Electrophotographic photosensitive member, process cartridge, and electrophotographic apparatus

Information

  • Patent Grant
  • 9372419
  • Patent Number
    9,372,419
  • Date Filed
    Thursday, August 29, 2013
    11 years ago
  • Date Issued
    Tuesday, June 21, 2016
    8 years ago
Abstract
Provided are an electrophotographic photosensitive member in which a residual potential hardly increases at the time of image formation, a pattern memory hardly occurs, and the crack of a conductive layer hardly occurs, and a process cartridge and an electrophotographic apparatus each including the electrophotographic photosensitive member. To this end, the conductive layer of the electrophotographic photosensitive member contains a titanium oxide particle coated with tin oxide doped with phosphorus, a tin oxide particle doped with phosphorus, and a binding material, and when a total volume of the conductive layer is represented by VT, a total volume of the titanium oxide particle coated with tin oxide doped with phosphorus in the conductive layer is represented by V1P, and a total volume of the tin oxide particle doped with phosphorus in the conductive layer is represented by V2P, the VT, the V1P, and the V2P satisfy the following expressions: 2≦{(V2P/VT)/(V1P/VT)}×100≦25 and 15≦{(V1P/VT)+(V2P/VT)}×100≦45.
Description
TECHNICAL FIELD

The present invention relates to an electrophotographic photosensitive member, and a process cartridge and an electrophotographic apparatus each including the electrophotographic photosensitive member.


BACKGROUND ART

An electrophotographic photosensitive member using an organic photo-conductive material (organic electrophotographic photosensitive member) has been intensively studied and developed in recent years.


The electrophotographic photosensitive member basically includes a support and a photosensitive layer formed on the support. In actuality, however, various layers are provided in many cases between the support and the photosensitive layer for the purposes of, for example, covering defects in the surface of the support, protecting the photosensitive layer from electrical destruction, enhancing chargeability, and improving charge injection blocking property from the support to the photosensitive layer.


Of the layers to be provided between the support and the photosensitive layer, a layer containing metal oxide particles is known as a layer to be provided for the purpose of covering defects in the surface of the support. The layer containing metal oxide particles generally has high electro-conductivity (for example, an initial volume resistivity of 1.0×108 to 2.0×1013 Ω·cm) as compared to that of a layer not containing metal oxide particles, and even when the thickness of the layer is increased, a residual potential at the time of forming an image is difficult to increase. Therefore, the layer containing metal oxide particles covers defects in the surface of the support easily. When such layer having high electro-conductivity (hereinafter referred to as “conductive layer”) is provided between the support and the photosensitive layer to cover defects in the surface of the support, an allowable range of defects in the surface of the support is enlarged. As a result, an allowable range of the support to be used is enlarged. Thus, an advantage of enhancing productivity of an electrophotographic photosensitive member is provided.


Patent Literature 1 discloses a technology involving using, in a conductive layer between a support and a photosensitive layer, a titanium oxide particle coated with tin oxide doped with phosphorus or tungsten. In addition, Patent Literature 2 discloses a technology involving using, in a conductive layer between a support and a photosensitive layer, a titanium oxide particle coated with tin oxide doped with phosphorus, tungsten, or fluorine.


In addition, Patent Literature 3 discloses a technology involving incorporating, into the undercoat layer of an electrophotographic photosensitive member obtained by sequentially laminating the undercoat layer, an intermediate layer, and a photosensitive layer on a conductive support, two kinds of metal oxide particles having different average particle diameters. In addition, Patent Literature 4 discloses the following technology. Two or more kinds of electro-conductive particles having different primary particle diameters are incorporated into the intermediate layer of an electrophotographic photosensitive member obtained by laminating the intermediate layer and a photosensitive layer on a conductive support in the stated order, a ratio “A:B” between the average particle diameters of primary particles A having the largest average particle diameter of the electro-conductive particles and primary particles B having the smallest average particle diameter thereof is set to 12:1 to 30:1, and the average particle diameter of the primary particles B is set to 0.05 μm or less. In addition, Patent Literature 4 discloses a technology involving using a tin oxide particle doped with tantalum in the intermediate layer of the electrophotographic photosensitive member.


In addition, Patent Literatures 5 and 6 each describe a technology involving using a tin oxide particle doped with niobium in a conductive layer or an intermediate layer between a support and a photosensitive layer.


CITATION LIST
Patent Literature



  • PTL 1: Japanese Patent Application Laid-Open No. 2012-18371

  • PTL 2: Japanese Patent Application Laid-Open No. 2012-18370

  • PTL 3: Japanese Patent Application Laid-Open No. 2007-187771

  • PTL 4: Japanese Patent Application Laid-Open No. 2004-151349

  • PTL 5: Japanese Patent Application Laid-Open No. H01-248158

  • PTL 6: Japanese Patent Application Laid-Open No. H01-150150



SUMMARY OF INVENTION
Technical Problem

In recent years, the following opportunity has been increasing: a large amount of images identical to each other are output from one and the same electrophotographic photosensitive member in a short time period.


In such case, the direction of movement of a recording medium (such as a transfer material (e.g., paper) or an intermediate transfer member) in an electrophotographic photosensitive member and a vertical direction (longitudinal direction when the electrophotographic photosensitive member is cylindrical) do not deviate from each other. Accordingly, for example, when a solid black image or a half-tone image is output after a large amount of images each including vertical lines 306 (lines parallel to the direction of movement of the recording medium) like an image 301 of FIG. 4 have been continuously output, a product called a pattern memory occurs in a portion where a vertical line has been formed. More specifically, in essence, the solid black image is output like an image 302 of FIG. 4 and the half-tone image is output like an image 303 of FIG. 4. However, when the solid black image is output after a large amount of images each including the vertical lines 306 like the image 301 of FIG. 4 have been continuously output, the output image may be an image 304 with vertical lines 307 resulting from the repetition hysteresis of the vertical lines 306 of the image 301 of FIG. 4. In the case of the half-tone image as well, as in the case of the solid black image, the output image may be an image 305 with vertical lines 308 resulting from the repetition hysteresis of the vertical lines 306 of the image 301 of FIG. 4. An image portion where the repetition hysteresis has appeared like those vertical lines 307 and 308 is called a pattern memory.


In particular, the following opportunity has been recently increasing as compared with olden times in association with the lengthening of the lifetime of an electrophotographic photosensitive member: a large amount of images identical to each other are output from one and the same electrophotographic photosensitive member in a short time period. Accordingly, even in a conventional electrophotographic photosensitive member that has heretofore been able to be sufficiently used, the case where the pattern memory occurs when a large amount of images identical to each other are output in a short time period has started to become apparent. In this respect, each of the electrophotographic photosensitive members including conventional conductive layers disclosed in Patent Literatures 1 to 6 has sometimes involved the emergence of the case where the pattern memory occurs.


On the other hand, in the case of a conductive layer containing a binding material and metal oxide particles, a crack is liable to occur in the conductive layer even when the volume resistivity of the conductive layer is reduced merely by increasing the content of the metal oxide particles in the conductive layer in order that an increase in residual potential at the time of image formation may be suppressed. Accordingly, the following necessity arises: while the occurrence of the crack of the conductive layer is suppressed, the occurrence of a pattern memory is suppressed and the increase of the residual potential is suppressed.


In view of the foregoing, the present invention is directed to providing an electrophotographic photosensitive member in which a residual potential hardly increases at the time of image formation, a pattern memory hardly occurs, and the crack of a conductive layer hardly occurs, and a process cartridge and an electrophotographic apparatus each including the electrophotographic photosensitive member.


Solution to Problem

According to one aspect of the present invention, there is provided an electrophotographic photosensitive member, including: a support; a conductive layer formed on the support; and a photosensitive layer formed on the conductive layer, in which: the conductive layer contains a titanium oxide particle coated with tin oxide doped with phosphorus, a tin oxide particle doped with phosphorus, and a binding material; and when a total volume of the conductive layer is represented by VT, a total volume of the titanium oxide particle coated with tin oxide doped with phosphorus in the conductive layer is represented by V1P, and a total volume of the tin oxide particle doped with phosphorus in the conductive layer is represented by V2P, the VT, the V1P, and the V2P satisfy the following expressions (1) and (2).

2≦{(V2P/VT)/(V1P/VT)}×100≦25  (1)
15≦{(V1P/VT)+(V2P/VT)}×100≦45  (2)


According to another aspect of the present invention, there is provided an electrophotographic photosensitive member, including: a support; a conductive layer formed on the support; and a photosensitive layer formed on the conductive layer, in which: the conductive layer contains a titanium oxide particle coated with tin oxide doped with tungsten, a tin oxide particle doped with tungsten, and a binding material; and when a total volume of the conductive layer is represented by VT, a total volume of the titanium oxide particle coated with tin oxide doped with tungsten in the conductive layer is represented by V1W, and a total volume of the tin oxide particle doped with tungsten in the conductive layer is represented by V2W, the VT, the V1W, and the V2W satisfy the following expressions (6) and (7).

2≦{(V2W/VT)/(V1W/VT)}×100×25  (6)
15×{(V1W/VT)+(V2W/VT)}×100≦45  (7)


According to still another aspect of the present invention, there is provided an electrophotographic photosensitive member, including: a support; a conductive layer formed on the support; and a photosensitive layer formed on the conductive layer, in which: the conductive layer contains a titanium oxide particle coated with tin oxide doped with fluorine, a tin oxide particle doped with fluorine, and a binding material; and when a total volume of the conductive layer is represented by VT, a total volume of the titanium oxide particle coated with tin oxide doped with fluorine in the conductive layer is represented by V1F, and a total volume of the tin oxide particle doped with fluorine in the conductive layer is represented by V2F, the VT, the V1F, and the V2F satisfy the following expressions (11) and (12).

2≦{(V2F/VT)/(V1F/VT)}×100×25  (11)
15≦{(V1F/VT)+(V2F/VT)}×100≦45  (12)


According to still another aspect of the present invention, there is provided an electrophotographic photosensitive member, including: a support; a conductive layer formed on the support; and a photosensitive layer formed on the conductive layer, in which: the conductive layer contains a titanium oxide particle coated with tin oxide doped with niobium, a tin oxide particle doped with niobium, and a binding material; and when a total volume of the conductive layer is represented by VT, a total volume of the titanium oxide particle coated with tin oxide doped with niobium in the conductive layer is represented by V1Nb, and a total volume of the tin oxide particle doped with niobium in the conductive layer is represented by V2Nb, the VT, the V1Nb, and the V2Nb satisfy the following expressions (16) and (17).

2≦{(V2Nb/VT)/V1Nb/VT)}×100≦25  (16)
15≦{(V1Nb/VT)+(V2Nb/VT)}×100≦45  (17)


According to still another aspect of the present invention, there is provided an electrophotographic photosensitive member, including: a support; a conductive layer formed on the support; and a photosensitive layer formed on the conductive layer, in which: the conductive layer contains a titanium oxide particle coated with tin oxide doped with tantalum, a tin oxide particle doped with tantalum, and a binding material; and when a total volume of the conductive layer is represented by VT, a total volume of the titanium oxide particle coated with tin oxide doped with tantalum in the conductive layer is represented by V1Ta, and a total volume of the tin oxide particle doped with tantalum in the conductive layer is represented by V2Ta, the VT, the V1Ta, and the V2Ta satisfy the following expressions (21) and (22).

2≦{(V2Ta/VT)/(V1Ta/VT)}×100≦25  (21)
15≦{(V1Ta/VT)+(V2Ta/VT)}×100≦45  (22)


According to still another aspect of the present invention, there is provided a process cartridge detachably mountable to a main body of an electrophotographic apparatus, in which the process cartridge integrally supports: the above-described electrophotographic photosensitive member; and at least one device selected from the group consisting of a charging device, a developing device, a transferring device, and a cleaning device.


According to still another aspect of the present invention, there is provided an electrophotographic apparatus, including: the above-described electrophotographic photosensitive member; a charging device; an exposing device; a developing device; and a transferring device.


Advantageous Effects of Invention

According to the present invention, there is provided the electrophotographic photosensitive member in which a residual potential hardly increases at the time of image formation, a pattern memory hardly occurs, and the crack of a conductive layer hardly occurs, and the process cartridge and the electrophotographic apparatus each including the electrophotographic photosensitive member.


Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.





BRIEF DESCRIPTION OF DRAWINGS


FIG. 1 is a view illustrating an example of the schematic construction of an electrophotographic apparatus including a process cartridge having an electrophotographic photosensitive member of the present invention.



FIG. 2 is a view (top view) for illustrating a method of measuring the volume resistivity of a conductive layer.



FIG. 3 is a view (cross-sectional view) for illustrating the method of measuring the volume resistivity of a conductive layer.



FIG. 4 is a view (image example) for illustrating a pattern memory.



FIG. 5 is a view illustrating a one-dot keima pattern image.





DESCRIPTION OF EMBODIMENTS

An electrophotographic photosensitive member of the present invention is an electrophotographic photosensitive member including a support, a conductive layer formed on the support, and a photosensitive layer formed on the conductive layer.


The photosensitive layer may be a single-layer type photosensitive layer obtained by incorporating a charge-generating substance and a charge-transporting substance into a single layer, or may be a laminated type photosensitive layer obtained by laminating a charge-generating layer containing a charge-generating substance and a charge-transporting layer containing a charge-transporting substance. In addition, an undercoat layer may be provided between the conductive layer and photosensitive layer to be formed on the support as required.


A support having electro-conductivity (conductive support) is preferred as the support, and for example, a metal support formed of a metal such as aluminum, an aluminum alloy, or stainless steel can be used. When aluminum or an aluminum alloy is used, an aluminum tube produced by a production method including an extrusion process and a drawing process, or an aluminum tube produced by a production method including an extrusion process and an ironing process can be used. Such aluminum tube provides good dimensional accuracy and good surface smoothness without the cutting of its surface, and is advantageous in terms of cost. However, burr-like protruding defects are liable to occur on the uncut surface of the aluminum tube. Accordingly, it is particularly effective to provide the conductive layer.


In the electrophotographic photosensitive member of the present invention, any one of the following combinations of metal oxide particles as well as a binding material is used in the conductive layer to be formed on the support:

  • (p) a titanium oxide particle coated with tin oxide doped with phosphorus and a tin oxide particle doped with phosphorus;
  • (w) a titanium oxide particle coated with tin oxide doped with tungsten and a tin oxide particle doped with tungsten;
  • (f) a titanium oxide particle coated with tin oxide doped with fluorine and a tin oxide particle doped with fluorine;
  • (nb) a titanium oxide particle coated with tin oxide doped with niobium and a tin oxide particle doped with niobium; and
  • (ta) a titanium oxide particle coated with tin oxide doped with tantalum and a tin oxide particle doped with tantalum.


One of the features lies in that in each of the combinations (p), (w), (f), (nb), and (ta) of metal oxide particles, phosphorus (P), tungsten (W), fluorine (F), niobium (Nb), or tantalum (Ta) is common to the element with which tin oxide is doped. It should be noted that the titanium oxide particles are particles of titanium oxide (TiO2) and the tin oxide particles are particles of tin oxide (SnO2).


Hereinafter, the titanium oxide particle coated with tin oxide doped with phosphorus is also represented as “P-doped tin oxide-coated titanium oxide particles” and the tin oxide particle doped with phosphorus is also represented as “P-doped tin oxide particles.” In addition, the titanium oxide particle coated with tin oxide doped with tungsten is also represented as “W-doped tin oxide-coated titanium oxide particles” and the tin oxide particle doped with tungsten is also represented as “W-doped tin oxide particles.” In addition, the titanium oxide particle coated with tin oxide doped with fluorine is also represented as “F-doped tin oxide-coated titanium oxide particles” and the tin oxide particle doped with fluorine is also represented as “F-doped tin oxide particles.” In addition, the titanium oxide particle coated with tin oxide doped with niobium is also represented as “Nb-doped tin oxide-coated titanium oxide particles” and the tin oxide particle doped with niobium is also represented as “Nb-doped tin oxide particles.” In addition, the titanium oxide particle coated with tin oxide doped with tantalum is also represented as “Ta-doped tin oxide-coated titanium oxide particles” and the tin oxide particle doped with tantalum is also represented as “Ta-doped tin oxide particles.”


Further, in the electrophotographic photosensitive member of the present invention, in the case where the combination of metal oxide particles to be incorporated into the conductive layer is the combination (p), when the total volume of the conductive layer is represented by VT, the volume of the P-doped tin oxide-coated titanium oxide particles in the conductive layer is represented by V1P, and the volume of the P-doped tin oxide particles in the conductive layer is represented by V2P, VT, V1P, and V2P satisfy the following expressions (1) and (2).

2≦{(V2P/VT)/(V1P/VT)}×100≦25  (1)
15×{(V1P/VT)+(V2P/VT)}×100≦45  (2)


Further, in the case where the combination of metal oxide particles to be incorporated into the conductive layer is the combination (w), when the total volume of the conductive layer is represented by VT, the volume of the W-doped tin oxide-coated titanium oxide particles in the conductive layer is represented by V1W, and the volume of the W-doped tin oxide particles in the conductive layer is represented by V2W, VT, V1W, and V2W satisfy the following expressions (6) and (7).

2×{(V2W/VT)/(V1W/VT)}×100≦25  (6)
15≦{(V1W/VT)+(V2W/VT)}×100≦45  (7)


Further, in the case where the combination of metal oxide particles to be incorporated into the conductive layer is the combination (f), when the total volume of the conductive layer is represented by VT, the volume of the F-doped tin oxide-coated titanium oxide particles in the conductive layer is represented by V1F, and the volume of the F-doped tin oxide particles in the conductive layer is represented by V2F, VT, V1F, and V2F satisfy the following expressions (11) and (12).

2≦{(V2F/VT)/(V1F/VT)}×100≦25  (11)
15≦{(V1F/VT)+(V2F/VT)}×100≦45  (12)


Further, in the case where the combination of metal oxide particles to be incorporated into the conductive layer is the combination (nb), when the total volume of the conductive layer is represented by VT, the volume of the Nb-doped tin oxide-coated titanium oxide particles in the conductive layer is represented by V1Nb, and the volume of the Nb-doped tin oxide particles in the conductive layer is represented by V2Nb, VT, V1Nb, and V2Nb satisfy the following expressions (16) and (17).

2≦{(V2Nb/VT)/(V1Nb/VT)}×100≦25  (16)
15≦{(V1Nb/VT)+(V2Nb/VT)}×100≦45  (17)


Further, in the case where the combination of metal oxide particles to be incorporated into the conductive layer is the combination (ta), when the total volume of the conductive layer is represented by VT, the volume of the Ta-doped tin oxide-coated titanium oxide particles in the conductive layer is represented by V1Ta, and the volume of the Ta-doped tin oxide particles in the conductive layer is represented by V2Ta, VT, V1Ta, and V2Ta satisfy the following expressions (21) and (22).

2≦{(V2Ta/VT)/(V1Ta/VT)}×100×25  (21)
15≦{(V1Ta/VT)+(V2Ta/VT)}×100≦45  (22)


Hereinafter, V1P, V1W, V1F, V1Nb, and V1Ta are also collectively represented as “V1,” and V2P, V2W, V2F, V2Nb, and V2Ta are also collectively represented as “V2.” In addition, the P-doped tin oxide-coated titanium oxide particles, the W-doped tin oxide-coated titanium oxide particles, the F-doped tin oxide-coated titanium oxide particles, the Nb-doped tin oxide-coated titanium oxide particles, and the Ta-doped tin oxide-coated titanium oxide particles are also collectively represented as “a first metal oxide particle,” and the P-doped tin oxide particles, the W-doped tin oxide particles, the F-doped tin oxide particles, the Nb-doped tin oxide particles, and the Ta-doped tin oxide particles are also collectively represented as “a second metal oxide particle.”


The inventors of the present invention have made extensive studies to suppress the occurrence of a pattern memory. As a result, the inventors have found that the pattern memory is suppressed by the formation of a good electro-conductive path over a wide range in the conductive layer, in other words, uniform movement of charge in the conductive layer. This is probably because local retention or storage of the charge in the conductive layer hardly occurs. However, the retention or storage of the charge may not largely correlate with the volume resistivity or electric resistance of the conductive layer because the retention or storage is a local phenomenon. The formation of a good electro-conductive path in the conductive layer for suppressing the pattern memory requires the formation of an electro-conductive path that passes both the first metal oxide particle and the second metal oxide particle. To this end, the following necessity may arise for suppressing the occurrence of the pattern memory: instead of the formation of the conductive layer containing only the first metal oxide particle or the conductive layer containing only the second metal oxide particle, the first metal oxide particle and the second metal oxide particle are caused to exist in the conductive layer at a certain ratio, and then an electro-conductive path that passes both the first metal oxide particle and the second metal oxide particle is formed. That is, it may be necessary to satisfy the expression (1), (6), (11), (16), or (21). When the value for {(V2/VT)/(V1/VT)}×100 is less than 2, the ratio of the amount of the second metal oxide particle to the amount of the first metal oxide particle becomes insufficient. Accordingly, it is assumed that the situation becomes close to that in the case of the conductive layer containing only the first metal oxide particle and hence an electro-conductive path good for suppressing the occurrence of the pattern memory cannot be formed. On the other hand, when the value for {(V2/VT)/(V1/VT)}×100 is more than 25, the ratio of the amount of the second metal oxide particle to the amount of the first metal oxide particle becomes excessive. Accordingly, it is assumed that the situation becomes close to that in the case of the conductive layer containing only the second metal oxide particle and hence an electro-conductive path good for suppressing the occurrence of the pattern memory cannot be formed. When the following expression (3), (8), (13), (18), or (23) is satisfied, a suppressing effect on the occurrence of the pattern memory becomes additionally significant because the ratio between the first metal oxide particle and the second metal oxide particle becomes the ratio at which an electro-conductive path additionally good for suppressing the occurrence of the pattern memory can be formed.

