Patent Application
20250131905
The present invention relates to the field of electronic device design technologies, and in particular, to an electronic device.
The call function is a basic function of some electronic devices and realized by a sound apparatus of the electronic device. When a user holds an electronic device to make a call, the sound of the electronic device may leak to the external environment, leading to a privacy leakage of the user. To mitigate the sound leakage, in the electronic device in the related art, an electroacoustic apparatus is provided with an opening that is communicated with a rear cavity. In such case, the vibrations of diaphragms of the sound apparatus cause a first sound wave emitted from the opening and a second sound wave emitted from a front cavity of the electroacoustic apparatus to form out-of-phase sound waves, ultimately achieving a certain degree of cancellation, thereby alleviating sound leakage. However, the opening causes the rear cavity of the sound apparatus to communicate with the external environment, making it easier for a foreign matter (liquid, solid particle, and the like) to intrude into the sound apparatus, thus resulting in the drawback of the electronic device being susceptible to intrusion of the foreign matter.
The present invention discloses an electronic device.
This application discloses an electronic device, including a device housing, a sound apparatus, and a screen. The screen covers the device housing and is provided with a first sound hole at a joint with the device housing. The sound apparatus is disposed in the device housing, and the sound apparatus includes an apparatus housing and an electroacoustic module. The electroacoustic module includes a first diaphragm and a second diaphragm, the apparatus housing is connected to the first diaphragm and the second diaphragm, and the device housing is provided with a second sound hole.
At least the apparatus housing, the screen, the device housing, and the first diaphragm enclose to form a first front cavity, and the first front cavity is communicated with the first sound hole.
At least the apparatus housing and the second diaphragm enclose to form a second front cavity, and the second front cavity is communicated with the second sound hole.
When the electroacoustic module is in a first state, the first sound wave formed by the vibration of the first diaphragm and the second sound wave formed by the vibration of the second diaphragm are in opposite phases.
Reference numerals in the accompanying drawings are described as follows:
To make the objectives, technical solutions, and advantages of the present invention clearer, the following clearly describes the technical solutions of the present invention with reference to the specific embodiments of the present invention and the corresponding accompanying drawings. Apparently, the described embodiments are merely some but not all of the embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
The embodiments of this application disclose an electronic device, and the disclosed electronic device may be a smartphone, a tablet computer, an e-book reader, a game console, or the like. A specific type of the electronic device is not limited in this embodiment of this application.
Referring to
The device housing 100, as a basic component of the electronic device, can directly or indirectly provide an installation base for other components of the electronic device and protection for at least some other components of the electronic device. The screen 300 and the sound apparatus 200 may be directly or indirectly mounted on the device housing 100, thereby achieving installation on the device housing 100. Specifically, the sound apparatus 200 is disposed in the device housing 100, thereby achieving installation based on the device housing 100 and obtaining protection from the device housing 100.
In an embodiment of this application, the screen 300 covers the device housing 100. Specifically, the screen 300 and the device housing 100 may be fixedly bonded using an adhesive layer. A first sound hole 310 is provided at a joint between the screen 300 and the device housing 100. The device housing 100 is provided with a second sound hole 1111.
Both the first sound hole 310 and the second sound hole 1111 are used for sound output. Specifically, the first sound hole 310 may be provided at an edge of the screen 300 connected to the device housing 100, or at an edge of the device housing 100 connected to the screen 300. Certainly, after the first sound hole 310 and the device housing 100 are connected, their connected portions can be spliced for forming the first sound hole 310. This embodiment of this application does not limit the specific position and formation method of the first sound hole 310.
In an optional solution, there is an assembly relationship between the screen 300 and the device housing 100. The screen 300 is assembled with the device housing 100, providing an assembly gap at the joint between the screen 300 and the device housing 100. The assembly gap can serve as the first sound hole 310. In this case, using the assembly gap as the first sound hole 310 can fully utilize the existing structure of the electronic device, thereby avoiding specially creating the first sound hole 310. Additionally, the assembly gap is typically small, and using the assembly gap as the first sound hole 310 provides a better advantage in preventing a foreign matter from intruding into the electronic device.
