Patent Grant
12112681
This relates generally to electronic devices, and, more particularly, to electronic devices with displays.
Electronic devices often include displays. For example, an electronic device may have an organic light-emitting diode (OLED) display based on organic light-emitting diode pixels or a liquid crystal display (LCD) based on liquid crystal display pixels. The display may include display driver circuitry that is configured to provide display data to the pixels and gate driver circuitry that is configured to control the pixels.
It is within this context that the embodiments herein arise.
An electronic device may have a display. The display may include an array of pixels formed on a silicon substrate. The display may include display driver circuitry that is configured to provide display data to the pixels and gate driver circuitry that is configured to control the pixels.
The display driver circuitry may be formed in a display driver integrated circuit that outputs display data and other control signals for operating the display. An interposer structure may be included in the electronic device. The interposer structure may be attached to the silicon display substrate and may only partially overlap the silicon display substrate. The display driver integrated circuit may be attached to the interposer structure and provide signals to the display pixels through the interposer structure. The interposer structure may have a first portion that is attached to the silicon display substrate, a second portion that is attached to the display driver integrated circuit, and a third portion that is attached to a flexible printed circuit.
In another possible arrangement, the display driver integrated circuit may bridge a gap between the silicon display substrate and the flexible printed circuit. The display driver integrated circuit only partially overlaps the silicon display substrate in this arrangement.
The silicon display substrate may be formed on a support structure that provides mechanical support for the display substrate. The support structure may be formed from a metal material and may also serve as a heat sink for the display substrate. The support structure may have an extension that extends past an edge of the silicon display substrate. A filler may be included between the support structure extension and the display driver integrated circuit and/or interposer.
An illustrative electronic device of the type that may be provided with a display is shown in
As shown in
Input-output circuitry in device 10 such as input-output devices 12 may be used to allow data to be supplied to device 10 and to allow data to be provided from device 10 to external devices. Input-output devices 12 may include buttons, joysticks, scrolling wheels, touch pads, key pads, keyboards, microphones, speakers, tone generators, vibrators, cameras, sensors, light-emitting diodes and other status indicators, data ports, etc. A user can control the operation of device 10 by supplying commands through input resources of input-output devices 12 and may receive status information and other output from device 10 using the output resources of input-output devices 12.
Input-output devices 12 may include one or more displays such as display 14. Display 14 may be a touch screen display that includes a touch sensor for gathering touch input from a user or display 14 may be insensitive to touch. A touch sensor for display 14 may be based on an array of capacitive touch sensor electrodes, acoustic touch sensor structures, resistive touch components, force-based touch sensor structures, a light-based touch sensor, or other suitable touch sensor arrangements. A touch sensor for display 14 may be formed from electrodes formed on a common display substrate with the display pixels of display 14 or may be formed from a separate touch sensor panel that overlaps the pixels of display 14. If desired, display 14 may be insensitive to touch (i.e., the touch sensor may be omitted). Display 14 in electronic device 10 may be a head-up display that can be viewed without requiring users to look away from a typical viewpoint or may be a head-mounted display that is incorporated into a device that is worn on a user's head. If desired, display 14 may also be a holographic display used to display holograms.
Control circuitry 16 may be used to run software on device 10 such as operating system code and applications. During operation of device 10, the software running on control circuitry 16 may display images on display 14.
Display 14 may have an array of pixels 22 for displaying images for a user such as pixel array 28. Pixels 22 in array 28 may be arranged in rows and columns. The edges of array 28 may be straight or curved (i.e., each row of pixels 22 and/or each column of pixels 22 in array 28 may have the same length or may have a different length). There may be any suitable number of rows and columns in array 28 (e.g., ten or more, one hundred or more, or one thousand or more, etc.). Display 14 may include pixels 22 of different colors. As an example, display 14 may include red pixels, green pixels, and blue pixels. Pixels of other colors such as cyan, magenta, and yellow might also be used.
Display driver circuitry 20 may be used to control the operation of pixels 28. Display driver circuitry 20 may be formed from integrated circuits, thin-film transistor circuits, and/or other suitable circuitry. Illustrative display driver circuitry 20 of
As shown in
To display the images on pixels 22, display driver circuitry 20A may supply corresponding image data to data lines D while issuing control signals to supporting display driver circuitry such as gate driver circuitry 20B over signal paths 30. With the illustrative arrangement of
Gate driver circuitry 20B (sometimes referred to as gate line driver circuitry or horizontal control signal circuitry) may be implemented using one or more integrated circuits and/or may be implemented using thin-film transistor circuitry on substrate 26. Horizontal control lines G (sometimes referred to as gate lines, scan lines, emission control lines, etc.) run horizontally across display 14. Each gate line G is associated with a respective row of pixels 22. If desired, there may be multiple horizontal control lines such as gate lines G associated with each row of pixels. Individually controlled and/or global signal paths in display 14 may also be used to distribute other signals (e.g., power supply signals, etc.).