5≦{(V2P/VT)/(V1P/VT)}×100≦20  (3)
5≦{(V2W/VT)/(V1W/VT)}×100≦20  (8)
5≦{(V2F/VT)/(V1F/VT)}×100≦20  (13)
5≦{(V2Nb/VT)/(V1Nb/VT)}×100≦20  (18)
5≦{(V2Ta/VT)/(V1Ta/VT)}×100≦20  (23)


In addition, the formation of the electro-conductive path that passes the first metal oxide particle and the second metal oxide particle in the conductive layer may require that the sum of the contents of the first metal oxide particle and a second metal oxide particle in the conductive layer fall within a certain range. That is, it may be necessary to satisfy the expression (2), (7), (12), (17), or (22). When the value for {(V1+V2)/VT}×100 is less than 15, the retention or storage of the charge in the conductive layer is liable to occur and hence an increase in residual potential is liable to be large in the case of repeated use of the electrophotographic photosensitive member. The value for {(V1+V2)/VT}×100 is more preferably 20 or more. On the other hand, when the value for {(V1+V2)/VT}×100 is more than 45, the amount of the binding material becomes relatively small and hence a crack is liable to occur in the conductive layer. The value for {(V1+V2)/VT}×100 is more preferably 40 or less. That is, the following expression (4), (9), (14), (19), or (24) is more preferably satisfied.

20≦{(V1P/VT)+(V2P/VT)}×100≦40  (4)
20≦{(V1W/VT)+(V2W/VT)}×100≦40  (9)
20≦{(V1F/VT)+(V2F/VT)}×100≦40  (14)
20≦{(V1Nb/VT)+(V2Nb/VT)}×100≦40  (19)
20≦{(V1Ta/VT)+(V2Ta/VT)}×100≦40  (24)


As described above, it is necessary to satisfy the expressions (1) and (2) simultaneously, to satisfy the expressions (6) and (7) simultaneously, to satisfy the expressions (11) and (12) simultaneously, to satisfy the expressions (16) and (17) simultaneously, or to satisfy the expressions (21) and (22) simultaneously for obtaining an electrophotographic photosensitive member in which a residual potential hardly increases at the time of image formation, a pattern memory hardly occurs, and the crack of a conductive layer hardly occurs.


With regard to the present invention, in the case where the combination of the metal oxide particles to be incorporated into the conductive layer is, for example, a combination of a titanium oxide particle coated with tin oxide doped with antimony and a tin oxide particle doped with antimony, or a combination of titanium oxide particles coated with oxygen-deficient tin oxide and oxygen-deficient tin oxide particles, the suppressing effect on the occurrence of the pattern memory deteriorates as compared with that in the case where the combination of the metal oxide particles to be incorporated into the conductive layer is the combination (p), (w), (f), (nb), or (ta).


In addition, even when a species (dopant) to be doped into tin oxide is phosphorus, tungsten, fluorine, niobium, or tantalum, in the case where a species to be doped into tin oxide of the first metal oxide particle and a species to be doped into tin oxide of the second metal oxide particle differ from each other such as the case where the combination of the metal oxide particles to be incorporated into the conductive layer is a combination of a titanium oxide particle coated with tin oxide doped with phosphorus and a tin oxide particle doped with tungsten, the suppressing effect on the occurrence of the pattern memory similarly deteriorates as compared with that in the case of the combination (p), (w), (f), (nb), or (ta) in which the species to be doped are identical to each other. This is probably because of the following reason: when the species to be doped into tin oxide of the first metal oxide particle and the species to be doped into tin oxide of the second metal oxide particle are identical to each other, the electrical properties, surface properties, and work functions of the first metal oxide particle and a second metal oxide particle become physical properties closest to each other in a comprehensive manner, and hence it becomes easy for the charge to move uniformly in the conductive layer.


In addition, in the case where the combination of the metal oxide particles to be incorporated into the conductive layer is the combination (p), when the abundance ratio of phosphorus to tin oxide in the P-doped tin oxide-coated titanium oxide particles is represented by R1P [atom %] and the abundance ratio of phosphorus to tin oxide in the P-doped tin oxide particles is represented by R2P [atom %], the following expression (5) is preferably satisfied.

0.9≦R2P/R1P≦1.1  (5)


In addition, in the case where the combination of the metal oxide particles to be incorporated into the conductive layer is the combination (w), when the abundance ratio of tungsten to tin oxide in the W-doped tin oxide-coated titanium oxide particles is represented by R1W [atom %] and the abundance ratio of tungsten to tin oxide in the W-doped tin oxide particles is represented by R2W [atom %], the following expression (10) is preferably satisfied.

0.9≦R2W/R1W≦1.1  (10)


In addition, in the case where the combination of the metal oxide particles to be incorporated into the conductive layer is the combination (f), when the abundance ratio of fluorine to tin oxide in the F-doped tin oxide-coated titanium oxide particles is represented by R1F [atom %] and the abundance ratio of fluorine to tin oxide in the F-doped tin oxide particles is represented by R2F [atom %], the following expression (15) is preferably satisfied.

0.9≦R2F/R1F≦1.1  (15)


In addition, in the case where the combination of the metal oxide particles to be incorporated into the conductive layer is the combination (nb), when the abundance ratio of niobium to tin oxide in the Nb-doped tin oxide-coated titanium oxide particles is represented by R1Nb [atom %] and the abundance ratio of niobium to tin oxide in the Nb-doped tin oxide particles is represented by R2Nb [atom %], the following expression (20) is preferably satisfied.

0.9≦R2Nb/R1Nb≦1.1  (20)


In addition, in the case where the combination of the metal oxide particles to be incorporated into the conductive layer is the combination (ta), when the abundance ratio of tantalum to tin oxide in the Ta-doped tin oxide-coated titanium oxide particles is represented by R1Ta [atom %] and the abundance ratio of tantalum to tin oxide in the Ta-doped tin oxide particles is represented by R2Ta [atom %], the following expression (25) is preferably satisfied.

0.9≦R2Ta/R1Ta≦1.1  (25)


Hereinafter, R1P, R1W, R1F, R1Nb, and R1Ta are also collectively represented as “R1,” and R2P, R2W, R2F, R2Nb, and R2Ta are also collectively represented as “R2.”


As represented by the expression (5), (10), (15), (20), or (25), the abundance ratios of phosphorus, tungsten, fluorine, niobium, or tantalum in tin oxide of the first metal oxide particle and tin oxide of the second metal oxide particle are preferably as close as possible to each other. In other words, the ratio R2/R1 is preferably as close as possible to 1.0, and specifically, the ratio is preferably 0.9 or more and 1.1 or less. When the ratio R2/R1 is 0.9 or more and 1.1 or less, an electro-conductive path additionally good for suppressing the occurrence of the pattern memory is formed and hence the suppressing effect on the occurrence of the pattern memory becomes additionally significant.


The measurement of R1 and R2 can be performed by STEM-EDX after taking out the conductive layer of the electrophotographic photosensitive member according to an FIB method. In addition, the measurement of V1 and V2 can be performed by the slice and view of an FIB-SEM after taking out the conductive layer of the electrophotographic photosensitive member according to the FIB method.


First, the measurement of R1 and R2 is described.


Sampling for the STEM-EDX analysis was performed as described below.


The sampling is performed with a supporting base made of copper (Cu) by an FIB-μ sampling method. An apparatus used by the inventors of the present invention is an FB-2000A μ-Sampling System (trade name) manufactured by Hitachi High-Technologies Corporation. The sampling was performed so that the horizontal and longitudinal sizes of a sample became such sizes that a measurement range could be secured, and the thickness of the sample became 150 nm.


The STEM-EDX analysis was performed as described below.


The inventors of the present invention have performed the analysis with a field emission electron microscope (HRTEM) (trade name: JEM2100F) manufactured by JEOL Ltd. and a JED-2300T (trade name) (having a resolution of 133 eV or less) (energy dispersive X-ray spectroscopy) manufactured by JEOL Ltd. as an EDX portion.


Analysis conditions were set as described below.

    • System: Analysis Station
    • Image acquisition: Digital Micrograph
    • Measurement conditions: Acceleration voltage: 200
    • kV, beam diameter (diameter): 1.0 nm, measurement
    • time: 50 seconds (in point analysis) and 40 minutes (in area analysis)


The measurement range measured 3.6 μm long by 3.4 μm wide by 150 nm thick.


The abundance ratio of phosphorus to tin oxide in the P-doped tin oxide particles, the abundance ratio of phosphorus to tin oxide in the P-doped tin oxide-coated titanium oxide particles, the abundance ratio of tungsten to tin oxide in the W-doped tin oxide particles, the abundance ratio of tungsten to tin oxide in the W-doped tin oxide-coated titanium oxide particles, the abundance ratio of fluorine to tin oxide in the F-doped tin oxide particles, the abundance ratio of fluorine to tin oxide in the F-doped tin oxide-coated titanium oxide particles, the abundance ratio of niobium to tin oxide in the Nb-doped tin oxide particles, the abundance ratio of niobium to tin oxide in the Nb-doped tin oxide-coated titanium oxide particles, the abundance ratio of tantalum to tin oxide in the Ta-doped tin oxide particles, or the abundance ratio of tantalum to tin oxide in the Ta-doped tin oxide-coated titanium oxide particles can be determined from an atomic ratio because the identification of an element can be performed by the STEM-EDX.


The sampling was similarly performed ten times to provide ten samples, followed by the measurement. The average of a total of ten R1's and the average of a total of ten R2's were each defined as a value for R1 or R2 in the conductive layer of the electrophotographic photosensitive member as a measuring object.


Next, the measurement of the ratios (V1/VT) and (V2/VT) is described.


The volume of the P-doped tin oxide-coated titanium oxide particles and the volume of the P-doped tin oxide particles, and their ratios in the conductive layer can be determined by identifying tin oxide doped with phosphorus and titanium oxide based on their difference in contrast of the slice and view of the FIB-SEM. When the species to be doped into tin oxide is an element except phosphorus such as tungsten, fluorine, niobium, or tantalum, the volumes and the ratios in the conductive layer can be similarly determined.


Conditions for the slice and view in the present invention were set as described below.

    • Sampling for analysis: FIB method
    • Processing and observation apparatus: NVision 40
    • manufactured by SII-Zeiss
    • Slice interval: 10 nm
    • Observation conditions:
    • Acceleration voltage: 1.0 kV
    • Sample tilt: 54°
    • WD: 5 mm
    • Detector: BSE detector
    • Aperture: 60 μm, high current
    • ABC: ON
    • Image resolution: 1.25 nm/pixel


The analysis is performed in a region measuring 2 μm wide by 2 μm long, information on each cross-section is integrated, and the volumes V1 and V2 per space measuring 2 μm wide by 2 μm long by 2 μm thick (VT=8 μm3) are determined. In addition, the measurement is performed under an environment having a temperature of 23° C. and a pressure of 1×10−4 Pa. It should be noted that a Strata 400S (sample tilt: 52°) manufactured by FEI Company can also be used as a processing and observation apparatus.


The sampling was similarly performed ten times to provide ten samples, followed by the measurement. A value obtained by dividing the average of a total of ten volumes V1 per 8 μm3 by VT (8 μm3) was defined as the ratio (V1/VT) in the conductive layer of the electrophotographic photosensitive member as a measuring object. In addition, a value obtained by dividing the average of a total of ten volumes V2 per 8 μm3 by VT (8 μm3) was defined as a value for the ratio (V2/VT) in the conductive layer of the electrophotographic photosensitive member as a measuring object.


It should be noted that the areas of identified tin oxide doped with phosphorus and titanium oxide were obtained from the information on each cross-section through image analysis. The image analysis was performed with the following image processing software.


Image processing software: Image-Pro Plus manufactured by Media Cybernetics


Of the metal oxide particles to be used in the present invention, the first metal oxide particle has a coating layer constituted of tin oxide doped with phosphorus, tungsten, fluorine, niobium, or tantalum, and a core particle constituted of titanium oxide. In addition, the first metal oxide particle is such a structure that the core particle is coated with the coating layer.


The ratio (coating ratio) of tin oxide (SnO2) in the first metal oxide particle to be used in the present invention is preferably 10 to 60% by mass. A tin raw material needed for producing tin oxide (SnO2) needs to be blended at the time of the production of the first metal oxide particle for controlling the coating ratio of tin oxide (SnO2). For example, when tin chloride (SnCl4) as a tin raw material is used, the blending needs to be performed in consideration of the amount of tin oxide (SnO2) to be produced from tin chloride (SnCl4). Although tin oxide (SnO2) constituting the coating layer of each of the first metal oxide particle to be used in the present invention is doped with phosphorus (P), tungsten (W), fluorine (F), niobium (Nb), or tantalum (Ta), the coating ratio is a value calculated from the mass of tin oxide (SnO2) with respect to the total mass of tin oxide (SnO2) and titanium oxide (TiO2) without any consideration of the mass of phosphorus (P), tungsten (W), fluorine (F), niobium (Nb), or tantalum (Ta) with which tin oxide (SnO2) is doped.


In addition, it is preferred that tin oxide (SnO2) in the first metal oxide particle or a second metal oxide particle be doped with phosphorus (P), tungsten (W), fluorine (F), niobium (Nb), or tantalum (Ta) in an amount (doping ratio) of 0.1 to 10 mass % with respect to tin oxide (SnO2) (in terms of mass of the tin oxide containing no phosphorus (P), tungsten (W), fluorine (F), niobium (Nb), and tantalum (Ta)).


It should be noted that a method of producing the first metal oxide particle (P-doped tin oxide-coated titanium oxide particles, W-doped tin oxide-coated titanium oxide particles, F-doped tin oxide-coated titanium oxide particles, Nb-doped tin oxide-coated titanium oxide particles, or Ta-doped tin oxide-coated titanium oxide particles) is also disclosed in Japanese Patent Application Laid-Open No. H06-207118 and Japanese Patent Application Laid-Open No. 2004-349167.


In addition, a method of producing the second metal oxide particle (P-doped tin oxide particles, W-doped tin oxide particles, F-doped tin oxide particles, Nb-doped tin oxide particles, or Ta-doped tin oxide particles) is also disclosed in Japanese Patent No. 3365821, Japanese Patent Application Laid-Open No. H02-197014, Japanese Patent Application Laid-Open No. H09-278445, and Japanese Patent Application Laid-Open No. H10-53417.


A particulate shape, a spherical shape, a needle shape, a fibrous shape, a columnar shape, a rod shape, a spindle shape, a plate shape, and other analogous shapes can each be used as the shape of a titanium oxide (TiO2) particle as the core particle in each of the first metal oxide particle to be used in the present invention. Of those, a spherical shape is preferred from such a viewpoint that an image defect such as a black spot hardly occurs.


In addition, any one of the crystal forms such as rutile, anatase, brookite, and amorphous forms can be used as the crystal form of the titanium oxide (TiO2) particle as the core particle in each of the first metal oxide particle to be used in the present invention. In addition, any one of the production methods such as a sulfuric acid method and a hydrochloric acid method can be adopted as the production method.


In the present invention, a first reason why the first metal oxide particle having the core particles (titanium oxide (TiO2) particles) are used is as described below. Tin oxide (SnO2) constituting the coating layer of each of the first metal oxide particle has higher electro-conductivity than that of titanium oxide (TiO2) constituting each core particle and charge received by the second metal oxide particle containing tin oxide (SnO2) propagates mainly through the coating layer containing tin oxide (SnO2) in each of the first metal oxide particle, i.e., the transfer of the charge between tin oxide (SnO2) is mainly performed, and hence the transfer of the charge between the first metal oxide particle and the second metal oxide particle becomes smooth, and the charge uniformly moves in the conductive layer.


A second reason why the first metal oxide particle having the core particles (titanium oxide (TiO2) particles) are used is that an improvement in dispersibility of the second metal oxide particle in a conductive-layer coating solution is achieved. When the second metal oxide particle is used without the use of the first metal oxide particle, the aggregation of the second metal oxide particle is liable to occur in the conductive-layer coating solution to enlarge their average particle diameter, and hence protrusive seeding defects occur in the surface of the conductive layer to be formed or the stability of the conductive-layer coating solution reduces in some cases. In addition, the suppressing effect on the pattern memory is not sufficiently obtained.


A third reason why the first metal oxide particle having the core particles (titanium oxide (TiO2) particles) are used is that the titanium oxide (TiO2) particles as the core particles of the first metal oxide particle each have low transparency as a particle and hence easily cover defects in the surface of the support. In contrast, for example, when barium sulfate particles are used as the core particles, the particles each have high transparency as a particle and hence a material for covering the defects in the surface of the support may be separately needed.


The particle diameter of each of the titanium oxide (TiO2) particles as the core particles of the first metal oxide particle to be used in the present invention is preferably 0.05 μm or more and 0.40 μm or less from the viewpoint of adjusting the average particle diameter of the first metal oxide particle to a preferred range to be described later.


The powder resistivity of the first metal oxide particle to be used in the present invention is preferably 1.0×101 Ω·cm or more and 1.0×106 Ω·cm or less, more preferably 1.0×102 Ω·cm or more and 1.0×105 Ω·cm or less.


The powder resistivity of the second metal oxide particle to be used in the present invention is preferably 1.0×100 Ω·cm or more and 1.0×105 Ω·cm or less, more preferably 1.0×101 Ω·cm or more and 1.0×104 Ω·cm or less.


The powder resistivity of the first metal oxide particle to be used in the present invention is preferably lower than the powder resistivity of the titanium oxide (TiO2) particles as the core particles of the first metal oxide particle.


A method of measuring the powder resistivity of metal oxide particles such as the first metal oxide particle or a second metal oxide particle to be used in the present invention is as described below.


The powder resistivity of metal oxide particles such as the first metal oxide particle or a second metal oxide particle to be used in the present invention, or of the core particles of composite particles like the first metal oxide particle to be used in the present invention is measured under a normal-temperature and normal-humidity (23° C./50% RH) environment. In the present invention, a resistivity meter manufactured by Mitsubishi Chemical Corporation (trade name: Loresta GP (Hiresta UP when the powder resistivity exceeded 1.0×107 Ω·cm)) was used as a measuring apparatus. The metal oxide particles as measuring objects are compressed into a pellet-shaped sample for measurement at a pressure of 500 kg/cm2. A voltage of 100 V is applied. The core particles are subjected to the measurement before the formation of the coating layer.


The conductive layer can be formed by applying the conductive-layer coating solution containing a solvent, the binding material, and the first metal oxide particle and the second metal oxide particle onto the support, and drying and/or curing the resultant coating film.


The conductive-layer coating solution can be prepared by dispersing the first metal oxide particle and the second metal oxide particle together with the binding material into the solvent. As a dispersion method, there are given, for example, methods using a paint shaker, a sand mill, a ball mill, and a liquid collision type high-speed disperser.


Examples of the binding material to be used in the conductive layer include resins such as a phenol resin, polyurethane, polyamide, polyimide, polyamide-imide, polyvinyl acetal, an epoxy resin, an acrylic resin, a melamine resin, and polyester. The resins may be used alone or in combination of two or more kinds thereof. Further, of those resins, from the viewpoints of, for example, suppression of migration (dissolution) into another layer, adhesiveness with the support, dispersibility and dispersion stability of the particles of the present invention, and solvent resistance after layer formation, a curable resin is preferred, and a thermosetting resin is more preferred. Further, of the thermosetting resins, a thermosetting phenol resin and thermosetting polyurethane are preferred. In the case of using the curable resin as the binding material in the conductive layer, the binding material to be contained in the conductive-layer coating solution is a monomer and/or an oligomer of the curable resin.


Examples of the solvent to be used in the conductive-layer coating solution include alcohols such as methanol, ethanol, and isopropanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, ethers such as tetrahydrofuran, dioxane, ethylene glycol monomethyl ether, and propylene glycol monomethyl ether, esters such as methyl acetate and ethyl acetate, and aromatic hydrocarbons such as toluene and xylene.


