The subject matter herein generally relates to an electronic device with fan modules.
An electronic device, such as a computer, generally includes an enclosure, a central processing unit (CPU) with a fan module, memories, and a plurality of expansion cards, such as graphics cards, located in the enclosure. The fan module is operated to guide air to flow to the CPU to cool the CPU, and then the hot air from the CPU is flowed out of the enclosure under an action of a system fan module.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
Several definitions that apply throughout this disclosure will now be presented.
The term “substantially” is defined to be essentially conforming to the particular dimension, shape or other word that substantially modifies, such that the component need not be exact. For example, substantially cylindrical means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
The enclosure 100 can include a case 10 and a covering plate 20. The case 10 includes a first side plate 11, a second side plate 12, a front plate 13, a rear plate 14, and a bottom plate 15.
The power supply 40 is mounted on the bottom plate 15, adjacent to the rear plate 14, and abuts against the first side plate 11. The power supply 40 includes a first wall 41 substantially parallel to the first side plate 11, a second wall 42 substantially parallel to the rear plate 41, and a third wall 43 substantially parallel to the bottom plate 15. The first wall 41 defines a plurality of first ventilation holes 411. The second wall 42 defines a plurality of second ventilation holes 421. The first fan module 44 includes a first fan 441 secured to the rear plate 14. The rear plate 14 further defines a plurality of first air outlets 141 corresponding to the first fan 441.
The second fan module 50 is mounted on the first heating component 31 and includes a heat sink 51, a second fan 52, and an air duct 53. The second fan 52 is operable to guide air to flow from the first heating component 31 to the air duct 53. The air duct 53 has a cover 533. In at least one embodiment, the air duct 53 is hollow cylindrical to surround the second fan 52. When the second fan 52 is operated, the cover 533 can be opened by the air flow. When the second fan 52 is stopped operating, the cover 533 covers the air duct 53, inhibiting dust from flowing into the enclosure 100. The covering plate 20 defines a second air outlet 21 aligned with the cover 533. A height of the air duct 53 is substantially equal to a distance between the covering plate 20 and the second fan 52.
A third heating component 60 is secured to the front plate 13 and adjacent to the first side plate 11. In one embodiment, the third heating component 60 is a hard disk drive module. The front plate 13 further defines a second air inlet 132 and a third air inlet 133. The second air inlet 132 is adjacent to the second side plate 12. The third air inlet 133 is adjacent to the first side plate 11 and faces to the third heating component 60. Each of the second air inlet 132 and the third air inlet 133 is a shuttered inlet.
Referring to
The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of an electronic device. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, including in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including, the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.
Number | Date | Country | Kind |
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201310650414.4 | Dec 2013 | CN | national |