This relates generally to electronic devices and, more particularly, to electronic devices with antennas and other wireless circuitry.
Electronic devices often include wireless circuitry with antennas. For example, cellular telephones, computers, and other devices often contain antennas for supporting wireless communications.
It can be challenging to form electronic device antenna structures with desired attributes. In large electronic devices, antennas can sometimes be isolated from the surrounding environment. This makes the antennas relatively immune to environmental effects, but is not feasible in smaller devices. In a compact electronic device, antenna structures may be formed on or near the external surfaces of the device. This may make antenna performance subject to environmental influence. If, for example, a portion of an antenna is touched by a user's hand, the antenna can be detuned. Antenna detuning has the potential to adversely impact wireless communications performance.
It would therefore be desirable to be able to provide wireless circuitry and electrical components for electronic devices that exhibit enhanced immunity to environmental detuning.
An electronic device may have wireless circuitry. The wireless circuitry may include a radio-frequency transceiver circuit coupled to one or more antennas. The electronic device may have a housing. Peripheral conductive housing structures in the housing may be used to form an inverted-F antenna resonating element and an antenna ground
An antenna may be formed from the inverted-F antenna resonating element, the antenna ground, and other antenna structures. A tip of the antenna resonating element and the antenna ground may be separated by a peripheral housing gap filled with plastic. The antenna may be sensitive to capacitance changes induced by the presence of a user's hand overlapping the gap or other portions of the antenna. A hand capacitance sensing electrode may be mounted in the plastic of the gap or elsewhere in the vicinity of the antenna.
A transmission line may couple the radio-frequency transceiver circuit to the antenna. Another transmission line may couple the hand capacitance sensing electrode to the antenna to retune the antenna in the event that the user's hand overlaps the antenna.
Electronic devices such as electronic device 10 of
The antennas of the wireless communications circuitry can include loop antennas, inverted-F antennas, strip antennas, planar inverted-F antennas, slot antennas, hybrid antennas that include antenna structures of more than one type, or other suitable antennas. Conductive structures for the antennas may, if desired, be formed from conductive electronic device structures. The conductive electronic device structures may include conductive housing structures. The housing structures may include peripheral structures such as peripheral conductive structures that run around the periphery of an electronic device. The peripheral conductive structure may serve as a bezel for a planar structure such as a display, may serve as sidewall structures for a device housing, may have portions that extend upwards from an integral planar rear housing (e.g., to form vertical planar sidewalls or curved sidewalls), and/or may form other housing structures. Gaps may be formed in the peripheral conductive structures that divide the peripheral conductive structures into peripheral segments. One or more of the segments may be used in forming one or more antennas for electronic device 10. Antennas may also be formed using an antenna ground plane formed from conductive housing structures such as metal housing midplate structures and other internal device structures. Rear housing wall structures may be used in forming antenna structures such as an antenna ground.
Electronic device 10 may be a portable electronic device or other suitable electronic device. For example, electronic device 10 may be a laptop computer, a tablet computer, a somewhat smaller device such as a wrist-watch device, pendant device, headphone device, earpiece device, or other wearable or miniature device, a handheld device such as a cellular telephone, a media player, or other small portable device. Device 10 may also be a television, a set-top box, a desktop computer, a computer monitor into which a computer has been integrated, or other suitable electronic equipment.
Device 10 may include a housing such as housing 12. Housing 12, which may sometimes be referred to as a case, may be formed of plastic, glass, ceramics, fiber composites, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or a combination of these materials. In some situations, parts of housing 12 may be formed from dielectric or other low-conductivity material. In other situations, housing 12 or at least some of the structures that make up housing 12 may be formed from metal elements.
Device 10 may, if desired, have a display such as display 14. Display 14 may be mounted on the front face of device 10. The rear face of device 10 may be formed from a planar rear housing wall in housing 12. Display 14 may be a touch screen that incorporates capacitive touch electrodes or may be insensitive to touch.
Display 14 may include image pixels formed from light-emitting diodes (LEDs), organic LEDs (OLEDs), plasma cells, electrowetting pixels, electrophoretic pixels, liquid crystal display (LCD) components, or other suitable image pixel structures. A display cover layer such as a layer of clear glass or plastic may cover the surface of display 14. Buttons such as button 24 may pass through openings in the cover layer. The cover layer may also have other openings such as an opening for speaker port 26.