In addition, a surface roughness providing material for roughening the surface of the conductive layer may be incorporated into the conductive-layer coating solution in order to suppress the occurrence of interference fringes on an output image due to the interference of light reflected at the surface of the conductive layer. Resin particles having an average particle diameter of 1 μm or more and 5 μm or less are preferred as the surface roughness providing material. Examples of the resin particles include particles of curable resins such as a curable rubber, a polyurethane, an epoxy resin, an alkyd resin, a phenol resin, a polyester, a silicone resin, and an acryl-melamine resin. Of those, particles of a silicone resin that hardly aggregate are preferred. The density (0.5 to 2 g/cm3) of the resin particles is small as compared with the densities (4 to 8 g/cm3) of the first metal oxide particle and a second metal oxide particle to be used in the present invention, and hence the surface of the conductive layer can be efficiently roughened at the time of the formation of the conductive layer. In this regard, however, when the content of the surface roughness providing material in the conductive layer increases, the volume resistivity of the conductive layer tends to increase in some cases. Accordingly, the content of the surface roughness providing material in the conductive-layer coating solution is preferably 1 to 80% by mass with respect to the binding material in the conductive-layer coating solution for adjusting the volume resistivity of the conductive layer to 2.0×1013 Ω·cm or less. In the present invention, the densities [g/cm3] of the first metal oxide particle, the second metal oxide particle, the binding material (provided that when the binding material was liquid, a cured product thereof was subjected to the measurement), the silicone particles, and the like were determined with a dry auto-densimeter as described below. A helium gas purge was performed ten times as a pretreatment for particles as measuring objects at a temperature of 23° C. and a maximum pressure of 19.5 psig with a dry auto-densimeter manufactured by Shimadzu Corporation (trade name: Accupyc 1330) and a container having a capacity of 10 cm3. After that, a fluctuation in pressure in a sample chamber of 0.0050 psig/min was used as a pressure equilibrium judgment value as to whether a pressure in the container reached equilibrium. When the fluctuation was equal to or less than the value, the pressure was defined as being in an equilibrium state and then the measurement was initiated to measure any such density [g/cm3] automatically.


In addition, a leveling agent for improving the surface property of the conductive layer may be incorporated into the conductive-layer coating solution. In addition, pigment particles may be incorporated into the conductive-layer coating solution for additionally improving the coverage of the conductive layer.


In addition, the average particle diameter of the first metal oxide particle (P-doped tin oxide-coated titanium oxide particles, W-doped tin oxide-coated titanium oxide particles, F-doped tin oxide-coated titanium oxide particles, Nb-doped tin oxide-coated titanium oxide particles, or Ta-doped tin oxide-coated titanium oxide particles) in the conductive-layer coating solution is preferably 0.10 μm or more and 0.45 μm or less, more preferably 0.15 μm or more and 0.40 μm or less. When the average particle diameter is less than 0.10 μm, the reaggregation of the first metal oxide particle is liable to occur after the preparation of the conductive-layer coating solution and hence the stability of the conductive-layer coating solution may reduce. When the average particle diameter is more than 0.45 μm, the surface of the conductive layer roughens to promote the occurrence of local injection of charge into the photosensitive layer, and hence a black spot on the white background of an output image may become conspicuous.


In addition, the average particle diameter of the second metal oxide particle (P-doped tin oxide particles, W-doped tin oxide particles, F-doped tin oxide particles, Nb-doped tin oxide particles, or Ta-doped tin oxide particles) in the conductive-layer coating solution is preferably 0.01 μm or more and 0.45 μm or less, more preferably 0.01 μm or more and 0.10 μm or less.


The average particle diameters of metal oxide particles such as the first metal oxide particle and a second metal oxide particle in the conductive-layer coating solution can be determined by the following liquid phase sedimentation method or cross-sectional observation with an SEM.


First, the conductive-layer coating solution is diluted with the solvent used for its preparation so that its transmittance may fall within the range of 0.8 to 1.0. Next, a histogram of the average particle diameter (volume average particle diameter) and particle size distribution of the metal oxide particles is created with an ultracentrifugal automatic particle size distribution analyzer. In the present invention, the measurement was performed with an ultracentrifugal automatic particle size distribution analyzer (trade name: CAPA 700) manufactured by HORIBA, Ltd. as the ultracentrifugal automatic particle size distribution analyzer under the condition of a number of rotation of 3,000 rpm.


From the viewpoint of covering defects in the surface of the support, the thickness of the conductive layer is preferably 10 μm or more and 40 μm or less, more preferably 15 μm or more and 35 μm or less.


It should be noted that, in the present invention, as an apparatus for measuring the thickness of each layer of the electrophotographic photosensitive member including the conductive layer, FISHERSCOPE mms manufactured by Fisher Instruments K.K. was used.


The volume resistivity of the conductive layer is preferably 1.0×108 Ω·cm or more and 2.0×1013 Ω·cm or less. When a layer having a volume resistivity of 2.0×1013 Ω·cm or less is provided on the support as a layer for covering the defects in the surface of the support, the flow of charge is hardly disrupted at the time of image formation and hence a residual potential hardly increases. Meanwhile, when the volume resistivity of the conductive layer is 1.0×108 Ω·cm or more, the quantity of the charge flowing in the conductive layer at the time of the charging of the electrophotographic photosensitive member does not become excessively large and hence fogging due to an increase in dark attenuation of the electrophotographic photosensitive member hardly occurs.


A method of measuring the volume resistivity of the conductive layer of the electrophotographic photosensitive member is described with reference to FIGS. 2 and 3. FIG. 2 is a top view for illustrating the method of measuring the volume resistivity of the conductive layer and FIG. 3 is a cross-sectional view for illustrating the method of measuring the volume resistivity of the conductive layer.


The volume resistivity of the conductive layer is measured under a normal-temperature and normal-humidity (23° C./50% RH) environment. A copper tape 203 (manufactured by Sumitomo 3M Limited, Type No. 1181) is attached to the surface of a conductive layer 202 and is used as an electrode on the front surface side of the conductive layer 202. In addition, a support 201 is used as an electrode on the back side of the conductive layer 202. A power source 206 for applying a voltage between the copper tape 203 and the support 201, and a current measurement appliance 207 for measuring a current flowing between the copper tape 203 and the support 201 are placed. In addition, a copper wire 204 is mounted on the copper tape 203 for applying a voltage to the copper tape 203 and then the copper wire 204 is fixed to the copper tape 203 by attaching a copper tape 205 similar to the copper tape 203 from above the copper wire 204 so that the copper wire 204 may not protrude from the copper tape 203. A voltage is applied to the copper tape 203 with the copper wire 204.


When a background current value in the case where no voltage is applied between the copper tape 203 and the support 201 is represented by I0 [A], a current value in the case where a voltage of −1 V formed only of a DC voltage (DC component) is applied is represented by I [A], the thickness of the conductive layer 202 is represented by d [cm], and the area of the electrode (copper tape 203) on the front surface side of the conductive layer 202 is represented by S [cm2], a value represented by the following expression (26) is defined as a volume resistivity p [Ω·cm] of the conductive layer 202.

ρ=1/(I−I0S/d [Ω·cm]  (26)


This measurement is preferably performed with an appliance capable of measuring a minute current as the current measurement appliance 207 because a minute current quantity whose absolute value is 1×10−6 A or less is measured in the measurement. Examples of such appliance include a pA meter (trade name: 4140B) manufactured by Yokogawa Hewlett-Packard and a high resistance meter (trade name: 4339B) manufactured by Agilent Technologies.


It should be noted that the volume resistivity of the conductive layer measured in a state where only the conductive layer is formed on the support and that measured in a state where only the conductive layer is left on the support by peeling each layer (such as the photosensitive layer) on the conductive layer from the electrophotographic photosensitive member show the same value.


In order to prevent the injection of a charge from the conductive layer to the photosensitive layer, an undercoat layer (barrier layer) having electric barrier property may be provided between the conductive layer and the photosensitive layer.


The undercoat layer can be formed by coating the conductive layer with an undercoat-layer coating solution containing a resin (binder material) and drying the resultant coating film.


Examples of the resin (binder material) to be used in the undercoat layer include a polyvinyl alcohol, a polyvinyl methyl ether, a polyacrylic acids, a methylcellulose, an ethylcellulose, a polyglutamic acid, casein, starch, and other water-soluble resins, a polyamide, a polyimide, a polyamide-imide, a polyamic acid, a melamine resin, an epoxy resin, a polyurethane, and a polyglutamate. Of those, thermoplastic resins are preferred to effectively express the electric barrier property of the undercoat layer. Of the thermoplastic resins, a thermoplastic polyamide is preferred. The polyamide is preferably a copolymerized nylon.


The thickness of the undercoat layer is preferably 0.1 μm or more and 2.0 μm or less.


In addition, an electron-transporting substance (electron-accepting substance such as an acceptor) may be contained in the undercoat layer to prevent the flow of charge from being disrupted in the undercoat layer.


Examples of the electron-transporting substance include electron-withdrawing substances such as 2,4,7-trinitrofluorenone, 2,4,5,7-tetranitrofluorenone, chloranil, and tetracyanoquinodimethane, and polymers of those electron-withdrawing substances.


The photosensitive layer is provided on the conductive layer (undercoat layer).


Examples of the charge-generating substance to be used in the photosensitive layer include: azo pigments such as monoazo, disazo, and trisazo; phthalocyanine pigments such as metal phthalocyanine and non-metal phthalocyanine; indigo pigments such as indigo and thioindigo; perylene pigments such as perylene acid anhydride and perylene acid imide; polycyclic quinone pigments such as anthraquinone and pyrenequinone; squarylium dyes; pyrylium salts and thiapyrylium salts; triphenylmethane dyes; quinacridone pigments; azulenium salt pigments; cyanine dyes; xanthene dyes; quinonimine dyes; and styryl dyes. Of those, metal phthalocyanines such as oxytitanium phthalocyanine, hydroxygallium phthalocyanine, and chlorogallium phthalocyanine are preferred.


When the photosensitive layer is a laminated type photosensitive layer, the charge-generating layer can be formed by applying a charge-generating-layer coating solution, which is prepared by dispersing a charge-generating substance into a solvent together with a binder material, and then drying the resultant coating film. As a dispersion method, there are given, for example, methods using a homogenizer, an ultrasonic wave, a ball mill, a sand mill, an attritor, and a roll mill.


Examples of the binder material to be used in the charge-generating layer include a polycarbonate, a polyester, a polyarylate, a butyral resin, a polystyrene, a polyvinyl acetal, a diallyl phthalate resin, an acrylic resin, a methacrylic resin, a vinyl acetate resin, a phenol resin, a silicone resin, a polysulfone, a styrene-butadiene copolymer, an alkyd resin, an epoxy resin, a urea resin, and a vinyl chloride-vinyl acetate copolymer. Those binder materials may be used alone or as a mixture or a copolymer of two or more kinds thereof.


The ratio of the charge-generating substance to the binder material (charge-generating substance:binder material) falls within the range of preferably 10:1 to 1:10 (mass ratio), more preferably 5:1 to 1:1 (mass ratio).


Examples of the solvent to be used in the charge-generating-layer coating solution include an alcohol, a sulfoxide, a ketone, an ether, an ester, an aliphatic halogenated hydrocarbon, and an aromatic compound.


The thickness of the charge-generating layer is preferably 5 μm or less, more preferably 0.1 μm or more and 2 μm or less.


Further, any of various sensitizers, antioxidants, UV absorbers, plasticizers, and the like may be added to the charge-generating layer as required. Further, an electron-transporting substance (electron-accepting substance such as an acceptor) may be contained in the charge-generating layer to prevent the flow of charge from being disrupted in the charge-generating layer.


Examples of the electron-transporting substance include electron-withdrawing substances such as 2,4,7-trinitrofluorenone, 2,4,5,7-tetranitrofluorenone, chloranil, and tetracyanoquinodimethane, and polymers of those electron-withdrawing substances.


Examples of the charge-transporting substance to be used in the photosensitive layer include a triarylamine compound, a hydrazone compound, a styryl compound, a stilbene compound, a pyrazoline compound, an oxazole compound, a thiazole compound, and a triarylmethane compound.


When the photosensitive layer is a laminated type photosensitive layer, the charge-transporting layer can be formed by applying a charge-transporting-layer coating solution, which is prepared by dissolving a charge-transporting substance and a binder material in a solvent, and then drying the resultant coating film.


Examples of the binder material to be used in the charge-transporting layer include an acrylic resin, a styrene resin, a polyester, a polycarbonate, a polyarylate, a polysulfone, a polyphenylene oxide, an epoxy resin, a polyurethane, an alkyd resin, and an unsaturated resin. Those binder materials may be used alone or as a mixture or a copolymer of two or more kinds thereof.


The ratio of the charge-transporting substance to the binder material (charge-transporting substance:binder material) preferably falls within the range of 2:1 to 1:2 (mass ratio).


Examples of the solvent to be used in the charge-transporting-layer coating solution include: ketones such as acetone and methyl ethyl ketone; esters such as methyl acetate and ethyl acetate; ethers such as dimethoxymethane and dimethoxyethane; aromatic hydrocarbons such as toluene and xylene; and hydrocarbons each substituted by a halogen atom, such as chlorobenzene, chloroform, and carbon tetrachloride.


The thickness of the charge-transporting layer is preferably 3 μm or more and 40 μm or less, more preferably 4 μm or more and 30 μm or less from the viewpoints of charging uniformity and image reproducibility.


Further, an antioxidant, a UV absorber, or a plasticizer may be added to the charge-transporting layer as required.


When the photosensitive layer is a single-layer type photosensitive layer, the single-layer type photosensitive layer can be formed by applying a single-layer-type-photosensitive-layer coating solution containing a charge-generating substance, a charge-transporting substance, a binder material, and a solvent, and then drying the resultant coating film. As the charge-generating substance, the charge-transporting substance, the binder material, and the solvent, for example, those of various kinds described above can be used.


Further, a protective layer may be formed on the photosensitive layer to protect the photosensitive layer. The protective layer can be formed by applying a protective-layer coating solution containing a resin (binder material), and then drying and/or curing the resultant coating film.


The thickness of the protective layer is preferably 0.5 μm or more and 10 μm or less, more preferably 1 μm or more and 8 μm to less.


In the application of each of the coating solutions corresponding to the respective layers, coating methods such as dip coating, spray coating, spinner coating, roller coating, Meyer bar coating, and blade coating may be employed.



FIG. 1 illustrates an example of the schematic construction of an electrophotographic apparatus including a process cartridge having an electrophotographic photosensitive member.


In FIG. 1, an electrophotographic photosensitive member 1 having a drum shape (cylindrical shape) is driven to rotate around an axis 2 in a direction indicated by the arrow at a predetermined peripheral speed.


The circumferential surface of the electrophotographic photosensitive member 1 to be driven to rotate is uniformly charged at a positive or negative predetermined potential by a charging device (such as a primary charging device or a charging roller) 3, and then receives exposure light (image exposure light) 4 emitted from an exposing device (not shown) such as a slit exposure or a laser-beam scanning exposure. Thus, electrostatic latent images corresponding to images of interest are sequentially formed on the circumferential surface of the electrophotographic photosensitive member 1. A voltage to be applied to the charging device 3 may be only a DC voltage, or may be a DC voltage superimposed with an AC voltage.


The electrostatic latent images formed on the circumferential surface of the electrophotographic photosensitive member 1 are converted into toner images by development with toner of a developing device 5. Subsequently, the toner images formed on the circumferential surface of the electrophotographic photosensitive member 1 are transferred to a transfer material (such as paper) P by a transfer bias from a transferring device (such as a transfer roller) 6. The transfer material P is fed with a transfer material feeding device (not shown) to a portion (abutment portion) between the electrophotographic photosensitive member 1 and the transferring device 6 in synchronization with the rotation of the electrophotographic photosensitive member 1.


The transfer material P which has received the transfer of the toner images is separated from the circumferential surface of the electrophotographic photosensitive member 1, introduced to a fixing device 8, subjected to image fixation, and then printed as an image-formed product (print or copy) out of the apparatus.


The circumferential surface of the electrophotographic photosensitive member 1 after the transfer of the toner images undergoes removal of the remaining toner after the transfer by a cleaning device (such as a cleaning blade) 7. Further, the circumferential surface of the electrophotographic photosensitive member 1 is subjected to a neutralization process with pre-exposure light 11 from a pre-exposing device (not shown) and then repeatedly used in image formation. It should be noted that, when the charging device is a contact-charging device such as a charging roller, the pre-exposure is not always required. It should also be noted that, when the electrophotographic apparatus adopts a cleaner-less system, the cleaning device is not always required.


The electrophotographic photosensitive member 1 and at least one structural component selected from the charging device 3, the developing device 5, the transferring device 6, the cleaning device 7, and the like may be housed in a container and then integrally supported as a process cartridge. In addition, the process cartridge may be detachably mountable to the main body of an electrophotographic apparatus. In FIG. 1, the electrophotographic photosensitive member 1, and the charging device 3, the developing device 5, and the cleaning device 7 are integrally supported as a cartridge, thereby forming a process cartridge 9, which is detachably mountable to the main body of an electrophotographic apparatus, through use of a guiding device 10 such as a rail of the main body of the electrophotographic apparatus. Further, the electrophotographic apparatus may have a construction including the electrophotographic photosensitive member 1, and the charging device 3, the exposing device, the developing device 5, and the transferring device 6.


EXAMPLE

Hereinafter, the present invention is described in more detail by way of specific examples, provided that the present invention is not limited thereto. It should be noted that the term “part(s)” in each of Examples and Comparative Examples means “part(s) by mass,” the term “average particle diameter” means “average primary particle diameter,” the unit “%” of a coating ratio in each table means “% by mass,” and the unit “%” of a doping ratio (doping amount) means “% by mass.” In addition, densities in Examples and the tables are each a value determined by the foregoing method and are each represented in the unit of “g/cm3.”


<Preparation Examples of Conductive-Layer Coating Solutions>


(Preparation Example of Conductive-Layer Coating Solution CP-1)


112.00 Parts of P-doped tin oxide-coated titanium oxide particles (average primary particle diameter: 230 nm, powder resistivity: 5,000 Ω·cm, amount (doping ratio) of phosphorus doped into tin oxide: 4.50% by mass, coating ratio: 45% by mass, density: 5.1 g/cm3) as a first metal oxide particle, 3.00 parts of P-doped tin oxide particles (average primary particle diameter: 20 nm, powder resistivity: 300 Ω·cm, amount (doping ratio) of phosphorus doped into tin oxide: 3.60% by mass, density: 6.8 g/cm3) as a second metal oxide particle, 266.67 parts of a phenol resin (trade name: PLYOPHEN J-325, manufactured by DIC Corporation, resin solid content: 60% by mass) as a binding material, and 120 parts of 1-methoxy-2-propanol as a solvent were loaded into a sand mill using 465 parts of glass beads each having a diameter of 0.8 mm, and were then subjected to a dispersion treatment under the following dispersion treatment conditions to provide a dispersion solution: a disc rotation number of 2,000 rpm, a dispersion treatment time of 4.5 hours, and a setting temperature of cooling water of 18° C.


The glass beads were removed from the dispersion solution with a mesh. After that, 5.00 parts of silicone resin particles (trade name: TOSPEARL 120, manufactured by Momentive Performance Materials Inc., average particle diameter: 2 μm) as a surface roughness providing material and 0.30 part of a silicone oil (trade name: SH28PA, manufactured by Dow Corning Toray Silicone Co., Ltd.) as a leveling agent were added to the dispersion solution, and then the mixture was stirred for 30 minutes to prepare a conductive-layer coating solution CP-1.


(Preparation Examples of Conductive-Layer Coating Solutions CP-2 to CP-93, CP-141 to CP-233, CP-281 to CP-373, CP-421 to CP-513, and CP-561 to CP-653)


Conductive-layer coating solutions CP-2 to CP-93, CP-141 to CP-233, CP-281 to CP-373, CP-421 to CP-513, and CP-561 to CP-653 were prepared by the same operations as those of the preparation example of the conductive-layer coating solution CP-1 except that the kind (including a coating ratio, a doping ratio, and a density, the same holds true for the following) and amount of the first metal oxide particle, the kind (including a doping ratio and a density, the same holds true for the following) and amount of the second metal oxide particle, and the amount of the binding material were changed as shown in Tables 1 to 3, 8 to 10, 15 to 17, 44 to 46, and 49 to 51.


It should be noted that P-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-2 to CP-93 had a powder resistivity of 5,000 Ω·cm.


In addition, P-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-7, CP-13, CP-19, CP-24, CP-29, CP-35, CP-40, CP-45, CP-50, CP-55, CP-61, CP-66, CP-71, CP-77, CP-83, and CP-89 had a powder resistivity of 300 Ω·cm.


In addition, P-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-2, CP-8, CP-14, CP-20, CP-25, CP-30, CP-36, CP-41, CP-46, CP-51, CP-56, CP-62, CP-67, CP-72, CP-78, CP-84, and CP-90 had a powder resistivity of 250 Ω·cm. In addition, P-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-3, CP-6, CP-9, CP-12, CP-15, CP-18, CP-21, CP-26, CP-31, CP-34, CP-37, CP-42, CP-47, CP-52, CP-57, CP-60, CP-63, CP-68, CP-73, CP-76, CP-79, CP-82, CP-85, CP-88, and CP-91 had a powder resistivity of 200 Ω·cm.


In addition, P-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-4, CP-10, CP-16, CP-22, CP-27, CP-32, CP-38, CP-43, CP-48, CP-53, CP-58, CP-64, CP-69, CP-74, CP-80, CP-86, and CP-92 had a powder resistivity of 150 Ω·cm.


In addition, P-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-5, CP-11, CP-17, CP-23, CP-28, CP-33, CP-39, CP-44, CP-49, CP-54, CP-59, CP-65, CP-70, CP-75, CP-81, CP-87, and CP-93 had a powder resistivity of 100 Ω·cm.


In addition, W-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-141 to CP-233 had a powder resistivity of 3,000 Ω·cm.


In addition, W-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-141, CP-147, CP-153, CP-159, CP-164, CP-169, CP-175, CP-180, CP-185, CP-190, CP-195, CP-201, CP-206, CP-211, CP-217, CP-223, and CP-229 had a powder resistivity of 180 Ω·cm.


