Patent Application
20170077627
This application is based on reference Japanese Patent Application No. 2015-180938 filed on Sep. 14, 2015, the disclosure of which is incorporated herein by reference.
The present disclosure relates to an electronic device including a substrate having a through hole and a press-fit terminal fit into the through hole.
Conventionally, there has been known an electronic control unit (electronic device) that includes a circuit board (substrate) and a press-fit terminal (see, for example, Patent Literature 1: JP 2004-134301 A). The circuit board includes a through hole into which the press-fit terminal is fit and a conductor (land) formed in a wall of the through hole.
In Patent Literature 1, the press-fit terminal is fit into the through hole via a jig for press fitting. After inserting a hollow jig into the through hole, the press-fit terminal is fit into the jig. Next, the jig is removed from the through hole, and then the press-fit terminal is fit into the through hole. Compared with a way of press-fitting without the jig, it is possible to suppress an increase in load applied to the circuit board generated when press-fitting the press-fit terminal. Therefore, damage to the circuit board due to the press-fitting of the press-fit terminal can be suppressed.
However, in the above-described way, the width of the press-fit terminal along a direction perpendicular to the thickness direction of the circuit board needs to be narrower than the internal diameter of the jig. In other words, greater deformation of the press-fit terminal is needed as compared with a way without using the jig. Thus, there is concern about plastic deformation of the press-fit terminal. When the plastic deformation of the press-fit terminal occurs after pulling out the jig, a contact reaction force applied to the substrate from the press-fit terminal may decrease. As a result, after pulling out the jig, a holding force acting between the press-fit terminal and the circuit board may be decreased.
In view of the above, it is an objective of the present disclosure to provide an electronic device that suppresses an increase in load applied to a substrate when press-fitting the press-fit terminal and that maintains a holding force between the substrate and the press-fit terminal.
In an aspect of the present disclosure, an electronic device includes a substrate, and a press-fit terminal. The substrate includes a first surface, a second surface opposite to the first surface in a thickness direction of the substrate, a through hole, and an electrode formed in the first surface, the second surface, and a wall of the through hole. The press-fit terminal is fit into the through hole from the first surface while being elastically deformed. The press-fit terminal is connected to the electrode by a reaction force due to the elastic deformation of the press-fit terminal. The substrate includes (i) a core layer that is overlapped, in the thickness direction, with a contact portion of the electrode with the press-fit terminal, and (ii) a flexible layer that is at a position closer to the first surface than the core layer is to. The flexible layer has a lower elastic modulus than the core layer.
In the aspect, when press-fitting the press-fit terminal into the through hole, the flexible layer can be easily deformed by load from the press-fit terminal. Thus, an increase in load applied to the substrate during the press-fitting of the press-fit terminal can be suppressed by the deformation of the flexible layer.
The direction in which load is applied to the substrate from the press-fit terminal is perpendicular to the thickness direction of the substrate. In the above-described configuration, the core layer that is less deformable than the flexible layer is overlapped, in the thickness direction, with the contact portion of the electrode with the press-fit terminal. Accordingly, after press-fitting the press-fit terminal into the through hole, the substrate can be less likely to be deformed due to load from the press-fit terminal. Hence, it is possible to suppress a decrease in a holding force between the press-fit terminal and the substrate.
The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description made with reference to the accompanying drawings. In the drawings:
As follows, a plurality of embodiments of the present disclosure will be described in detail. It is needless to say that the embodiments are some examples of the present disclosure, and therefore the present disclosure is not limited to these embodiment. Furthermore, each of the substantially same structures among the embodiments will be assigned to the respective common referential numeral and the description of the substantially same structures will be omitted in the subsequent embodiments. In the following, a thickness direction of a substrate is defined as a direction Z, a particular direction perpendicular to the direction Z is defined as a direction X, and a direction perpendicular to both the direction Z and the direction X is defined as a direction Y. Furthermore, a plane defined by the direction X and the direction Y is defined as an X-Y plane and a shape along the X-Y plane is referred as a “plane shape”.
