An electronics compartment, and solutions for cooling the interior of an electronics compartment are disclosed.
Known electronics compartments have walls which seal off a component space from the surrounding environment. In a known solution the temperature of the air inside the component space rises clue to heat generated by electric components present in the component space. The heated air is in contact with the walls of the component space and consequently heat is conducted through the walls to the surrounding environment of the component space.
However, known electronics compartments can have insufficient cooling. Due to the insufficient cooling, the temperature inside the component space may rise to a level where damage may occur.
An electronics compartment is disclosed comprising: a component space which is sealed off from a surrounding environment by walls of the electronics compartment; an internal panel arranged in the component space along a wall of the electronics compartment for delimiting an internal channel between the wall and the internal panel; a first inlet in a vicinity of a first end of the internal channel for allowing air to enter the internal channel from a space located on an opposite side of the internal panel in relation to the internal channel; a first outlet in a vicinity of a second end of the internal channel for allowing air to exit from the internal channel to the space located on the opposite side of the internal panel in relation to the internal channel; an external panel arranged along a same wall of the electronics compartment as the internal panel, but outside the component space for delimiting an external channel between the wall and the external panel, the wall being air-tight at least between the external channel and the internal channel for separating the external channel from the internal channel by preventing airflow between these channels; a second inlet in a vicinity of a first end of the external channel for allowing air to enter the external channel from the surrounding environment of the electronics compartment; and a second outlet in a vicinity of a second end of the external channel for allowing air to exit from the external channel to the surrounding environment of the electronics compartment.
In the following, exemplary embodiments of the present invention will be described in closer detail by way of example and with reference to the attached drawings, in which:
Exemplary embodiments as disclosed herein include a solution for providing adequate cooling to an electronics compartment. An exemplary electronics compartment can include: a component space which is sealed off from the surrounding environment by walls of the electronics compartment, an internal panel arranged in the component space along a wall of the electronics compartment for delimiting an internal channel between the wall and the internal panel, a first inlet in the vicinity of a first end of the internal channel for allowing air to enter the internal channel from a space located on an opposite side of the internal panel in relation to the internal channel, and a first outlet in the vicinity of a second end of the internal channel for allowing air to exit from the internal channel to the space located on the opposite side of the internal panel in relation to the internal channel. An external panel can be arranged along the same wall of the electronics compartment as the internal panel, but outside the component space for delimiting an external channel between the wall and the external panel, the wall being air-tight at least between the external channel and the internal channel for separating the external channel from the internal channel by preventing airflow between these channels. A second inlet in the vicinity of a first end of the external channel can allow air to enter the external channel from the surrounding environment of the electronics compartment, and a second outlet in the vicinity of a second end of the external channel can allow air to exit from the external channel to the surrounding environment of the electronics compartment.
In the illustrated example, one of the walls 13 is implemented as a removable cover facilitating installation of electric components in the component space, for instance. This wall 13 of the component space is utilized as an air-to-air heat exchanger for transferring heat from the inside of the component space to the surrounding environment outside the component space.
The electronics compartment 10 includes an external panel 15 arranged along the wall 13 on the outside of the component space for delimiting an external channel 16 between the wall 13 and the external panel 15. The external panel 15 is illustrated as being attached to the wall 13 in
In the illustrated embodiment the surface area of the wall 13 is increased by protrusions and recesses 12. Therefore, transfer of heat from the outer surface of the wall 13 to the air in the external channel 16 can be improved.
The internal panel 14 delimits an internal channel 20 between the wall 13 and the internal panel 14. In the figures the internal channel 20 is illustrated by arrows indicating airflow through the internal channel 20. A first inlet 21 is arranged at a lower end of the internal panel 14 for allowing air to enter the internal channel 20 from a space located on an opposite side of the internal panel 14 in relation to the internal channel 20. Similarly, a first outlet 22 is arranged at an upper end of the internal panel 14 for allowing air to exit from the internal channel 20 to the space located on the opposite side of the internal panel 14 in relation to the internal channel 20. Consequently, air can flow from the component space via the first inlet 21 into the internal channel 20 and from the internal channel 20 via the first outlet 22 into the component space. In this way, air which is heated by electric components in the component space may flow into the internal channel where the air is cooled as heat is transferred through the wall 13 into the external channel 16. The air-tight wall 13 separates the external channel from the internal channel and prevents flow of air between these channels. The air exiting the internal channel 20 has, therefore, a lower temperature than the air entering the internal channel. Components in the component space are, therefore, cooled due to the airflow. A fan may be utilized in order to cause air to flow through the internal channel 20. Such a fan may be located in the internal channel 20 or in the component space.
The protrusions and recesses 12 provided in the wall 13 in order to increase the outside surface area of the wall 13 are present also on the inside of the wall 13. Consequently, the inside surface area of the wall is increased and the transfer of heat from the air in the internal channel to the inner surface of the wall 13 can be improved.
One exemplary alternative to manufacture the wall 13, the internal panel 14 and the external panel 15 is injection molding of a suitable plastic material. However, in practice, the external panel 15 acts as a cosmetic outer surface of the electronics compartment, in which case it may also have other functional tasks than to provide the external channel only. Therefore, some parts of the external panel or the entire external panel may be manufactured in a different way and of a different material than plastics.
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It is to be understood that the above description and the accompanying figures are only intended to illustrate examples of the present invention. It will be apparent to those skilled in the art that the invention can be varied and modified without departing from the scope of the invention.
Thus, it will be appreciated by those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The presently disclosed embodiments are therefore considered in all respects to be illustrative and not restricted. The scope of the invention is indicated by the appended claims rather than the foregoing description and all changes that come within the meaning and range and equivalence thereof are intended to be embraced therein.