Housing 12 may include peripheral housing structures such as structures 16. Structures 16 may run around the periphery of device 10 and display 14. In configurations in which device 10 and display 14 have a rectangular shape with four edges, structures 16 may be implemented using peripheral housing structures that have a rectangular ring shape with four corresponding edges (as an example). Peripheral structures 16 or part of peripheral structures 16 may serve as a bezel for display 14 (e.g., a cosmetic trim that surrounds all four sides of display 14 and/or that helps hold display 14 to device 10). Peripheral structures 16 may also, if desired, form sidewall structures for device 10 (e.g., by forming a metal band with vertical sidewalls, curved sidewalls, etc.).
Peripheral housing structures 16 may be formed of a conductive material such as metal and may therefore sometimes be referred to as peripheral conductive housing structures, conductive housing structures, peripheral metal structures, or a peripheral conductive housing member (as examples). Peripheral housing structures 16 may be formed from a metal such as stainless steel, aluminum, or other suitable materials. One, two, or more than two separate structures may be used in forming peripheral housing structures 16.
It is not necessary for peripheral housing structures 16 to have a uniform cross-section. For example, the top portion of peripheral housing structures 16 may, if desired, have an inwardly protruding lip that helps hold display 14 in place. The bottom portion of peripheral housing structures 16 may also have an enlarged lip (e.g., in the plane of the rear surface of device 10). Peripheral housing structures 16 may have substantially straight vertical sidewalls, may have sidewalls that are curved, or may have other suitable shapes. In some configurations (e.g., when peripheral housing structures 16 serve as a bezel for display 14), peripheral housing structures 16 may run around the lip of housing 12 (i.e., peripheral housing structures 16 may cover only the edge of housing 12 that surrounds display 14 and not the rest of the sidewalls of housing 12).
If desired, housing 12 may have a conductive rear surface. For example, housing 12 may be formed from a metal such as stainless steel or aluminum. The rear surface of housing 12 may lie in a plane that is parallel to display 14. In configurations for device 10 in which the rear surface of housing 12 is formed from metal, it may be desirable to form parts of peripheral conductive housing structures 16 as integral portions of the housing structures forming the rear surface of housing 12. For example, a rear housing wall of device 10 may be formed from a planar metal structure and portions of peripheral housing structures 16 on the sides of housing 12 may be formed as vertically extending integral metal portions of the planar metal structure. Housing structures such as these may, if desired, be machined from a block of metal and may include one or more separate pieces.
Display 14 may include conductive structures such as an array of capacitive electrodes, conductive lines for addressing pixel elements, driver circuits, etc. Housing 12 may include internal structures such as metal frame members, a planar housing member (sometimes referred to as a midplate) that spans the walls of housing 12 (i.e., a substantially rectangular sheet formed from one or more parts that is welded or otherwise connected between opposing sides of member 16), printed circuit boards, and other internal conductive structures. These conductive structures, which may be used in forming a ground plane in device 10, may be located in the center of housing 12 (e.g., the portion of display 14 that contains a display module for displaying images and that lie between end regions 22 and 20).
In regions 22 and 20, openings may be formed within the conductive structures of device 10 (e.g., between peripheral conductive housing structures 16 and opposing conductive ground structures such as conductive housing midplate or rear housing wall structures, a printed circuit board, and conductive electrical components in display 14 and device 10). These openings, which may sometimes be referred to as gaps, may be filled with air, plastic, and other dielectrics.
Conductive housing structures and other conductive structures in device 10 such as a midplate, traces on a printed circuit board, display 14, and conductive electronic components may serve as a ground plane for the antennas in device 10. The openings in regions 20 and 22 may serve as slots in open or closed slot antennas, may serve as a central dielectric region that is surrounded by a conductive path of materials in a loop antenna, may serve as a space that separates an antenna resonating element such as a strip antenna resonating element or an inverted-F antenna resonating element from the ground plane, may contribute to the performance of a parasitic antenna resonating element, or may otherwise serve as part of antenna structures formed in regions 20 and 22. If desired, the ground plane that is under the active area of display 14 and/or other metal structures in device 10 may have portions that extend into parts of the ends of device 10 (e.g., the ground may extend towards the dielectric-filled openings in regions 20 and 22).