Referring to
As shown in
As shown in
The base 12 serves as an electric insulation layer of the substrate 10. The base 12 includes a core layer 12a, a flexible layer 12b more flexible than the core layer 12a. The core layer 12a and the flexible layer 12b are laminated on each other in the direction Z. More specifically, the flexible layer 12b is formed at a position closer to the top surface 10a than the core layer 12a is to. One surface of the flexible layer 12b serves as the top surface 10a of the substrate 12.
A resin material having peel strength of 0.9 N/mm or more and having an elastic modulus more than 10 GPa can be used as material of the core layer 12a. In the present embodiment, the core layer 12a has an elastic modulus of 16 GPa. On the contrary, a resin material having peel strength of 0.9 N/mm or less and having elastic modulus of 10 GPa or less can be used as material of the flexible layer 12b. In the present embodiment, the flexible layer 12b has an elastic modulus of 8 GPa. In the present embodiment, the core layer 12a and the flexible layer 12b are formed with a pre-preg formed by infiltrating resin into a glass cloth. A type of resin to be infiltrated into the glass cloth used for the core layer 12a is different from that for the flexible layer 12b.
The through hole 14 is a hole of the substrate 10 at which the substrate 10 is mechanically connected to the press-fit terminal 40. The through hole 14 passes through the substrate 10 from the top surface 10a to the bottom surface 10b. As shown in
The electrode 16 is an electrode for the substrate 10 that is disposed at the through hole 14. The electrode 16 is formed of metallic material, more specifically, of nickel. In other words, the electrode 16 includes a plating layer formed of nickel. In the present embodiment, the electrode 16 further includes another plating layer formed of copper and gold in addition to the plating layer formed of nickel. The electrode 16 is formed by laminating a plurality of the plating layers on each other.
The electrode 16 includes a wall portion 16a formed on a wall of the through hole 14, a bottom portion 16b formed on the bottom surface 10b, and a top portion 16c formed on the top surface 10a. The wall portion 16a defines a wall surface of the through hole 14. The wall portion 16a, the bottom portion 16b, and the top portion 16c are connected to each other.
The wall portion 16a, the bottom portion 16b, and the top portion 16c exhibit a substantially annular plane shape having an inner circumferential edge and an outer circumferential edge. When viewed in the direction Z, the inner circumferential edges of the wall portion 16a, the bottom portion 16b, and the top portion 16c are overlapped with each other. Furthermore, when viewed in the direction Z, the outer circumferential edges of the bottom portion 16b and the top portion 16c surround the outer circumferential edge of the wall portion 16a.
In the present embodiment, the substrate 10 further includes two pairs of a circuit layer, a land, and a solder resist, all of which are not illustrated. One of the two pairs of the circuit layer, the land, and the solder resist is formed on one side of the core layer 12a opposite to the flexible layer 12b and the other of the two pairs is formed on one side of the flexible layer 12b opposite to the core layer 12a. A circuit layer is further formed between the core layer 12a and the flexible layer 12b. The land is an electrode of the substrate 10 for mounting the electronic component 20 on the substrate 10.
The substrate 10 is fixed to at least one of the case 30 and the housing 50. For example, fastening by a screw may be used as means for fixing the substrate 10. Alternatively, a press-fit terminal (not illustrated) different from the press-fit terminal 40, which is fixed to the case 30, may be used to fix the substrate 10 to the case 30. In this case, the press-fit terminal different from the press-fit terminal 40 may be fit into a through hole in the substrate 10 that is different from the through hole 14.
The electro components 20 form an electronic circuit together with the substrate 10. In the present embodiment, the electro components 20 are a surface mounted type component. However, a mounting structure for the electronic components 20 may be not limited to the present embodiment. The insertion mounted type can be used in addition to the surface mounted type. A diode, a coil, a capacitor, a resistor, an IC chip, a microcomputer, an ASIC, or the like may be used as the electronic component 20.
