The present disclosure relates to an electronics enclosure with a heat-transfer element.
This section provides background information related to the present disclosure and is not necessarily prior art.
Electronic components, such as control modules for a compressor, for example, generate heat during operation. Such electronic components are often housed in sealed enclosures that protect the electronic components from exposure to moisture, dirt, and debris. A fan can be provided within the enclosure to facilitate heat transfer between the electronic components and air within the enclosure. Heat can then be transferred from the air to the walls of the enclosure, and subsequently to the ambient atmosphere, for example. The present disclosure provides an enclosure for electronic components and includes features for improving airflow within the enclosure to improve cooling of the electronic components.
This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.
In one form, the present disclosure provides a compressor that may include a compressor shell, a compression mechanism disposed within the compressor shell, a motor disposed within the shell and driving the compression mechanism, and a control module in communication with the motor and configured to control operation of the motor. An enclosure may be mounted to the compressor shell and may define an internal cavity in which the control module may be disposed. A fan may be disposed within the internal cavity. The enclosure may include an airflow deflector having a base portion, a first leg, and a second leg. The first and second legs may be spaced apart from each other and extend from the base portion. The fan may force air against the base portion. A first portion of the air may flow from the base portion along the first leg. A second portion of the air may flow from the base portion along the second leg.
In some configurations of the compressor of the above paragraph, the airflow deflector is integrally formed with a shell member that defines the enclosure. In some configurations, the airflow deflector is a recess formed in the shell member.
In some configurations of the compressor, the airflow deflector is formed separately from a shell member that defines the enclosure. In some configurations, the airflow deflector is mounted to the shell member.
In some configurations of the compressor of any of the above paragraphs, the base portion and the first and second legs cooperate to form a U-shape.
In some configurations of the compressor of any of the above paragraphs, the fan is aligned with the base portion such that a rotational axis of the fan extends through the base portion.
In some configurations of the compressor of any of the above paragraphs, the first and second legs include curved surfaces.
In some configurations of the compressor of any of the above paragraphs, air flows from the fan toward the base portion in a first direction.
In some configurations of the compressor of any of the above paragraphs, the curved surfaces of the first and second legs curve in a second direction as the curved surfaces extend away from the base portion.
In some configurations of the compressor of any of the above paragraphs, the second direction is opposite the first direction.
In another form, the present disclosure provides an assembly that may include a shell, an electronic component, a fan, and an airflow deflector. The shell member may at least partially define an enclosure having an internal cavity. The electronic component may be disposed within the internal cavity. The fan may be disposed within the internal cavity. The airflow deflector may include a base portion, a first leg, and a second leg. The first and second legs may be spaced apart from each other and extend from the base portion. The fan may force air against the base portion. A first portion of the air may flow from the base portion along the first leg. A second portion of the air may flow from the base portion along the second leg.
In some configurations of the assembly of the above paragraph, the airflow deflector is integrally formed with the shell member.
In some configurations of the assembly of either of the above paragraphs, the airflow deflector is a recess formed in the shell member.
In some configurations, the airflow deflector is formed separately from the shell member and is mounted to the shell member.
In some configurations of the assembly of any of the above paragraphs, the base portion and the first and second legs cooperate to form a U-shape.
In some configurations of the assembly of any of the above paragraphs, the fan is aligned with the base portion such that a rotational axis of the fan extends through the base portion.
In some configurations of the assembly of any of the above paragraphs, the first and second legs include curved surfaces.
In some configurations of the assembly of any of the above paragraphs, air flows from the fan toward the base portion in a first direction.
In some configurations of the assembly of any of the above paragraphs, the curved surfaces of the first and second legs may curve in a second direction as the curved surfaces extend away from the base portion.
In some configurations of the assembly of any of the above paragraphs, the second direction is opposite the first direction.
In some configurations of the assembly of any of the above paragraphs, the electronic component is disposed adjacent the base portion and between the first and second legs.
In some configurations of the assembly of any of the above paragraphs, the electronic component is, includes or is a part of a control module configured to control operation of a compressor.
In some configurations of the assembly of any of the above paragraphs, the enclosure is mounted to a shell of the compressor.
In some configurations of the assembly of any of the above paragraphs, a depth of the airflow deflector and an angle of attack of the first and second legs are configured to optimize airflow within the enclosure.
In some configurations of the assembly of any of the above paragraphs, the cavity is sealed such that air does not flow into or out of the cavity.
In some configurations of the assembly of any of the above paragraphs, the shell member may include heat sink fins. The fins may be formed on an exterior surface of the shell member.
Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings.
Example embodiments will now be described more fully with reference to the accompanying drawings.
Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “including,” and “having,” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.
When an element or layer is referred to as being “on,” “engaged to,” “connected to,” or “coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to,” “directly connected to,” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
Spatially relative terms, such as “inner,” “outer,” “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
With reference to
Referring now to
A fan 24 may be disposed within the cavity 22 and is operable to circulate air around the cavity 22 to convectively cool the control module 12. The fan 24 may be attached to or mounted proximate an airflow deflector (or airfoil) 26. In the particular example shown in
As shown in
As shown in
As shown in
Referring now to
Like the airflow deflector 26, the airflow deflector 126 may be generally U-shaped and may include a base portion 130, a first leg 134, and a second leg 136. As shown in
The airflow deflectors 26, 126 of the enclosures 14, 114 may improve airflow throughout the interior of the enclosures 14, 114 and around the control module 12. Furthermore, the airflow deflectors 26, 126 may reduce or eliminate turbulence in the airflow, which improves heat transfer between the control module 12 and the air within the enclosure 14, 114.
The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.
This application claims the benefit of U.S. Provisional Application No. 62/878,497, filed on Jul. 25, 2019. The entire disclosure of the above application is incorporated herein by reference.
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Number | Date | Country | |
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20210029847 A1 | Jan 2021 | US |
Number | Date | Country | |
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62878497 | Jul 2019 | US |