Gate driver circuitry 20B may assert control signals on the gate lines G in display 14. For example, gate driver circuitry 20B may receive clock signals and other control signals from circuitry 20A on paths 30 and may, in response to the received signals, assert a gate line signal on gate lines G in sequence, starting with the gate line signal G in the first row of pixels 22 in array 28. As each gate line is asserted, data from data lines D may be loaded into a corresponding row of pixels. In this way, control circuitry such as display driver circuitry 20A and 20B may provide pixels 22 with signals that direct pixels 22 to display a desired image on display 14. Each pixel 22 may have a light-emitting diode and circuitry (e.g., thin-film circuitry on substrate 26) that responds to the control and data signals from display driver circuitry 20.
Gate driver circuitry 20B may include blocks of gate driver circuitry such as gate driver row blocks. Each gate driver row block may include circuitry such output buffers and other output driver circuitry, register circuits (e.g., registers that can be chained together to form a shift register), and signal lines, power lines, and other interconnects. Each gate driver row block may supply one or more gate signals to one or more respective gate lines in a corresponding row of the pixels of the array of pixels in the active area of display 14.
Substrate 26 may include a plurality of contacts that are used to electrically connect circuitry within the substrate to additional components within the electronic device. One such contact is cathode contact 58. Cathode contact 58 is configured to electrically connect to a cathode layer for the display. The cathode layer may be present when display 14 includes organic light-emitting diode pixels, as an example. In an organic light-emitting diode display, organic light-emitting diode layers may be formed over substrate 26. Substrate 26 may include an array of anodes that contact the organic light-emitting diode layers. The cathode layer is formed over the organic light-emitting diode layers.
In the example of
As shown in
Display driver integrated circuit 50 may receive signals from flexible printed circuit 60. The flexible printed circuit 60 may be coupled between substrate layer 26 and printed circuit board 74. Flexible printed circuit 60 may be formed from one or more dielectric layers formed from a flexible material such as polyimide. Metal traces may be printed on the one or more dielectric layers. Printed circuit board 74 may be, for example, a rigid printed circuit board (sometimes referred to as a motherboard).
Flexible printed circuit 60 includes one or more contacts 62 (sometimes referred to as contact pads 62) and one or more contacts 68 (sometimes referred to as contact pads 68). Contacts 62 are electrically connected to a respective contact 66 (sometimes referred to as contact pads 66 or bond pads 66) in substrate 26 by conductive bonding structures 64 (sometimes referred to as conductive interconnect structures 64, conductive attachment structures 64, etc.). Contacts 68 are electrically connected to a respective contact 72 (sometimes referred to as contact pads 72 or bond pads 72) in rigid printed circuit board 74 by conductive bonding structures 70 (sometimes referred to as conductive interconnect structures 70, conductive attachment structures 70, etc.). Conductive bonding structures 64 and 70 may be, for example, formed from anisotropic conductive films. A conductive bonding structure 64 is interposed between each respective contact 62 and contact 66. The conductive bonding structures 64 may form a physical and electrical connection between flexible printed circuit 60 and substrate 26. A conductive bonding structure 70 is interposed between each respective contact 68 and contact 72. The conductive bonding structures 70 may form a physical and electrical connection between flexible printed circuit 60 and rigid printed circuit board 74.
During operations of the electronic device of
In
It may be desirable to reduce the magnitude of distance 78. Because substrate 26 in
Substrate 26 may include a plurality of contacts that are used to electrically connect circuitry within the substrate to additional components within the electronic device. One such contact is cathode contact 58. Cathode contact 58 is configured to electrically connect to a cathode layer for the display. The cathode layer may be used when display 14 includes organic light-emitting diode pixels, as previously described.
In the example of
As shown in
Interposer 76 may receive signals from flexible printed circuit 60. The flexible printed circuit 60 may be coupled between interposer 76 and printed circuit board 74. Flexible printed circuit 60 includes one or more contacts 62 (sometimes referred to as contact pads 62) and one or more contacts 68 (sometimes referred to as contact pads 68). Contacts 62 are electrically connected to a respective contact 82 (sometimes referred to as contact pads 82 or bond pads 82) in interposer 76 by conductive bonding structures 64 (sometimes referred to as conductive interconnect structures 64, conductive attachment structures 64, etc.). Contacts 68 are electrically connected to a respective contact 72 (sometimes referred to as contact pads 72 or bond pads 72) in rigid printed circuit board 74 by conductive bonding structures 70 (sometimes referred to as conductive interconnect structures 70, conductive attachment structures 70, etc.). Conductive bonding structures 64 and 70 may be, for example, formed from anisotropic conductive films. A conductive bonding structure 64 is interposed between each respective contact 62 and contact 82. The conductive bonding structures 64 may form a physical and electrical connection between flexible printed circuit 60 and interposer 76. A conductive bonding structure 70 is interposed between each respective contact 68 and contact 72. The conductive bonding structures 70 may form a physical and electrical connection between flexible printed circuit 60 and rigid printed circuit board 74.