The sound apparatus 200 is an apparatus capable of emitting sound in the electronic device. The sound apparatus 200 is disposed in the device housing 100. Specifically, the sound apparatus 200 can be fixedly installed in the device housing 100 through bonding, connection by a connector, snap-fitting, or other means.
In this embodiment of this application, the sound apparatus 200 includes an apparatus housing 210 and an electroacoustic module 220. The apparatus housing 210 is a housing portion of the sound apparatus 200, and the electroacoustic module 220 is a sound-generating portion of the sound apparatus 200. The electroacoustic module 220 is disposed in the apparatus housing 210. Specifically, the electroacoustic module 220 is fixed in the apparatus housing 210, and the apparatus housing 210 is connected to the device housing 100, thereby achieving the installation of the electroacoustic module 220 along with the apparatus housing 210 in the device housing 100. The apparatus housing 210 and the device housing 100 may be connected in fixation manners such as bonding, snap-fitting, or connection by a connector.
The electroacoustic module 220 includes a first diaphragm 221 and a second diaphragm 222. During specific operation, the vibration of the first diaphragm 221 can generate a first sound wave, and the vibration of the second diaphragm 222 can generate a second sound wave. The vibration directions of the first diaphragm 221 and the second diaphragm 222 may be the same or different.
As described above, the electroacoustic module 220 is disposed in the apparatus housing 210. Specifically, the apparatus housing 210 is connected to the first diaphragm 221 and the second diaphragm 222. At least the apparatus housing 210, the screen 300, the device housing 100, and the first diaphragm 221 enclose to form a first front cavity 101, and the first front cavity 101 is communicated with the first sound hole 310. The first sound wave formed by the vibration of the first diaphragm 221 propagates to the environment where the electronic device is located sequentially through the first front cavity 101 and the first sound hole 310, thereby achieving sound emission.
At least the apparatus housing 210 and the second diaphragm 222 enclose to form a second front cavity 102, and the second front cavity 102 is communicated with the second sound hole 1111. The second sound wave formed by the vibration of the second diaphragm 222 propagates to the environment of the electronic device sequentially through the second front cavity 102 and the second sound hole 1111, thereby achieving sound emission.
The electroacoustic module 220 disclosed in this embodiment of this application has a first state. When the electroacoustic module 220 is in the first state, the first sound wave formed by the vibration of the first diaphragm 221 and the second sound wave formed by the vibration of the second diaphragm 222 are in opposite phases. The first sound wave and second sound wave with opposite phases can superpose when emitted outside the electronic device, achieving a certain degree of cancellation and mitigating the phenomenon of the first sound wave and second sound wave being heard by other people in a further region, thereby alleviating sound leakage.
Compared with the electronic devices in the related art, the electronic device disclosed in this embodiment of this application has an improved structure, enabling the electronic device to form the first front cavity 101 that is communicated with the first sound hole 310 and the second front cavity 102 that is communicated with the second sound hole 1111, respectively. In the first state, the first sound wave emitted from the first sound hole 310 and the second sound wave emitted from the second sound hole 1111 have opposite phases, achieving a certain degree of cancellation, thereby addressing the issue of sound leakage. Since the first front cavity 101 and the second front cavity 102 transmit the first sound wave and second sound wave with opposite phases and the sound leakage issue can be addressed through sound wave cancellation, avoiding providing for the sound apparatus the opening that is communicated with the rear cavity thereof and preventing the foreign matter from intruding into the rear cavity, thereby addressing the issue of the electronic device being susceptible to intrusion of the foreign matter.
