This relates generally to electronic devices, and, more particularly, to electronic devices with light sensors.
Electronic devices such as laptop computers, cellular telephones, and other equipment are sometimes provided with optical components such as light sensors. Light sensors such as ambient light sensors may be used to make measurements on ambient lighting conditions. For example, an ambient light sensor may measure ambient light intensity so that display brightness adjustments may be made to a display in an electronic device.
To reduce ambient light sensor sensitivity to the presence of directional light sources such as lamps in the user's ambient environment, ambient light sensors may be provided with light diffusers. A light diffuser may diffuse incoming ambient light before the ambient light is measured by a photodetector associated with the ambient light sensor. Light diffuser structures may help reduce the sensitivity of an ambient light sensor to sources of directional lighting, but may scatter incoming light away from a photodetector in the ambient light sensor, thereby reducing ambient light sensor sensitivity.
An electronic device may be provided with a display. The display may have an array of pixels that form an active area and may have an inactive area that runs along an edge of the active area. An opaque layer may be formed on an inner surface of a display cover layer in the inactive area of the display or may be formed on another transparent layer in the electronic device. An ambient light sensor window may be formed from the opening and may be aligned with color ambient light sensor.
The ambient light sensor may have an integrated circuit with photodetectors. A color filter layer may overlap the photodetectors and may be used to provide the photodetectors with the ability to sense different colors of light.
Ambient light passing through the ambient light sensor window may be diffused by a light diffuser having one or more light-diffusing layers. The light-diffusing layers may include light-scattering particles embedded in materials such as polymers and/or may include textured light-scattering surface structures.
Diffused ambient light may be collimated using a light collimator. The light collimator may be interposed between the photodetectors and the light-diffusing layers. The light-collimator may have one or more light-collimating layers. Each light-collimating layer may include a textured light collimating pattern such as inwardly facing protrusions.
If desired, an infrared-light-blocking filter may be interposed between the light-collimating layer(s) and the photodetectors.
Electronic devices may be provided with optical components. The optical components may include light sensing components such as ambient light sensors.
An illustrative electronic device of the type that may be provided with an ambient light sensor is shown in
As shown in
Device 10 may have input-output circuitry such as input-output devices 12. Input-output devices 12 may include user input devices that gather user input and output components that provide a user with output. Devices 12 may also include communications circuitry that receives data for device 10 and that supplies data from device 10 to external devices and may include sensors that gather information from the environment.
Input-output devices 12 may include one or more displays such as display 14. Display 14 may be a touch screen display that includes a touch sensor for gathering touch input from a user or display 14 may be insensitive to touch. A touch sensor for display 14 may be based on an array of capacitive touch sensor electrodes, acoustic touch sensor structures, resistive touch components, force-based touch sensor structures, a light-based touch sensor, or other suitable touch sensor arrangements. Display 14 may be a liquid crystal display, a light-emitting diode display (e.g., an organic light-emitting diode display), an electrophoretic display, or other display.
Input-output devices 12 may include optical components 18. Optical components 18 may include ambient light sensors (e.g., color ambient light sensors configured to measure ambient light color and intensity by making light measurements with multiple light detector channels each of which has a corresponding color filter and photodetector to measure light in a different wavelength band), optical proximity sensors (e.g., sensors with a light-emitting device such as an infrared light-emitting diode and a corresponding light detector such as an infrared photodiode for detecting when an external object that is illuminated by infrared light from the light-emitting diode is in the vicinity of device 10), a visible light camera, an infrared light camera, light-emitting diodes that emit flash illumination for visible light cameras, infrared light-emitting diodes that emit illumination for infrared cameras, and/or other optical components.
In addition to optical components 18, input-output devices 12 may include buttons, joysticks, scrolling wheels, touch pads, key pads, keyboards, microphones, speakers, tone generators, vibrators, cameras, light-emitting diodes and other status indicators, non-optical sensors (e.g., temperature sensors, microphones, capacitive touch sensors, force sensors, gas sensors, pressure sensors, sensors that monitor device orientation and motion such as inertial measurement units formed from accelerometers, compasses, and/or gyroscopes), data ports, etc. A user can control the operation of device 10 by supplying commands through input-output devices 12 and may receive status information and other output from device 10 using the output resources of input-output devices 12.
Device 10 may have a housing. The housing may form a laptop computer enclosure, an enclosure for a wristwatch, a cellular telephone enclosure, a tablet computer enclosure, or other suitable device enclosure. A perspective view of a portion of an illustrative electronic device is shown in
Display 14 may be protected using a display cover layer such as a layer of transparent glass, clear plastic, sapphire, or other clear layer (e.g., a transparent planar member that forms some or all of a front face of device 10 or that is mounted in other portions of device 10). Openings may be formed in the display cover layer. For example, an opening may be formed in the display cover layer to accommodate a button, a speaker port, or other components. Openings may be formed in housing 22 to form communications ports (e.g., an audio jack port, a digital data port, etc.), to form openings for buttons, etc. In some configurations, housing 22 may have a rear housing wall formed from a planar glass member or other transparent layer (e.g., a planar member formed on a rear face of device 10 opposing a front face of device 10 that includes a display cover layer). The planar member forming the rear housing wall may have an interior surface that is coated with an opaque masking layer.