Interposer 76 may have a portion mounted on substrate 26. As shown in
There may be an array of contacts 56 that are configured to be electrically connected to the interposer contacts 86 using conductive structures 88. There may be more than 1,000 total contacts 56, more than 3,000 total contacts 56, more than 5,000 total contacts 56, more than 7,000 total contacts 56, more than 8,000 total contacts 56, more than 9,000 total contacts 56, etc. The array of contacts 56 may have more than five rows, more than ten rows, more than twenty rows, more than thirty rows, etc. The array of contacts 56 may have more than 100 columns, more than 200 columns, more than 300 columns, more than 400 columns, etc.
During operations of the electronic device of
Interposer 76 therefore receive signals from the flexible printed circuit (e.g., at contacts 82), conveys the signals to DDIC 50 (e.g., using some of contacts 84), receives output signals from DDIC 50 (e.g., at some of contacts 84), and conveys the signals to substrate 26 (e.g., using contacts 86).
In
In
Due to the omission of these components on substrate 26 in
Distance 78 in
To ensure the mechanical reliability of the interposer 76 and DDIC 50 in
As shown in
In some cases, filler 92 may be formed from a conformal material that conforms to an upper surface and edges of display driver integrated circuit 50. The conformal material may be deposited in a liquid state to ensure the material fills the gap between support structure 90 and display driver integrated circuit 50 and conforms to display driver integrated circuit 50. The conformal material may subsequently be solidified to ensure the material maintains its shape/structural integrity during operation. Filler 92 in this type of arrangement may be epoxy, as an example.
In another possible example, filler 92 may be formed from a solid plastic spacer that is attached to support structure 90 and/or display driver integrated circuit 50 with adhesive. In this case, the filler is attached in a solid state and serves as a spacer between support structure 90 and display driver integrated circuit 50 and/or interposer 76.
Using interposer 76 in device 10 provides advantages in addition to reducing the footprint of substrate 26. Bonding processes for contacts on substrate 26 may be temperature limited due to manufacturing constraints associated with the silicon substrate. Due to these temperature constraints, soldering may not be available as an attachment technique for contacts on substrate 26. This is why anisotropic conductive films (ACF) may be used as the attachment structure for contacts on substrate 26.
With the arrangement of
Said another way, in
Another advantage to using interposer 76 in device 10 is that interposer 76 may be designed to include additional circuitry 80 for the electronic device. Additional circuitry 80 may be timing circuitry for operating the display (e.g., gate driver circuitry 20B as in
The example of including a dedicated interposer structure as in
There may be an array of contacts 56 that are configured to be electrically connected to the DDIC contacts 52 using conductive structures 54. There may be more than 1,000 total contacts 56, more than 3,000 total contacts 56, more than 5,000 total contacts 56, more than 7,000 total contacts 56, more than 8,000 total contacts 56, more than 9,000 total contacts 56, etc. The array of contacts 56 may have more than five rows, more than ten rows, more than twenty rows, more than thirty rows, etc. The array of contacts 56 may have more than 100 columns, more than 200 columns, more than 300 columns, more than 400 columns, etc.
Display driver integrated circuit 50 may receive signals from flexible printed circuit 60. The flexible printed circuit 60 may be coupled directly to contacts 52 in display driver integrated circuit 50.
Flexible printed circuit 60 includes one or more contacts 96 (sometimes referred to as contact pads 96) and one or more contacts 68 (sometimes referred to as contact pads 68). Contacts 96 are electrically connected to a respective contact 52 (sometimes referred to as contact pads 52 or bond pads 52) in DDIC 50 by conductive bonding structures 98 (sometimes referred to as conductive interconnect structures 98, conductive attachment structures 98, etc.). Contacts 68 are electrically connected to a respective contact 72 (sometimes referred to as contact pads 72 or bond pads 72) in rigid printed circuit board 74 by conductive bonding structures 70 (sometimes referred to as conductive interconnect structures 70, conductive attachment structures 70, etc.). Conductive bonding structures 70 and 98 may be, for example, formed from anisotropic conductive films. A conductive bonding structure 98 is interposed between each respective contact 96 and contact 52. The conductive bonding structures 98 may form a physical and electrical connection between flexible printed circuit 60 and DDIC 50. A conductive bonding structure 70 is interposed between each respective contact 68 and contact 72. The conductive bonding structures 70 may form a physical and electrical connection between flexible printed circuit 60 and rigid printed circuit board 74.