The case 30 serves as a housing member that houses a portion of the press-fit terminal 40, the substrate 10, and the electronic component 20, and as a connector for the electronic device 100. The case 30 includes a bottom 32 and has a box shape with an opening at one side of the case 30 opposite to the bottom 32. The bottom 32 has a substantially plate shape having a thickness along the direction Z. The opening of the case 30 is closed by the housing 50. The case 30 is arranged to cover the substrate 10 and the electronic components 20. An internal surface 32a of the bottom 32 close to the substrate 10 faces the top surface 10a in the direction Z. The case 30 is formed of resin material.
The case 30 further includes extension portions 34 that extend from the bottom 32 in the direction Z away from the substrate 10. Each of the extension portions 34 has a substantially cylindrical shape. The extension portions 34 and the bottom 32 provide a connector housing into which a connector for external components is fit. In the present embodiment, the external components are the battery and the ECU.
The press-fit terminals 40 are integrally formed with the bottom 32 by insert molding. In other words, the press-fit terminals 40 are held by the bottom 32. The connector housing and the press-fit terminals 40 provide a connector for the electronic device 100. Each of the press-fit terminals 40 and the external components are electrically connected to each other when the connector of the external components is fit into the connector housing.
The press-fit terminal 40 extends in the direction Z. One ends of the press-fit terminals 40 exist inside a space defined between the extension portions 34. The other ends of the press-fit terminals 40 form elastic members 42 fit into the through holes 14. The elastic member 42 is fit into the through hole 14 from the top surface 10a of the substrate 10. The elastic member 42 press-fit into the through hole 14 applies a reaction force generated from elastic deformation to the wall portion 16a. As a result, the press-fit terminal 40 and the substrate 10 are held by each other, and therefore electrically and mechanically connected to each other.
The elastic member 42 includes a pair of arms 42a, a first connector 42b, and a second connector 42c. The pair of arms 42a face each other in the direction X and each of the arms 42a includes a contact surface 42d in contact with the wall portion 16a. In other words, the electrode 16 includes a contact portion 16d in contact with the press-fit terminal 40. The contact surface 42d is defined as a portion of the arm 42a that is in contact with the electrode 16. The contact surface 42d extends along the direction Z and has a curved surface along the wall surface of the through hole 14.
The contact portion 16d is a portion of the wall portion 16a that is in contact with the arm 42a. That is, the contact portion 16d is a portion of the substrate 10 that is in contact with the press-fit terminal 40. The contract portion 16d is within a specified region along the direction Z. The contact portion 16d is formed to be overlapped, in the direction Z, with the core layer 12a. In other words, the substrate 10 and the press-fit terminal 40 are arranged so that the contact portion 16d is overlapped with the core layer 12a in the direction Z. In the present embodiment, the entire region of the contact portion 16d is overlapped with the substantially entire region of the core layer 12a along the direction Z. Accordingly, the contact portion 16d is not overlapped with the flexible layer 12b in the direction Z.
The first connector 42b connects one ends of the arms 42a. The first connector 42b also serves as a tip end of the press-fit terminal 40. The second connector 42c connects the other ends of the arms 42a.
The housing 50 serves, together with the case 30, as a housing member that houses a portion of each of the press-fit terminals 40, the substrate 10, and the electronic components 20. In other words, the housing 50 defines, together with the case 30, a housing space that houses the portions of the press-fit terminals 40, the substrate 10, and the electronic components 20.
The housing 50 has a substantially plate shape having a thickness along the direction Z. An inner surface 50a of the housing 50 close to the substrate 10 faces the substrate 10 in the direction Z. The inner surface 50a closes the opening of the case 30. The housing 50 is formed of, e.g., metallic material or resin material.
Next, a method for assembling the electronic device 100 will be described with reference to
Initially, the substrate 10, on which the electronic components 20 are mounted, and the case 30, that is integrally formed with the press-fit terminals 40, are prepared. Then, as shown in
When moving the press-fit terminal 40 toward the substrate 10 in the press-fitting direction during the press-fitting process, the press-fit terminal 40 is brought into contact with the electrode 16 at a position A. When further moving the press-fit terminal 40 in the press-fitting direction from the position A, the press-fit terminal 40 reaches at a position B. The load applied to the substrate 10 increases as the press-fit terminal 40 is moved from the position A toward the position B.
