Electronic lapping guide in a magnetic recording transducer

Information

  • Patent Grant
  • 9153260
  • Patent Number
    9,153,260
  • Date Filed
    Tuesday, March 13, 2012
    12 years ago
  • Date Issued
    Tuesday, October 6, 2015
    8 years ago
Abstract
A slider includes a transducer including a magnetic structure having a front edge and a back edge. The slider further includes an electronic lapping guide (ELG) substantially coplanar with the magnetic structure and having a top edge and a bottom edge. The slider further includes a plurality of pads configured to calibrate a sheet resistance of the ELG and an offset of the ELG.
Description
BACKGROUND

Conventional magnetic heads typically employ lapping to fabricate structures within the head. For example, lapping is typically used in processing a read sensor in a read transducer. Lapping determines the stripe height, or length measured from the air-bearing surface (ABS), of the read sensor. Similarly, lapping may be used in fabricating the main pole of a conventional write transducer. The nose length, or the distance from the ABS at which the pole tip widens, may also be determined through lapping.


In order to control lapping an electronic lapping guide (ELG) is typically used. FIG. 1 depicts a top view of a conventional ELG 10. The conventional ELG 10 is essentially a resistive stripe. Thus, the conventional ELG 10 is coupled with leads 14 and 16 that are used to determine the resistance of the conventional ELG 10. The conventional ELG has a length l from the surface 12 being lapped. As lapping continues, the surface 12 is worn away, and the length of the conventional ELG 10 decreases.



FIG. 2 is a flow chart depicting a conventional method 30 for performing lapping using the conventional ELG. The conventional method 30 is described in the context of the conventional ELG 10. The resistance of the conventional ELG 10 is measured during lapping of the transducer, via step 32. The current length of the conventional ELG 10 is determined based upon the resistance measured in step 32 and the sheet resistance of the conventional ELG 10, via step 34. The sheet resistance may be determined in a conventional manner using a conventional Van der Pauw pattern (not shown) which is provided on the substrate on which the magnetic transducer is to be fabricated. The conventional Van der Pauw test pattern is a well known pattern that may be used to determine sheet resistance of a stripe, such as the conventional ELG 10. Thus, after step 34, the length corresponding to a particular measured resistance for the conventional ELG 10 is known.


The lapping is terminated when the resistance of the conventional ELG 10 indicates that the desired length of the conventional ELG 10 has been reached, via step 36. Because the conventional ELG 10 and structure, such as a read sensor or pole, both exist on the transducer being lapped, the lengths of the conventional ELG 10 and the structure change with lapping. Consequently, the lengths of the read sensor or pole may also be set in step 36.


Although the conventional method 30 and conventional ELG 10 function, there may be variations in lapping. In particular, the method 10 may not provide the desired length in the structure being fabricated. For example, the pole and read sensor may not have the desired nose lengths and stripe heights. Consequently, once the transducer is completed, it is tested. It may then be determined that some portion of the transducers do not function as desired. As a result, additional inventory is maintained or additional transducers are fabricated to ensure the number and quality of transducers desired are available.


Accordingly, what is needed is an improved method for providing and using an ELG in a magnetic transducer.


SUMMARY

A method and system for providing an ELG for a structure in a magnetic transducer are described. The structure has a front edge and a back edge. The ELG includes a stripe having a top edge and a bottom edge. The method and system include calibrating a sheet resistance of the stripe and calibrating an offset of the top edge of the stripe from the back edge of the structure. The method and system further include terminating the lapping based at least on the sheet resistance and the offset of the ELG.





BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS


FIG. 1 depicts a conventional ELG as used in a conventional magnetic transducer.



FIG. 2 is a flow chart depicting a conventional method for performing lapping utilizing a conventional ELG.



FIG. 3 is a flow chart depicting an exemplary embodiment of a method for providing and utilizing an ELG.



FIG. 4 depicts an exemplary embodiment of an ELG and the corresponding structure being fabricated in a transducer.



FIG. 5 depicts exemplary embodiments of masks and corresponding structures fabricated.



FIG. 6 is a flow chart depicting another exemplary embodiment of a method for performing lapping utilizing an ELG.



FIG. 7 is a flow chart depicting an exemplary embodiment of a method for calibrating the offset of an ELG.