In this embodiment of this application, the apparatus housing 210 may be of an integrated structure. For example, it can be formed by bending or cold pressing a sheet of housing raw material, and the electroacoustic module 220 may be directly wrapped during formation, thereby achieving the assembly connection of the electroacoustic module 220 and the apparatus housing 210. Certainly, considering ease of assembly, in another optional solution, the apparatus housing 210 may be of a split structure, including a first housing 211 and a second housing 212, the first housing 211 being connected to the second housing 212. Specifically, the first housing 211 and the second housing 212 may be assembled and connected through bonding, welding, or other means. This structure can achieve the connection between the first housing 211 and the second housing 212 through assembly, without the need for complex process device, thereby having the advantage of easy assembly.
Since the electroacoustic module 220 and the apparatus housing 210 have an assembly relationship, at least one of the first housing 211 and the second housing 212 has an assembly relationship with the electroacoustic module 220. Based on this, in a further technical solution, the first housing 211 is connected to the first diaphragm 221, and the second housing 212 is connected to the second diaphragm 222, thereby achieving the connection between the apparatus housing 210 and the electroacoustic module 220. Specifically, the first housing 211 and the first diaphragm 221 may be connected through bonding, and similarly, the second housing 212 and the second diaphragm 222 may also be connected through bonding. Certainly, the connection between the first housing 211 and the second housing 212 allows for an interference fit between the first housing 211 and the first diaphragm 221, as well as between the second housing 212 and the second diaphragm 222, thereby achieving the assembly connection between them. Certainly, in this case, the sound apparatus 200 can be clamped by the first housing 211 and the second housing 212, thereby achieving fixed installation. Certainly, it should be noted that the interference fit mentioned here is also a type of connection.
In the case that the apparatus housing 210 includes the first housing 211 and the second housing 212, the first front cavity 101 is at least enclosed by the first housing 211, the screen 300, the device housing 100, and the first diaphragm 221, and the second front cavity 102 is at least enclosed by the second housing 212 and the second diaphragm 222. This method of forming the first front cavity 101 and the second front cavity 102 through separate cooperation of the components (for example, the first housing 211 and the second housing 212) of the apparatus housing 210 of the split structure with the electroacoustic module 220 can be easily achieved through assembly.
As described above, the electroacoustic module 220 disclosed in this embodiment of this application has a first state. In the first state, the first sound wave and the second sound wave are mutually inverse sound waves, and undergo a certain degree of cancellation during propagation. Therefore, in a case of the electroacoustic module 220 being in the first state, the sound apparatus 200 generates a low sound. In such case, the sound apparatus 200 is equivalent to a receiver, and when the user uses the electronic device for a call, the sound apparatus 200 functions as a receiver, emitting a low sound for the user to listen to within a close range. Due to the inverse cancellation of sound waves, the sound emitted by the sound apparatus 200 is canceled during long-distance propagation. This makes it difficult for others at a distance to hear the call content, thereby addressing the issue of sound leakage and better protecting call privacy.
In a further technical solution, the electroacoustic module 220 may further have a second state. Certainly, the second state is different from the first state. When the electroacoustic module 220 is in the second state, the first sound wave formed by the vibration of the first diaphragm 221 and the second sound wave formed by the vibration of the second diaphragm 222 are in a same phase. In this case, the first sound wave and the second sound wave with the same phase superpose after emitted from the first sound hole 310 and the second sound hole 1111, achieving enhancement and ultimately producing a high sound. In this case, the sound apparatus 200 is equivalent to a speaker, capable of performing the function of a speaker. Clearly, the sound apparatus 200 can perform the functions of a receiver and a speaker, thereby avoiding the need for the electronic device to be equipped with both a receiver and a speaker, which is beneficial for simplifying the structure of the electronic device. It should be noted that in this specification the control of whether the first sound wave and the second sound wave formed by the electroacoustic module 220 are in the same phase or different phases is prior art and is not further described here.
In a further technical solution, in the second state, the sound apparatus 200 is a first speaker, and the electronic device disclosed in this embodiment of this application may further include a second speaker 400. The second speaker 400 is disposed in the device housing 100. Specifically, the second speaker 400 may also be fixed in the device housing 100 by bonding, snap-fitting, or connection by a connector, thereby achieving installation.