In addition, W-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-142, CP-148, CP-154, CP-160, CP-165, CP-170, CP-176, CP-181, CP-186, CP-191, CP-196, CP-202, CP-207, CP-212, CP-218, CP-224, and CP-230 had a powder resistivity of 140 Ω·cm.


In addition, W-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-143, CP-146, CP-149, CP-152, CP-155, CP-158, CP-161, CP-166, CP-171, CP-174, CP-177, CP-182, CP-187, CP-192, CP-197, CP-200, CP-203, CP-208, CP-213, CP-216, CP-219, CP-222, CP-225, CP-228, and CP-231 had a powder resistivity of 100 Ω·cm.


In addition, W-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-144, CP-150, CP-156, CP-162, CP-167, CP-172, CP-178, CP-183, CP-188, CP-193, CP-198, CP-204, CP-209, CP-214, CP-220, CP-226, and CP-232 had a powder resistivity of 70 Ω·cm.


In addition, W-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-145, CP-151, CP-157, CP-163, CP-168, CP-173, CP-179, CP-184, CP-189, CP-194, CP-199, CP-205, CP-210, CP-215, CP-221, CP-227, and CP-233 had a powder resistivity of 30 Ω·cm.


In addition, F-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-281 to CP-373 had a powder resistivity of 5,000 Ω·cm.


In addition, F-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-281, CP-287, CP-293, CP-299, CP-304, CP-309, CP-315, CP-320, CP-325, CP-330, CP-335, CP-341, CP-346, CP-351, CP-357, CP-363, and CP-369 had a powder resistivity of 300 Ω·cm.


In addition, F-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-282, CP-288, CP-294, CP-300, CP-305, CP-310, CP-316, CP-321, CP-326, CP-331, CP-336, CP-342, CP-347, CP-352, CP-358, CP-364 and CP-370 had a powder resistivity of 270 Ω·cm.


In addition, F-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-283, CP-286, CP-289, CP-292, CP-295, CP-298, CP-301, CP-306, CP-311, CP-314, CP-317, CP-322, CP-327, CP-332, CP-337, CP-340, CP-343, CP-348, CP-353, CP-356, CP-359, CP-362, CP-365, CP-368, and CP-371 had a powder resistivity of 220 Ω·cm.


In addition, F-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-284, CP-290, CP-296, CP-302, CP-307, CP-312, CP-318, CP-323, CP-328, CP-333, CP-338, CP-344, CP-349, CP-354, CP-360, CP-366, and CP-372 had a powder resistivity of 170 Ω·cm.


In addition, F-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-285, CP-291, CP-297, CP-303, CP-308, CP-313, CP-319, CP-324, CP-329, CP-334, CP-339, CP-345, CP-350, CP-355, CP-361, CP-367, and CP-373 had a powder resistivity of 130 Ω·cm.


In addition, Nb-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-421 to CP-513 had a powder resistivity of 6,500 Ω·cm.


In addition, Nb-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-421, CP-427, CP-433, CP-439, CP-444, CP-449, CP-455, CP-460, CP-465, CP-470, CP-475, CP-481, CP-486, CP-491, CP-497, CP-503, and CP-509 had a powder resistivity of 400 Ω·cm.


In addition, Nb-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-422, CP-428, CP-434, CP-440, CP-445, CP-450, CP-456, CP-461, CP-466, CP-471, CP-476, CP-482, CP-487, CP-492, CP-498, CP-504, and CP-510 had a powder resistivity of 360 Ω·cm.


In addition, Nb-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-423, CP-426, CP-429, CP-432, CP-435, CP-438, CP-441, CP-446, CP-451, CP-454, CP-457, CP-462, CP-467, CP-472, CP-477, CP-480, CP-483, CP-488, CP-493, CP-496, CP-499, CP-502, CP-505, CP-508, and CP-511 had a powder resistivity of 330 Ω·cm.


In addition, Nb-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-424, CP-430, CP-436, CP-442, CP-447, CP-452, CP-458, CP-463, CP-468, CP-473, CP-478, CP-484, CP-489, CP-494, CP-500, CP-506, and CP-512 had a powder resistivity of 300 Ω·cm.


In addition, Nb-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-425, CP-431, CP-437, CP-443, CP-448, CP-453, CP-459, CP-464, CP-469, CP-474, CP-479, CP-485, CP-490, CP-495, CP-501, CP-507, and CP-513 had a powder resistivity of 270 Ω·cm.


In addition, Ta-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-561 to CP-653 had a powder resistivity of 4,500 Ω·cm.


In addition, Ta-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-561, CP-567, CP-573, CP-579, CP-584, CP-589, CP-595, CP-600, CP-605, CP-610, CP-615, CP-621, CP-626, CP-631, CP-637, CP-643, and CP-649 had a powder resistivity of 270 Ω·cm.


In addition, Ta-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-562, CP-568, CP-574, CP-580, CP-585, CP-590, CP-596, CP-601, CP-606, CP-611, CP-616, CP-622, CP-627, CP-632, CP-638, CP-644, and CP-650 had a powder resistivity of 200 Ω·cm.


In addition, Ta-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-563, CP-566, CP-569, CP-572, CP-575, CP-578, CP-581, CP-586, CP-591, CP-594, CP-597, CP-602, CP-607, CP-612, CP-617, CP-620, CP-623, CP-628, CP-633, CP-636, CP-639, CP-642, CP-645, CP-648, and CP-651 had a powder resistivity of 160 Ω·cm.


In addition, Ta-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-564, CP-570, CP-576, CP-582, CP-587, CP-592, CP-598, CP-603, CP-608, CP-613, CP-618, CP-624, CP-629, CP-634, CP-640, CP-646, and CP-652 had a powder resistivity of 110 Ω·cm.


In addition, Ta-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-565, CP-571, CP-577, CP-583, CP-588, CP-593, CP-599, CP-604, CP-609, CP-614, CP-619, CP-625, CP-630, CP-635, CP-641, CP-647, and CP-653 had a powder resistivity of 65 Ω·cm.


(Preparation Examples of Conductive-Layer Coating Solutions CP-94 to CP-140, CP-234 to CP-280, CP-374 to CP-420, CP-514 to CP-560, and CP-654 to CP-700)


Conductive-layer coating solutions CP-94 to CP-140, CP-234 to CP-280, CP-374 to CP-420, CP-514 to CP-560, and CP-654 to CP-700 were prepared by the same operations as those of the preparation example of the conductive-layer coating solution CP-1 except that: the kind and amount of the first metal oxide particle, the kind and amount of the second metal oxide particle, the amount of the binding material, and the amount of the silicone resin particles were changed as shown in Tables 3, 4, 11, 12, 18, 19, 46, 47, 52, and 53; and the operation for the dispersion treatment was carried out by adding 30.00 parts of uncoated titanium oxide particles (powder resistivity: 5.0×107 Ω·cm, average particle diameter: 210 nm, density: 4.2 g/cm3) at the time of the operation for the dispersion treatment. It should be noted that when the conductive-layer coating solutions CP-139, CP-279, CP-419, CP-559, and CP-699 were prepared, the disc rotation number and dispersion treatment time in the dispersion treatment conditions were changed to 2,500 rpm and 10 hours, respectively. In addition, when the conductive-layer coating solutions CP-140, CP-280, CP-420, CP-560, and CP-700 were prepared, the disc rotation number and dispersion treatment time in the dispersion treatment conditions were changed to 2,500 rpm and 30 hours, respectively.


It should be noted that P-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-94 to CP-140 had a powder resistivity of 5,000 Ω·cm.


In addition, P-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-94, CP-99, CP-104, CP-109, CP-114, CP-119, CP-124, CP-129, and CP-134 had a powder resistivity of 300 Ω·cm.


In addition, P-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-95, CP-100, CP-105, CP-110, CP-115, CP-120, CP-125, CP-130, and CP-135 had a powder resistivity of 250 Ω·cm.


In addition, P-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-96, CP-101, CP-106, CP-111, CP-116, CP-121, CP-126, CP-131, CP-136, CP-139, and CP-140 had a powder resistivity of 200 Ω·cm.


In addition, P-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-97, CP-102, CP-107, CP-112, CP-117, CP-122, CP-127, CP-132, and CP-137 had a powder resistivity of 150 Ω·cm.


In addition, P-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-98, CP-103, CP-108, CP-113, CP-118, CP-123, CP-128, CP-133, and CP-138 had a powder resistivity of 100 Ω·cm.


In addition, W-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-234 to CP-280 had a powder resistivity of 3,000 Ω·cm.


In addition, W-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-234, CP-239, CP-244, CP-249, CP-254, CP-259, CP-264, CP-269, and CP-274 had a powder resistivity of 180 Ω·cm.


In addition, W-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-235, CP-240, CP-245, CP-250, CP-255, CP-260, CP-265, CP-270, and CP-275 had a powder resistivity of 140 Ω·cm.


In addition, W-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-236, CP-241, CP-246, CP-251, CP-256, CP-261, CP-266, CP-271, CP-276, CP-279, and CP-280 had a powder resistivity of 100 Ω·cm.


In addition, W-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-237, CP-242, CP-247, CP-252, CP-257, CP-262, CP-267, CP-272, and CP-277 had a powder resistivity of 70 Ω·cm.


In addition, W-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-238, CP-243, CP-248, CP-253, CP-258, CP-263, CP-268, CP-273, and CP-278 had a powder resistivity of 30 Ω·cm.


In addition, F-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-374 to CP-420 had a powder resistivity of 5,000 Ω·cm.


In addition, F-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-374, CP-379, CP-384, CP-389, CP-394, CP-399, CP-404, CP-409, and CP-414 had a powder resistivity of 300 Ω·cm.


In addition, F-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-375, CP-380, CP-385, CP-390, CP-395, CP-400, CP-405, CP-410, and CP-415 had a powder resistivity of 270 Ω·cm.


In addition, F-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-376, CP-381, CP-386, CP-391, CP-396, CP-401, CP-406, CP-411, CP-416, CP-419, and CP-420 had a powder resistivity of 220 Ω·cm.


In addition, F-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-377, CP-382, CP-387, CP-392, CP-397, CP-402, CP-407, CP-412, and CP-417 had a powder resistivity of 170 Ω·cm.


In addition, F-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-378, CP-383, CP-388, CP-393, CP-398, CP-403, CP-408, CP-413, and CP-418 had a powder resistivity of 130 Ω·cm.


In addition, Nb-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-514 to CP-560 had a powder resistivity of 6,500 Ω·cm.


In addition, Nb-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-514, CP-519, CP-524, CP-529, CP-534, CP-539, CP-544, CP-549, and CP-554 had a powder resistivity of 400 Ω·cm. In addition, Nb-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-515, CP-520, CP-525, CP-530, CP-535, CP-540, CP-545, CP-550, and CP-555 had a powder resistivity of 360 Ω·cm.


In addition, Nb-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-516, CP-521, CP-526, CP-531, CP-536, CP-541, CP-546, CP-551, CP-556, CP-559, and CP-560 had a powder resistivity of 330 Ω·cm.


In addition, Nb-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-517, CP-522, CP-527, CP-532, CP-537, CP-542, CP-547, CP-552, and CP-557 had a powder resistivity of 300 Ω·cm.


In addition, Nb-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-518, CP-523, CP-528, CP-533, CP-538, CP-543, CP-548, CP-553, and CP-558 had a powder resistivity of 270 Ω·cm.


In addition, Ta-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-654 to CP-700 had a powder resistivity of 4,500 Ω·cm.


In addition, Ta-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-654, CP-659, CP-664, CP-669, CP-674, CP-679, CP-684, CP-689, and CP-694 had a powder resistivity of 270 Ω·cm.


In addition, Ta-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-655, CP-660, CP-665, CP-670, CP-675, CP-680, CP-685, CP-690, and CP-695 had a powder resistivity of 200 Ω·cm.


In addition, Ta-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-656, CP-661, CP-666, CP-671, CP-676, CP-681, CP-686, CP-691, CP-696, CP-699, and CP-700 had a powder resistivity of 160 Ω·cm.


In addition, Ta-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-657, CP-662, CP-667, CP-672, CP-677, CP-682, CP-687, CP-692, and CP-697 had a powder resistivity of 110 Ω·cm.


In addition, Ta-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-658, CP-663, CP-668, CP-673, CP-678, CP-683, CP-688, CP-693, and CP-698 had a powder resistivity of 65 Ω·cm.


(Preparation Examples of Conductive-Layer Coating Solutions CP-C1 to CP-C22, CP-C42 to CP-C63, CP-C76 to CP-C97, CP-C107 to CP-C128, and CP-C129 to CP-C150)


Conductive-layer coating solutions CP-C1 to CP-C22, CP-C42 to CP-C63, CP-C76 to CP-C97, CP-C107 to CP-C128, and CP-C129 to CP-C150 were prepared by the same operations as those of the preparation example of the conductive-layer coating solution CP-1 except that the kind and amount of the first metal oxide particle, the kind and amount of the second metal oxide particle, and the amount of the binding material were changed (including a change as to whether or not the first metal oxide particle or the second metal oxide particle were used, the same holds true for the following) as shown in Tables 5, 13, 20, 48, and 54.


It should be noted that P-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-C1 to CP-C9 and CP-C13 to CP-C22 had a powder resistivity of 5,000 Ω·cm.


In addition, P-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-C4 to CP-C22 had a powder resistivity of 200 Ω·cm.


In addition, W-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-C42 to CP-050 and CP-054 to CP-C63 had a powder resistivity of 3,000 Ω·cm.


In addition, W-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-C45 to CP-C63 had a powder resistivity of 100 Ω·cm.


In addition, F-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-C76 to CP-C84 and CP-C88 to CP-C97 had a powder resistivity of 5,000 Ω·cm.


In addition, F-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-C79 to CP-C97 had a powder resistivity of 220 Ω·cm.


In addition, Nb-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-C107 to CP-C115 and CP-C119 to CP-C128 had a powder resistivity of 6,500 Ω·cm.


In addition, Nb-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-C110 to CP-C128 had a powder resistivity of 330 Ω·cm.


In addition, Ta-doped tin oxide-coated titanium oxide particles used as the first metal oxide particle in the preparation of the conductive-layer coating solutions CP-C129 to CP-C137 and CP-C141 to CP-C150 had a powder resistivity of 4,500 Ω·cm.


In addition, Ta-doped tin oxide particles used as the second metal oxide particle in the preparation of the conductive-layer coating solutions CP-C132 to CP-C150 had a powder resistivity of 160 Ω·cm.


(Preparation Examples of Conductive-Layer Coating Solutions CP-C23 to CP-C35, CP-C64 to CP-C71, CP-C98 to CP-C105, CP-C151 to CP-C178, and CP-C179)


Conductive-layer coating solutions CP-C23 to CP-C35, CP-C64 to CP-C71, CP-C98 to CP-C105, and CP-C151 to CP-C179 were prepared by the same operations as those of the preparation example of the conductive-layer coating solution CP-1 except that the kind and amount of the first metal oxide particle, the kind and amount of the second metal oxide particle, and the amount of the binding material were changed as shown in Tables 6, 7, 14, 21, and 55 to 58. It should be noted that in the tables, for example, titanium oxide particles coated with oxygen-deficient tin oxide (oxygen-deficient tin oxide-coated titanium oxide particles) do not correspond to the first metal oxide particle according to the present invention and oxygen-deficient tin oxide particles do not correspond to the second metal oxide particle according to the present invention, but the particles were shown in the respective columns for convenience as examples to be compared with the present invention. The same holds true for the following.


It should be noted that P-doped tin oxide-coated titanium oxide particles used in the preparation of the conductive-layer coating solutions CP-C26 to CP-C28, CP-C31 to CP-C32, CP-C153, and CP-C154 had a powder resistivity of 5,000 Ω·cm.


In addition, P-doped tin oxide-coated barium sulfate particles used in the preparation of the conductive-layer coating solution CP-C35 had a powder resistivity of 5,000 Ω·cm.


In addition, P-doped tin oxide particles used in the preparation of the conductive-layer coating solutions CP-C23 to CP-C25, CP-C29, CP-C30, CP-C35, CP-151, and CP-152 had a powder resistivity of 200 Ω·cm.


In addition, W-doped tin oxide-coated titanium oxide particles used in the preparation of the conductive-layer coating solutions CP-C67 to CP-C69, CP-C104, CP-C157, and CP-C158 had a powder resistivity of 3,000 Ω·cm.


In addition, W-doped tin oxide-coated barium sulfate particles used in the preparation of the conductive-layer coating solution CP-C71 had a powder resistivity of 3,000 Ω·cm.


In addition, W-doped tin oxide particles used in the preparation of the conductive-layer coating solutions CP-C31, CP-C64 to CP-C66, CP-C70, CP-C71, CP-C155, and CP-C156 had a powder resistivity of 100 Ω·cm.


In addition, F-doped tin oxide-coated titanium oxide particles used in the preparation of the conductive-layer coating solutions CP-C30, CP-C70, CP-C101 to CP-C103, CP-C161, and CP-C162 had a powder resistivity of 5,000 Ω·cm.


In addition, F-doped tin oxide-coated barium sulfate particles used in the preparation of the conductive-layer coating solution CP-C105 had a powder resistivity of 5,000 Ω·cm.


In addition, F-doped tin oxide particles used in the preparation of the conductive-layer coating solutions CP-C32, CP-C159, and CP-C160 had a powder resistivity of 220 Ω·cm.


In addition, Nb-doped tin oxide-coated titanium oxide particles used in the preparation of the conductive-layer coating solutions CP-C151, CP-C155, CP-C159, CP-C166 to CP-C168, and CP-C170 had a powder resistivity of 6,500 Ω·cm.


In addition, Nb-doped tin oxide-coated barium sulfate particles used in the preparation of the conductive-layer coating solution CP-C171 had a powder resistivity of 6,500 Ω·cm.


In addition, Nb-doped tin oxide particles used in the preparation of the conductive-layer coating solutions CP-C153, CP-C157, CP-C161, CP-C163 to CP-C165, CP-C169, and CP-C171 had a powder resistivity of 330 Ω·cm.


In addition, Ta-doped tin oxide-coated titanium oxide particles used in the preparation of the conductive-layer coating solutions CP-C152, CP-C156, CP-C160, CP-C169, and CP-C175 to CP-C177 had a powder resistivity of 4,500 Ω·cm.


In addition, Ta-doped tin oxide-coated barium sulfate particles used in the preparation of the conductive-layer coating solution CP-C178 had a powder resistivity of 4,500 Ω·cm.


In addition, Ta-doped tin oxide particles used in the preparation of the conductive-layer coating solutions CP-C154, CP-C158, CP-C162, CP-C170, CP-C172 to CP-C174, and CP-C178 had a powder resistivity of 160 Ω·cm.


In addition, oxygen-deficient tin oxide-coated titanium oxide particles used in the preparation of the conductive-layer coating solutions CP-C23, CP-C64, CP-C98, CP-C163, and CP-C172 had a powder resistivity of 5,000 Ω·cm.


In addition, oxygen-deficient tin oxide-coated barium sulfate particles used in the preparation of the conductive-layer coating solutions CP-C24, CP-C33, CP-C65, CP-C99, CP-C164, CP-C173, and CP-C179 had a powder resistivity of 5,000 Ω·cm.


In addition, Sb-doped tin oxide-coated titanium oxide particles used in the preparation of the conductive-layer coating solutions CP-C25, CP-C34, CP-C66, CP-C100, CP-C165, and CP-C174 had a powder resistivity of 3,000 Ω·cm.


In addition, oxygen-deficient tin oxide particles used in the preparation of the conductive-layer coating solutions CP-C26, CP-C33, CP-C67, CP-C101, CP-C166, CP-C175, and CP-C179 had a powder resistivity of 200 Ω·cm.


In addition, indium tin oxide particles used in the preparation of the conductive-layer coating solutions CP-C27, CP-C68, CP-C102, CP-C167, and CP-C176 had a powder resistivity of 100 Ω·cm.


In addition, Sb-doped tin oxide particles used in the preparation of the conductive-layer coating solutions CP-C28, CP-C34, CP-C69, CP-C103, CP-C168, and CP-C177 had a powder resistivity of 100 Ω·cm.


(Preparation Example of Conductive-Layer Coating Solution CP-C36)


The intermediate-layer coating liquid of Example 1 described in Patent Literature 4 was prepared by the following operations and defined as a conductive-layer coating solution CP-C36.


That is, 20 parts of barium sulfate particles coated with oxygen-deficient tin oxide (coating ratio: 50% by mass, average primary particle diameter: 600 nm, specific gravity: 5.1 (density=5.1 g/cm3)), 100 parts of a tin oxide particle doped with antimony (trade name: T-1, manufactured by Mitsubishi Materials Corporation, average primary particle diameter: 20 nm, powder resistivity: 5 Ω·cm, specific gravity: 6.6 (density=6.6 g/cm3)), 70 parts of a resol-type phenol resin (trade name: PLYOPHEN J-325, manufactured by DIC Corporation, resin solid content: 60%) as a binding material, and 100 parts of 2-methoxy-1-propanol were loaded into a ball mill, and were then subjected to a dispersion treatment for 20 hours to prepare a conductive-layer coating solution CP-C36.