FIG. 8 is a diagram depicting an exemplary embodiment of test sites for calibrating the offset of an ELG.



FIG. 9 is a flow chart depicting an exemplary embodiment of a method for calibrating the sheet resistance of an ELG.



FIG. 10 is a diagram depicting an exemplary embodiment of a head utilizing ELGs.



FIG. 11 is a diagram depicting an exemplary embodiment of a transducer utilizing ELGs.



FIG. 12 is a diagram depicting an exemplary embodiment of a transducer utilizing ELGs.



FIG. 13 is a diagram depicting an exemplary embodiment of a portion of a head utilizing ELGs.





DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS


FIG. 3 is a flow chart depicting an exemplary embodiment of a method 100 for providing and utilizing one or more ELGs during fabrication of a magnetic transducer. For simplicity, some steps of the method 100 may be omitted. FIG. 4 depicts an exemplary embodiment of a portion of a transducer 200 for which the method 100 is used. The transducer 200 includes an ELG 210 and a structure 220. The transducer also includes leads (not shown) for the ELG 210 and might also include leads (not shown) for the structure 220. The transducer 200 may be part of a merged head including a read transducer and a write transducer. The transducer 200 may reside on a slider (not shown). The method 100 may be used for either or both transducers. The method 100 is also described in the context of a single structure 210 and a single ELG 210. However, the method 100 may be used for fabricating multiple transducers and/or multiple structures and may employ multiple ELG(s) at substantially the same time.


The structure 220 being fabricated has a front edge 222 and a back edge 224. For simplicity, the structure 220 is shown as a rectangle. However, in another embodiment, the structure 220 may have a different shape. In addition, the structure 220 is depicted as terminating at the back edge 224. However, in another embodiment, the back edge 224 may simply mark a relevant position. For example, for a pole, the back edge 224 may correspond to the end of the nose of the pole. The ELG includes a stripe having a top edge 214 and a bottom edge 212. The front edge 222 of the structure 220 and the bottom edge 212 of the ELG(s) 210 reside at the surface being lapped. In one embodiment, the ELG(s) 210 and the corresponding structure(s) 220 are coplanar. For example, a read ELG (RELG) being used in lapping a read sensor may be coplanar with the read sensor. Similarly, a write ELG (WELG) used in lapping a pole may be coplanar with the pole. In one embodiment, the stripe 210 may be a simple shape, such as a rectangle. In another embodiment, the stripe may have a different shape. The track width of the ELG(s) 210 may also be well controlled. For example, in one embodiment, the track width of an ELG 210 is controlled to be within one percent of the nominal track width. In one embodiment, the ELG(s) are placed in each flash field on a wafer being processed. In one embodiment, each ELG 210 is a tunneling magnetoresistive (MR) stripe.


The sheet resistance of the ELG 210 is calibrated, via step 102. In one embodiment, step 102 calibrates the sheet resistance of each stripe 210. This calibration may be performed using a known method, such as the Van der Pauw method.


The offset of the top edge 214 of the ELG 210, or stripe 210, from the back edge 224 of the structure 210 is calibrated, via step 104. In one embodiment, the top edge 214 of each ELG 210 is designed to be the same distance from the surface being lapped as the back edge 224 of the structure 210. In such an embodiment, the mask(s) used to form each ELG 210 and the corresponding structure 220 have endpoints corresponding to the top edge 214 and the back edge 224, respectively, at the same distance from the surface to be lapped. However, due to fabrication conditions, there still may be an offset between the top edge 214 of the ELG 210 and the back edge 224 of the structure 220. For example, FIG. 5 depicts an exemplary embodiment of the masks 230 and 240 that might be used for the ELG 210 and structure 220, respectively. As seen in FIG. 5, although the ELG 210 and structure 220 are designed to terminate the same distance from the surface being lapped, both edges 214 and 224 differ from the masks 230 and 240. Consequently, there is a small offset, d, between the edges 214 and 224. If the transducer 200 is designed such that the top edge 214 of the ELG 210 is not even with the back edge 224 of the structure 220, the difference between these edges 214 and 224 may be increased from the desired amount by an analogous offset. Determination of the offset may improve the ability to determine the length of the structure 220 from the ELG 210. In one embodiment, a correction factor is determined in step 104 which allows the placement of the top edge 214 of the ELG 210 to be determined based on the masks used. In one embodiment, the offset is calibrated for both a WELG and a RELG in step 104.