In general, device 10 may include any suitable number of antennas (e.g., one or more, two or more, three or more, four or more, etc.). The antennas in device 10 may be located at opposing first and second ends of an elongated device housing (e.g., at ends 20 and 22 of device 10 of
Portions of peripheral housing structures 16 may be provided with gap structures. For example, peripheral housing structures 16 may be provided with one or more gaps such as peripheral gaps 18, as shown in
In a typical scenario, device 10 may have upper and lower antennas (as an example). An upper antenna may, for example, be formed at the upper end of device 10 in region 22. A lower antenna may, for example, be formed at the lower end of device 10 in region 20. The antennas may be used separately to cover identical communications bands, overlapping communications bands, or separate communications bands. The antennas may be used to implement an antenna diversity scheme or a multiple-input-multiple-output (MIMO) antenna scheme.
Antennas in device 10 may be used to support any communications bands of interest. For example, device 10 may include antenna structures for supporting local area network communications, voice and data cellular telephone communications, global positioning system (GPS) communications or other satellite navigation system communications, Bluetooth® communications, etc.
A schematic diagram showing illustrative components that may be used in device 10 of
Storage and processing circuitry 30 may be used to run software on device 10, such as internet browsing applications, voice-over-internet-protocol (VOIP) telephone call applications, email applications, media playback applications, operating system functions, etc. To support interactions with external equipment, storage and processing circuitry 30 may be used in implementing communications protocols. Communications protocols that may be implemented using storage and processing circuitry 30 include internet protocols, wireless local area network protocols (e.g., IEEE 802.11 protocols—sometimes referred to as WiFi®), protocols for other short-range wireless communications links such as the Bluetooth® protocol, cellular telephone protocols, MIMO protocols, antenna diversity protocols, etc.
Input-output circuitry 44 may include input-output devices 32. Input-output devices 32 may be used to allow data to be supplied to device 10 and to allow data to be provided from device 10 to external devices. Input-output devices 32 may include user interface devices, data port devices, and other input-output components. For example, input-output devices may include touch screens, displays without touch sensor capabilities, buttons, joysticks, scrolling wheels, touch pads, key pads, keyboards, microphones, cameras, buttons, speakers, status indicators, light sources, audio jacks and other audio port components, digital data port devices, light sensors, motion sensors (accelerometers), capacitance sensors, proximity sensors, fingerprint sensors (e.g., a fingerprint sensor integrated with a button such as button 24 of
Input-output circuitry 44 may include wireless communications circuitry 34 for communicating wirelessly with external equipment. Wireless communications circuitry 34 may include radio-frequency (RF) transceiver circuitry formed from one or more integrated circuits, power amplifier circuitry, low-noise input amplifiers, passive RF components, one or more antennas, transmission lines, and other circuitry for handling RF wireless signals. Wireless signals can also be sent using light (e.g., using infrared communications).
Wireless communications circuitry 34 may include radio-frequency transceiver circuitry 90 for handling various radio-frequency communications bands. For example, circuitry 34 may include transceiver circuitry 36, 38, and 42. Transceiver circuitry 36 may handle 2.4 GHz and 5 GHz bands for WiFi® (IEEE 802.11) communications and may handle the 2.4 GHz Bluetooth® communications band. Circuitry 34 may use cellular telephone transceiver circuitry 38 for handling wireless communications in frequency ranges such as a low communications band from 700 to 960 MHz, a midband from 1710 to 2170 MHz, and a high band from 2300 to 2700 MHz or other communications bands between 700 MHz and 2700 MHz or other suitable frequencies (as examples). Circuitry 38 may handle voice data and non-voice data. Wireless communications circuitry 34 can include circuitry for other short-range and long-range wireless links if desired. For example, wireless communications circuitry 34 may include 60 GHz transceiver circuitry, circuitry for receiving television and radio signals, paging system transceivers, near field communications (NFC) circuitry, etc. Wireless communications circuitry 34 may include global positioning system (GPS) receiver equipment such as GPS receiver circuitry 42 for receiving GPS signals at 1575 MHz or for handling other satellite positioning data. In WiFi® and Bluetooth® links and other short-range wireless links, wireless signals are typically used to convey data over tens or hundreds of feet. In cellular telephone links and other long-range links, wireless signals are typically used to convey data over thousands of feet or miles.
