1. Technical Field
The present disclosure relates to electronic devices, and particularly, to an electronic device with a cooling module.
2. Description of Related Art
Mini electronic devices, such as mini computers, are increasingly used in more fields. During operation, the electronic components generate a lot of heat in the housings of the mini electronic devices. A common method for dissipating the heat is to use fans. However, the housing of the mini electronic device is too small to arrange enough fans for heat dissipating.
Many aspects of the present embodiments can be better understood with reference to the following drawing. The components in the drawing are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawing, like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawing, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The cooling module 40 includes a chassis 41 defining a receiving space 410, and a semiconductor chilling plate 42 received in the receiving space 410. A first heat sink 43 is received in the receiving space 410 and attached to a heat side of the semiconductor chilling plate 42. A second heat sink 44 is received in the receiving space 410 and attached to a cool side of the semiconductor chilling plate 42. The chassis 41 includes a first side plate 411 facing the motherboard 10, and a second side plate 412 facing the hard disk drive area 30. The first side plate 411 defines two through holes 413 aligning with the second heat sink 44 for arranging two first fans 50. The second side plate 412 defines two first inlets 4121 aligning with the second heat sink 44, and a second inlet 4122 aligning with the first heat sink 43. A second fan 60 is placed at one end of the chassis 41 adjacent to the housing 100. The housing 100 defines a through hole 101 aligning with the second fan 60, to expose the second fan 60.
The chassis 41 is made of adiabatic material.
The semiconductor chilling plate 42, the first fans 50, and the second fan 60 are electrically connected to the motherboard 10, to be powered by the motherboard 10. The motherboard 10 can sense the temperature in the housing 100 to adjust the speeds of the first and second fans 50 and 60 and the refrigerating output of the semiconductor chilling plate 42.
When the electronic device 1 operates, a first airflow A coming from outside flows through the hard disk drive area 30 to cool the hard disk drives, then flows into the cooling module 40 through the first inlets 4121 to be cooled by the semiconductor chilling plate 42 and the second heat sink 44. The cooled first airflow A flows to the motherboard 10 through the first fans 50 to cool the motherboard 10.
A second airflow B coming from outside flows through the hard disk drive area 30 to cool the hard disk drives, then flows into the cooling module 40 through the second inlets 4122 to cool the first heat sink 43. The heated second airflow B is guided by the second fan 60 to flow to outside through the through hole 101.
In this embodiment, the electronic device 1 utilizes the semiconductor chilling plate 42 to cool the housing 100, which can dissipate heat effectively and reduce quantity of fans.
Even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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2011 1 0394576 | Dec 2011 | CN | national |
Number | Name | Date | Kind |
---|---|---|---|
6813150 | King et al. | Nov 2004 | B2 |
6999315 | Inoue | Feb 2006 | B2 |
7002799 | Malone et al. | Feb 2006 | B2 |
8072753 | Sun | Dec 2011 | B2 |
8120909 | Fu et al. | Feb 2012 | B2 |
8456829 | Chen et al. | Jun 2013 | B2 |
8508942 | Tian et al. | Aug 2013 | B2 |
20080068796 | Pav et al. | Mar 2008 | A1 |
20090059515 | Tsakanikas | Mar 2009 | A1 |
20130141865 | Wu et al. | Jun 2013 | A1 |
Number | Date | Country | |
---|---|---|---|
20130141864 A1 | Jun 2013 | US |