Referring back to FIGS. 3-4, during fabrication of the corresponding structure 220, lapping is terminated based on the properties of the ELG, via step 106. Step 106 also includes terminating lapping based at least on the sheet resistance and the offset calibrated in steps 102 and 104. In one embodiment, the resistance of an ELG 210 is measured during lapping. Based on the offset, the resistance, and the sheet resistance, the length of not only the ELG 210 but also the structure 220 can be determined. When the resistance of ELG 210 indicates the desired length of the ELG 210 has been reached, the desired length of the structure 220 has also been reached. Thus, lapping is terminated.


Through the use of the method 100, the lapping may be significantly better controlled. As a result, structures such as read sensors and portions of the pole(s) may be lapped closer to the desired goals. As a result the fabrication may be improved. In particular, large variations in the structures which may adversely affect device performance may be avoided. Device manufacturability and performance may thus be improved.



FIG. 6 is a flow chart depicting an exemplary embodiment of a method 110 for performing lapping utilizing ELG(s). For simplicity, some steps may be omitted. The method 110 is also described in the context of the transducer 200. Referring to FIGS. 4 and 6, the method 110 may be considered to commence as or after lapping has started. The lapping performed in the method 110 is used to fabricate structure(s) in a read transducer and/or a write transducer.


The resistance of the ELG 210 is measured during lapping, via step 112. Well known techniques may be used to perform the resistance measurement. Step 112 may include taking multiple resistance measurements during lapping. For example, the resistance of the ELG 210 may be measured substantially continuously for at least a portion of the lapping performed.


Based on the resistance, the sheet resistance calibration performed in step 102 of the method 100, and the offset calibration performed in step 104 of the method 100, the target length of the ELG 210 is determined, via step 114. The target length of the ELG 210 corresponds to the target length of the structure 220 being fabricated. In one embodiment, the back edge 224, such as the back end of the read sensor or the end of the nose of a pole, is designed to be the same distance from the surface being lapped as the top edge 214 of the ELG 210. However, there may be some offset, which may be calibrated using step 104 of the method 100. Thus, in step 114 the correspondence between the resistance of the ELG 210 and the lengths of the ELG 210 and structure 220 can be determined. The lapping is terminated when the resistance of the ELG 210 indicates that the target length of the ELG 210, and thus the desired length of the structure 220, has been reached, via step 116.


The ELG 210 may thus be used to control lapping. Because both the sheet resistance and the offset of the ELG 210 have been calibrated, the target length of the ELG 210 may be better determined in step 114. Lapping can thus be better controlled. As a result, variations in lapping may be reduced. Consequently, the structure 220 may have a length closer to the desired length. For example, variations in the stripe height of a read sensor and the nose length of a pole may be reduced. Device manufacturability and performance may thus be better controlled.



FIG. 7 is a flow chart depicting an exemplary embodiment of a method 150 for calibrating the offset of ELG(s). As discussed with respect to the methods 100 and 110, the offset of the ELG is calibrated. The method 150 may thus be used in performing step 104 of the method 100. For simplicity, some steps may be omitted. The method 150 is also described in the context of a single ELG. However, the method 150 may be used for calibrating multiple ELGs at substantially the same time.