Wireless communications circuitry 34 may include antennas 40. Antennas 40 may be formed using any suitable antenna types. For example, antennas 40 may include antennas with resonating elements that are formed from loop antenna structures, patch antenna structures, inverted-F antenna structures, slot antenna structures, planar inverted-F antenna structures, helical antenna structures, hybrids of these designs, etc. Different types of antennas may be used for different bands and combinations of bands. For example, one type of antenna may be used in forming a local wireless link antenna and another type of antenna may be used in forming a remote wireless link antenna.
As shown in
To provide antenna structures such as antenna(s) 40 with the ability to cover communications frequencies of interest, antenna(s) 40 may be provided with circuitry such as filter circuitry (e.g., one or more passive filters and/or one or more tunable filter circuits). Discrete components such as capacitors, inductors, and resistors may be incorporated into the filter circuitry. Capacitive structures, inductive structures, and resistive structures may also be formed from patterned metal structures (e.g., part of an antenna). If desired, antenna(s) 40 may be provided with adjustable circuits such as tunable components 102 to tune antennas over communications bands of interest. Tunable components 102 may be part of a tunable filter or tunable impedance matching network, may be part of an antenna resonating element, may span a gap between an antenna resonating element and antenna ground, etc. Tunable components 102 may include tunable inductors, tunable capacitors, or other tunable components. Tunable components such as these may be based on switches and networks of fixed components, distributed metal structures that produce associated distributed capacitances and inductances, variable solid state devices for producing variable capacitance and inductance values, tunable filters, or other suitable tunable structures. During operation of device 10, control circuitry 30 may issue control signals on one or more paths such as path 88 that adjust inductance values, capacitance values, or other parameters associated with tunable components 102, thereby tuning antenna structures 40 to cover desired communications bands.
Path 92 may include one or more transmission lines. As an example, signal path 92 of
Transmission line 92 may be coupled to antenna feed structures associated with antenna structures 40. As an example, antenna structures 40 may form an inverted-F antenna, a slot antenna, a hybrid inverted-F slot antenna or other antenna having an antenna feed with a positive antenna feed terminal such as terminal 98 and a ground antenna feed terminal such as ground antenna feed terminal 100. Positive transmission line conductor 94 may be coupled to positive antenna feed terminal 98 and ground transmission line conductor 96 may be coupled to ground antenna feed terminal 92. Other types of antenna feed arrangements may be used if desired. The illustrative feeding configuration of
A directional coupler may be interposed in transmission line path 92. Control circuitry 30 and transceiver circuitry 90 may gather phase and magnitude information on the impedance of antenna 40 (or part of antenna 40) using the directional coupler. By using the coupler or other circuitry to gather real time information on the impedance of antenna 40, control circuitry 30 can determine when antenna 40 is being loaded by external objects (e.g., when a user's hand is in the vicinity of antenna 40 and is therefore affecting the impedance of antenna 40). If desired, control circuitry 30 may use information from a proximity sensor (see. e.g., sensors 32 of
Passive retuning circuitry may also be provided in device 10 to help prevent antenna 40 from being detuned due to the presence of an external object such as a user's hand or other body part. In a passive retuning arrangement, a capacitance change or other change that is produced by the user's hand (or other external object) is used to adjust antenna 40 in a way that prevents antenna 40 from exhibiting undesired detuning effects. By using passive retuning structures, the need to implement active tuning control for components 102 may be reduced or may even be eliminated (if desired).
The potential of an external object to influence antenna performance is illustrated in connection with the illustrative antenna of
As shown in
Main resonating element arm 108 may be coupled to ground 104 by return path 110. Antenna feed 112 may include positive antenna feed terminal 98 and ground antenna feed terminal 100 and may run in parallel to return path 110 between arm 108 and ground 104. The antenna feed for antenna 40 may include positive antenna feed terminal 98 and ground antenna feed terminal 100.
Antenna 40 may be implemented using conductive structures in device 10 such as conductive housing structures, metal traces on a plastic carrier or printed circuit, etc. With one suitable arrangement, arm 108 and/or portions of ground 104 may be formed from peripheral conductive housing structures 16. Gap 18 may separate tip portion 120 of arm 108 from nearby portion 122 of ground 104 (and a corresponding gap 18 on an opposing side of device 10 may separate the tip of branch 108′ of arm 108 from a corresponding adjacent portion of ground 104).
