1. Technical Field
The present disclosure relates to an electronic device including a heat dissipation module.
2. Description of Related Art
In a server, a row of system fans is supplied to dissipate heat for electronic components of the motherboard. If the temperature of one of the areas of the motherboard increases, the corresponding fan usually speeds up to supply more airflow for the area. However, the noise generated by the high speed fan can be bothersome.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
The circuit board 10 includes a plurality of electronic components 12, and a plurality of sensors 14 to test temperature of different areas 13 of the circuit board 10.
The stopping doors 30 are mounted on a top of the rail 23 away from the circuit board 10. Each stopping door 30 can be folded or spread along a longitudinal direction of the rail 23.
An airflow outlet 61 of the fan 60 faces the circuit board 10, and an airflow inlet 62 of the fan 60 is opposite to the circuit board 10. Portions of the fan 60 at opposite sides of the airflow inlet 62 are respectively fastened to two neighboring stopping doors 30 located at opposite sides of the fan 60.
When the temperature of one of the areas 13 is relatively high, the corresponding sensor 14 sends signals to the chip 55 of the sliding block 50 near the area 13. The chip 55 receives the signals and controls the corresponding motor 53 to drive the corresponding wheel 51 to roll. Therefore, the sliding block 50 slides along the bracket 20 and is gradually near the high temperature area 13. The fan 60 fastened to the sliding block 50 can supply more airflow for the high temperature area 13. As the signals of the sensors 14, the chips 55 control the sliding blocks 50 with the fans 60 to slide toward the areas 13 having higher temperature than other areas 13, thereby increasing the heat dissipation efficiency.
Obviously, when one of the fans 60 moves, one of the stopping doors 30 fastened to the fan 60 and opposite to the movement direction of the fan 60 spreads, and the other stopping door 30, fastened to the fan 60 and toward the movement direction of the fan 60, is folded. The stopping doors 30 can block the high temperature airflow from the circuit board 10 to flow to the airflow inlets 62 of the fans 60, thus avoid decreasing the heat dissipation efficiency of the fans 60.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and various changes may be made thereto without departing from the spirit and scope of the description or sacrificing all of their material advantages, the examples hereinbefore described merely being embodiments.
| Number | Date | Country | Kind |
|---|---|---|---|
| 101138367 | Oct 2012 | TW | national |