different than the perspective captured by the imaging sensors. As another example, a representation of a physical environment may be transformed by graphically modifying (e.g., enlarging) portions thereof, such that the modified portion may be representative but not photorealistic versions of the originally captured images. As a further example, a representation of a physical environment may be transformed by graphically eliminating or obfuscating portions thereof. Augmented virtuality: an augmented virtuality (AV) environment refers to a simulated environment in which a virtual or computer generated environment incorporates one or more sensory inputs from the physical environment. The sensory inputs may be representations of one or more characteristics of the physical environment. For example, an AV park may have virtual trees and virtual buildings, but people with faces photorealistically reproduced from images taken of physical people. As another example, a virtual object may adopt a shape or color of a physical article imaged by one or more imaging sensors. As a further example, a virtual object may adopt shadows consistent with the position of the sun in the physical environment.

Hardware: there are many different types of electronic systems that enable a person to sense and/or interact with various CGR environments. Examples include head mounted systems, projection-based systems, heads-up displays (HUDs), vehicle windshields having integrated display capability, windows having integrated display capability, displays formed as lenses designed to be placed on a person's eyes (e.g., similar to contact lenses), headphones/earphones, speaker arrays, input systems (e.g., wearable or handheld controllers with or without haptic feedback), smartphones, tablets, and desktop/laptop computers. A head mounted system may have one or more speaker(s) and an integrated opaque display. Alternatively, a head mounted system may be configured to accept an external opaque display (e.g., a smartphone). The head mounted system may incorporate one or more imaging sensors to capture images or video of the physical environment, and/or one or more microphones to capture audio of the physical environment. Rather than an opaque display, a head mounted system may have a transparent or translucent display. The transparent or translucent display may have a medium through which light representative of images is directed to a person's eyes. The display may utilize digital light projection, OLEDs, LEDs, uLEDs, liquid crystal on silicon, laser scanning light sources, or any combination of these technologies. The medium may be an optical waveguide, a hologram medium, an optical combiner, an optical reflector, or any combination thereof. In one embodiment, the transparent or translucent display may be configured to become opaque selectively. Projection-based systems may employ retinal projection technology that projects graphical images onto a person's retina. Projection systems also may be configured to project virtual objects into the physical environment, for example, as a hologram or on a physical surface.

The foregoing is merely illustrative and various modifications can be made by those skilled in the art without departing from the scope and spirit of the described embodiments. The foregoing embodiments may be implemented individually or in any combination.

Electronic Device with Antenna Connections Between Curved Conductors

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