Patent Application
20170285434
This non-provisional patent application claims priority under 35 U.S.C. §119(a) from Patent Application No. 201610202699.9 filed in The People's Republic of China on Apr. 1, 2016.
This present disclosure relates to electronic paper display technology, and in particular to an electronic paper display module, a method for making the electronic paper display module, and an electronic paper display device utilizing the electronic paper display module.
Electrophoretic electronic papers have a high contrast and a wide view angle. Characters and images displayed by the electrophoretic electronic papers do not disappear immediately when the power is suddenly cut off. In addition, the electrophoretic electronic papers are easily bendable, and do not need backlight and continuous charging. Due to these characteristics, the electrophoretic electronic papers are becoming more and more widely used, for example, in books, printing medium for paper or magazine, foldable screens, or electronic wallpapers.
The electronic paper display device typically includes a housing, a main board mounted in the housing, and an electronic paper display module mounted in the housing and electrically connected with the main board. Referring to
The electronic paper display layer 530 includes an electronic paper display screen 532 and an image layer 535 that are stacked with each other. The electronic paper display screen 532 is used to display characters or images. Characters or images to be displayed by the electronic paper display layer 530 are printed on the image layer 535, and the image layer 535 is electrically connected with the circuit layer 520. The electrical connecting member 570 is used to electrically connect the circuit layer 520 with the main board of the electronic paper display device or with an external power supply to supply power to the circuit layer 520.
In making the electronic paper display module 500, the substrate 510 is first provided, wherein the substrate 510 is made from polyethylene terephthalate (PET). A hole is drilled through the substrate 510. Conductive silver paste is printed on the lower surface of the substrate 510 to form the circuit layer 520. Conductive carbon paste is printed on the lower surface of the circuit layer 520 to form the electrical connecting member 570. Conductive carbon paste is printed on the upper surface of the substrate 510 to form the image layer 535. The insulating layer 560 is formed on the lower surface of the circuit layer 520 by printing. The electronic paper display screen 532 is affixed to the upper surface of the image layer 535 and is pressed to securely connect with the image layer 535. The resulted assembly is stored in an environment having a temperature of 25 degrees and a relative humidity of 50%, so as to maintain the relative humidity of ink layer of the electronic paper display screen at 50%±5%. The bottom protective layer 550 is affixed to the lower surface of the circuit layer 520, and the bottom protective layer 550, the insulating layer 560 and the electrical connecting member 570 completely cover the lower surface of the circuit layer 520. The top protective layer 540 is affixed to the upper surface of the electronic paper display screen 532. The top protective layer 540 and the bottom protective layer 550 are pressed to make the top protective layer 540 seal the upper surfaces and four sides of the electronic paper display layer 530 and make the bottom protective layer 550 seal the lower surface and three adjacent side surfaces of the circuit layer 520. Finally, a circumferential edge of the electronic paper display module 500 is punched to make it have a shape as desired.
In the above process of making the electronic paper display module 500, in order to maintain the relative humidity of the ink layer of the electronic paper display screen 532 at 50%±5%, the top protective layer 540 and the bottom protective layer 550 are required to be affixed to the upper and lower surfaces of the substrate 510, respectively, to seal the circuit layer 520 and the electronic paper display layer 530, thereby isolating them from outside air and preventing them from getting damp. However, because of the top protective layer 540 and the bottom protective layer 550 affixed to the upper and lower surfaces of the substrate 510, the process of making the electronic paper display module 500 can be complex, which increases the manufacturing cost. In addition, the protective layers have high cost and, therefore, the use of the top protective layer 540 and the bottom protective layer 550 increases the material cost.
Accordingly, there is a desire for a simplified method of making an electronic paper display module, an electronic paper display module with reduced cost, and an electronic paper display device employing the electronic paper display module.