A plurality of windage test stripes is provided, via step 152. The windage test stripes have a differing heights corresponding to a plurality of mask dimensions. FIG. 8 is a diagram depicting an exemplary embodiment of test stripes 250, 252, 254, and 256 provided in step 152. For clarity, FIG. 8 is not to scale. For example, in one embodiment, the length, hi, of a test stripe may vary by other amounts not shown in FIG. 8. In one embodiment, the widths of the stripes 250, 252, 254, and 256 are known to a high degree of accuracy. For example, the width, w, of each stripe 250, 252, 254, and 256 may be greater than one hundred times the variation in the width. In the embodiment shown, the widths of the stripes 250, 252, 254, and 256 are the same. However, in another embodiment, the widths may vary. Windage test stripes 250, 252, 254, and 256 shown are substantially rectangular in shape. However, in another embodiment, stripes having another shape may be used. The test stripes 250, 252, 254, and 256 have varying heights h1, h2, h3, and h4. The varying heights h1, h2, h3, and h4 correspond to different dimensions for the masks (not shown) used in forming the stripes 250, 252, 254, and 256, respectively. The test stripes 250, 252, 254, and 256 provided in step 152 may be formed on the same substrate as the transducer(s) being fabricated. For example, the windage test stripes may be formed in part of a wafer that is not part of the final device. In another embodiment, the transducer may be configured such that the windage test stripes 250, 252, 254, and 256 are part of the transducer. In one embodiment, one set of windage test stripes are provided for each ELG in each flash field. For example, one set of windage test stripes may be provided for a RELG and another set of windage test stripes may be provided for the WELG. In such a case, the windage stripes for the RELG may have different shapes and/or configuration than those for the WELG.


A test resistance for the windage test stripes 250, 252, 254, and 256 is measured, via step 154. The stripe height for the windage test stripes 250, 252, 254, and 256 is determined, via step 156. The actual stripe heights h1, h2, h3, and h4 may be determined based on a known sheet resistance of the stripes 250, 252, 254, and 256, the resistances of the stripes 250, 252, 254, and 256, and the width, w, of the stripes. The length is given by the sheet resistance multiplied by the width and divided by the resistance measured.


A correction factor between the heights and the mask dimensions is determined using the lengths determined in step 156 and the mask dimensions, via step 158. The correction factor determined in step 158 may be used to account for differences in the actual heights of structures formed.


Through the use of the method 150, calibration of the ELG may be improved. In particular, the differences between the designed length as expressed in the masks and the actual lengths of the ELGs may be determined. As a result of this calibration, the differences between the lengths of the ELGs and the lengths of the structures being fabricated may be better determined. Consequently, the ELG may provide a more accurate indication of the height of the structure being fabricated. When used in connection with the methods 100 and 110, lapping may be improved.



FIG. 9 is a flow chart depicting an exemplary embodiment of a method 170 for calibrating the sheet resistance of ELG(s). As discussed with respect to the methods 100 and 110, the sheet resistance of the ELG is calibrated. The method 170 may be used in performing step 102 of the method 100. For simplicity, some steps may be omitted. The method 170 is also described in the context of a single ELG. However, the method 170 may be used for calibrating multiple ELGs at substantially the same time.


One or more Van der Pauw test patterns are provided for a corresponding ELG, via step 172. The Van der Pauw test pattern is fabricated of the same materials as the ELG. In one embodiment, each ELG has at least one corresponding Van der Pauw test pattern. Thus, each flash field may have at least one corresponding Van der Pauw test pattern. Van der Pauw test patterns are one well known mechanism for determining sheet resistance. However, in another embodiment, other test patterns might be used.


One or more test resistance measurements are taken for the Van der Pauw test pattern via step 174. In one embodiment, a single test resistance measurement might be used. However, in another embodiment, multiple measurements are taken for each test pattern. Based on these test resistance measurements and the known geometry of the Van der Pauw test pattern, the sheet resistance of the ELG may be determined, via step 176.


The method 170 allows for calibration of the sheet resistance of the ELG(s) used. In particular, the wafer-to-wafer variations in the sheet resistance of the ELG may be accounted for. In combination with the improved calibration of the offset(s) for the ELG(s), the target length of the ELGs may be better determined. In addition, resistance of the ELG corresponding to the desired length of the structure may be better determined. Consequently, lapping may be improved.



FIGS. 10-13 are diagrams depicting an exemplary embodiment of a head 300 utilizing ELGs and fabricated in accordance with the methods 100, 110, 150, and 170. The head 300 includes a read transducer 302 and a write transducer 304. For clarity, only a portion of the transducers 302 and 304 are shown. In addition, FIGS. 10-13 are not drawn to scale. FIG. 10 is a perspective view of the head 300. FIG. 11 is a diagram depicting a top view of a portion of the write transducer 304. FIG. 12 is a diagram depicting a top view of the read transducer 306. FIG. 13 depicts a portion of the leads in the head 300.


