Patent Application
20120092825
1. Technical Field
The present disclosure relates to electronic devices, and more particularly to an electronic device with a heat dissipation module installed therein.
2. Description of Related Art
Many electronic devices (e.g., portable computers, all-in-one computers, etc.) include a circuit board and a heat dissipation module. The heat dissipation module includes a heat sink attached on a heat generating component of the circuit board and a fan mounted on the heat sink. The heat sink and the fan can dissipate heat from the heat generating component to keep a temperature of the heat generating component within a safe operating range. However, the heat sink and the fan take up much space above the circuit board, which adds to the size of the electronic device.
Therefore, there is room for improvement within the art.
Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation. In the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The mainframe module 10 includes a base panel 12 and a motherboard 14 attached on the base panel 12. A first heat generating component 141 and a second heat generating component 143 are attached on the motherboard 14. A power supply module 15, an optical disk drive 16, and a hard disk drive 17 are attached on the base panel 12. In one embodiment, the first heat generating component 141 is a central processing unit mounted on the motherboard 14. The second heat generating component 143 is a video card that is removable along a direction parallel to the motherboard 14.
The heat dissipation module 50 includes a plurality of fans 20, a first heat sink 30, and a second heat sink 40. The first heat sink 30 includes a first outer shell 32, a plurality of parallel first fins 34 enclosed by the first outer shell 32, and a pair of first heat pipes 36. A first end of the pair of first heat pipes 36 extends through the plurality of first fins 34. A first connecting block 38 is attached to a second end of the pair of first heat pipes 36.
The second heat sink 40 includes a second outer shell 42, a plurality of parallel second fins 44, and a second heat dissipation pipe 46. One end of the second heat dissipation pipe 46 extends through the plurality of second fins 44. A second connecting block 48 is attached to a second end of the second heat dissipation pipe 46.
Referring to
In one embodiment shown in
The first heat dissipation module 50 or the second heat dissipation module 50a is attached on the base panel 12, rather than being attached on the heat generating components directly, which can save space above the motherboard 14 and reduce a thickness of the electronic device.
While the present disclosure has been illustrated by the description of preferred embodiments thereof, and while the preferred embodiments have been described in considerable detail, it is not intended to restrict or in any way limit the scope of the appended claims to such details. Additional advantages and modifications within the spirit and scope of the present disclosure will readily appear to those skilled in the art. Therefore, the present disclosure is not limited to the specific details and illustrative examples shown and described.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201010509999.4 | Oct 2010 | CN | national |
