Patent Grant
7385828
This invention generally relates to an electronic shunt resistor assembly and a method to electrically connect a shunt resistor to a substrate supporting electronic components.
The low resistance value of a shunt resistor results in very small voltage measurements as low as 3 μV. To minimize the measurement error from parasitic voltages developed by dissimilar metals and temperature gradients, the conductor materials used in connection with a shunt resistor shall be the same metallic elements. The parasitic voltages can also be minimized by eliminating the temperature differences between the various parts of the circuit as these temperatures can contribute to measurement error in the application.
Current solutions accomplish the connection between the shunt resistor and the substrate supporting the electronic components by soldering as shown in U.S. Pat. No. 6,787,935 granted to Andreus Heim Sep. 7, 2004, or by using scythe-type lines bent upward by 90 degrees of the transmission connections. Alternatively, the connection between the shunt resistor and the substrate can be accomplished by soldering S-shaped copper interconnects as shown in the prior art assembly of
The weakness of these connection methods is that the soldered interfaces induce voltage measurement error. Moreover the connection methods are difficult to process because significant energy is required to heat the large copper slug sufficiently to reflow solder. The voltages induced by the various metals involved in the connection are increased by the thermal differences between the metals. Since the voltages that are to be measured across the shunt resistor are very small (as low as 3 μV), the induced voltages can significantly affect the accuracy of the shunt voltage measurement.
This invention provides an electronic shunt resistor assembly that minimizes the thermal differences and the material differences in the connection junctions between the shunt resistor and the electronic monitoring circuit to eliminate errors in the shunt voltage measurement. The invention is disclosed in four embodiments that accomplish these objectives.
As background,
Referring now to the first embodiment of the invention disclosed in connection with
The electronic monitoring unit 14 has a circuit board 22 that is supported on the planar shunt resistor 12 by a plastic frame 23. Circuit board 22 is preferably of a material that has substantially the same coefficient of thermal expansion as the resistance element 16 and the terminal bars 18 and 20. In the example cited above, the material for the circuit board would be a conventional board material such as FR4 which is mixture of materials with epoxy resin as the main constituent. The circuit board may also be comprised of an inorganic substrate such as ceramic.
Circuit board 22 includes input contacts 24 for electronic components 26 carried by circuit board 22 in order to monitor desired characteristics, such as the voltage drop across the resistor 16. Input contacts 24 are preferably arranged along one edge of circuit board 22. Circuit board 22 also has input/output contacts 28 for the electronic components 26 with input/output contacts 28 preferably being arranged along a opposite edge of circuit board 22. In the example cited above, contacts 24 and 28 are preferably copper or a copper alloy that has substantially the same coefficient of thermal expansion and electrical properties as the resistance element 16 and the terminal bars 18 and 20.
Electronic shunt resistor assembly 10 further includes a first plurality of electrical connectors 30 connecting the terminal bar 18 at one end of the resistance element 16 to the input contacts 24 of circuit board 22 and a second plurality of electrical connectors 32 connecting the terminal bar 20 at an opposite end of the resistance element 16 to the input/output contacts 28 of circuit board 22. The electrical connectors 30 and 32 are wires that are also of material that has substantially the same electrical properties and coefficient of thermal expansion as the other components discussed above. In the example that is discussed above, the material of the electrical connectors 30 and 32, i.e. the wires 30 and 32 is selected from the group consisting of copper and copper alloys. The electrical connectors 30 and 32 are not only of a selected material but the electrical wires 30 and 32 are also bonded to the respective terminal bars 18 and 20 and to the respective contacts 24 and 28 solderlessly to avoid or at least reduce parasitic voltage drops that can be produced by the use of dissimilar materials and/or differential thermal expansion of the components. The solderless bond or wire-bonding is preferably achieved by ultrasonic welding which is a well known conventional process.
Thus in this first embodiment, copper or copper alloy wire bonds are used to connect the shunt resistor 12 to the monitoring circuit of the electronic monitoring unit 14. The shunt attachment points are copper or copper alloy as are the attachment points on the monitoring circuit board 22. The same metals are used in each junction thereby eliminating problems associated with the use of dissimilar metals. Moreover, the wire bonds can be repeated to create a redundant connection with effective heat transfer capability which minimizes the thermal gradients between the different electronic components of the monitoring circuit. The attachment process is preferably a ultra-ultrasonic weld which is well known in the integrated circuit packaging industry.
Referring now to the second embodiment of the invention disclosed in connection with
Thus in this second embodiment, copper foil leaves are bonded to the circuit board using a commonly used via hole and copper plating process. The leaves will then be welded to the copper terminal bars. The advantages of the second embodiment like the first, are that the same metals are used at each junction thereby eliminating problems associated with the use of dissimilar metals. Moreover, the copper leaves are effective heat transfer paths which minimize the thermal gradients at the junctions.
Referring now to the third embodiment of the invention disclosed in connection with
Referring now to the fourth embodiment of the invention disclosed in connection with
It will be readily understood by those persons skilled in the art that the present invention is susceptible of broad utility and application. Many embodiments and adaptations of the present invention other than those described above, as well as many variations, modifications and equivalent arrangements, will be apparent from or reasonably suggested by the present invention and the foregoing description, without departing from the substance or scope of the present invention. Accordingly, while the present invention has been described herein in detail in relation to its preferred embodiments, it is to be understood that this disclosure is only illustrative and exemplary of the present invention and is made merely for purposes of providing a full and enabling disclosure of the invention. The foregoing disclosure is not intended or to be construed to limit the present invention or otherwise to exclude any such other embodiments, adaptations, variations, modifications and equivalent arrangements, the present invention being limited only by the following claims and the equivalents thereof.
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| Number | Date | Country | |
|---|---|---|---|
| 20070177318 A1 | Aug 2007 | US |