The sound emission direction of the first speaker and the sound emission direction of the second speaker 400 may be the same or different. If the sound emission direction of the first speaker and the sound emission direction of the second speaker 400 are the same, the electronic device can achieve a stronger loudspeaking effect. If the sound emission direction of the first speaker and the sound emission direction of the second speaker 400 are different, they can emit sound in different directions, ultimately enabling the electronic device to provide a stereo sound effect in the speaker mode. This can improve the sound performance of the electronic device. It should be noted that in this specification the sound emission direction of the first speaker being different from the sound emission direction of the second speaker 400 means the orientations of the sound holes (that is, the first sound hole 310 and the second sound hole 1111) of the first speaker are different from an orientation of the sound hole of the second speaker 400.
Optionally, the sound apparatus 200 may be located at the top end of the electronic device, and the second speaker 400 may be located at the bottom end of the electronic device, as shown in
In this embodiment of this application, the sound apparatus 200 has a rear cavity 103, which can achieve the low pitch performance of the sound apparatus 200. In an optional solution, the first diaphragm 221 is disposed opposite the second diaphragm 222, with a first sub rear cavity 1031 formed therebetween. The apparatus housing 210 and the electroacoustic module 220 enclose to form a second sub rear cavity 1032, the first sub rear cavity 1031 is communicated with the second sub rear cavity 1032, and the rear cavity 103 includes the first sub rear cavity 1031 and the second sub rear cavity 1032. Certainly, the rear cavity 103 of the sound apparatus 200 may only include the first sub rear cavity 1031. As compared to the rear cavity 103 that only includes the first sub rear cavity 1031, the second sub rear cavity 1032 enclosed by the apparatus housing 210 and the electroacoustic module 220 can cooperate with the first sub rear cavity 1031, thereby expanding the space of the rear cavity 103 and further improving the low pitch performance of the sound apparatus 200.
As described above, the first diaphragm 221 is disposed opposite the second diaphragm 222, making their vibration directions consistent. Specifically, the first diaphragm 221 and the second diaphragm 222 may vibrate along a first direction, and the second sub rear cavity 1032 is located on a first side of the electroacoustic module 220. The second sub rear cavity 1032 and the electroacoustic module 220 are sequentially distributed along a second direction, where the first direction is perpendicular to the screen 300, and the second direction is perpendicular to the first direction. This structure allows the second sub rear cavity 1032 to be sequentially distributed along the second direction, thereby avoiding stacking in a direction perpendicular to the screen 300. Typically, the direction perpendicular to the screen 300 is the thickness direction of the electronic device. Forming the second sub rear cavity 1032 on the first side of the electroacoustic module 220 in the second direction avoids stacking in the thickness direction of the electronic device, thus avoiding a large thickness of the electric device, facilitating the design of thinner electronic devices.
In a further technical solution, the apparatus housing 210 and the electroacoustic module 220 enclose to form a third sub rear cavity 1033. The third sub rear cavity 1033 is communicated with at least one of the first sub rear cavity 1031 and the second sub rear cavity 1032. The third sub rear cavity 1033 and the electroacoustic module 220 are sequentially distributed along the second direction and located on the second side of the electroacoustic module 220. The first side and the second side are two opposite sides of the electroacoustic module 220. This structure can further increase the volume of the rear cavity 103 by adding the third sub rear cavity 1033, thereby better improving the low pitch performance of the sound apparatus 200.