(Preparation Example of Conductive-Layer Coating Solution CP-C37)


A conductive-layer coating solution CP-C37 was prepared by the same operations as those of the preparation example of the conductive-layer coating solution CP-C36 except that the tin oxide particle doped with antimony were changed to a tin oxide particle doped with tantalum (average primary particle diameter: 20 nm, specific gravity: 6.1 (density=6.1 g/cm3)).


(Preparation Example of Conductive-Layer Coating Solution CP-C38)


The conductive layer coating fluid L-7 described in Patent Literature 2 was prepared by the following operations and defined as a conductive-layer coating solution CP-C38.


That is, 46 parts of P-doped tin oxide-coated titanium oxide particles (average primary particle diameter: 220 nm, powder resistivity: 100 Ω·cm, amount (doping ratio) of phosphorus doped into tin oxide: 7% by mass, coating ratio: 15%), 36.5 parts of a phenol resin (trade name: PLYOPHEN J-325, manufactured by DIC Corporation, resin solid content: 60% by mass) as a binding material, and 50 parts of 1-methoxy-2-propanol as a solvent were loaded into a sand mill using glass beads each having a diameter of 0.5 mm, and were then subjected to a dispersion treatment under the following dispersion treatment conditions to provide a dispersion solution: a disc rotation number of 2,500 rpm and a dispersion treatment time of 3.5 hours.


3.9 Parts of silicone resin particles (trade name: TOSPEARL 120, manufactured by Momentive Performance Materials Inc., average particle diameter: 2 μm) as a surface roughness providing material and 0.001 part of a silicone oil (trade name: SH28PA, manufactured by Dow Corning Toray Silicone Co., Ltd.) as a leveling agent were added to the dispersion solution, and then the mixture was stirred to prepare a conductive-layer coating solution CP-C38.


(Preparation Example of Conductive-Layer Coating Solution CP-C39)


The conductive layer coating fluid L-21 described in Patent Literature 2 was prepared by the following operations and defined as a conductive-layer coating solution CP-C39.


That is, 44 parts of P-doped tin oxide-coated titanium oxide particles (average primary particle diameter: 40 nm, powder resistivity: 500 Ω·cm, amount (doping ratio) of phosphorus doped into tin oxide: 8% by mass, coating ratio: 20%), 36.5 parts of a phenol resin (trade name: PLYOPHEN J-325, manufactured by DIC Corporation, resin solid content: 60% by mass) as a binding material, and 50 parts of 1-methoxy-2-propanol as a solvent were loaded into a sand mill using glass beads each having a diameter of 0.5 mm, and were then subjected to a dispersion treatment under the following dispersion treatment conditions to provide a dispersion solution: a disc rotation number of 2,500 rpm and a dispersion treatment time of 3.5 hours.


3.9 Parts of silicone resin particles (trade name: TOSPEARL 120, manufactured by Momentive Performance Materials Inc., average particle diameter: 2 μm) as a surface roughness providing material and 0.001 part of a silicone oil (trade name: SH28PA, manufactured by Dow Corning Toray Silicone Co., Ltd.) as a leveling agent were added to the dispersion solution, and then the mixture was stirred to prepare a conductive-layer coating solution CP-C39.


(Preparation Example of Conductive-Layer Coating Solution CP-C40)


The conductive layer coating fluid 1 described in Patent Literature 1 was prepared by the following operations and defined as a conductive-layer coating solution CP-C40.


That is, 204 parts of P-doped tin oxide-coated titanium oxide particles (powder resistivity: 40 Ω·cm, coating ratio: 35% by mass, amount (doping ratio) of phosphorus doped into tin oxide: 3% by mass), 148 parts of a phenol resin (trade name: PLYOPHEN J-325, manufactured by DIC Corporation, resin solid content: 60% by mass) as a binding material, and 98 parts of 1-methoxy-2-propanol as a solvent were loaded into a sand mill using 450 parts of glass beads each having a diameter of 0.8 mm, and were then subjected to a dispersion treatment under the following dispersion treatment conditions to provide a dispersion solution: a number of rotation of 2,000 rpm, a dispersion treatment time of 4 hours, and a setting temperature of cooling water of 18° C.


The glass beads were removed from the dispersion solution with a mesh. After that, 13.8 parts of silicone resin particles (trade name: TOSPEARL 120, manufactured by Momentive Performance Materials Inc., average particle diameter: 2 μm) as a surface roughness providing material, 0.014 part of a silicone oil (trade name: SH28PA, manufactured by Dow Corning Toray Silicone Co., Ltd.) as a leveling agent, 6 parts of methanol, and 6 parts of 1-methoxy-2-propanol were added to the dispersion solution, and then the mixture was stirred to prepare a conductive-layer coating solution CP-C40.


(Preparation Example of Conductive-Layer Coating Solution CP-C41)


The conductive layer coating fluid 4 described in Patent Literature 1 was prepared by the following operations and defined as a conductive-layer coating solution CP-C41.


That is, 204 parts of P-doped tin oxide-coated titanium oxide particles (powder resistivity: 500 Ω·cm, coating ratio: 35% by mass, amount (doping ratio) of phosphorus (P) doped into tin oxide (SnO2): 0.05% by mass), 148 parts of a phenol resin (trade name: PLYOPHEN J-325, manufactured by DIC Corporation, resin solid content: 60% by mass) as a binding material, and 98 parts of 1-methoxy-2-propanol as a solvent were loaded into a sand mill using 450 parts of glass beads each having a diameter of 0.8 mm, and were then subjected to a dispersion treatment under the following dispersion treatment conditions to provide a dispersion solution: a number of rotation of 2,000 rpm, a dispersion treatment time of 4 hours, and a setting temperature of cooling water of 18° C.


The glass beads were removed from the dispersion solution with a mesh. After that, 13.8 parts of silicone resin particles (trade name: TOSPEARL 120, manufactured by Momentive Performance Materials Inc., average particle diameter: 2 μm) as a surface roughness providing material, 0.014 part of a silicone oil (trade name: SH28PA, manufactured by Dow Corning Toray Silicone Co., Ltd.) as a leveling agent, 6 parts of methanol, and 6 parts of 1-methoxy-2-propanol were added to the dispersion solution, and then the mixture was stirred to prepare a conductive-layer coating solution CP-C41.


(Preparation Example of Conductive-Layer Coating Solution CP-C72)


The conductive layer coating fluid L-10 described in Patent Literature 2 was prepared by the following operations and defined as a conductive-layer coating solution CP-C72.


That is, 53 parts of W-doped tin oxide-coated titanium oxide particles (average primary particle diameter: 220 nm, powder resistivity: 150 Ω·cm, amount (doping ratio) of tungsten doped into tin oxide: 7% by mass, coating ratio: 15%), 36.5 parts of a phenol resin (trade name: PLYOPHEN J-325, manufactured by DIC Corporation, resin solid content: 60% by mass) as a binding material, and 50 parts of 1-methoxy-2-propanol as a solvent were loaded into a sand mill using glass beads each having a diameter of 0.5 mm, and were then subjected to a dispersion treatment under the following dispersion treatment conditions to provide a dispersion solution: a disc rotation number of 2,500 rpm and a dispersion treatment time of 3.5 hours.


The glass beads were removed from the dispersion solution with a mesh. After that, 3.9 parts of silicone resin particles (trade name: TOSPEARL 120, manufactured by Momentive Performance Materials Inc., average particle diameter: 2 μm) as a surface roughness providing material and 0.001 part of a silicone oil (trade name: SH28PA, manufactured by Dow Corning Toray Silicone Co., Ltd.) as a leveling agent were added to the dispersion solution, and then the mixture was stirred to prepare a conductive-layer coating solution CP-C72.


(Preparation Example of Conductive-Layer Coating Solution CP-C73)


The conductive layer coating fluid L-22 described in Patent Literature 2 was prepared by the following operations and defined as a conductive-layer coating solution CP-C73.


That is, 46 parts of W-doped tin oxide-coated titanium oxide particles (average primary particle diameter: 40 nm, powder resistivity: 550 Ω·cm, amount (doping ratio) of tungsten doped into tin oxide: 8% by mass, coating ratio: 20%), 36.5 parts of a phenol resin (trade name: PLYOPHEN J-325, manufactured by DIC Corporation, resin solid content: 60% by mass) as a binding material, and 50 parts of 1-methoxy-2-propanol as a solvent were loaded into a sand mill using glass beads each having a diameter of 0.5 mm, and were then subjected to a dispersion treatment under the following dispersion treatment conditions to provide a dispersion solution: a disc rotation number of 2,500 rpm and a dispersion treatment time of 3.5 hours.


3.9 Parts of silicone resin particles (trade name: TOSPEARL 120, manufactured by Momentive Performance Materials Inc., average particle diameter: 2 μm) as a surface roughness providing material and 0.001 part of a silicone oil (trade name: SH28PA, manufactured by Dow Corning Toray Silicone Co., Ltd.) as a leveling agent were added to the dispersion solution, and then the mixture was stirred to prepare the conductive layer coating fluid L-22 described in Patent Literature 2. The coating solution was defined as the conductive-layer coating solution CP-C73.


(Preparation Example of Conductive-Layer Coating Solution CP-C74)


The conductive layer coating fluid 10 described in Patent Literature 1 was prepared by the following operations and defined as a conductive-layer coating solution CP-C74.


That is, 204 parts of W-doped tin oxide-coated titanium oxide particles (powder resistivity: 25 Ω·cm, coating ratio: 33% by mass, amount (doping ratio) of tungsten doped into tin oxide: 3% by mass), 148 parts of a phenol resin (trade name: PLYOPHEN J-325, manufactured by DIC Corporation, resin solid content: 60% by mass) as a binding material, and 98 parts of 1-methoxy-2-propanol as a solvent were loaded into a sand mill using 450 parts of glass beads each having a diameter of 0.8 mm, and were then subjected to a dispersion treatment under the following dispersion treatment conditions to provide a dispersion solution: a number of rotation of 2,000 rpm, a dispersion treatment time of 4 hours, and a setting temperature of cooling water of 18° C.


The glass beads were removed from the dispersion solution with a mesh. After that, 13.8 parts of silicone resin particles (trade name: TOSPEARL 120, manufactured by Momentive Performance Materials Inc., average particle diameter: 2 μm) as a surface roughness providing material, 0.014 part of a silicone oil (trade name: SH28PA, manufactured by Dow Corning Toray Silicone Co., Ltd.) as a leveling agent, 6 parts of methanol, and 6 parts of 1-methoxy-2-propanol were added to the dispersion solution, and then the mixture was stirred to prepare a conductive-layer coating solution CP-C74.


(Preparation Example of Conductive-Layer Coating Solution CP-C75)


The conductive layer coating fluid 13 described in Patent Literature 1 was prepared by the following operations and defined as a conductive-layer coating solution CP-C75.


That is, 204 parts of W-doped tin oxide-coated titanium oxide particles (powder resistivity: 69 Ω·cm, coating ratio: 33% by mass, amount (doping ratio) of tungsten doped into tin oxide: 0.1% by mass), 148 parts of a phenol resin (trade name: PLYOPHEN J-325, manufactured by DIC Corporation, resin solid content: 60% by mass) as a binding material, and 98 parts of 1-methoxy-2-propanol as a solvent were loaded into a sand mill using 450 parts of glass beads each having a diameter of 0.8 mm, and were then subjected to a dispersion treatment under the following dispersion treatment conditions to provide a dispersion solution: a number of rotation of 2,000 rpm, a dispersion treatment time of 4 hours, and a setting temperature of cooling water of 18° C.


The glass beads were removed from the dispersion solution with a mesh. After that, 13.8 parts of silicone resin particles (trade name: TOSPEARL 120, manufactured by Momentive Performance Materials Inc., average particle diameter: 2 um) as a surface roughness providing material, 0.014 part of a silicone oil (trade name: SH28PA, manufactured by Dow Corning Toray Silicone Co., Ltd.) as a leveling agent, 6 parts of methanol, and 6 parts of 1-methoxy-2-propanol were added to the dispersion solution, and then the mixture was stirred to prepare a conductive-layer coating solution CP-C75.


(Preparation Example of Conductive-Layer Coating Solution CP-C106)


The conductive layer coating fluid L-30 described in Patent Literature 2 was prepared by the following operations and defined as a conductive-layer coating solution CP-C106.


That is, 60 parts of F-doped tin oxide-coated titanium oxide particles (average primary particle diameter: 75 nm, powder resistivity: 300 Ω·cm, amount (doping ratio) of fluorine doped into tin oxide: 7% by mass, coating ratio: 15%), 36.5 parts of a phenol resin (trade name: PLYOPHEN J-325, manufactured by DIC Corporation, resin solid content: 60% by mass) as a binding material, and 50 parts of 1-methoxy-2-propanol as a solvent were loaded into a sand mill using glass beads each having a diameter of 0.5 mm, and were then subjected to a dispersion treatment under the following dispersion treatment conditions to provide a dispersion solution: a disc rotation number of 2,500 rpm and a dispersion treatment time of 3.5 hours.


The glass beads were removed from the dispersion solution with a mesh. After that, 3.9 parts of silicone resin particles (trade name: TOSPEARL 120, manufactured by Momentive Performance Materials Inc., average particle diameter: 2 μm) as a surface roughness providing material and 0.001 part of a silicone oil (trade name: SH28PA, manufactured by Dow Corning Toray Silicone Co., Ltd.) as a leveling agent were added to the dispersion solution, and then the mixture was stirred to prepare a conductive-layer coating solution CP-C106.














TABLE 1








(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)

























Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


Conductive-layer

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


coating solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-1 
P-doped
45
4.50
5.1
112.00
P-doped
3.60
6.8
3.00
1.3
266.67
1.3
5.00
None


CP-2 
tin
45
4.50
5.1
112.00
tin oxide
4.05
6.7
2.95
1.3
266.75
1.3
5.00



CP-3 
oxide-
45
4.50
5.1
112.00
particles
4.50
6.7
2.95
1.3
266.75
1.3
5.00



CP-4 
coated
45
4.50
5.1
112.00
(average
4.95
6.7
2.95
1.3
266.75
1.3
5.00



CP-5 
titanium
45
4.50
5.1
112.00
particle
5.40
6.7
2.95
1.3
266.75
1.3
5.00



CP-6 
oxide
45
4.50
5.1
108.50
diameter:
4.50
6.7
7.15
1.3
265.58
1.3
5.00



CP-7 
particles
45
4.50
5.1
99.80
20 nm
3.60
6.8
17.30
1.3
263.17
1.3
5.00



CP-8 
(average
45
4.50
5.1
99.90

4.05
6.7
17.06
1.3
263.40
1.3
5.00



CP-9 
particle
45
4.50
5.1
99.90

4.50
6.7
17.06
1.3
263.40
1.3
5.00



CP-10
diameter:
45
4.50
5.1
99.90

4.95
6.7
17.06
1.3
263.40
1.3
5.00



CP-11
230 nm)
45
4.50
5.1
99.90

5.40
6.7
17.06
1.3
263.40
1.3
5.00



CP-12

45
4.50
5.1
93.50

4.50
6.7
24.60
1.3
261.50
1.3
5.00



CP-13

45
4.50
5.1
89.30

3.60
6.8
29.80
1.3
259.83
1.3
5.00



CP-14

45
4.50
5.1
89.40

4.05
6.7
29.40
1.3
260.33
1.3
5.00



CP-15

45
4.50
5.1
89.40

4.50
6.7
29.40
1.3
260.33
1.3
5.00



CP-16

45
4.50
5.1
89.40

4.95
6.7
29.40
1.3
260.33
1.3
5.00



CP-17

45
4.50
5.1
89.40

5.40
6.7
29.40
1.3
260.33
1.3
5.00



CP-18

45
4.50
5.1
135.50

4.50
6.7
3.00
1.3
226.50
1.3
5.00



CP-19

45
4.50
5.1
131.00

3.60
6.8
8.75
1.3
225.42
1.3
5.00



CP-20

45
4.50
5.1
131.10

4.05
6.7
8.65
1.3
225.42
1.3
5.00



CP-21

45
4.50
5.1
131.10

4.50
6.7
8.65
1.3
225.42
1.3
5.00



CP-22

45
4.50
5.1
131.10

4.95
6.7
8.65
1.3
225.42
1.3
5.00



CP-23

45
4.50
5.1
131.10

5.40
6.7
8.65
1.3
225.42
1.3
5.00



CP-24

45
4.50
5.1
120.50

3.60
6.8
20.90
1.3
222.67
1.3
5.00



CP-25

45
4.50
5.1
120.60

4.05
6.7
20.60
1.3
223.00
1.3
5.00



CP-26

45
4.50
5.1
120.60

4.50
6.7
20.60
1.3
223.00
1.3
5.00



CP-27

45
4.50
5.1
120.60

4.95
6.7
20.60
1.3
223.00
1.3
5.00



CP-28

45
4.50
5.1
120.60

5.40
6.7
20.60
1.3
223.00
1.3
5.00



CP-29

45
4.50
5.1
112.50

3.60
6.8
30.00
1.3
220.83
1.3
5.00



CP-30

45
4.50
5.1
112.60

4.05
6.7
29.60
1.3
221.33
1.3
5.00



CP-31

45
4.50
5.1
112.60

4.50
6.7
29.60
1.3
221.33
1.3
5.00



CP-32

45
4.50
5.1
112.60

4.95
6.7
29.60
1.3
221.33
1.3
5.00



CP-33

45
4.50
5.1
112.60

5.40
6.7
29.60
1.3
221.33
1.3
5.00



CP-34

45
4.50
5.1
107.60

4.50
6.7
35.35
1.3
220.08
1.3
5.00



CP-35

45
4.30
5.1
171.50

3.60
6.8
4.60
1.3
164.83
1.3
5.00



CP-36

45
4.50
5.1
171.50

4.05
6.7
4.50
1.3
165.00
1.3
5.00



CP-37

45
4.50
5.1
171.50

4.50
6.7
4.50
1.3
165.00
1.3
5.00



CP-38

45
4.50
5.1
171.50

4.95
6.7
4.50
1.3
165.00
1.3
5.00



CP-39

45
4.50
5.1
171.50

5.40
6.7
4.50
1.3
165.00
1.3
5.00



CP-40

45
4.50
5.1
165.60

3.60
6.8
11.05
1.3
163.92
1.3
5.00





















TABLE 2








(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)

























Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


Conductive-layer

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


coating solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-41
P-doped
45
4.50
5.1
165.70
P-doped
4.05
6.7
10.90
1.3
164.00
1.3
5.00
None


CP-42
tin
45
4.50
5.1
165.70
tin oxide
4.50
6.7
10.90
1.3
164.00
1.3
5.00



CP-43
oxide-
45
4.50
5.1
165.70
particles
4.95
6.7
10.90
1.3
164.00
1.3
5.00



CP-44
coated
45
4.50
5.1
165.70
(average
5.40
6.7
10.90
1.3
164.00
1.3
5.00



CP-45
titanium
45
4.50
5.1
151.80
particle
3.60
6.8
26.35
1.3
161.42
1.3
5.00



CP-46
oxide
45
4.50
5.1
151.95
diameter:
4.05
6.7
25.95
1.3
161.83
1.3
5.00



CP-47
particles
45
4.50
5.1
151.95
20 nm
4.50
6.7
25.95
1.3
161.83
1.3
5.00



CP-48
(average
45
4.50
5.1
151.95

4.95
6.7
25.95
1.3
161.83
1.3
5.00



CP-49
particle
45
4.50
5.1
151.95

5.40
6.7
25.95
1.3
161.83
1.3
5.00



CP-50
diameter:
45
4.50
5.1
141.40

3.60
6.8
37.70
1.3
159.83
1.3
5.00



CP-51
230 nm)
45
4.50
5.1
141.70

4.05
6.7
37.25
1.3
160.08
1.3
5.00



CP-52

45
4.50
5.1
141.70

4.50
6.7
37.25
1.3
160.08
1.3
5.00



CP-53

45
4.50
5.1
141.70

4.95
6.7
37.25
1.3
160.08
1.3
5.00



CP-54

45
4.50
5.1
141.70

5.40
6.7
37.25
1.3
160.08
1.3
5.00



CP-55

45
4.50
5.1
134.80

3.60
6.8
45.00
1.3
158.67
1.3
5.00



CP-56

45
4.50
5.1
135.15

4.05
6.7
44.40
1.3
159.08
1.3
5.00



CP-57

45
4.50
5.1
135.15

4.50
6.7
44.40
1.3
159.08
1.3
5.00



CP-58

45
4.50
5.1
135.15

4.95
6.7
44.40
1.3
159.08
1.3
5.00



CP-59

45
4.50
5.1
135.15

5.40
6.7
44.40
1.3
159.08
1.3
5.00



CP-60

45
4.50
5.1
197.70

4.50
6.7
5.20
1.3
120.17
1.3
5.00



CP-61

45
4.50
5.1
190.70

3.60
6.8
12.75
1.3
119.25
1.3
5.00



CP-62

45
4.50
5.1
190.85

4.05
6.7
12.55
1.3
119.33
1.3
5.00



CP-63

45
4.50
5.1
190.85

4.50
6.7
12.55
1.3
119.33
1.3
5.00



CP-64

45
4.50
5.1
190.85

4.95
6.7
12.55
1.3
119.33
1.3
5.00



CP-65

45
4.50
5.1
190.85

5.40
6.7
12.55
1.3
119.33
1.3
5.00



CP-66

45
4.50
5.1
174.40

3.60
6.8
30.30
1.3
117.17
1.3
5.00



CP-67

45
4.50
5.1
174.70

4.05
6.7
29.90
1.3
117.33
1.3
5.00



CP-68

45
4.50
5.1
174.70

4.50
6.7
29.90
1.3
117.33
1.3
5.00



CP-69

45
4.50
5.1
174.70

4.95
6.7
29.90
1.3
117.33
1.3
5.00



CP-70

45
4.50
5.1
174.70

5.40
6.7
29.90
1.3
117.33
1.3
5.00



CP-71

45
4.50
5.1
162.30

3.60
6.8
43.30
1.3
115.67
1.3
5.00



CP-72

45
4.50
5.1
162.70

4.05
6.7
42.75
1.3
115.92
1.3
5.00



CP-73

45
4.50
5.1
162.70

4.50
6.7
42.75
1.3
115.92
1.3
5.00



CP-74

45
4.50
5.1
162.70

4.95
6.7
42.75
1.3
115.92
1.3
5.00



CP-75

45
4.50
5.1
162.70

5.40
6.7
42.75
1.3
115.92
1.3
5.00



CP-76

45
4.50
5.1
155.05

4.50
6.7
50.95
1.3
115.00
1.3
5.00



CP-77

45
4.50
5.1
208.30

3.60
6.8
5.60
1.3
101.83
1.3
5.00



CP-78

45
4.50
5.1
208.25

4.05
6.7
5.56
1.3
101.98
1.3
5.00



CP-79

45
4.50
5.1
208.25

4.50
6.7
5.56
1.3
101.98
1.3
5.00



CP-80

45
4.50
5.1
208.25

4.95
6.7
5.56
1.3
101.98
1.3
5.00





















TABLE 3








(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)

























Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


Conductive-layer

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


coating solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-81 
P-doped
45
4.50
5.1
208.25
P-doped
5.40
6.7
5.56
1.3
101.98
1.3
5.00
None


CP-82 
tin
45
4.50
5.1
201.10
tin oxide
4.50
6.7
13.20
1.3
101.17
1.3
5.00



CP-83 
oxide-
45
4.50
5.1
183.55
particles
3.60
6.8
31.90
1.3
99.25
1.3
5.00



CP-84 
coated
45
4.50
5.1
183.90
(average
4.05
6.7
31.40
1.3
99.50
1.3
5.00



CP-85 
titanium
45
4.50
5.1
183.90
particle
4.50
6.7
31.40
1.3
99.50
1.3
5.00



CP-86 
oxide
45
4.50
5.1
183.90
diameter:
4.95
6.7
31.40
1.3
99.50
1.3
5.00



CP-87 
particles
45
4.50
5.1
183.90
20 nm
5.40
6.7
31.40
1.3
99.50
1.3
5.00



CP-88 
(average
45
4.50
5.1
171.10

4.50
6.7
45.00
1.3
98.17
1.3
5.00



CP-89 
particle
45
4.50
5.1
162.50

3.60
6.8
54.20
1.3
97.17
1.3
5.00



CP-90 
diameter:
45
4.50
5.1
163.00

4.05
6.7
53.55
1.3
97.42
1.3
5.00



CP-91 
230 nm)
45
4.50
5.1
163.00

4.50
6.7
53.55
1.3
97.42
1.3
5.00



CP-92 

45
4.50
5.1
163.00

4.95
6.7
53.55
1.3
97.42
1.3
5.00



CP-93 

45
4.50
5.1
163.00

5.40
6.7
53.55
1.3
97.42
1.3
5.00
























CP-94 

45
4.50
5.1
135.40

3.60
6.8
9.05
1.3
159.25
1.3
40.00
Uncoated
4.2
30.00


CP-95 

45
4.50
5.1
135.40

4.05
6.7
8.90
1.3
159.50
1.3
40.00
titanium
4.2
30.00


CP-96 

45
4.50
5.1
135.40

4.50
6.7
8.90
1.3
159.50
1.3
40.00
oxide
4.2
30.00


CP-97 

45
4.50
5.1
135.40

4.95
6.7
8.90
1.3
159.50
1.3
40.00
particles
4.2
30.00


CP-98 

45
4.50
5.1
135.40

5.40
6.7
8.90
1.3
159.50
1.3
40.00
(average
4.2
30.00


CP-99 

45
4.50
5.1
124.50

3.60
6.8
21.60
1.3
156.50
1.3
40.00
particle
4.2
30.00


CP-100

45
4.50
5.1
124.50

4.05
6.7
21.30
1.3
157.00
1.3
40.00
diameter:
4.2
30.00


CP-101

45
4.50
5.1
124.50

4.50
6.7
21.30
1.3
157.00
1.3
40.00
210 nm
4.2
30.00


CP-102

45
4.50
5.1
124.50

4.95
6.7
21.30
1.3
157.00
1.3
40.00

4.2
30.00


CP-103

45
4.50
5.1
124.50

5.40
6.7
21.30
1.3
157.00
1.3
40.00

4.2
30.00


CP-104

45
4.50
5.1
116.20

3.60
6.8
31.00
1.3
154.67
1.3
40.00

4.2
30.00


CP-105

45
4.50
5.1
116.40

4.05
6.7
30.60
1.3
155.00
1.3
40.00

4.2
30.00


CP-106

45
4.50
5.1
116.40

4.50
6.7
30.60
1.3
155.00
1.3
40.00

4.2
30.00


CP-107

45
4.50
5.1
116.40

4.95
6.7
30.60
1.3
155.00
1.3
40.00

4.2
30.00


CP-108

45
4.50
5.1
116.40

5.40
6.7
30.60
1.3
155.00
1.3
40.00

4.2
30.00


CP-109

45
4.50
5.1
171.10

3.60
6.8
11.40
1.3
95.83
1.3
40.00

4.2
30.00


CP-110

45
4.50
5.1
171.20

4.05
6.7
11.25
1.3
95.92
1.3
40.00

4.2
30.00


CP-111

45
4.50
5.1
171.20

4.50
6.7
11.25
1.3
95.92
1.3
40.00

4.2
30.00


CP-112

45
4.50
5.1
171.20

4.95
6.7
11.25
1.3
95.92
1.3
40.00

4.2
30.00


CP-113

45
4.50
5.1
171.20

5.40
6.7
11.25
1.3
95.92
1.3
40.00

4.2
30.00


CP-114

45
4.50
5.1
156.80

3.60
6.8
27.20
1.3
93.33
1.3
40.00

4.2
30.00


CP-115

45
4.50
5.1
157.00

4.05
6.7
26.85
1.3
93.58
1.3
40.00

4.2
30.00


CP-116

45
4.50
5.1
157.00

4.50
6.7
26.85
1.3
93.58
1.3
40.00

4.2
30.00


CP-117

45
4.50
5.1
157.00

4.95
6.7
26.85
1.3
93.58
1.3
40.00

4.2
30.00


CP-118

45
4.50
5.1
157.00

5.40
6.7
26.85
1.3
93.58
1.3
40.00

4.2
30.00


CP-119

45
4.50
5.1
146.10

3.60
6.8
39.00
1.3
91.50
1.3
40.00

4.2
30.00


CP-120

45
4.50
5.1
146.40

4.05
6.7
38.50
1.3
91.83
1.3
40.00

4.2
30.00





















TABLE 4








(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)

























Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


Conductive-layer

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


coating solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]





CP-121
P-doped
45
4.50
5.1
146.40
P-doped
4.50
6.7
38.50
1.3
91.83
1.3
40.00
Uncoated
4.2
30.00


CP-122
tin
45
4.50
5.1
146.40
tin oxide
4.95
6.7
38.50
1.3
91.83
1.3
40.00
titanium
4.2
30.00


CP-123
oxide-
45
4.50
5.1
146.40
particles
5.40
6.7
38.50
1.3
91.83
1.3
40.00
oxide
4.2
30.00


CP-124
coated
45
4.50
5.1
197.05
(average
3.60
6.8
13.15
1.3
49.67
1.3
40.00
particles
4.2
30.00


CP-125
titanium
45
4.50
5.1
197.20
particle
4.05
6.7
13.00
1.3
49.67
1.3
40.00
(average
4.2
30.00


CP-126
oxide
45
4.50
5.1
197.20
diameter:
4.50
6.7
13.00
1.3
49.67
1.3
40.00
particle
4.2
30.00


CP-127
particles
45
4.50
5.1
197.20
20 nm
4.95
6.7
13.00
1.3
49.67
1.3
40.00
diameter:
4.2
30.00


CP-128
(average
45
4.50
5.1
197.20

5.40
6.7
13.00
1.3
49.67
1.3
40.00
210 nm
4.2
30.00


CP-129
particle
45
4.50
5.1
180.20

3.60
6.8
31.30
1.3
47.50
1.3
40.00

4.2
30.00


CP-130
diameter:
45
4.50
5.1
180.50

4.05
6.7
30.85
1.3
47.75
1.3
40.00

4.2
30.00


CP-131
230 nm)
45
4.50
5.1
180.50

4.50
6.7
30.85
1.3
47.75
1.3
40.00

4.2
30.00


CP-132

45
4.50
5.1
180.50

4.95
6.7
30.85
1.3
47.75
1.3
40.00

4.2
30.00


CP-133

45
4.50
5.1
180.50

5.40
6.7
30.85
1.3
47.75
1.3
40.00

4.2
30.00


CP-134

45
4.50
5.1
167.65

3.60
6.8
44.75
1.3
46.00
1.3
40.00

4.2
30.00


CP-135

45
4.50
5.1
168.05

4.05
6.7
44.16
1.3
46.32
1.3
40.00

4.2
30.00


CP-136

45
4.50
5.1
168.05

4.50
6.7
44.16
1.3
46.32
1.3
40.00

4.2
30.00


CP-137

45
4.50
5.1
168.05

4.95
6.7
44.16
1.3
46.32
1.3
40.00

4.2
30.00


CP-138

45
4.50
5.1
168.05

5.40
6.7
44.16
1.3
46.32
1.3
40.00

4.2
30.00


CP-139

45
4.50
5.1
157.00

4.50
6.7
26.85
1.3
93.58
1.3
40.00

4.2
30.00


CP-140

45
4.50
5.1
161.00

4.50
6.7
22.85
1.3
93.58
1.3
40.00

4.2
30.00





















TABLE 5








(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)

























Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


Conductive-layer

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


coating solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]





















CP-C1 
P-doped tin
45
4.50
5.1
114.60
None
1.3
267.33
1.3
5.00
None


CP-C2 
oxide-coated
45
4.50
5.1
175.60

1.3
165.67
1.3
5.00



CP-C3 
titanium
45
4.50
5.1
213.50

1.3
102.50
1.3
5.00






















CP-C4 
oxide
45
4.50
5.1
113.25
P-doped
4.50
6.7
1.49
1.3
267.10
1.3
5.00



CP-C5 
particles
45
4.50
5.1
173.50
tin oxide
4.50
6.7
2.27
1.3
165.38
1.3
5.00



CP-C6 
(average
45
4.50
5.1
210.90
particles
4.50
6.7
2.80
1.3
102.17
1.3
5.00



CP-C7 
particle
45
4.50
5.1
85.60
(average
4.50
6.7
33.75
1.3
259.42
1.3
5.00



CP-C8 
diameter:
45
4.50
5.1
129.20
particle
4.50
6.7
50.95
1.3
158.08
1.3
5.00



CP-C9 
230 nm)
45
4.50
5.1
155.65
diameter:
4.50
6.7
61.35
1.3
96.67
1.3
5.00


















CP-C10
None
20 nm
4.50
6.7
133.40
1.3
236.00
1.3
5.00



CP-C11


4.50
6.7
192.80
1.3
137.00
1.3
5.00



CP-C12


4.50
6.7
226.40
1.3
81.00
1.3
5.00






















CP-C13
P-doped tin
45
4.50
5.1
83.20

4.50
6.7
2.20
1.3
316.00
1.3
5.00



CP-C14
oxide-coated
45
4.50
5.1
80.60

4.50
6.7
5.30
1.3
315.17
1.3
5.00



CP-C15
titanium
45
4.50
5.1
74.50

4.50
6.7
12.75
1.3
312.92
1.3
5.00



CP-C16
oxide
45
4.50
5.1
69.75

4.50
6.7
18.35
1.3
311.50
1.3
5.00



CP-C17
particles
45
4.50
5.1
66.70

4.50
6.7
21.92
1.3
310.63
1.3
5.00



CP-C18
(average
45
4.50
5.1
217.70

4.50
6.7
5.75
1.3
85.92
1.3
5.00



CP-C19
particle
45
4.50
5.1
210.05

4.50
6.7
13.80
1.3
85.25
1.3
5.00



CP-C20
diameter:
45
4.50
5.1
191.95

4.50
6.7
32.80
1.3
83.75
1.3
5.00



CP-C21
230 nm)
45
4.50
5.1
178.50

4.50
6.7
46.95
1.3
82.58
1.3
5.00



CP-C22

45
4.50
5.1
169.98

4.50
6.7
55.85
1.3
81.95
1.3
5.00





















TABLE 6







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)























layer

Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


coating

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-C23
Oxygen-
45

5.1
152.00
P-doped tin
4.50
6.7
26.00
1.3
161.67
1.3
5.00
None



deficient tin




oxide











oxide-coated




particles











titanium oxide




(average











particles




particle











(average




diameter











particle




20 nm)











diameter:
















230 nm)















CP-C24
Oxygen-
45

5.1
152.00

4.50
6.7
26.00
1.3
161.67
1.3
5.00




deficient tin
















oxide-coated
















barium sulfate
















particles
















(average
















particle
















diameter:
















230 nm)















CP-C25
Sb-doped tin
45
4.50
5.1
152.00

4.50
6.7
26.00
1.3
161.67
1.3
5.00




oxide-coated
















titanium oxide
















particles
















(average
















particle
















diameter:
















230 nm)















CP-C26
P-doped tin
45
4.50
5.1
152.20
Oxygen-

6.6
25.60
1.3
162.00
1.3
5.00




oxide-coated




deficient











titanium oxide




tin oxide











particles




particles











(average




(average











particle




particle











diameter:




diameter:











230 nm)




20 nm)










CP-C27
P-doped tin
45
4.50
5.1
152.10
Indium tin
4.50
7.1
27.35
1.3
160.92
1.3
5.00




oxide-coated




oxide











titanium oxide




particles











particles




(average











(average




particle











particle




diameter:











diameter:




20 nm)










CP-C28
230 nm)
45
4.50
5.1
152.20
Sb-doped
4.50
6.6
25.60
1.3
162.00
1.3
5.00









tin oxide
















particles
















(average
















particle
















diameter:
















20 nm)










CP-C29
W-doped tin
45
4.50
52
153.30
P-doped tin
4.50
6.7
25.70
1.3
160.00
1.3
5.00




oxide-coated




oxide











titanium oxide




particles











particles




(average











(average




particle











particle




diameter:











diameter:




20 nm)











230 nm)





















TABLE 7







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)























layer

Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


coating

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-C30
F-doped tin
45
4.50
5.0
150.60
P-doped tin
4.50
6.7
26.25
1.3
163.58
1.3
5.00
None



oxide-coated




oxide











titanium oxide




particles











particles




(average











(average




particle











particle




diameter:











diameter:




20 nm)











230 nm)















CP-C31
P-doped tin
45
4.50
5.1
150.20
W-doped tin
4.50
7.5
28.80
1.3
160.00
1.3
5.00




oxide-coated




oxide











titanium oxide




particles











particles




(average











(average




particle











particle




diameter:











diameter:




20 nm)










CP-C32
230 nm)
45
4.50
5.1
152.20
F-doped tin
4.50
6.6
25.60
1.3
162.00
1.3
5.00









oxide
















particles
















(average
















particle
















diameter:
















20 nm)










CP-C33
Oxygen-
45

5.1
152.20
Oxygen-

6.6
25.60
1.3
162.00
1.3
5.00




deficient tin




deficient











oxide-coated




tin oxide











barium sulfate




particles











particles




(average











(average




particle











particle




diameter:











diameter:




20 nm)











230 nm)















CP-C34
Sb-doped tin
45
4.50
5.1
152.20
Sb-doped
4.50
6.6
25.60
1.3
162.00
1.3
5.00




oxide-coated




tin oxide











titanium oxide




particles











particles




(average











(average




particle











particle




diameter:











diameter:




20 nm)











230 nm)















CP-C35
P-doped tin
45
4.50
5.1
151.90
P-doped tin
4.50
6.7
26.00
1.3
161.83
1.3
5.00




oxide-coated




oxide











barium sulfate




particles











particles




(average











(average




particle











particle




diameter:











diameter:




20 nm)











230 nm)





















TABLE 8








(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)

























Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


Conductive-layer

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


coating solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-141
W-doped
45
4.50
5.2
113.20
W-doped
3.60
7.4
3.22
1.3
264.30
1.3
5.00
None


CP-142
tin
45
4.50
5.2
113.20
tin oxide
4.05
7.5
3.26
1.3
264.23
1.3
5.00



CP-143
oxide-
45
4.50
5.2
113.20
particles
4.50
7.5
3.26
1.3
264.23
1.3
5.00



CP-144
coated
45
4.50
5.2
113.20
(average
4.95
7.6
3.31
1.3
264.15
1.3
5.00



CP-145
titanium
45
4.50
5.2
113.20
particle
5.40
7.6
3.31
1.3
264.15
1.3
5.00



CP-146
oxide
45
4.50
5.2
109.40
diameter:
4.50
7.5
7.90
1.3
262.83
1.3
5.00



CP-147
particles
45
4.50
5.2
100.50
20 nm
3.60
7.4
18.60
1.3
259.83
1.3
5.00



CP-148
(average
45
4.50
5.2
100.50

4.05
7.5
18.85
1.3
259.42
1.3
5.00



CP-149
particle
45
4.50
5.2
100.50

4.50
7.5
18.85
1.3
259.42
1.3
5.00



CP-150
diameter:
45
4.50
5.2
100.40

4.95
7.6
19.10
1.3
259.17
1.3
5.00



CP-151
230 nm)
45
4.50
5.2
100.40

5.40
7.6
19.10
1.3
259.17
1.3
5.00



CP-152

45
4.50
5.2
93.70

4.50
7.5
27.05
1.3
257.08
1.3
5.00



CP-153

45
4.50
5.2
89.55

3.60
7.4
31.86
1.3
255.98
1.3
5.00



CP-154

45
4.50
5.2
89.48

4.05
7.5
32.26
1.3
255.43
1.3
5.00



CP-155

45
4.50
5.2
89.48

4.50
7.5
32.26
1.3
255.43
1.3
5.00



CP-156

45
4.50
5.2
89.30

4.95
7.6
32.65
1.3
255.08
1.3
5.00



CP-157

45
4.50
5.2
89.30

5.40
7.6
32.65
1.3
255.08
1.3
5.00



CP-158

45
4.50
5.2
136.65

4.50
7.5
3.97
1.3
223.97
1.3
5.00



CP-159

45
4.50
5.2
132.00

3.60
7.4
9.40
1.3
222.67
1.3
5.00



CP-160

45
4.50
5.2
132.00

4.05
7.5
9.55
1.3
222.42
1.3
5.00



CP-161

45
4.50
5.2
132.00

4.50
7.5
9.55
1.3
222.42
1.3
5.00



CP-162

45
4.50
5.2
131.90

4.95
7.6
9.65
1.3
222.42
1.3
5.00



CP-163

45
4.50
5.2
131.90

5.40
7.6
9.65
1.3
222.42
1.3
5.00



CP-164

45
4.50
5.2
121.00

3.60
7.4
22.40
1.3
219.33
1.3
5.00



CP-165

45
4.50
5.2
120.85

4.05
7.5
22.67
1.3
219.13
1.3
5.00



CP-166

45
4.50
5.2
120.85

4.50
7.5
22.67
1.3
219.13
1.3
5.00



CP-167

45
4.50
5.2
120.70

4.95
7.6
22.95
1.3
218.92
1.3
5.00



CP-168

45
4.50
5.2
120.70

5.40
7.6
22.95
1.3
218.92
1.3
5.00



CP-169

45
4.50
5.2
112.75

3.60
7.4
32.10
1.3
216.92
1.3
5.00



CP-170

45
4.50
5.2
112.55

4.05
7.5
32.50
1.3
216.58
1.3
5.00



CP-171

45
4.50
5.2
112.55

4.50
7.5
32.50
1.3
216.58
1.3
5.00



CP-172

45
4.50
5.2
112.40

4.95
7.6
32.85
1.3
216.25
1.3
5.00



CP-173

45
4.50
5.2
112.40

5.40
7.6
32.85
1.3
216.25
1.3
5.00



CP-174

45
4.50
5.2
107.30

4.50
7.5
38.70
1.3
215.00
1.3
5.00



CP-175

45
4.50
5.2
172.50

3.60
7.4
4.90
1.3
162.67
1.3
5.00



CP-176

45
4.50
5.2
172.40

4.05
7.5
5.00
1.3
162.67
1.3
5.00



CP-177

45
4.50
5.2
172.40

4.50
7.5
5.00
1.3
162.67
1.3
5.00



CP-178

45
4.50
5.2
172.40

4.95
7.6
5.05
1.3
162.58
1.3
5.00



CP-179

45
4.50
5.2
172.40

5.40
7.6
5.05
1.3
162.58
1.3
5.00



CP-180

45
4.50
5.2
166.30

3.60
7.4
11.05
1.3
161.42
1.3
5.00





















TABLE 9








(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)

























Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


Conductive-layer

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


coating solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-181
W-doped
45
4.50
5.2
166.20
W-doped
4.05
7.5
12.00
1.3
161.33
1.3
5.00
None


CP-182
tin
45
4.50
5.2
166.20
tin oxide
4.50
7.5
12.00
1.3
161.33
1.3
5.00



CP-183
oxide-
45
4.50
5.2
166.10
particles
4.95
7.6
12.15
1.3
161.25
1.3
5.00



CP-184
coated
45
4.50
5.2
166.10
(average
5.40
7.6
12.15
1.3
161.25
1.3
5.00



CP-185
titanium
45
4.50
5.2
151.80
particle
3.60
7.4
28.15
1.3
158.42
1.3
5.00



CP-186
oxide
45
4.50
5.2
151.60
diameter:
4.05
7.5
28.45
1.3
158.25
1.3
5.00



CP-187
particles
45
4.50
5.2
151.60
20 nm
4.50
7.5
28.45
1.3
158.25
1.3
5.00



CP-188
(average
45
4.50
5.2
151.45

4.95
7.6
28.80
1.3
157.92
1.3
5.00



CP-189
particle
45
4.50
5.2
151.45

5.40
7.6
28.80
1.3
157.92
1.3
5.00



CP-190
diameter:
45
4.50
5.2
141.10

3.60
7.4
40.20
1.3
156.17
1.3
5.00



CP-191
230 nm)
45
4.50
5.2
140.85

4.05
7.5
40.65
1.3
155.83
1.3
5.00



CP-192

45
4.50
5.2
140.85

4.50
7.5
40.65
1.3
155.83
1.3
5.00



CP-193

45
4.50
5.2
140.55

4.95
7.6
41.10
1.3
155.58
1.3
5.00



CP-194

45
4.50
5.2
140.55

5.40
7.6
41.10
1.3
155.58
1.3
5.00



CP-195

45
4.50
5.2
134.30

3.60
7.4
47.80
1.3
154.83
1.3
5.00



CP-196

45
4.50
5.2
134.05

4.05
7.5
48.35
1.3
154.33
1.3
5.00



CP-197

45
4.50
5.2
134.05

4.50
7.5
48.35
1.3
154.33
1.3
5.00



CP-198

45
4.50
5.2
133.70

4.95
7.6
48.90
1.3
154.00
1.3
5.00



CP-199

45
4.50
5.2
133.70

5.40
7.6
48.90
1.3
154.00
1.3
5.00



CP-200

45
4.50
5.2
198.40

4.50
7.5
5.75
1.3
118.08
1.3
5.00



CP-201

45
4.50
5.2
191.15

3.60
7.4
13.60
1.3
117.08
1.3
5.00



CP-202

45
4.50
5.2
191.00

4.05
7.5
13.80
1.3
117.00
1.3
5.00



CP-203

45
4.50
5.2
191.00

4.50
7.5
13.80
1.3
117.00
1.3
5.00



CP-204

45
4.50
5.2
190.90

4.95
7.6
13.95
1.3
116.92
1.3
5.00



CP-205

45
4.50
5.2
190.90

5.40
7.6
13.95
1.3
116.92
1.3
5.00



CP-206

45
4.50
5.2
174.10

3.60
7.4
32.20
1.3
114.50
1.3
5.00



CP-207

45
4.50
5.2
173.76

4.05
7.5
32.60
1.3
114.50
1.3
5.00



CP-208

45
4.50
5.2
173.76

4.50
7.5
32.60
1.3
114.50
1.3
5.00



CP-209

45
4.50
5.2
173.50

4.95
7.6
33.00
1.3
114.17
1.3
5.00



CP-210

45
4.50
5.2
173.50

5.40
7.6
33.00
1.3
114.17
1.3
5.00



CP-211

45
4.50
5.2
161.45

3.60
7.4
45.95
1.3
112.67
1.3
5.00



CP-212

45
4.50
5.2
161.05

4.05
7.5
46.50
1.3
112.42
1.3
5.00



CP-213

45
4.50
5.2
161.05

4.50
7.5
46.50
1.3
112.42
1.3
5.00



CP-214

45
4.50
5.2
160.70

4.95
7.6
47.00
1.3
112.17
1.3
5.00



CP-215

45
4.30
5.2
160.70

5.40
7.6
47.00
1.3
112.17
1.3
5.00



CP-216

45
4.50
5.2
153.10

4.50
7.5
55.20
1.3
111.17
1.3
5.00



CP-217

45
4.50
5.2
208.90

3.60
7.4
6.00
1.3
100.17
1.3
5.00



CP-218

45
4.50
5.2
208.85

4.05
7.5
6.07
1.3
100.13
1.3
5.00



CP-219

45
4.50
5.2
208.85

4.50
7.5
6.07
1.3
100.13
1.3
5.00



CP-220

45
4.50
5.2
208.85

4.95
7.6
6.10
1.3
100.08
1.3
5.00





















TABLE 10








(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)

























Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


Conductive-layer

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


coating solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-221
W-doped
45
4.50
5.2
208.85
W-doped
5.40
7.6
6.10
1.3
100.08
1.3
5.00
None


CP-222
tin
45
4.50
5.2
201.00
tin oxide
4.50
7.5
14.50
1.3
99.17
1.3
5.00



CP-223
oxide-
45
4.50
5.2
183.00
particles
3.60
7.4
33.85
1.3
96.92
1.3
5.00



CP-224
coated
45
4.50
5.2
182.65
(average
4.05
7.5
34.30
1.3
96.75
1.3
5.00



CP-225
titanium
45
4.50
5.2
182.65
particle
4.50
7.5
34.30
1.3
96.75
1.3
5.00



CP-226
oxide
45
4.50
5.2
182.35
diameter:
4.95
7.6
34.70
1.3
96.58
1.3
5.00



CP-227
particles
45
4.50
5.2
182.35
20 nm
5.40
7.6
34.70
1.3
96.58
1.3
5.00



CP-228
(average
45
4.50
5.2
169.20

4.50
7.5
48.80
1.3
95.00
1.3
5.00



CP-229
particle
45
4.50
5.2
161.10

3.60
7.4
57.35
1.3
94.25
1.3
5.00



CP-230
diameter:
45
4.50
5.2
160.67

4.05
7.5
57.95
1.3
93.97
1.3
5.00



CP-231
230 nm)
45
4.50
5.2
160.67

4.50
7.5
57.95
1.3
93.97
1.3
5.00



CP-232

45
4.50
5.2
160.25

4.95
7.6
58.55
1.3
93.67
1.3
5.00



CP-233

45
4.50
5.2
160.25

5.40
7.6
58.55
1.3
93.67
1.3
5.00





















TABLE 11








(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)

























Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


Conductive-layer

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


coating solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]


























CP-234
W-doped
45
4.50
5.2
136.40
W-doped
3.60
7.4
9.72
1.3
156.47
1.3
40.00
Uncoated
4.2
30.00


CP-235
tin
45
4.50
5.2
136.40
tin oxide
4.05
7.5
9.85
1.3
156.25
1.3
40.00
titanium
4.2
30.00


CP-236
oxide-
45
4.50
5.2
136.40
particles
4.50
7.5
9.85
1.3
156.25
1.3
40.00
oxide
4.2
30.00


CP-237
coated
45
4.50
5.2
136.30
(average
4.95
7.6
9.98
1.3
156.20
1.3
40.00
particles
4.2
30.00


CP-238
titanium
45
4.50
5.2
136.30
particle
5.40
7.6
9.98
1.3
156.20
1.3
40.00
(average
4.2
30.00


CP-239
oxide
45
4.50
5.2
125.00
diameter:
3.60
7.4
23.15
1.3
153.08
1.3
40.00
particles
4.2
30.00


CP-240
particles
45
4.50
5.2
124.90
20 nm
4.05
7.5
23.44
1.3
152.77
1.3
40.00
diameter
4.2
30.00


CP-241
(average
45
4.50
5.2
124.90

4.50
7.5
23.44
1.3
152.77
1.3
40.00
210 nm)
4.2
30.00


CP-242
particle
45
4.50
5.2
124.70

4.95
7.6
23.70
1.3
152.67
1.3
40.00

4.2
30.00


CP-243
diameter:
45
4.50
5.2
124.70

5.40
7.6
23.70
1.3
152.67
1.3
40.00

4.2
30.00


CP-244
230 nm)
45
4.50
5.2
116.50

3.60
7.4
33.15
1.3
150.58
1.3
40.00

4.2
30.00


CP-245

45
4.50
5.2
116.30

4.05
7.5
33.55
1.3
150.25
1.3
40.00

4.2
30.00


CP-246

45
4.50
5.2
116.30

4.50
7.5
33.55
1.3
150.25
1.3
40.00

4.2
30.00


CP-247

45
4.50
5.2
116.10

4.95
7.6
33.95
1.3
149.92
1.3
40.00

4.2
30.00


CP-248

45
4.50
5.2
116.10

5.40
7.6
33.95
1.3
149.92
1.3
40.00

4.2
30.00


CP-249

45
4.50
5.2
171.80

3.60
7.4
12.25
1.3
93.25
1.3
40.00

4.2
30.00


CP-250

45
4.50
5.2
171.70

4.05
7.5
12.40
1.3
93.17
1.3
40.00

4.2
30.00


CP-251

45
4.50
5.2
171.70

4.50
7.5
12.40
1.3
93.17
1.3
40.00

4.2
30.00


CP-252

45
4.50
5.2
171.65

4.95
7.6
12.55
1.3
93.00
1.3
40.00

4.2
30.00


CP-253

45
4.50
5.2
171.65

5.40
7.6
12.55
1.3
93.00
1.3
40.00

4.2
30.00


CP-254

45
4.50
5.2
156.85

3.60
7.4
29.05
1.3
90.17
1.3
40.00

4.2
30.00


CP-255

45
4.50
5.2
156.65

4.05
7.5
29.40
1.3
89.92
1.3
40.00

4.2
30.00


CP-256

45
4.50
5.2
156.65

4.50
7.5
29.40
1.3
89.92
1.3
40.00

4.2
30.00


CP-257

45
4.50
5.2
156.45

4.95
7.6
29.75
1.3
89.67
1.3
40.00

4.2
30.00


CP-258

45
4.50
5.2
156.45

5.40
7.6
29.75
1.3
89.67
1.3
40.00

4.2
30.00


CP-259

45
4.50
5.2
145.80

3.60
7.4
41.40
1.3
87.83
1.3
40.00

4.2
30.00


CP-260

45
4.50
5.2
145.50

4.05
7.5
42.00
1.3
87.50
1.3
40.00

4.2
30.00


CP-261

45
4.50
5.2
145.50

4.50
7.5
42.00
1.3
87.50
1.3
40.00

4.2
30.00


CP-262

45
4.50
5.2
145.20

4.95
7.6
42.45
1.3
87.25
1.3
40.00

4.2
30.00


CP-263

45
4.50
5.2
145.20

5.40
7.6
42.45
1.3
87.25
1.3
40.00

4.2
30.00


CP-264

45
4.50
5.2
197.50

3.60
7.4
14.10
1.3
47.33
1.3
40.00

4.2
30.00


CP-265

45
4.50
5.2
197.35

4.05
7.5
14.25
1.3
47.33
1.3
40.00

4.2
30.00


CP-266

45
4.50
5.2
197.35

4.50
7.5
14.25
1.3
47.33
1.3
40.00

4.2
30.00


CP-267

45
4.50
5.2
197.20

4.95
7.6
14.45
1.3
47.25
1.3
40.00

4.2
30.00


CP-268

45
4.50
5.2
197.20

5.40
7.6
14.45
1.3
47.25
1.3
40.00

4.2
30.00


CP-269

45
4.50
5.2
179.80

3.60
7.4
33.30
1.3
44.83
1.3
40.00

4.2
30.00


CP-270

45
4.50
5.2
179.55

4.05
7.5
33.70
1.3
44.58
1.3
40.00

4.2
30.00





















TABLE 12








(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)

























Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


Conductive-layer

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


coating solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]


























CP-271
W-doped
45
4.50
5.2
179.55
W-doped
4.50
7.5
33.70
1.3
44.58
1.3
40.00
Uncoated
4.2
30.00


CP-272
tin
45
4.50
5.2
179.30
tin oxide
4.95
7.6
34.10
1.3
44.33
1.3
40.00
titanium
4.2
30.00


CP-273
oxide-
45
4.50
5.2
179.30
particles
5.40
7.6
34.10
1.3
44.33
1.3
40.00
oxide
4.2
30.00


CP-274
coated
45
4.50
5.2
166.75
(average
3.60
7.4
47.50
1.3
42.92
1.3
40.00
particles
4.2
30.00


CP-275
titanium
45
4.50
5.2
166.40
particle
4.05
7.5
48.00
1.3
42.67
1.3
40.00
(average
4.2
30.00


CP-276
oxide
45
4.50
5.2
166.40
diameter:
4.50
7.5
48.00
1.3
42.67
1.3
40.00
particles
4.2
30.00


CP-277
particles
45
4.50
5.2
166.05
20 nm
4.95
7.6
48.55
1.3
42.33
1.3
40.00
diameter
4.2
30.00


CP-278
(average
45
4.50
5.2
166.05

5.40
7.6
48.55
1.3
42.33
1.3
40.00
210 nm)
4.2
30.00


CP-279
particle
45
4.50
5.2
156.65

4.50
7.5
29.40
1.3
89.92
1.3
40.00

4.2
30.00


CP-280
diameter:
45
4.50
5.2
160.55

4.50
7.5
25.50
1.3
89.92
1.3
40.00

4.2
30.00



230 nm)





















TABLE 13








(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)

























Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


Conductive-layer

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


coating solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]





















CP-C42
W-doped tin
45
4.50
5.2
115.85
None
1.3
265.25
1.3
5.00
None


CP-C43
oxide-coated
45
4.50
5.2
176.85

1.3
163.58
1.3
5.00



CP-C44
titanium
45
4.50
5.2
214.46

1.3
100.90
1.3
5.00






















CP-C45
oxide
45
4.50
5.2
114.50
W-doped
4.50
7.5
1.65
5.00
264.75
1.3
5.00



CP-C46
particles
45
4.50
5.2
174.62
tin oxide
4.50
7.5
2.51
1.3
163.12
1.3
5.00



CP-C47
(average
45
4.50
5.2
211.63
particles
4.50
7.5
3.05
1.3
100.53
1.3
5.00



CP-C48
particle
45
4.50
5.2
85.50
(average
4.50
7.5
37.00
1.3
254.17
1.3
5.00



CP-C49
diameter:
45
4.50
5.2
127.80
particle
4.50
7.5
55.30
1.3
153.17
1.3
5.00



CP-C50
230 nm)
45
4.50
5.2
153.01
diameter:
4.50
7.5
66.21
1.3
92.97
1.3
5.00


















CP-C51
None
20 nm
4.50
7.5
141.25
1.3
222.92
1.3
5.00



CP-C52


4.50
7.5
199.36
1.3
126.07
1.3
5.00



CP-C53


4.50
7.5
231.05
1.3
73.25
1.3
5.00






















CP-C54
W-doped tin
45
4.50
5.2
85.25

4.50
7.5
2.43
1.3
313.87
1.3
5.00



CP-C55
oxide-coated
45
4.50
5.2
81.50

4.50
7.5
5.88
1.3
312.70
1.3
5.00



CP-C56
titanium
45
4.50
5.2
75.05

4.50
7.5
14.07
1.3
309.80
1.3
5.00



CP-C57
oxide
45
4.50
5.2
70.20

4.50
7.5
20.25
1.3
307.58
1.3
5.00



CP-C58
particles
45
4.50
5.2
67.10

4.50
7.5
24.19
1.3
306.18
1.3
5.00



CP-C59
(average
45
4.50
5.2
218.08

4.50
7.5
6.30
1.3
84.37
1.3
5.00



CP-C60
particle
45
4.50
5.2
209.80

4.50
7.5
15.12
1.3
83.47
1.3
5.00



CP-C61
diameter:
45
4.50
5.2
190.47

4.50
7.5
35.72
1.3
81.35
1.3
5.00



CP-C62
230 nm)
45
4.50
5.2
176.27

4.50
7.5
50.85
1.3
79.80
1.3
5.00



CP-C63

45
4.50
5.2
167.35

4.50
7.5
60.35
1.3
78.83
1.3
5.00





















TABLE 14







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)























layer

Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


coating

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-C64
Oxygen-
45

5.1
150.26
W-doped tin
4.50
7.5
28.73
1.3
160.02
1.3
5.00
None



deficient tin




oxide











oxide-coated




particles











titanium oxide




(average











particles




particle











(average




diameter:











particle




20 nm)











diameter:
















230 nm)















CP-C65
Oxygen-
45

5.1
150.26

4.50
7.5
28.73
1.3
160.02
1.3
5.00




deficient tin
















oxide-coated
















barium sulfate
















particles
















(average
















particle
















diameter:
















230 nm)















CP-C66
Sb-doped tin
45
4.50
5.2
151.61

4.50
7.5
28.43
1.3
158.27
1.3
5.00




oxide-coated
















titanium oxide
















particles
















(average
















particle
















diameter:
















230 nm)















CP-C67
W-doped tin
45
4.50
5.2
153.50
Oxygen-

6.6
25.32
1.3
160.30
1.3
5.00




oxide-coated




deficient











titanium oxide




tin oxide











particles




particles











(average




(average











particle




particle











diameter:




diameter:











230 nm)




20 nm)










CP-C68
W-doped tin
45
4.50
5.2
152.45
Indium tin
4.50
7.1
27.05
1.3
159.17
1.3
5.00




oxide-coated




oxide











titanium oxide




particles











particles




(average











(average




particle











particle




diameter:











diameter:




20 nm)











230 nm)















CP-C69
W-doped tin
45
4.50
5.2
153.50
Sb-doped
4.50
6.6
25.32
1.3
160.30
1.3
5.00




oxide-coated




tin oxide











titanium oxide




particles











particles




(average











(average




particle











particle




diameter:











diameter:




20 nm)











230 nm)















CP-C70
F-doped tin
45
4.50
5.0
148.90
W-doped tin
4.50
7.5
29.03
1.3
161.78
1.3
5.00




oxide-coated




oxide











titanium oxide




particles











particles




(average











(average




particle











particle




diameter:











diameter:




20 nm)











230 nm)















CP-C71
W-doped tin
45
4.50
5.2
151.61

4.50
7.5
28.43
1.3
158.27
1.3
5.00




oxide-coated
















barium sulfate
















particles
















(average
















particle
















diameter:
















230 nm)





















TABLE 15







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)























layer

Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


coating

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-281
F-doped
45
4.50
5.0
110.70
F-doped
3.60
6.7
2.97
1.3
268.88
1.3
5.00
None