In the press-fitting process, the load applied to the substrate 10 has a maximum value when the press-fit terminal 40 is at the position B. Therefore, in the comparative substrate, breakage of the press-fit terminal 40 likely occurs when the press-fit terminal 40 is at the position B. For example, separation of at least a portion of the land formed in the wall of the through hole or separation between the layers in the substrate 10 may occur as the breakage of the press-fit terminal 40.
When moving the press-fit terminal 40 from the position B in the press-fitting direction, the press-fit terminal 40 reaches at a position C. The load applied to the substrate 10 decreases as the press-fit terminal 40 is moved from the position B toward the positon C.
In the press-fitting process, load is applied to the substrate 10 from the press-fit terminal 40 in a direction perpendicular to the direction Z. In the present embodiment, the flexible layer 12b is deformed due to load from the press-fit terminal 40 such that the width of the through hole 14 along the direction X expands. As a result, in the present embodiment, load applied to the substrate 10 is lowered as compared with the comparative example when the press-fit terminal 40 is in the range between the position A and the positon C.
When moving the press-fit terminal 40 from the position C in the press-fitting direction, the press-fit terminal 40 reaches at the position D. When the press-terminal 40 reaches at the position D, the press-fitting process is terminated. The position D is defined as a position that the press-fit terminal 40 and the substrate 10 are held with each other.
When the press-fit terminal 40 is at a position between the position C and the position D, at least a portion of the contact portion 16d is overlapped with the core layer 12a in the direction Z. As a result, the substrate 10 with the press-fit terminal 40 at a position between the position C and the position D is less likely deformed as compared with the substrate 10 with the press-fit terminal 40 at a position between the positon A and the position C. Accordingly, load applied to the substrate 10 has the substantially same as the value of the comparative example when the press-fit terminal 40 is at a positon between the position C and the position D.
In the press-fitting process, a portion of the wall portion 16a is worn due to the press-fitting of the press-fit terminal 40. As a result, an oxide film formed on the surface of the wall portion 16a can be removed. By the removal of the oxide film, reliability of electric connection between the substrate 10 and the press-fit terminal 40 can be improved. After the press-fitting process, the housing 50 is fixed to at least one of the case 30 and the substrate 10. Then, assembly of the electronic device 100 is completed.
Next, effects of the electronic device 100 according to the above-described embodiment will be described.
In the present embodiment, when press-fitting the press-fit terminal 40 into the through hole 14, the flexible layer 12b is easily deformed due to load from the press-fit terminal 40. As a result, an increase in load applied to the substrate 10 during the press-fitting process can be suppressed due to the deformation of the flexible layer 12b.
As described above, the direction of load applied to the substrate 10 from the press-fit terminal 40 is a direction perpendicular to the direction Z. In the present embodiment, the core layer 12a that is less likely deformed than the flexible layer 12b is arranged to overlap with the contact portion 16d in the direction Z. Thus, the substrate 10 is less likely deformed due to load from the press-fit terminal 40 after the press-fit terminal 40 is fit into the through hole 14. Accordingly, a decrease in a holding force acting between the press-fit terminal 40 and the substrate 10 can be suppressed. It should be noted that the holding force has the same value of a force necessary to pull the press-fit terminal 40 out of the substrate 10 in a state where the electronic device 100 is assembled.
Generally, a land formed of nickel is more breakable and fragile than a land formed of gold or copper. Therefore, it would be difficult to use the land formed of nickel at the wall of the through hole 14 in a conventional substrate.
On the contrary, in the present embodiment, an increase in load applied to the substrate 10 during the press-fitting of the press-fit terminal 40 can be suppressed because of the flexible layer 12b. Therefore, even if the electrode 16 is formed of nickel, breakage of the electrode 16 can be suppressed. Hence, nickel can be used as a material for the electrode 16, and therefore options of material for the electrode 16 can be increased.