Specifically, the height of the third sub rear cavity 1033 decreases in a direction away from the electroacoustic module 220. It should be noted that the height refers to the dimension of the third sub rear cavity 1033 in the thickness direction of the electronic device. The thickness direction is perpendicular to the screen 300. The second front cavity 102 has a front cavity sound transmission channel 1021. The second front cavity 102 is communicated with the second sound hole 1111 through the front cavity sound transmission channel 1021. The second sound hole 1111 is provided on the device housing 100. The front cavity sound transmission channel 1021 can be stacked on the second sub rear cavity 1032 in the thickness direction of the electronic device. The opening of the front cavity sound transmission channel 1021 gradually increases in the direction near the second sound hole 1111 to achieve better sound output. The gradually decreasing height of the third sub rear cavity 1033 can better adapt to the size variation of the opening of the front cavity sound transmission channel 1021.
In the electronic device disclosed in this embodiment of the application, the device housing 100 has a housing inner cavity 104, and the sound apparatus 200 has a rear cavity 103. In an optional solution, the first diaphragm 221 may be a first water-proof diaphragm, and the first front cavity 101 is isolated from the housing inner cavity 104 and the rear cavity 103, thereby preventing particles and liquids entering the first front cavity 101 from entering the housing inner cavity 104 or the rear cavity 103, further improving dustproof and water-proof performance.
Similarly, in another optional solution, the second diaphragm 222 may be a second water-proof diaphragm, and the second front cavity 102 is isolated from the housing inner cavity 104 and the rear cavity 103, thereby preventing particles and liquids entering the second front cavity 102 from entering the housing inner cavity 104 or the rear cavity 103, further improving dustproof and water-proof performance.
In this embodiment of this application, the device housing 100 may include a frame body 110 and a cover body 120. The frame body 110 includes an enclosure frame 111 and a support plate 112. The support plate 112 is located in a region surrounded by the enclosure frame 111. The screen 300 and the cover body 120 are respectively connected to the opposite sides of the frame body 110. The cover body 120 and the frame body 110 enclose to form the housing inner cavity 104. Specifically, the cover body 120 may be a battery cover. The support plate 112 and the enclosure frame 111 may be of an integrated structure, or split structures fixedly connected through assembly.
The sound apparatus 200 is disposed in the housing inner cavity 104, and the support plate 112 is located between the sound apparatus 200 and the screen 300. The support plate 112 is provided with a first through hole 1121, and a first sealing member 201 is disposed between the apparatus housing 210 and the support plate 112. The first sealing member 201 surrounds the first through hole 1121, and a second sealing member 202 may be disposed between the support plate 112 and the screen 300. In an optional solution, the first diaphragm 221, the apparatus housing 210, the support plate 112, the first sealing member 201, the second sealing member 202, and the screen 300 enclose to form the first front cavity 101. This structure of the device housing 100 can enclose to form the housing inner cavity 104 while also providing an installation position for the sound apparatus 200 with the support plate 112. Additionally, the first front cavity 101 and the housing inner cavity 104 are sealed and isolated by the first sealing member 201 and the second sealing member 202.
The support plate 112 can provide an installation position for the sound apparatus 200. For ease of installation, one of the support plate 112 and the apparatus housing 210 may be provided with a positioning hole 1122, and the other may be provided with a positioning protrusion 2111. The positioning hole 1122 is matched with the positioning protrusion 2111. During installation of the sound apparatus 200, an operator can first insert the positioning protrusion 2111 into the positioning hole 1122 for pre-positioning, and then connect the apparatus housing 210 and the support plate 112. Specifically, the apparatus housing 210 and the support plate 112 can be connected through connection by a connector (a threaded connector), bonding, or other means.
In this context, the second sound hole 1111 may be provided on the enclosure frame 111. A first end surface of the apparatus housing 210 may be provided with a sound opening that is communicated with the second front cavity 102 (which can be considered as a port of the front cavity sound transmission channel 1021). A third sealing member 203 may be disposed between the first end surface and the inner wall of the enclosure frame 111. The second sound hole 1111 is communicated with the sound opening. Providing the second sound hole 1111 on the enclosure frame 111 can easily achieve a different orientation from the first sound hole 310, thereby improving the sound effect. Additionally, as provided on the enclosure frame 111, the second sound hole 1111 is more easily exposed on a side surface of the electronic device. This design allows the second sound hole 1111 to be less noticeable, thereby helping to improve the aesthetic performance of the electronic device.