Display 14 may have an array of pixels 28 in active area AA (e.g., liquid crystal display pixels, organic light-emitting diode pixels, electrophoretic display pixels, etc.). Pixels 28 of active area AA may display images for a user of device 10. Active area AA may be rectangular or may have other suitable shapes.
Inactive portions of display 14 such as inactive border area IA may be formed along one or more edges of active area AA. Inactive border area IA may overlap circuits, signal lines, and other structures that do not emit light for forming images. To hide inactive circuitry and other components in border area IA from view by a user of device 10, the underside of the outermost layer of display 14 (e.g., the display cover layer or other display layer) may be coated with an opaque masking material such as a layer of black ink (e.g., polymer containing black dye and/or black pigment, opaque materials of other colors, etc.) and/or other layers (e.g., metal, dielectric, semiconductor, etc.). Opaque masking materials such as these may also be formed on an inner surface of a planar rear housing wall formed from glass, ceramic, polymer, crystalline transparent materials such as sapphire, or other transparent material.
Optical components (e.g., a camera, a light-based proximity sensor, an ambient light sensor, status indicator light-emitting diodes, camera flash light-emitting diodes, etc.) may be mounted under one or more optical component windows such as optical component window 20 of
In an arrangement of the type shown in
Optical component windows may, in general, include any suitable layer(s) of material (e.g., inorganic and/or organic thin-film layers, partially transparent metal films, dielectric coating layers such as thin-film interference filter coatings formed from stacks of dielectric layers, etc.). These layers of material may be formed within an opening in a layer of opaque masking material.
Window 20 may be formed from an opening in opaque masking layer 30. Opaque masking layer 30 may be formed from polymer containing dye and/or pigment (e.g., black ink) and/or other opaque material on the inner surface of display cover layer 14C in inactive area IA. The opening associated with window 20 may be left free of overlapping coatings or may be covered with one or more overlapping layers such as layer 32 to adjust the outward appearance of optical component window 20. Layer(s) 32 may be, for example, a layer of polymer containing dye and/or ink having a light transmission of about 1-10%, at least 2%, at least 0.5%, at least 1.5%, less than 7%, less than 5%, less than 3%, etc. If desired, optical component windows may be formed in housing walls and/or other structures in device 10. The example of
Any suitable optical component 18 that emits and/or detects light (e.g., an ambient light sensor, an optical proximity sensor, an image sensor, a light-emitting diode or other light source, etc.) may be aligned with window 20. As shown in
Display 14 has an array of pixels overlapped by display cover layer 14C in an active area (AA) of display 14 (not shown in
Color ambient light sensor 50 may include support structures such as support structure 36 (sometimes referred to as a sensor wall, a sensor body structure, a sensor housing structure, etc.). A ring or patch of adhesive such as pressure sensitive adhesive layer 34 may be used to couple support structure 36 to the underside of display cover layer 14C in alignment with optical component window 20. Support structure 36 may form walls that surround optical layers 38. Optical layers 38 may include one or more light diffuser layers (sometimes referred to as light diffusing layers) that diffuse incoming ambient light and/or may include one or more visible-light-transmitting-and-infrared-light-blocking filters (sometimes referred to as infrared-light-blocking filters or infrared-blocking filters). One or more light collimation layers may also be included in optical layers 38. The thickness of each layer 38 may be 100-200 microns, at least 15 microns, at least 50 microns, at least 100 microns, less than 250 microns, less than 300 microns, less than 600 microns, or other suitable thickness.
With one illustrative configuration, the diffuser layer(s) may be mounted between layer 32 and the infrared-blocking filter(s), so that the infrared-blocking filter(s) are between light-detector integrated circuit 40 and the light diffuser layer(s). The light collimating layer(s) may be mounted between the light diffuser layers and the infrared-blocking filter(s). If desired, other optical layers may be included in layers 38. Ambient light traveling through window 20 (e.g., through layer 14C, layer 32, and layers 38) may be detected using photodetectors 42 in light detector integrated circuit 40. Control circuitry 16 (
Viewed from above through layer 14C, support structure 36 may extend around the periphery of optical window 20 (e.g., with a footprint that is circular, oval, rectangular, or other suitable shape). Support structure 36 may be formed from an opaque material that blocks visible and infrared light such as black plastic and/or other opaque materials. Support structure 36 may be used to form a one-piece or a multi-piece housing for sensor 50. In the example of
Light detector integrated circuit 40 may be formed from a silicon die or other semiconductor die. Wire bonds, through-silicon vias and solder joints, or other conductive paths may be used in coupling the circuitry of light detector integrated circuit 40 to contact pads on printed circuit 46. Solder joints or other electrical connections may be used to couple signal paths formed from metal traces in flexible printed circuit 48 to signal paths in printed circuit 46 (e.g., signal paths formed from metal lines in printed circuit 46 that are coupled to the circuitry of integrated circuit 40). In this way, the circuitry of light detector integrated circuit 40 may be coupled to the signal paths in flexible printed circuit 48 so that these signal paths may route signals to and from control circuitry 16.