Referring to FIGS. 10-13, the read transducer 302 includes a reader structure 330 including a read sensor 332. The reader structure 330, and more specifically the read sensor 332, resides substantially in the plane 306. Other structures (not shown) may also be part of the read transducer 302. In addition, a RELG 310 resides substantially in the plane 306. Consequently, the RELG 310 and the read sensor 332 are substantially coplanar. Similarly, the write transducer 304 includes a main pole 340 having a nose 342. The pole 340 resides substantially in the plane 308. Other structures, such as other poles and coil(s) (not shown) are also part of the write transducer 304. In addition, a WELG 320 resides substantially in the plane 308. Consequently, the WELG 320 and the pole 340 are substantially coplanar. Formation of the RELG 310 and WELG 320 may be performed as the read sensor 332 and pole 340 are fabricated. For example, the WELG 320 may be shaped using masks utilized for the trimming of the pole 340. Pads 350, 360, and 370 are also shown. In addition, for an embodiment in which a metal gap layer (not shown) is used above the pole 340, it may be desirable to deposit an insulating film (not shown) on the WELG 320 prior to deposition of the gap layer in order to reduce the risk of shorting of the WELG 320. In the embodiment depicted, one RELG 310 and one WELG 320 for the read transducer 302 and the write transducer 304, respectively, are shown. In another embodiment, multiple RELGs and/or multiple WELGs may be used.


In the embodiment depicted, the shared ground pad 370 is used for both the WELG 320 and the RELG 310. Use of a shared ground pad 370 may enable closer placement of the RELG 310 and WELG 320 to the read sensor 332 and pole 340, respectively. Further, in order to reduce the number of fabrication processes specific to the WELG 320, contacts are providing through the films provided during fabrication of the transducer 304 to allow electrical contact to the WELG 320.


The WELG 320 has a bottom edge 322 at the surface 380 being lapped and a top edge 324. The pole 340 has a front edge 344 at the surface being lapped and a back edge 346 at the end of the nose 342, where the pole 340 widens. The RELG 310 has a bottom edge 312 at the surface 380 being lapped and a top edge 314. The read sensor 332 has a front edge 334 at the surface 380 being lapped and a back edge 336 at the end of read sensor 332. Through the use of the methods 100, 150, and 170, the offset of the edges 324 and 346 and the offset between the edges 314 and 336 may be calibrated.


Also shown are pads 390, 392, 394, and 396. In one embodiment, the pads 390, 392, 394, and 396 may reside above the pads 350 and 360. The pads 390, 392, 394, and 396 are used to make contact to leads for a Van der Pauw test pattern (not shown) or windage test stripes (not shown in FIGS. 10-13) that are not part of the head 300. In the embodiment shown, the Van der Pauw test pattern and windage test stripes are, instead formed on a portion of the substrate that is removed from the head 300 during fabrication. However, in another embodiment, the Van der Pauw test pattern and/or the windage test stripes might be included in the head 300. In the embodiment shown, four pads 390, 392, 394, and 396 are used for a four point measurement for the windage test stripes or the Van der Pauw test pattern. However, in another embodiment, another number of pads and/or another measurement may be used.


Using the methods 100, 150, and 170, the sheet resistances and offsets of the RELG 310 and WELG 320 may be calibrated. Further, the RELG 310 and WELG 320 may be employed to control lapping of the surface 380. As a result, variations in the lapping and, therefore, in the lengths of the nose 342 and read sensor 332 may be reduced. Consequently, manufacturability and performance of the head 300 may be improved.

