In at least one aspect, the present invention relates to negative electron affinity semiconductor photocathode.
The modern-day congested and contested electromagnetic spectrum has placed stringent demands on electronic systems[1, 2]. A single electromagnetic (EM) source that changes transmission bands, multiple frequencies, or even frequency bands and is able to quickly switch frequencies when the desired communication channels become contested is of value in a contested environment.
Electron emission cathodes are used in a wide variety of applications, including but not limited to, electron microscopes[15, 16], electron beam lithography[17], space propulsion[18], high power microwave (HPM) devices[19-21],, free-electron lasers[22], and displays[23]. HPM sources for millimeter-wave and terahertz radiation are of great interest for military and defense applications such as radar, electronic countermeasures, and communications[20, 24]. While photo-assisted field emission devices have been explored in the past[25],[26],[27],[28],[29], as promising high-frequency emitter, these are generally studied utilizing free-space optics to directly focus a laser on a tip or tip array, and use p-type silicon to enable photogating of field emission. Recently, simulation and experimental results have shown that optically driven emitters[30-37] could play a valuable role in cathodes for high-power microwave and vacuum electron devices in general.
Generating ultra-fast electron pulse trains from a low-power optical signal with stable electron emitters has been a key goal for vacuum electron emitters[33, 34, 36, 38-42]. Photo-gated semiconductor field emitters have been explored in the past due to the possibility of stable, ultrafast modulation with a low-power laser. The introduction of the laser enables significant reduction of the gate-emitter capacitance, which is a key limiter for field emitter array response times. Thus far, the majority of devices explored have been p-type semiconductors [39, 43-45], primarily silicon, made into sharp tips with local metal gates encircling the tips. Such emitters do not have a large supply of electrons due to the p-type semiconductor doping, so the voltage is used to bring the emitter to the edge of emission, and the optical pulse is used to modulate the supply function. Experimental results for such samples have been promising, with the best emitter arrays demonstrating a pulse full width half maximum (FWHM) of ~80 ps [39]. However, the efficiency of such emitter arrays has been limited, with quantum efficiencies of < 0.05%. Thus, to get 1 mA of current from the emitter would require a >2 W laser, limiting the compactness of the system. Thus far, these systems have primarily been fabricated out of semiconductors that absorb primarily visible and near-infrared light, such as Si.
The combination of visible light-based emitters and high powers necessary also prevent the use of state-of-the-art (SOA) commercial laser amplitude modulators, which are primarily developed for optical telecom wavelengths, between 1300 nm-1600 nm. However, even with SOA commercial modulators, it is a challenge to effectively modulate beams at the watt level. However, ~200 mW level beams can be modulated at >20 GHz frequencies. This implies that devices sensitive to telecom wavelength photons exhibiting photon-to-electron quantum efficiencies of 10-30% are required in order to get modulated currents in the 10-100 mA range.
Accordingly, there is a need for improved negative electron affinity semiconductor photocathode.
In at least one aspect, a Hot Electron Laser-Assisted Cathode (HELAC) device is provided. The HELAC device includes a semiconductor layer that absorbs incident photons, a graphene monolayer disposed over the semiconductor layer, and an insulator layer interposed between the semiconductor layer and graphene monolayer. The graphene monolayer is configured as a gate for the HELAC device while the insulator layer is configured to allow a voltage drop between the semiconductor layer and graphene. Advantageously, the HELAC device is configured to receive photons on an emitter surface and to emit hot electrons therefrom.
In another aspect, a photo-gated emitter termed Hot Electron Laser-Assisted Cathode (HELAC) that is sensitive to 1550 nm photons, with quantum efficiencies of >30%, and pulse FWHMs down to 5 ps is provided. This is achieved by utilizing III-V semiconductors typically used in telecom devices, a planar geometry, and a gate that is simultaneously electron and optically transparent.
In another aspect, the HELAC device set forth herein has the following properties: high-quantum efficiency with current densities up to 1 A/cm2; highly scalable planar geometry, eliminating sensitive field enhancement structures; sensitivity to telecommunication wavelengths to leverage commercial laser infrastructure; and modulation rates of up to 250 GHz
In another aspect, the HELAC device is comprised of a semiconductor or semimetal absorber, an insulator, and a metal emitter.
In another aspect, the HELAC device is comprised of a semiconductor or semimetal absorber, an insulator, and a semiconductor emitter.
In another method, a method for fabricating a Hot Electron Laser-Assisted Cathode (HELAC) device is provided. The method includes a step of epitaxially depositing a semiconductor layer over a top face of a wafer substrate. An insulator layer is deposited over the semiconductor layer by atomic layer deposition and/or plasma-enhanced chemical vapor deposition. A bottom contact is deposed over the bottom face of the wafer substrate. A graphene layer is transferred onto the insulator layer.