During operations of the electronic device of
In
In
Due to the omission of these components on substrate 26 in
Distance 78 in
To ensure the mechanical reliability of DDIC 50 in
As shown in
As previously discussed in connection with
Although the aforementioned arrangements for the display driver integrated circuit have been described in relation to an organic light-emitting diode display, it should be noted that the aforementioned arrangements may be used for any desired display type (a microLED display, a liquid crystal display, etc.).
It should be noted that the example in
The foregoing is merely illustrative and various modifications can be made by those skilled in the art without departing from the scope and spirit of the described embodiments. The foregoing embodiments may be implemented individually or in any combination.
This application claims priority to U.S. provisional patent application No. 63/240,311, filed Sep. 2, 2021, which is hereby incorporated by reference herein in its entirety.
| Number | Name | Date | Kind |
|---|---|---|---|
| 5959709 | Asada et al. | Sep 1999 | A |
| 6086441 | Akiguchi et al. | Jul 2000 | A |
| 6664942 | Kim et al. | Dec 2003 | B1 |
| 9009457 | O'Mullan | Apr 2015 | B2 |
| 9397117 | Okamoto et al. | Jul 2016 | B2 |
| 9756733 | Drzaic | Sep 2017 | B2 |
| 9829710 | Newell | Nov 2017 | B1 |
| 10170711 | Sauers et al. | Jan 2019 | B2 |
| 10219386 | Drzaic et al. | Feb 2019 | B2 |
| 10921855 | Wen | Feb 2021 | B1 |
| 10985143 | Bower et al. | Apr 2021 | B2 |
| 20020024302 | Wu et al. | Feb 2002 | A1 |
| 20060268530 | Nagao et al. | Nov 2006 | A1 |
| 20060284821 | Takenaka | Dec 2006 | A1 |
| 20070273632 | Kishimoto | Nov 2007 | A1 |
| 20100045655 | Jang | Feb 2010 | A1 |
| 20110050759 | Katsutani | Mar 2011 | A1 |
| 20110279128 | Von Staudt | Nov 2011 | A1 |
| 20120217982 | Narayanasamy | Aug 2012 | A1 |
| 20130082984 | Drzaic et al. | Apr 2013 | A1 |
| 20130176552 | Brown | Jul 2013 | A1 |
| 20140035114 | Gogoi | Feb 2014 | A1 |
| 20150187707 | Lee | Jul 2015 | A1 |
| 20150296580 | Kim | Oct 2015 | A1 |
| 20160071478 | Takahashi | Mar 2016 | A1 |
| 20160140882 | Doebelt | May 2016 | A1 |
| 20160189668 | Kang | Jun 2016 | A1 |
| 20160329386 | Sauers et al. | Nov 2016 | A1 |
| 20170010638 | Park | Jan 2017 | A1 |
| 20170084311 | Kim | Mar 2017 | A1 |
| 20170123896 | Baek | May 2017 | A1 |
| 20170236466 | Spitzer | Aug 2017 | A1 |
| 20170352305 | Chang | Dec 2017 | A1 |
| 20170367190 | Drzaic | Dec 2017 | A1 |
| 20180061294 | Kim | Mar 2018 | A1 |
| 20180081399 | Kwon | Mar 2018 | A1 |
| 20190012007 | Kim | Jan 2019 | A1 |
| 20190019449 | Pappas | Jan 2019 | A1 |
| 20190036542 | Wang | Jan 2019 | A1 |
| 20190066571 | Goward | Feb 2019 | A1 |
| 20190279558 | Monestier | Sep 2019 | A1 |
| 20190326367 | Jung | Oct 2019 | A1 |
| 20200020644 | Lee | Jan 2020 | A1 |
| 20200142540 | Rahmani | May 2020 | A1 |
| 20200211477 | Lai | Jul 2020 | A1 |
| 20200356488 | Malladi | Nov 2020 | A1 |
| 20210064090 | Wen et al. | Mar 2021 | A1 |
| 20210225430 | O | Jul 2021 | A1 |
| 20210234079 | Han | Jul 2021 | A1 |
| 20210349599 | Chen | Nov 2021 | A1 |
| 20210364861 | Lum | Nov 2021 | A1 |
| 20220147101 | Shin | May 2022 | A1 |
| 20220238498 | Tsutsui | Jul 2022 | A1 |
| 20220262320 | Chang | Aug 2022 | A1 |
| 20220310000 | David | Sep 2022 | A1 |
| 20220414815 | Surti | Dec 2022 | A1 |
| 20230266799 | Kim | Aug 2023 | A1 |
| Number | Date | Country | |
|---|---|---|---|
| 20230062202 A1 | Mar 2023 | US |
| Number | Date | Country | |
|---|---|---|---|
| 63240311 | Sep 2021 | US |