Claims
  • 1. A slider comprising: a transducer including a magnetic structure having a front edge and a back edge;an electronic lapping guide (ELG) substantially coplanar with the magnetic structure and having a top edge and a bottom edge; anda plurality of pads configured to calibrate a sheet resistance of the ELG and an offset of the ELG;a plurality of windage test stripes having a plurality of windage lengths in a direction perpendicular to the front edge of the magnetic structure, the plurality of windage test stripes being separate from any transducer including the transducer;wherein the plurality of pads is configured to be connected to a plurality of leads for the plurality of windage test stripes, the plurality of windage test stripes for determining the offset between the top edge of the ELG and the back edge of the magnetic structure.
  • 2. The slider of claim 1 wherein the plurality of pads is configured to be connect to at least one Van der Pauw pattern corresponding to the ELG, the at least one Van der Pauw pattern for determining the sheet resistance of the ELG.
  • 3. The slider of claim 1 wherein the transducer is a read transducer, the magnetic structure is a read sensor, and wherein the ELG is a read electronic lapping guide.
  • 4. The slider of claim 3 further comprising: a write transducer including a first pole, a main pole, and at least one coil for energizing the main pole, the main pole including a nose and a yoke;a write electronic lapping guide (WELG) substantially coplanar with the main pole.
  • 5. The slider of claim 1 wherein the transducer is a write transducer, the magnetic structure is a pole and wherein the ELG is a write electronic lapping guide.
  • 6. The slider of claim 1 wherein the ELG is a tunneling magnetoresistive stripe.
  • 7. The slider of claim 1 wherein the plurality of windage test stripes are electrically isolated from the magnetic structure.
  • 8. A slider comprising: a transducer including a magnetic structure having a front edge and a back edge and a plurality of windage test stripes, the plurality of windage test stripes having a plurality of windage lengths in a direction perpendicular to the front edge of the magnetic structure, the plurality of windage test stripes being physically separated from the magnetic structure by a nonzero distance;an electronic lapping guide (ELG) substantially coplanar with the magnetic structure and having a top edge and a bottom edge,a plurality of pads configured to calibrate a sheet resistance of the ELG and an offset of the ELG;wherein the plurality of pads is configured to be connected to a plurality of leads for the plurality of windage test stripes, the plurality of windage test stripes for determining the offset between the top edge of the ELG and the back edge of the magnetic structure.
  • 9. The slider of claim 8 wherein the plurality of windage test stripes are electrically isolated from the magnetic structure.
CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No. 12/056,409, filed on Mar. 27, 2008, and now issued as U.S. Pat. No. 8,151,441, which is hereby incorporated by reference in its entirety.