The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description.
For a further understanding of the nature, objects, and advantages of the present disclosure, reference should be made to the following detailed description, read in conjunction with the following drawings, wherein like reference numerals denote like elements and wherein:
Reference will now be made in detail to presently preferred embodiments and methods of the present invention, which constitute the best modes of practicing the invention presently known to the inventors. The Figures are not necessarily to scale. However, it is to be understood that the disclosed embodiments are merely exemplary of the invention that may be embodied in various and alternative forms. Therefore, specific details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for any aspect of the invention and/or as a representative basis for teaching one skilled in the art to variously employ the present invention.
It is also to be understood that this invention is not limited to the specific embodiments and methods described below, as specific components and/or conditions may, of course, vary. Furthermore, the terminology used herein is used only for the purpose of describing particular embodiments of the present invention and is not intended to be limiting in any way.
It must also be noted that, as used in the specification and the appended claims, the singular form “a,” “an,” and “the” comprise plural referents unless the context clearly indicates otherwise. For example, reference to a component in the singular is intended to comprise a plurality of components.
The term “comprising” is synonymous with “including,” “having,” “containing,” or “characterized by.” These terms are inclusive and open-ended and do not exclude additional, unrecited elements or method steps.
The phrase “consisting of” excludes any element, step, or ingredient not specified in the claim. When this phrase appears in a clause of the body of a claim, rather than immediately following the preamble, it limits only the element set forth in that clause; other elements are not excluded from the claim as a whole.
The phrase “consisting essentially of” limits the scope of a claim to the specified materials or steps, plus those that do not materially affect the basic and novel characteristic(s) of the claimed subject matter.
With respect to the terms “comprising,” “consisting of,” and “consisting essentially of,” where one of these three terms is used herein, the presently disclosed and claimed subject matter can include the use of either of the other two terms.
It should also be appreciated that integer ranges explicitly include all intervening integers. For example, the integer range 1-10 explicitly includes 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10. Similarly, the range 1 to 100 includes 1, 2, 3, 4.... 97, 98, 99, 100. Similarly, when any range is called for, intervening numbers that are increments of the difference between the upper limit and the lower limit divided by 10 can be taken as alternative upper or lower limits. For example, if the range is 1.1. to 2.1 the following numbers 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, and 2.0 can be selected as lower or upper limits.
When referring to a numerical quantity, in a refinement, the term “less than” includes a lower non-included limit that is 5 percent of the number indicated after “less than.” A lower non-includes limit means that the numerical quantity being described is greater than the value indicated as a lower non-included limited. For example, “less than 20” includes a lower non-included limit of 1 in a refinement. Therefore, this refinement of “less than 20” includes a range between 1 and 20. In another refinement, the term “less than” includes a lower non-included limit that is, in increasing order of preference, 20 percent, 10 percent, 5 percent, 1 percent, or 0 percent of the number indicated after “less than.”
For any device described herein, linear dimensions and angles can be constructed with plus or minus 50 percent of the values indicated rounded to or truncated to two significant figures of the value provided in the examples. In a refinement, linear dimensions and angles can be constructed with plus or minus 30 percent of the values indicated rounded to or truncated to two significant figures of the value provided in the examples. In another refinement, linear dimensions and angles can be constructed with plus or minus 10 percent of the values indicated rounded to or truncated to two significant figures of the value provided in the examples.
With respect to electrical devices, the term “connected to” means that the electrical components referred to as connected to are in electrical communication. In a refinement, “connected to” means that the electrical components referred to as connected to are directly wired to each other. In another refinement, “connected to” means that the electrical components communicate wirelessly or by a combination of wired and wirelessly connected components. In another refinement, “connected to” means that one or more additional electrical components are interposed between the electrical components referred to as connected to with an electrical signal from an originating component being processed (e.g., filtered, amplified, modulated, rectified, attenuated, summed, subtracted, etc.) before being received to the component connected thereto.
The term “electrical communication” means that an electrical signal is either directly or indirectly sent from an originating electronic device to a receiving electrical device. Indirect electrical communication can involve processing of the electrical signal, including but not limited to, filtering of the signal, amplification of the signal, rectification of the signal, modulation of the signal, attenuation of the signal, adding of the signal with another signal, subtracting the signal from another signal, subtracting another signal from the signal, and the like. Electrical communication can be accomplished with wired components, wirelessly connected components, or a combination thereof.
The term “one or more” means “at least one” and the term “at least one” means “one or more.” The terms “one or more” and “at least one” include “plurality” as a subset.