In one aspect, an electronic paper display module is provided which includes a substrate, a circuit layer, an insulating layer, an electronic paper display layer, an electrical connecting member, and a top protective layer. The circuit layer is disposed on one side of the substrate. The insulating layer is disposed on the substrate and the circuit layer. The electronic paper display layer is disposed on one side of the insulating layer opposite from the circuit layer and partially passes through the insulating layer to electrically connect with the circuit layer. The top protective layer is disposed on the insulating layer and the electronic paper display layer. The top protective layer, the insulating layer and the circuit layer cooperatively seal the electronic paper display layer to isolate it from outside air. The circuit layer, the insulating layer, the electrical connecting member and the substrate cooperatively seal the circuit layer to isolate it from outside air.
Preferably, the substrate comprises a thin metal sheet and two protective films disposed on opposite sides of the thin metal sheet, and the circuit layer is disposed on one side of one of the two protective films opposite from the thin metal sheet.
Preferably, the two protective films are adhered to the thin metal sheet with adhesive.
Preferably, the substrate comprises a metal sputtered base plate and two protective films on opposite sides of the metal sputtered base plate, and the circuit layer is disposed on one side of one of the two protective films opposite from the metal sputtered base plate.
Preferably, the metal sputtered base plate comprises a metal layer formed on its surface through a sputter deposition process.
Preferably, a material of the protective film is one of polycarbonate, polymethyl methacrylate, polyethylene terephthalate, polyethersulfone, cellulose ester, polyvinyl chloride, benzocyclobutene and acrylic resin.
Preferably, the electronic paper display module comprises an image layer and an electronic paper display screen. The image layer is disposed on the insulating layer and partially passes through the insulating layer to electrically connect with the circuit layer. The image layer is pre-formed with images or characters that the electronic paper display module needs to display, and the electronic paper display screen is stacked on the image layer.
Preferably, the electronic paper display screen is one of a micro-capsule electrophoretic screen, a microcup electrophoretic screen, a gyricon bead electrophoretic screen, and a partition electrophoretic screen.
Preferably, the image layer is made of conductive carbon paste ink or metal.
Preferably, the electrical connecting layer is made of conductive carbon paste ink or metal, the circuit layer is made of conductive silver paste ink or metal, and the insulating layer is made of insulating ink or resin.
In another aspect, an electronic paper display device is provided which employs the above-described electronic paper display module.
In still another aspect, a method for making an electronic paper display module is provided which includes the steps of: providing a substrate; forming a circuit layer on one side of the substrate; forming an insulating layer on the substrate and the circuit layer, with part of the circuit layer exposed outside the insulating layer; forming an image layer on one side of the insulating layer opposite from the circuit layer according to a preset image, with the image layer partially passing through the insulating layer to electrically connect with the circuit layer; forming an electrical connecting member on the circuit layer, wherein the electrical connecting member, the image layer, the insulating layer and the substrate cooperatively seal the circuit layer to isolate it from outside air; providing an electric paper display screen, and affixing and pressing the electronic paper display screen onto one side of the image layer opposite from the insulating layer; storing the electronic paper display module thus formed in an environment having a temperature of 25 degrees and a relative humidity of 50%, such that the relative humidity of electronic ink in the electronic paper display screen is maintained at 50%+5%; and forming a top protective layer on the electronic paper display screen and the insulating layer, wherein the top protective layer, the insulating layer and the circuit layer cooperatively seals the electronic paper display screen to isolate it from outside air.
Preferably, the circuit layer is formed by printing a conductive silver paste ink, or from a metal material through a sputtering, pressing, etching or laser process.
Preferably, the insulating layer is formed by printing an insulating ink, or by affixing and pressing or coating resin.
Preferably, the image layer is formed by printing a conductive carbon paste ink, or from a metal material through a sputtering, pressing, etching or laser process.
Preferably, the electrical connecting member is formed by printing a conductive carbon paste ink, or made from metal.
Preferably, the method further comprises the step of punching the electronic paper display module according to a preset shape after the top protective film is formed.
In the method for making the electronic paper display module of the present invention, the damp-resistant substrate is provided, and the circuit layer, the insulating layer and the electronic paper display layer are sequentially disposed on one side of the substrate, such that the circuit layer and the electronic paper display layer 70 can be sealed simply by affixing the top protective layer to the electronic paper display module, thereby maintaining the relative humidity of the electronic ink in the electronic paper display layer at 50%±5%. In comparison with the prior art, in making the electronic paper display module, adhering the bottom protective layer is no longer required, which simplifies the fabrication process and reduces the cost.