Next, a second embodiment will be described with reference to
As shown in
The intermediate conductor 18 partially exists between the core layer 12a and the flexible layer 12b. In other words, when viewed in the direction Z, only portions of the core layer 12a and the flexible layer 12b are overlapped with the entire of the intermediate conductor 18. The intermediate conductor 18 is overlapped with the contact portion 16d in the direction Z. More specifically, the intermediate conductor 18 is overlapped in the direction Z with a portion of the contact portion 16d that is close to the top surface 10a. The intermediate conductor 18 is arranged to surround the wall portion 16a.
In the present embodiment, the intermediate conductor 18 is connected to the wall portion 16a of the electrode 16. That is, the intermediate conductor 18 is connected to the electrode 16. In other words, the intermediate conductor 18 is electrically and mechanically connected to the electrode 16. In the present embodiment, the intermediate conductor 18 does not provide electric connection, and therefore is not connected to the circuit layer of the substrate 10.
In the present embodiment, the intermediate conductor 18 has a plane shape around the wall portion 16a. The intermediate conductor 18 has a substantially ring shape having a hole passing therethrough in the direction Z. The plane shape of the intermediate conductor 18 has a substantially annular shape having an inner circumferential edge and an outer circumferential edge. When viewed in the direction Z, the inner circumferential edge of the intermediate conductor 18 is overlapped with the outer circumferential edge of the wall portion 16a.
In the present embodiment, deformation of the substrate 10 after press-fitting the press-fit terminal 40 can be effectively suppressed by the intermediate conductor 18. Thus, a decrease in a holding force acting between the press-fit terminal 40 and the substrate 10 can be effectively suppressed.
In the present embodiment, the intermediate conductor 18 is connected to the electrode 16. Accordingly, deformation of the substrate 10 is further effectively suppressed as compared to a case where the intermediate conductor 18 is arranged away from the electrode 16. Therefore, a decrease in the holding force can be effectively suppressed.
In the present embodiment, the plane shape of the intermediate conductor 18 is the annular shape around the through hole 14. Thus, deformation of the substrate 10 in all directions perpendicular to the direction Z can be suppressed. Therefore, a decrease in the holding force can be effectively suppressed.
Although, the intermediate conductor 18 is connected to the electrode 16 in the present embodiment, it would not be limited to this configuration. For example, as shown in a first modification illustrated in
In the first modification, the substrate 10 includes two intermediate conductors 18. The intermediate conductors 18 are arranged at both sides of the wall portion 16a in the direction X. As a result, the two arms 42a are interposed between the two intermediate conductors 18 in the direction X. The base 12 is disposed between the intermediate conductor 18 and the wall portion 16a. Each of the intermediate conductors 18 has a curved plane shape (fan shape). One side surface of each of the intermediate conductors 18 that faces the wall portion 16a is a curved surface extending along the wall portion 16a.
In the present modification, the intermediate conductors 18 are not connected to the circuit layer of the substrate 10. However, the intermediate conductors 18 may electrically connect between the electrode 16 and the circuit layer. In this example, the intermediate conductors 18 also serve as a circuit layer of the substrate 10. Alternatively, the intermediate conductorsl8 may be connected to only the circuit layer and not to the electrode 16.
Next, a third embodiment will be described with reference to
As shown in
The center layer 12c has an elastic modulus with a value falling within the core layer 12a and the flexible layer 12b. In the present embodiment, the elastic modulus of the center layer 12c is set to be about 12 GPa. In the present embodiment, the center layer 12c forms a portion of the base 12. In other words, the center layer 12c is an electric insulation layer of the substrate 10. As with the core layer 12a and the flexible layer 12b, the center layer 12c is formed with a pre-preg formed by infiltrating resin into a glass cloth. A type of resin to be infiltrated into the glass cloth for the center layer 12c is different from the core layer 12a and the flexible layer 12b.