Resonating element arm portion 120 and antenna ground portion 122 form electrodes in a capacitor (i.e., gap 18 is associated with a capacitance C). The value of the capacitance between portion 120 and portion 122 is influenced by the operating environment of antenna 40. In particular, the value of capacitance C associated with gap 18 may be influenced by whether or not an external object such as user hand 124 is adjacent to gap 18 of antenna 40. Electric fields such as electric fields E1 and E2 may develop between portions 120 and 122. The change in capacitance C results from the varying environments of the electric fields between portions 120 and 122. In some situations such as the illustrative scenario shown in
The location of the portion of antenna 40 that experiences a change in capacitance or other impedance change due to the presence of a user's hand in the vicinity of antenna 40 affects the results of the capacitance change. In an inverted-F antenna of the type shown in
To help passively counteract the undesired effects of increasing capacitance C between portions 120 and 122 due to contact between a user's hand and antenna 40 in the vicinity of gap 18, a transmission line may be used to transfer the influence of the presence of the user's hand from the vicinity of gap 18 or other suitable location on device 10 to the vicinity of feed 112. The transmission line may be, for example, a coaxial cable transmission line, a microstrip transmission line, or other transmission line. An electrode may be used to register the presence of the user's hand. When the user's hand touches the electrode, a rise in capacitance is produced. This rise in capacitance is transferred to feed 112 to counteract the expected detuning influence of hand 124 in the vicinity of gap 18 at the tip of arm 108.
Consider, as an example, the illustrative impedances for antenna 40 that are plotted in
In the Smith chart of
If the user's hand or other external object is placed in the presence of gap(s) 18 (i.e., adjacent to antenna 40), antenna impedance 142 has the potential be detuned to impedance 146 (e.g., a value that is at mismatched with respect to transmission line impedance 140 and which therefore may cause antenna 40 to operate with unsatisfactory performance).
To prevent this detuning from adversely affecting antenna operation, antenna 40 may be passively retuned. In particular, an electrode may be provided near the external surface of device 10 in the vicinity of antenna 40 (e.g., near gap 18). Impedance changes in the vicinity of this electrode due to the presence of the user's hand may be conveyed to a suitable location in antenna 40 such as antenna feed 112 by a transmission line to counteract the potential antenna detuning associated with impedance 146. As shown in
Transceiver circuitry 90 may be coupled to antenna feed terminals 98 and 100 using transmission line 92. Impedance matching circuit 166 may be coupled between terminals 98 and 100 to help match the impedance of transmission line 92 to the impedance of antenna 40. Gaps 18 in the peripheral conductive housing structures of housing 12 may separate the ends of inverted-F antenna resonating element 108 from grounded portions of housing 12 (i.e., antenna ground). Gaps 18 may be filled with polymer or other dielectric. For example, right-hand gap 18 of
An electrode such as electrode 154 may be located on or near the external surface of antenna 40 in the vicinity of gap 18 or may be mounted in device 10 in another location that allows electrode 154 to sense capacitance changes associated with the presence and absence of the user's hand or other external object. In the example of
A transmission line such as coaxial cable 160 may be coupled between electrode 154 and feed 112. Cable 160 may have a positive inner conductor such as center conductor 156 that is coupled to electrode 154 and may have an outer ground conductor that is shorted to ground 104 at node 158. At end 162 of cable 160, center conductor 156 may be coupled to center conductor 94 of coaxial cable 92 (or other transmission line) through capacitor 164 or other coupling circuitry. The outer ground conductor of cable 160 at end 162 may be coupled to ground antenna feed terminal 100. Positive antenna feed terminal 98 in feed 112 may be coupled to resonating element 108 (e.g., the segment of peripheral conductive housing structure that stretches between the left-hand and right-hand peripheral gaps 18 of
The response of antenna 40 when device 10 is held in the hand of a user is shown in
The foregoing is merely illustrative and various modifications can be made by those skilled in the art without departing from the scope and spirit of the described embodiments. The foregoing embodiments may be implemented individually or in any combination.