Below, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Various embodiments of the present invention will be described with reference to the accompanying drawings. In the description and drawings, like reference numerals designate like elements. It should be noted that the figures are merely illustrative rather than restrictive. It also should be noted that the figures are only intended to facilitate the description and are not drawn to scale. Unless otherwise specified, all technical and scientific terms have the ordinary meaning as understood by people skilled in the art.
It is noted that, when a component is described to be “connected” to another component, it can be directly connected to the another component or there may be an intermediate component. When a component is described to be “disposed” on another component, it can be directly disposed on the another component or there may be an intermediate component. The terms used herein such as “top layer”, “upper surface”, “lower surface”, “side surface” or similar expressions are for the purposes of illustration only.
In the embodiment, the substrate 20 includes a thin metal sheet 22 and two protective films 24 disposed on upper and lower surfaces of the thin metal sheet 22. The thin metal sheet 22 may be made from a metal material such as aluminum, copper or tinned copper. The protective film 24 is adhered to the thin metal sheet 22 with adhesive 26. The protective film 24 may be made from a transparent flexible material such as plastic or resin. Specifically, the material of the protective film 24 may be polyester such as polycarbonate (PC), polymethyl methacrylate (PMMA) or polyethylene terephthalate (PET), or polyethersulfone (PES), cellulose ester, polyvinyl chloride (PVC), benzocyclobutene (BCB) or acrylic resin. Preferably, in the embodiment, the protective film 24 is a PET layer.
In this embodiment, the circuit layer 40 is formed by printing a conductive silver paste ink on one side of one protective film 24 opposite from the thin metal sheet 22. It should be understood that, in other embodiments, the circuit layer 40 may be formed from a metal material such as copper, aluminum or nickel, via a sputtering, pressing, etching or laser process.
In this embodiment, the insulating layer 50 is formed by printing an insulating ink. It should be understood that, in another embodiment, the insulating layer 50 may be formed by adhering or coating an insulating material such as resin on the circuit layer 40. The insulating layer 50 is disposed on the upper surfaces of the substrate 20 and the circuit layer 40 according to a preset pattern and seals three adjacent side surfaces of the circuit layer to prevent the circuit layer 400 from getting oxidized or damp by the outside environment. According to the preset pattern, the insulating layer 50 exposes a portion of the upper surface of the circuit layer 40 adjacent its side surface, for mounting the electrical connecting member 80. In addition, a portion of the upper surface of the circuit layer 40 close to a central area thereof is exposed outside the insulating layer 50, for allowing a part of the electronic paper display layer 70 to pass through the insulating layer 50 to electrically connect with the circuit layer 40. It should be understood that, in other embodiments, the insulating layer 50 may completely cover the upper surface of the circuit layer 40, and a hole is drilled through the insulating layer 50 to expose the portion of the upper surface of the circuit layer 40 close to the central area or an edge thereof.
In this embodiment, the electronic paper display layer 70 includes an image layer 72 and an electronic paper display screen 74. The image layer 72 is disposed on the upper surface of the insulating layer 50 and partially passes through the insulating layer 50 to electrically connect with the circuit layer 40. The image layer 72 is formed by printing a conductive carbon paste ink, on which all figures or characters that the electronic paper display module 410 needs to display are pre-formed. It should be understood that, in other embodiments, the image layer 72 may also be formed from a metal material through a sputtering, pressing, or etching process. The electronic paper display screen 74 is affixed to and completely covers an upper surface of the image layer 72, and has the same size as the image layer 72. The electronic paper display screen 74 may be an existing electrophoretic screen such as, but not limited to, one of a micro-capsule electrophoretic screen, a microcup electrophoretic screen, a gyricon bead electrophoretic screen, and a partition electrophoretic screen.
In this embodiment, the electrical connecting member 80 is formed by printing a conductive carbon paste ink. It should be understood that, in other embodiments, the electrical connecting member 80 may be formed from another conductive material such as metal.