The term “substantially,” “generally,” or “about” may be used herein to describe disclosed or claimed embodiments. The term “substantially” may modify a value or relative characteristic disclosed or claimed in the present disclosure. In such instances, “substantially” may signify that the value or relative characteristic it modifies is within ± 0%, 0.1%, 0.5%, 1%, 2%, 3%, 4%, 5% or 10% of the value or relative characteristic.
In drawings of multilayer structures, layers drawn as contacting each other can contact each other. In a refinement, one or more additional layers can be interposed between the layers drawn as contacting each other. The term “disposed over” encompasses the situation when two layers contact each other and when additional layers are interposed between two layers drawn as contacting each other.
Throughout this application, where publications are referenced, the disclosures of these publications in their entireties are hereby incorporated by reference into this application to more fully describe the state of the art to which this invention pertains.
“EQE” means external quantum efficiency.
“HELAC” means Hot Electron Laser-Assisted Cathode.
“NA” is the number density of acceptor atoms added to a semiconductor.
“ND” is the number density of donor atoms added to a semiconductor.
With reference to
Electron emission properties for the device depicted in
In a variation, HELAC device 10 includes a semiconductor that is sensitive while absorbing photons near 1550 nm is used. This allows well-established high-speed telecom lasers to be utilized. Furthermore, the current density can be increased from about 1 mA/cm2 to about 1 A/cm2 and experimentally demonstrate that those devices are capable of being modulated at rates 10-250 GHz.
Efficient photon to electron conversion in the HELAC devices set forth herein is driven by three processes. First, the absorption of photons will generate electron-hole pairs in the semiconductor, with electrons, swept to the insulator/graphene surface and the holes swept to the p-type contact. The electrons will tunnel across the insulator into the graphene, turning into hot electrons in the graphene. Once in graphene, the hot electrons will either be emitted into the vacuum or thermalize with the other carriers in graphene. The fundamental limits of the time response of these devices can be determined by the transit time of electron-hole pairs generated in the semiconductor and the intrinsic RC constant of the overall structure.
In another variation, lattice-matched, lightly doped InGaAs layers of varying thickness are grown on heavily doped p+ InP wafers. Advantageously, these layers can be deposited by arsenide and phosphide metal-organic chemical vapor deposition (MOCVD). The InGaAs should have approximately the same lattice constant as the underlying InP wafer. For example, InGaAs with a composition of 53% In and 47% Ga can be grown. Specifically, intrinsic InGaAs can be grown with no intentional doping. Very lightly doped p-type InGaAs with doping concentrations of ~1015-1016/cm3 can also be grown. In a refinement, InGaAs layers can be grown with thicknesses of 250 nm - 3 microns, with increments of 250 nm. These epitaxial wafers can serve as the baseline on which HELAC devices are fabricated.
The quality of the grown materials can be evaluated by utilizing X-ray diffraction, which will enable the identification of appropriate lattice matching and will allow the determination of initial quality of the epitaxy. The doping concentration and carrier mobility of these films by growing InGaAs on semi-insulating InP wafers can also be measured with the same conditions and using hall measurements to identify both carrier concentration and mobility. These values will then be utilized in our simulations to accurately simulate our devices.
Additional details are shown in H. U. Chae, R. Ahsan, and R. Kapadia, “Electronically Tunable Negative Electron Affinity Silicon Photoemitters,” 2021 IEEE International Conference on Plasma Science (ICOPS), 2021, pp. 1-1, doi: 10.1109/ICOPS36761.2021.9588524; the entire disclosure of which is hereby incorporated by reference in its entirety.
The following examples illustrate the various embodiments of the present invention. Those skilled in the art will recognize many variations that are within the spirit of the present invention and scope of the claims.
A proof-of-concept HELAC device with a current density of ~1 mA/cm2 using a silicon substrate, silicon oxide insulator, and monolayer graphene is demonstrated, as shown in
The electrical characterization circuit for the proof-of-concept HELAC is illustrated in
Accurate simulation of such a complex process can be carried out by using TCAD Sentaurus to simulate the absorption and transport of carriers inside the semiconductor, and injection into the graphene, and a Graphene Monte-Carlo Boltzmann Transport Solver (gMC-BTE) to calculate the emission of carriers from the graphene into vacuum. The basic framework on which to explore the performance of the HELAC devices and established initial projections has already been constructed.
Referring to
While exemplary embodiments are described above, it is not intended that these embodiments describe all possible forms of the invention. Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the invention. Additionally, the features of various implementing embodiments may be combined to form further embodiments of the invention.
This application claims the benefit of U.S. Provisional Application Serial No. 63/241,708 filed Sep. 8, 2021, the disclosure of which is hereby incorporated in its entirety by reference herein.
The invention was made with Government support under Contract No. DE-SC0021213 awarded by the U.S. Department of Energy. The Government has certain rights to the invention.
Number | Date | Country | |
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63241708 | Sep 2021 | US |