Light detector integrated circuit 40 may include multiple photodetectors 42 (e.g., photodiodes). Each photodetector 42 may be overlapped by a respective color filter in color filter layer 44. With one illustrative configuration, the color filters are formed from colored materials (e.g., polymer containing colored dyes and/or pigments) of different respective colors (e.g., red, blue, green, etc.). The color filters each pass light in a different respective range of wavelengths (e.g., a pass band of a different desired color) to an associated overlapped photodetector 42. With another illustrative configuration, each color filter may be formed from a thin-film interference filter (e.g., a stack of thin-film dielectric layers of alternating refractive index) that selectively passes a desired range of wavelengths (e.g., a pass band of a desired color) to an associated overlapped photodetector 42.
As an example, a red-pass color filter (dye-based, pigment-based, and/or thin-film-interference-filter-based) may overlap a first photodetector 42 to form a red-light-sensing channel in ambient light sensor 50, a blue-pass color filter may overlap a second photodetector 42 to form a blue-light-sensing channel in ambient light sensor 50, etc. The color filters of layer 44 may be configured to block infrared light (e.g., stray infrared light that has not been blocked by the infrared-blocking filter(s) in optical layers 38) and/or a separate infrared-light blocking layer (e.g., an infrared-light-blocking thin-film interference filter) may be formed under or over the color filters.
In the illustrative configuration of
One or both of the surfaces of substrate 62 and/or the surfaces of coating layer(s) 64 may be textured to help enhance the light diffusing properties of diffuser layer 60. In the example of
Diffuse light 70 may be spread over a relatively wide range of angles and may be characterized by a Lambertian distribution of intensity versus angle (as an example). This helps reduce the sensitivity of ambient light sensor 50 to variations in the angular orientation of ambient light sensor 50 with respect to sources of light in the environment surrounding device 10. Light that is spread at wide angles may, however, be spread too widely to be received by photodetectors 42, leading to a potential reduction in ambient light sensor sensitivity. To avoid sensitivity loss due to light diffusing by the light diffuser in ambient light sensor 50, a light collimator formed from one or more light-collimating layers may be incorporated into ambient light sensor 50. The light-collimating layers may help collimate diffused light 70 and thereby direct this light onto photodetectors 42 for measurement.
An illustrative light-collimating layer for ambient light sensor 50 is shown in
In the example of
As shown in the cross-sectional side view of light-collimating layer 86 of
Textured coating 102 may be a clear polymer layer that is deposited as a liquid and cured to form a solid textured pattern such as the illustrative pattern of protrusions shown in
Optical layers 38 may include one or more light diffuser layers 60 such as light diffuser layers 60 of the type described in connection with
Optical layers 38 may include one or more infrared-light-blocking filter layers such as infrared filter 110. Infrared filter 110 may be formed from an infrared-light-blocking thin-film interference filter (e.g., a stack of dielectric layers of alternating refractive index) on a transparent substrate such as a layer of glass or plastic, and/or may include a bulk material that absorbs infrared light and that transmits visible light. Infrared-light-blocking filter layer(s) such as these may, if desired, be incorporated into a layer on light-detector integrated circuit 42 (e.g., interspersed within color filter layer 44, at the top of color filter layer 44, at the bottom of color filter layer 44, etc.).
One or more light-collimating layers 86 may be used in forming a light collimator that is included in optical layers 38 to help collimate incoming ambient light as described in connection with
To help collimate ambient light that is received through window 20 in a variety of different orientations, ambient light sensor 50 may have multiple light-collimating layers 86 each of which has a different orientation. For example, the first and second light-collimating layers 86 of
In a first illustrative configuration, only light diffuser layers 60 are present and light-collimating layers 86 are omitted. The light intensity in this configuration is given by curve 124.
In a second illustrative configuration, a single light-collimating layer is present (e.g., the uppermost light-collimating layer 86 of
In a third illustrative configuration, first and second stacked light-collimating layers are present (e.g., layers 86 of
Other light-collimating layer configurations may be used, if desired (e.g., configurations with three or more light-collimating layers, etc.). The configurations of
The foregoing is merely illustrative and various modifications can be made to the described embodiments. The foregoing embodiments may be implemented individually or in any combination.
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Number | Date | Country | |
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20190096364 A1 | Mar 2019 | US |