In the present embodiment, the center layer 12c is more deformable than the core layer 12a but less deformable than the flexible layer 12b. Therefore, deformation of the center layer 12c due to load from the press-fit terminal 40 can be less than that of the flexible layer 12b and more than that of the core layer 12a. As a result, separation between the layers in the substrate 10 can be suppressed by the center layer 12c.
Next, a fourth embodiment will described with reference to
As shown in
The wall portion 16a includes a first wall 16e and a second wall 16f that define the wall of the through hole 14. The first wall 16e is connected to the bottom portion 16b at one end of the first wall 16e in the direction Z and the other end of the first wall 16e is connected to the second wall 16f. The contact portion 16d is a portion of the first wall 16e. The first wall 16e has a substantially circular plane shape viewed in the direction Z and has a curved surface extending along the direction Z. The diameter of the first wall 16e is substantially constant in the direction Z. In other words, the width W of the first wall 16e is substantially constant in the direction Z. The second wall 16f is connected to the first wall 16e at one end of the second wall 16f in the direction Z, and the other end of the second wall 16f is connected to the top portion 16c. In other words, the second wall 16f is positioned closer to the top surface 10a than the first wall 16e is to. The second wall 16f is angled relative to the direction Z. The second wall 16f has a substantially circular plate shape when viewed in the direction Z. The diameter of the second wall 16f on the X-Y plane varies according to positions along the direction Z. More specifically, the diameter of the second wall 16f on the X-Y plane increases from the connection portion with the first wall 16e toward the connection portion with the top portion 16c in the direction Z. In other words, the width W of the second wall 16f expands from the connection portion with the first wall 16e toward the connection portion with the top portion 16c in the direction Z.
In the present embodiment, the second wall 16f is overlapped with the flexible layer 12b in the direction Z. On the contrary, the second wall 16f is not overlapped with the core layer 12a in the direction Z. Alternatively, the second wall 16f may be overlapped with the core layer 12a in the direction Z.
In the present embodiment, deformation of the press-fit terminal 40 is small when the press-fit terminal 40 is at a position where the press-fit terminal 40 is in contact with the second wall 16f in the press-fitting process. Accordingly, in the press-fitting process, great deformation of the press-fit terminal 40 can be suppressed when the press-fit terminal 40 is at a positon between the position A and the position B during the press-fitting process. In other words, great deformation of the press-fit terminal 40 at a particular position can be suppressed during the press-fitting process. That is, in the press-fitting process, the press-fit terminal 40 can be deformed in a stepwise manner. Thus, an increase in load applied to the substrate 10 can be suppressed as compared with a configuration where the entire of the wall of the through hole 14 extends along the direction Z.
While the present disclosure has been described with reference to preferred embodiments thereof, it is to be understood that the disclosure is not limited to the preferred embodiments and constructions. The present disclosure is intended to cover various modification and equivalent arrangements. In addition, while the various combinations and configurations, which are preferred, other combinations and configurations, including more, less or only a single element, are also within the spirit and scope of the present disclosure.
In the present embodiments, the electronic device 100 includes the substrate 10, the electronic component 20, the case 30, the press-fit terminal 40, and the housing 50. However, other configuration can be used as long as the electronic device 40 includes at least the substrate 10 and the press-fit terminal 40.
In the present embodiments, the electrode 16 is formed of nickel. Alternatively, material other than nickel may be used for the electrode 16.
In the present embodiments, the contact surface 42d of each of the arms 42a extends along the direction Z and is a curved surface along the wall of the through hole 14. Alternatively, other configurations may be used as long as at least a portion of the elastic member 42 is in contact with the wall portion 16a and a reaction force by elastic deformation of the press-fit terminal 40 is applied to the wall of the press-fit terminal 40. The arm 42a may have a substantially rectangular plane shape.
The contact portion 16d may be formed in the wall portion 16a from the one end to the other end in the direction Z. In other words, the contact surface 42d of the arm 42a may be overlapped with the entire of the wall portion 16a in the direction Z.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2015-180938 | Sep 2015 | JP | national |