In a further technical solution, the apparatus housing 210 may be provided with a second through hole 2112, and the support plate 112 is provided with a third through hole 1123. The second through hole 2112 and the first diaphragm 221 are located on the same side of the apparatus housing 210. The second through hole 2112 and the first diaphragm 221 both face the support plate 112. The third through hole 1123 and the first through hole 1121 may face the same direction. The second through hole 2112 is communicated with the third through hole 1123, and the second front cavity 102 is communicated with the second through hole 2112. The second sound hole 1111 is provided on the enclosure frame 111. The sound apparatus 200 further includes a first cover plate 230. The first cover plate 230 is disposed on the apparatus housing 210 and forms a connection channel 105 with the apparatus housing 210. Specifically, the first cover plate 230 can be connected to the apparatus housing 210 by bonding, snap-fitting, or other means. Certainly, in the case that the apparatus housing 210 includes the first housing 211 and the second housing 212, the second through hole 2112 may be provided on the first housing 211.
In an optional solution, the front cavity sound transmission channel 1021 is formed on the second housing 212. In this case, the structure of the second housing 212 is complex. To facilitate the manufacturing of the second housing 212, it can be of a split structure. Specifically, the second housing 212 may include a second cover plate 2101 and a second housing body 2102. The second housing body 2102 may be provided with a process hole, and the second cover plate 2101 is mounted on the second housing body 2102, sealing the process hole. In this case, the second housing body 2102 can be manufactured first, and then the second cover plate 2101 is mounted on the second housing body 2102. Since the process hole can expose more of the internal structure of the second housing 212, it allows for easier implementation of the manufacturing process of the second housing 212. The second housing body 2102 may be formed through injection molding, and the process hole allows for easier demolding.
The connection channel 105 is communicated with the third through hole 1123 and the second sound hole 1111. The electronic device may further include a fourth sealing member 204. The fourth sealing member 204 is disposed between the support plate 112 and the apparatus housing 210, and surrounds the second through hole 2112 and the third through hole 1123. The fourth sealing member 204 and the first sealing member 201 may be coplanar. This structure allows the parts to be sealed between the sound apparatus 200 and the device housing 100 to be located on the same side of the apparatus housing 210, which undoubtedly facilitates the sealing design and sealing assembly.
In an optional solution, the fourth sealing member 204 and the first sealing member 201 may be of an integrated structure, with corresponding parts provided with avoidance holes to avoid the corresponding through holes. In this case, only one overall sealing structure needs to be installed, which undoubtedly facilitates the operation.
In this embodiment of this application, the first sealing member 201, the second sealing member 202, the third sealing member 203, and the fourth sealing member 204 may be sealing foam members or sealing silicone members. This embodiment of this application does not limit their materials.
Refer to
The foregoing embodiments of the present invention focus on the differences between the embodiments. As long as the different features of improvement in the embodiments are not contradictory, they can be combined to form a more preferred embodiment. For brevity, details are not repeated here.
The foregoing describes the embodiments of the present invention with reference to the accompanying drawings. However, the present invention is not limited to the foregoing specific implementations. These specific implementations are merely illustrative rather than restrictive. Inspired by the present invention, persons of ordinary skill in the art may develop many other forms which do not depart from the essence of the present invention and the protection scope of the claims, and all such forms shall fall within the protection scope of the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202210760536.8 | Jun 2022 | CN | national |
This application is a continuation application of PCT International Application No. PCT/CN2023/102275 filed on Jun. 26, 2023, which claims priority to Chinese Patent Application No. 202210760536.8, filed with the China National Intellectual Property Administration on Jun. 30, 2022 and entitled “ELECTRONIC DEVICE”, which is incorporated herein by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2023/102275 | Jun 2023 | WO |
| Child | 19002044 | US |
