Claims
- 1. An electronic equipment which comprises an outer cover, an adhesive member attached to a surface of the outer cover and a source generating electromagnetic waves, said source surrounded by the outer cover and the adhesive member to intercept said electromagnetic waves, wherein said adhesive member comprises a substrate and an adhesive resin layer containing electroconductive particles formed thereon, said electroconductive particles comprising at least one of a metal-plated ceramic powder and a metal-plated natural mica powder, said adhesive resin layer being formed on the substrate by electrodeposition coating, the substrate being a plastic substrate having a metallic thin layer on at least one side of the substrate, wherein the thin metallic layer is a copper film having a copper oxide film on a free side of the copper film not contacting with the substrate, said copper oxide film is formed prior to said electrodeposition coating as a chemically colored film by surface treatment of the copper film, and said adhesive resin layer is formed on the copper oxide.
- 2. An electronic equipment according to claim 1, wherein said adhesive member is attached to an inner surface of the outer cover.
- 3. An electronic equipment according to claim 1, wherein said ceramic powder and natural mica powder said has an average particle site of 0.1 to 5 .mu.m.
- 4. An electronic equipment which comprises an outer cover, an adhesive member attached to a surface of the outer cover and a source generating electromagnetic waves, said source surrounded by the outer cover and the adhesive member to intercept said electromagnetic waves, wherein said adhesive member comprises a substrate and an adhesive resin layer containing electroconductive particles formed thereon, said electroconductive particles comprising one or two members selected from the group consisting of metal-plated resin powder and ultra fine metal powder, the substrate being a plastic substrate having a metallic thin layer on at least one side of the substrate, wherein the thin metallic layer is a copper film having a copper oxide film on a free side of the copper film not contacting with the substrate, and said adhesive resin layer is formed on the copper oxide film by electrodeposition.
- 5. An electronic equipment which comprises an outer cover, an adhesive member attached to a surface of the outer cover and a source generating electromagnetic waves, said source surrounded by the outer cover and an adhesive member to intercept said electromagnetic waves, wherein said adhesive member comprises a substrate and an adhesive resin layer containing electroconductive particles formed thereon, said electroconductive particles comprising at least one member selected from the group consisting of metal-plated ceramic powder, metal-plated natural mica powder and at least one member selected from the group consisting of metal-plated resin powder and ultra fine metal powder, the substrate being a plastic substrate having a metallic thin layer on at least one side of the substrate, wherein the thin metallic layer is a copper film having a copper oxide film on a free side of the copper film not contacting with the substrate, and said adhesive resin layer is formed on the copper oxide film by electrodeposition.
Priority Claims (4)
Number |
Date |
Country |
Kind |
2-74204 |
Mar 1990 |
JPX |
|
2-77496 |
Mar 1990 |
JPX |
|
2-77497 |
Mar 1990 |
JPX |
|
2-119464 |
May 1990 |
JPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 07/674,145 filed Mar. 25, 1991, now abandoned.
US Referenced Citations (7)
Foreign Referenced Citations (2)
Number |
Date |
Country |
223763 |
Dec 1984 |
JPX |
61-276979 |
Dec 1986 |
JPX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
674145 |
Mar 1991 |
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