In this embodiment, the top protective layer 90 is disposed on the upper surfaces of the electronic paper display screen 74 and the insulating layer 50 and completely seals the upper surface and four side surfaces of the electronic paper display screen 74 and four side surfaces of the image layer 72. The top protective layer 90, the insulating layer 50, and the circuit layer 40 cooperatively seal the electronic paper display layer to isolate it from outside air and prevent it from getting damp, thereby maintaining a relative humidity of electronic ink in the electronic paper display screen 74 at 50%+5%. A material of the top protective layer 90 may be a polyester such as polycarbonate (PC), polymethyl methacrylate (PMMA) or polyethylene terephthalate (PET), or polyethersulfone (PES), cellulose ester, polyvinyl chloride (PVC), benzocyclobutene (BCB) or acrylic resin. Preferably, in this embodiment, the top protective layer 90 is a PET layer.
Referring to
601: A substrate is provided. The substrate has a damp-resistant capability. The substrate includes a thin metal sheet and protective films disposed on opposite sides of the thin metal sheet. Alternatively, the substrate includes two protective films and a metal sputtered base plate sandwiched between the two protective films. The substrate may be cut into desired specification.
602: A circuit layer is formed on an upper surface of the substrate. The circuit layer may be formed by printing a conductive silver paste ink, or made from a metal through a sputtering, pressing or etching process.
603: An insulating layer is formed on the upper surface of the substrate and an upper surface of the circuit layer, with part of the upper surface of the circuit layer exposed outside the insulating layer. The insulating layer is formed by printing an insulating ink, or alternatively by affixing and pressing or coating an insulating material such as resin to the substrate or the circuit layer. The insulating layer seals three adjacent side surfaces of the circuit layer.
604: An image layer is formed on an upper surface of the insulating layer according to a preset image. The image layer partially passes through the insulating layer to electrically connect with the circuit layer. The image layer may be formed by printing a conductive carbon paste ink, or alternatively made from a metal through a sputtering, pressing or etching process.
605: An electrical connecting member is formed on an upper surface of the circuit layer, and the electrical connecting member, the image layer and the insulating layer cooperatively cover the upper surface of the circuit layer. The electrical connecting member may be formed by printing a conductive carbon paste ink, or alternatively made from an electrically conductive material such as an electrically conductive metal.
606: An electric paper display screen is provided, which is affixed and pressed on the upper surface of the image layer. The electronic paper display screen covers the upper surface of the image layer and has the same size as the image layer.
607: The resulted electronic paper display module is stored in an environment having a temperature of 25 degrees and a relative humidity of 50%, such that the relative humidity of electronic ink in the electronic paper display screen is maintained at 50%±5%.
608: A top protective layer is formed on the upper surface of the electronic paper display screen and the upper surface of the insulating layer. The top protective layer seals the electronic paper display screen and the image layer to isolate them from outside air. The protective layer may be formed by affixing or coating. When the protective layer is formed on the upper surface of the electronic paper display screen by affixing, the top protective layer is pressed to seal the electronic paper display screen and the image layer.
609: The electronic paper display module is punched according to a preset shape.
In the method for making the electronic paper display module of the present invention, the damp-resistant substrate (20, 30) is provided, and the circuit layer 40, the insulating layer 50 and the electronic paper display layer 70 are sequentially disposed on one side of the substrate (20, 30), such that the circuit layer 40 and the electronic paper display layer 70 can be sealed simply by affixing a top protective layer 90 to the electronic paper display module 400, thereby maintaining the relative humidity of the electronic ink in the electronic paper display layer 70 at 50%±5%. In comparison with the prior art, in making the electronic paper display module, the bottom protective layer is no longer required, which simplifies the fabrication process and reduces the cost.
Although the invention is described with reference to one or more embodiments, the above description of the embodiments is used only to enable people skilled in the art to practice or use the invention. It should be appreciated by those skilled in the art that various modifications are possible without departing from the spirit or scope of the present invention. The embodiments illustrated herein should not be interpreted as limits to the present invention, and the scope of the invention is to be determined by reference to the claims that follow.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2016 1020 2699.9 | Apr 2016 | CN | national |