US Referenced Citations (110)
Number Name Date Kind
4157497 Eisen et al. Jun 1979 A
4670732 Church Jun 1987 A
4675986 Yen Jun 1987 A
5065483 Zammit Nov 1991 A
5210667 Zammit May 1993 A
5361547 Church et al. Nov 1994 A
5597340 Church et al. Jan 1997 A
5678086 Gandola et al. Oct 1997 A
5722155 Stover et al. Mar 1998 A
5742995 Amin et al. Apr 1998 A
5772493 Rottmayer et al. Jun 1998 A
5876264 Church et al. Mar 1999 A
5963784 Bothra et al. Oct 1999 A
6003361 Amin et al. Dec 1999 A
6027397 Church et al. Feb 2000 A
6029339 Chang et al. Feb 2000 A
6047224 Stover et al. Apr 2000 A
6083081 Fukuroi et al. Jul 2000 A
6131271 Fontana et al. Oct 2000 A
6193584 Rudy et al. Feb 2001 B1
6288870 Saliba Sep 2001 B1
6347983 Hao et al. Feb 2002 B1
6364743 Pust et al. Apr 2002 B1
6399401 Kye et al. Jun 2002 B1
6475064 Hao et al. Nov 2002 B2
6532646 Watanuki Mar 2003 B2
6609948 Fontana, Jr. et al. Aug 2003 B1
6623330 Fukuroi Sep 2003 B2
6674610 Thomas et al. Jan 2004 B1
6684171 Church et al. Jan 2004 B2
6699102 Reiley et al. Mar 2004 B2
6728067 Crawforth et al. Apr 2004 B2
6758722 Zhu Jul 2004 B2
6760197 Boutaghou et al. Jul 2004 B2
6786803 Crawforth et al. Sep 2004 B2
6793557 Bunch et al. Sep 2004 B2
6846222 Church et al. Jan 2005 B2
6857937 Bajorek Feb 2005 B2
6884148 Dovek et al. Apr 2005 B1
6935923 Burbank et al. Aug 2005 B2
6950289 Lam et al. Sep 2005 B2
6982042 Church et al. Jan 2006 B2
7014530 Kasiraj et al. Mar 2006 B2
7139152 Mahnad et al. Nov 2006 B2
7149061 Yamakura et al. Dec 2006 B2
7206172 Ding et al. Apr 2007 B2
7244169 Cyrille et al. Jul 2007 B2
7245459 Cyrille et al. Jul 2007 B2
7268976 Yamakura et al. Sep 2007 B2
7271982 MacDonald et al. Sep 2007 B2
7272883 Le et al. Sep 2007 B2
7287316 Kasahara et al. Oct 2007 B2
7333300 Church et al. Feb 2008 B2
7359152 Matono et al. Apr 2008 B2
7360296 Cyrille et al. Apr 2008 B2
7393262 Biskeborn Jul 2008 B2
7422511 Fukuroi Sep 2008 B2
7551406 Thomas et al. Jun 2009 B1
7554767 Hu et al. Jun 2009 B1
7564110 Beach et al. Jul 2009 B2
7603762 Baer et al. Oct 2009 B2
7643250 Araki et al. Jan 2010 B2
7716814 Sasaki et al. May 2010 B2
7770281 Pentek Aug 2010 B2
7788796 Hsiao et al. Sep 2010 B2
7861400 Lille Jan 2011 B2
8151441 Rudy et al. Apr 2012 B1
8165709 Rudy Apr 2012 B1
8291743 Shi et al. Oct 2012 B1
8307539 Rudy et al. Nov 2012 B1
8443510 Shi et al. May 2013 B1
20010004800 Yoshida et al. Jun 2001 A1
20010051491 Hao et al. Dec 2001 A1
20020012204 Boutaghou et al. Jan 2002 A1
20020094758 Reiley et al. Jul 2002 A1
20020173227 Lam et al. Nov 2002 A1
20030020467 Kasahara et al. Jan 2003 A1
20030021069 Crawforth et al. Jan 2003 A1
20040009739 Zhu Jan 2004 A1
20040075942 Bajorek Apr 2004 A1
20040097173 Crawforth et al. May 2004 A1
20040179310 Lam et al. Sep 2004 A1
20050023673 Nowak Feb 2005 A1
20050028354 Shindo et al. Feb 2005 A1
20050070206 Kasiraj et al. Mar 2005 A1
20050164607 Bajorek Jul 2005 A1
20050180048 MacDonald et al. Aug 2005 A1
20050185345 Ding et al. Aug 2005 A1
20050219752 Takahashi Oct 2005 A1
20060027528 Church et al. Feb 2006 A1
20060028770 Etoh et al. Feb 2006 A1
20060034021 Wu Feb 2006 A1
20060044683 Matono et al. Mar 2006 A1
20060103990 Ito et al. May 2006 A1
20060126222 Aoki et al. Jun 2006 A1
20060139802 Sasaki et al. Jun 2006 A1
20060168798 Naka Aug 2006 A1
20070008660 Yamakura et al. Jan 2007 A1
20070070543 Gunder et al. Mar 2007 A1
20070246761 Beach et al. Oct 2007 A1
20080013219 Wu Jan 2008 A1
20080072418 Kondo et al. Mar 2008 A1
20080144215 Hsiao et al. Jun 2008 A1
20080273275 Lille Nov 2008 A1
20090152235 Hsiao et al. Jun 2009 A1
20090211081 Boone, Jr. et al. Aug 2009 A1
20090268348 Bonhote et al. Oct 2009 A1
20100162556 Guruz et al. Jul 2010 A1
20100165513 Bonhote et al. Jul 2010 A1
20100208391 Gokemeijer Aug 2010 A1
Foreign Referenced Citations (2)
Number Date Country
60153137 Aug 1985 JP
2000067408 Mar 2000 JP
Non-Patent Literature Citations (3)
Entry
Matsushita, et al., “Elaborate Precision Machining Technologies for Creating High Added Value at Low Cost”, Fujitsu Sci. Tech. J., 43, 1, pp. 67-75, Jan. 2007.
Office Action dated Mar. 21, 2011 from U.S. Appl. No. 12/056,409, 16 pages.
Notice of Allowance dated Dec. 8, 2011 from U.S. Appl. No. 12/056,409, 12 pages.
Divisions (1)
Number Date Country
Parent 12056409 Mar 2008 US
Child 13419313 US