CP-282
tin
45
4.50
5.0
110.70
tin oxide
4.05
6.7
2.97
1.3
268.88
1.3
5.00



CP-283
oxide-
45
4.50
5.0
110.70
particles
4.50
6.6
2.93
1.3
268.95
1.3
5.00



CP-284
coated
45
4.50
5.0
110.70
(average
4.95
6.6
2.93
1.3
268.95
1.3
5.00



CP-285
titanium
45
4.50
5.0
110.70
particle
5.40
6.6
2.93
1.3
268.95
1.3
5.00



CP-286
oxide
45
4.50
5.0
107.15
diameter:
4.50
6.6
7.08
1.3
267.95
1.3
5.00



CP-287
particles
45
4.50
5.0
98.70
20 nm)
3.60
6.7
17.20
1.3
265.17
1.3
5.00



CP-288
(average
45
4.50
5.0
98.70

4.05
6.7
17.20
1.3
265.17
1.3
5.00



CP-289
particle
45
4.50
5.0
98.70

4.50
6.6
16.95
1.3
265.58
1.3
5.00



CP-290
diameter:
45
4.50
5.0
98.70

4.95
6.6
16.95
1.3
265.58
1.3
5.00



CP-291
230 nm)
45
4.50
5.0
98.70

5.40
6.6
16.95
1.3
265.58
1.3
5.00



CP-292

45
4.50
5.0
92.40

4.50
6.6
24.40
1.3
263.67
1.3
5.00



CP-293

45
4.50
5.0
88.20

3.60
6.7
29.55
1.3
262.08
1.3
5.00



CP-294

45
4.50
5.0
88.20

4.05
6.7
29.55
1.3
262.08
1.3
5.00



CP-295

45
4.50
5.0
88.30

4.50
6.6
29.15
1.3
262.58
1.3
5.00



CP-296

45
4.50
5.0
88.30

4.95
6.6
29.15
1.3
262.58
1.3
5.00



CP-297

45
4.50
5.0
88.30

5.40
6.6
29.15
1.3
262.58
1.3
5.00



CP-298

45
4.50
5.0
134.20

4.50
6.6
3.55
1.3
228.75
1.3
5.00



CP-299

45
4.50
5.0
129.70

3.60
6.7
8.70
1.3
227.67
1.3
5.00



CP-300

45
4.50
5.0
129.70

4.05
6.7
8.70
1.3
227.67
1.3
5.00



CP-301

45
4.50
5.0
129.73

4.50
6.6
8.57
1.3
227.83
1.3
5.00



CP-302

45
4.50
5.0
129.73

4.95
6.6
8.57
1.3
227.83
1.3
5.00



CP-303

45
4.50
5.0
129.73

5.40
6.6
8.57
1.3
227.83
1.3
5.00



CP-304

45
4.50
5.0
119.20

3.60
6.7
20.80
1.3
225.00
1.3
5.00



CP-305

45
4.50
5.0
119.20

4.05
6.7
20.80
1.3
225.00
1.3
5.00



CP-306

45
4.50
5.0
119.30

4.50
6.6
20.50
1.3
225.33
1.3
5.00



CP-307

45
4.50
5.0
119.30

4.95
6.6
20.50
1.3
225.33
1.3
5.00



CP-308

45
4.50
5.0
119.30

5.40
6.6
20.50
1.3
225.33
1.3
5.00



CP-309

45
4.50
5.0
111.40

3.60
6.7
29.85
1.3
222.92
1.3
5.00



CP-310

45
4.50
5.0
111.40

4.05
6.7
29.85
1.3
222.92
1.3
5.00



CP-311

45
4.50
5.0
111.45

4.50
6.6
29.45
1.3
223.50
1.3
5.00



CP-312

45
4.50
5.0
111.45

4.95
6.6
29.45
1.3
223.50
1.3
5.00



CP-313

45
4.50
5.0
111.45

5.40
6.6
29.45
1.3
223.50
1.3
5.00



CP-314

45
4.50
5.0
106.50

4.50
6.6
35.15
1.3
222.25
1.3
5.00



CP-315

45
4.50
5.0
170.20

3.60
6.7
4.57
1.3
167.05
1.3
5.00



CP-316

45
4.50
5.0
170.20

4.05
6.7
4.57
1.3
167.05
1.3
5.00



CP-317

45
4.50
5.0
170.20

4.50
6.6
4.50
1.3
167.17
1.3
5.00



CP-318

45
4.50
5.0
170.20

4.95
6.6
4.50
1.3
167.17
1.3
5.00



CP-319

45
4.50
5.0
170.20

5.40
6.6
4.50
1.3
167.17
1.3
5.00



CP-320

45
4.50
5.0
164.30

3.60
6.7
11.05
1.3
166.08
1.3
5.00





















TABLE 16







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)























layer

Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


coating

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-321
F-doped
45
4.50
5.0
164.30
F-doped
4.05
6.7
11.05
1.3
166.08
1.3
5.00
None


CP-322
tin
45
4.50
5.0
164.45
tin oxide
4.50
6.7
10.86
1.3
166.15
1.3
5.00



CP-323
oxide-
45
4.50
5.0
164.45
particles
4.95
6.6
10.86
1.3
166.15
1.3
5.00



CP-324
coated
45
4.50
5.0
164.45
(average
5.40
6.6
10.86
1.3
166.15
1.3
5.00



CP-325
titanium
45
4.50
5.0
150.60
particle
3.60
6.7
26.25
1.3
163.58
1.3
5.00



CP-326
oxide
45
4.50
5.0
150.60
diameter:
4.05
6.7
26.25
1.3
163.58
1.3
5.00



CP-327
particles
45
4.50
5.0
150.80
20 nm)
4.50
6.6
25.90
1.3
163.83
1.3
5.00



CP-328
(average
45
4.50
5.0
150.80

4.95
6.6
25.90
1.3
163.83
1.3
5.00



CP-329
particle
45
4.50
5.0
150.80

5.40
6.6
25.90
1.3
163.83
1.3
5.00



CP-330
diameter:
45
4.50
5.0
140.30

3.60
6.7
37.60
1.3
161.83
1.3
5.00



CP-331
230 nm)
45
4.50
5.0
140.30

4.05
6.7
37.60
1.3
161.83
1.3
5.00



CP-332

45
4.50
5.0
140.55

4.50
6.6
37.15
1.3
162.17
1.3
5.00



CP-333

45
4.50
5.0
140.55

4.95
6.6
37.15
1.3
162.17
1.3
5.00



CP-334

45
4.50
5.0
140.55

5.40
6.6
37.15
1.3
162.17
1.3
5.00



CP-335

45
4.50
5.0
133.80

3.60
6.7
44.82
1.3
160.63
1.3
5.00



CP-336

45
4.50
5.0
133.80

4.05
6.7
44.82
1.3
160.63
1.3
5.00



CP-337

45
4.50
5.0
134.10

4.50
6.6
44.25
1.3
161.08
1.3
5.00



CP-338

45
4.50
5.0
134.10

4.95
6.6
44.25
1.3
161.08
1.3
5.00



CP-339

45
4.50
5.0
134.10

5.40
6.6
44.25
1.3
161.08
1.3
5.00



CP-340

45
4.50
5.0
196.60

4.50
6.6
5.19
1.3
122.02
1.3
5.00



CP-341

45
4.50
5.0
189.70

3.60
6.7
12.74
1.3
120.93
1.3
5.00



CP-342

45
4.50
5.0
189.70

4.05
6.7
12.74
1.3
120.93
1.3
5.00



CP-343

45
4.50
5.0
189.75

4.50
6.6
12.55
1.3
121.17
1.3
5.00



CP-344

45
4.50
5.0
189.75

4.95
6.6
12.55
1.3
121.17
1.3
5.00



CP-345

45
4.50
5.0
189.75

5.40
6.6
12.55
1.3
121.17
1.3
5.00



CP-346

45
4.50
5.0
173.40

3.60
6.7
30.20
1.3
119.00
1.3
5.00



CP-347

45
4.50
5.0
173.40

4.05
6.7
30.20
1.3
119.00
1.3
5.00



CP-348

45
4.50
5.0
173.70

4.50
6.6
29.80
1.3
119.17
1.3
5.00



CP-349

45
4.50
5.0
173.70

4.95
6.6
29.80
1.3
119.17
1.3
5.00



CP-350

45
4.50
5.0
173.70

5.40
6.6
29.80
1.3
119.17
1.3
5.00



CP-351

45
4.50
5.0
161.30

3.60
6.7
43.25
1.3
117.42
1.3
5.00



CP-352

45
4.50
5.0
161.30

4.05
6.7
43.25
1.3
117.42
1.3
5.00



CP-353

45
4.50
5.0
161.70

4.50
6.6
42.70
1.3
117.67
1.3
5.00



CP-354

45
4.50
5.0
161.70

4.95
6.6
42.70
1.3
117.67
1.3
5.00



CP-355

45
4.50
5.0
161.70

5.40
6.6
42.70
1.3
117.67
1.3
5.00



CP-356

45
4.50
5.0
154.10

4.50
6.6
50.85
1.3
116.75
1.3
5.00



CP-357

45
4.50
5.0
204.30

3.60
6.7
5.56
1.3
103.57
1.3
5.00



CP-358

45
4.50
5.0
207.30

4.05
6.7
5.56
1.3
103.57
1.3
5.00



CP-359

45
4.50
5.0
207.35

4.50
6.6
5.48
1.3
103.62
1.3
5.00



CP-360

45
4.50
5.0
207.35

4.95
6.6
5.48
1.3
103.62
1.3
5.00


















TABLE 17







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
















layer

Coating
Doping



Doping




coating

ratio
ratio

Amount

ratio

Amount


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]





CP-361
F-doped
45
4.50
5.0
207.35
F-doped
5.40
6.6
5.48


CP-362
tin
45
4.50
5.0
200.07
tin oxide
4.50
6.6
13.21


CP-363
oxide-
45
4.50
5.0
182.62
particles
3.60
6.7
31.82


CP-364
coated
45
4.50
5.0
182.62
(average
4.05
6.7
31.82


CP-365
titanium
45
4.50
5.0
182.95
particle
4.50
6.6
31.40


CP-366
oxide
45
4.50
5.0
182.95
diameter:
4.95
6.6
31.40


CP-367
particles
45
4.50
5.0
182.95
20 nm)
5.40
6.6
31.40


CP-368
(average
45
4.50
5.0
170.15

4.50
6.6
44.95


CP-369
particle
45
4.50
5.0
161.65

3.60
6.7
54.18


CP-370
diameter:
45
4.50
5.0
161.65

4.05
6.7
54.18


CP-371
230 nm)
45
4.50
5.0
162.10

4.50
6.6
53.50


CP-372

45
4.50
5.0
162.10

4.95
6.6
53.50


CP-373

45
4.50
5.0
162.10

5.40
6.6
53.50














(3) Binding material (phenol resin)













Conductive-

Amount [part(s)]
(4) Silicone resin
(5) Particles except


layer

(resin solid content
particles
(1) to (4)














coating

thereof is 60% by

Amount


Amount


solution
Density
mass of the following)
Density
[part(s)]
Kind
Density
[part(s)]















CP-361
1.3
103.62
1.3
5.00
None


CP-362
1.3
102.87
1.3
5.00



CP-363
1.3
100.93
1.3
5.00



CP-364
1.3
100.93
1.3
5.00



CP-365
1.3
101.08
1.3
5.00



CP-366
1.3
101.08
1.3
5.00



CP-367
1.3
101.08
1.3
5.00



CP-368
1.3
99.83
1.3
5.00



CP-369
1.3
98.62
1.3
5.00



CP-370
1.3
98.62
1.3
5.00



CP-371
1.3
99.00
1.3
5.00



CP-372
1.3
99.00
1.3
5.00



CP-373
1.3
99.00
1.3
5.00





















TABLE 18







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)























layer

Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


coating

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]


























CP-374
F-doped
45
4.50
5.0
134.00
F-doped
3.60
6.7
9.00
1.3
161.67
1.3
40.00
Uncoated
4.2
30.00


CP-375
tin
45
4.50
5.0
134.00
tin oxide
4.05
6.7
9.00
1.3
161.67
1.3
40.00
titanium
4.2
30.00


CP-376
oxide-
45
4.50
5.0
134.10
particles
4.50
6.6
8.85
1.3
161.75
1.3
40.00
oxide
4.2
30.00


CP-377
coated
45
4.50
5.0
134.10
(average
4.95
6.6
8.85
1.3
161.75
1.3
40.00
particles
4.2
30.00


CP-378
titanium
45
4.50
5.0
134.10
particle
5.40
6.6
8.85
1.3
161.75
1.3
40.00
(average
4.2
30.00


CP-379
oxide
45
4.50
5.0
123.15
diameter:
3.60
6.7
21.45
1.3
159.00
1.3
40.00
particle
4.2
30.00


CP-380
particles
45
4.50
5.0
123.15
20 nm)
4.05
6.7
21.45
1.3
159.00
1.3
40.00
diameter:
4.2
30.00


CP-381
(average
45
4.50
5.0
123.25

4.50
6.6
21.15
1.3
159.33
1.3
40.00
210 nm)
4.2
30.00


CP-382
particle
45
4.50
5.0
123.25

4.95
6.6
21.15
1.3
159.33
1.3
40.00

4.2
30.00


CP-383
diameter:
45
4.50
5.0
123.25

5.40
6.6
21.15
1.3
159.33
1.3
40.00

4.2
30.00


CP-384
230 nm)
45
4.50
5.0
115.00

3.60
6.7
30.85
1.3
156.92
1.3
40.00

4.2
30.00


CP-385

45
4.50
5.0
115.00

4.05
6.7
30.85
1.3
156.92
1.3
40.00

4.2
30.00


CP-386

45
4.50
5.0
115.20

4.50
6.6
30.45
1.3
157.25
1.3
40.00

4.2
30.00


CP-387

45
4.50
5.0
115.20

4.95
6.6
30.45
1.3
157.25
1.3
40.00

4.2
30.00


CP-388

45
4.50
5.0
115.20

5.40
6.6
30.45
1.3
157.25
1.3
40.00

4.2
30.00


CP-389

45
4.50
5.0
169.80

3.60
6.7
11.40
1.3
98.00
1.3
40.00

4.2
30.00


CP-390

45
4.50
5.0
169.80

4.05
6.7
11.40
1.3
98.00
1.3
40.00

4.2
30.00


CP-391

45
4.50
5.0
169.85

4.50
6.6
11.25
1.3
98.17
1.3
40.00

4.2
30.00


CP-392

45
4.50
5.0
169.85

4.95
6.6
11.25
1.3
98.17
1.3
40.00

4.2
30.00


CP-393

45
4.50
5.0
169.85

5.40
6.6
11.25
1.3
98.17
1.3
40.00

4.2
30.00


CP-394

45
4.50
5.0
155.60

3.60
6.7
27.10
1.3
95.50
1.3
40.00

4.2
30.00


CP-395

45
4.50
5.0
155.60

4.05
6.7
27.10
1.3
95.50
1.3
40.00

4.2
30.00


CP-396

45
4.50
5.0
155.75

4.50
6.6
26.75
1.3
95.83
1.3
40.00

4.2
30.00


CP-397

45
4.50
5.0
155.75

4.95
6.6
26.75
1.3
95.83
1.3
40.00

4.2
30.00


CP-398

45
4.50
5.0
155.75

5.40
6.6
26.75
1.3
95.83
1.3
40.00

4.2
30.00


CP-399

45
4.50
5.0
144.95

3.60
6.7
38.85
1.3
93.67
1.3
40.00

4.2
30.00


CP-400

45
4.50
5.0
144.95

4.05
6.7
38.85
1.3
93.67
1.3
40.00

4.2
30.00


CP-401

45
4.50
5.0
145.20

4.50
6.6
38.85
1.3
94.08
1.3
40.00

4.2
30.00


CP-402

45
4.50
5.0
145.20

4.95
6.6
38.35
1.3
94.08
1.3
40.00

4.2
30.00


CP-403

45
4.50
5.0
145.20

5.40
6.6
38.35
1.3
94.08
1.3
40.00

4.2
30.00


CP-404

45
4.50
5.0
195.90

3.60
6.7
13.15
1.3
51.58
1.3
40.00

4.2
30.00


















TABLE 19







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
















layer

Coating
Doping



Doping




coating

ratio
ratio

Amount

ratio

Amount


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]





CP-405
F-doped
45
4.50
5.0
195.90
F-doped
4.05
6.7
13.15


CP-406
tin
45
4.50
5.0
196.10
tin oxide
4.50
6.6
12.95


CP-407
oxide-
45
4.50
5.0
196.10
particles
4.95
6.6
12.95


CP-408
coated
45
4.50
5.0
196.10
(average
5.40
6.6
12.95


CP-409
titanium
45
4.50
5.0
179.15
particle
3.60
6.7
31.20


CP-410
oxide
45
4.50
5.0
179.15
diameter:
4.05
6.7
31.20


CP-411
particles
45
4.50
5.0
179.45
20 nm)
4.50
6.6
30.80


CP-412
(average
45
4.50
5.0
179.45

4.95
6.6
30.80


CP-413
particle
45
4.50
5.0
179.45

5.40
6.6
30.80


CP-414
diameter:
45
4.50
5.0
166.60

3.60
6.7
44.70


CP-415
230 nm)
45
4.50
5.0
166.60

4.05
6.7
44.70


CP-416

45
4.50
5.0
167.05

4.50
6.6
44.10


CP-417

45
4.50
5.0
167.05

4.95
6.6
44.10


CP-418

45
4.50
5.0
167.05

5.40
6.6
44.10


CP-419

45
4.50
5.0
155.75

4.50
6.6
26.75


CP-420

45
4.50
5.0
159.00

4.50
6.6
23.20














(3) Binding material





(phenol resin)













Conductive-

Amount [part(s)]
(4) Silicone resin
(5) Particles except


layer

(resin solid content
particles
(1) to (4)














coating

thereof is 60% by mass

Amount


Amount


solution
Density
of the following)
Density
[part(s)]
Kind
Density
[part(s)]





CP-405
1.3
51.58
1.3
40.00
Uncoated
4.2
30.00


CP-406
1.3
51.58
1.3
40.00
titanium
4.2
30.00


CP-407
1.3
51.58
1.3
40.00
oxide
4.2
30.00


CP-408
1.3
51.58
1.3
40.00
particles
4.2
30.00


CP-409
1.3
49.42
1.3
40.00
(average
4.2
30.00


CP-410
1.3
49.42
1.3
40.00
particle
4.2
30.00


CP-411
1.3
49.58
1.3
40.00
diameter:
4.2
30.00


CP-412
1.3
49.58
1.3
40.00
210 nm)
4.2
30.00


CP-413
1.3
49.58
1.3
40.00

4.2
30.00


CP-414
1.3
47.83
1.3
40.00

4.2
30.00


CP-415
1.3
47.83
1.3
40.00

4.2
30.00


CP-416
1.3
48.08
1.3
40.00

4.2
30.00


CP-417
1.3
48.08
1.3
40.00

4.2
30.00


CP-418
1.3
48.08
1.3
40.00

4.2
30.00


CP-419
1.3
95.83
1.3
40.00

4.2
30.00


CP-420
1.3
96.33
1.3
40.00

4.2
30.00


















TABLE 20







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
















layer

Coating
Doping



Doping




coating

ratio
ratio

Amount

ratio

Amount


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
















CP-C76
F-doped tin
45
4.50
5.0
113.20
None


CP-C77
oxide-coated
45
4.50
5.0
174.30



CP-C78
titanium
45
4.50
5.0
212.50

















CP-C79
oxide
45
4.50
5.0
112.00
F-doped
4.50
6.6
1.48


CP-C80
particles
45
4.50
5.0
172.20
tin oxide
4.50
6.6
2.29


CP-C81
(average
45
4.50
5.0
209.90
particles
4.50
6.6
2.78


CP-C82
particle
45
4.50
5.0
84.60
(average
4.50
6.6
33.50


CP-C83
diameter:
45
4.50
5.0
128.20
particle
4.50
6.6
50.76


CP-C84
230 nm)
45
4.50
5.0
154.80
diameter:
4.50
6.6
61.30












CP-C85
None
20 nm)
4.50
6.6
132.30


CP-C86


4.50
6.6
191.85


CP-C87


4.50
6.6
225.67
















CP-C88
F-doped tin
45
4.50
5.0
82.10

4.50
6.6
2.17


CP-C89
oxide-coated
45
4.50
5.0
79.50

4.50
6.6
5.25


CP-C90
titanium
45
4.50
5.0
73.50

4.50
6.6
12.61


CP-C91
oxide
45
4.50
5.0
68.80

4.50
6.6
18.18


CP-C92
particles
45
4.50
5.0
65.90

4.50
6.6
21.75


CP-C93
(average
45
4.50
5.0
216.76

4.50
6.6
5.75


CP-C94
particle
45
4.50
5.0
209.10

4.50
6.6
13.81


CP-C95
diameter:
45
4.50
5.0
191.10

4.50
6.6
32.80


CP-C96
230 nm)
45
4.50
5.0
177.65

4.50
6.6
46.95


CP-C97

45
4.50
5.0
169.20

4.50
6.6
55.85















(4) Silicone resin
(5) Particles except


Conductive-
(3) Binding material (phenol resin)
particles
(1) to (4)














layer

Amount [part(s)] (resin

Amount


Amount


coating

solid content thereof is 60%

[part


[part


solution
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]















CP-C76
1.3
269.67
1.3
5.00
None


CP-C77
1.3
167.83
1.3
5.00



CP-C78
1.3
104.17
1.3
5.00



CP-C79
1.3
269.20
1.3
5.00



CP-C80
1.3
167.52
1.3
5.00



CP-C81
1.3
103.87
1.3
5.00



CP-C82
1.3
261.50
1.3
5.00



CP-C83
1.3
160.07
1.3
5.00



CP-C84
1.3
98.17
1.3
5.00



CP-C85
1.3
237.83
1.3
5.00



CP-C86
1.3
138.58
1.3
5.00



CP-C87
1.3
82.22
1.3
5.00



CP-C88
1.3
317.88
1.3
5.00



CP-C89
1.3
317.08
1.3
5.00



CP-C90
1.3
314.82
1.3
5.00



CP-C91
1.3
313.37
1.3
5.00



CP-C92
1.3
312.25
1.3
5.00



CP-C93
1.3
87.48
1.3
5.00



CP-C94
1.3
86.82
1.3
5.00



CP-C95
1.3
85.17
1.3
5.00



CP-C96
1.3
84.00
1.3
5.00



CP-C97
1.3
83.25
1.3
5.00





















TABLE 21







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)























layer

Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


coating

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-C98
Oxygen-
45

5.1
152.20
F-doped tin
4.50
6.6
25.60
1.3
162.00
1.3
5.00
None



deficient tin




oxide











oxide-coated




particles











titanium oxide




(average











particles




particle











(average




diameter:











particle




20 nm)











diameter:
















230 nm)















CP-C99
Oxygen-
45

5.1
152.20

4.50
6.6
25.60
1.3
162.00
1.3
5.00




deficient tin
















oxide-coated
















barium sulfate
















particles
















(average
















particle
















diameter:
















230 nm)















CP-C100
Sb-doped tin
45
4.50
5.2
153.50

4.50
6.6
25.35
1.3
160.25
1.3
5.00




oxide-coated
















titanium oxide
















particles
















(average
















particle
















diameter:
















230 nm)















CP-C101
F-doped tin
45
4.50
5.0
150.75
Oxygen-

6.6
25.90
1.3
163.92
1.3
5.00




oxide-coated




deficient











titanium oxide




tin oxide











particles




particles











(average




(average











particle




particle











diameter:




diameter:











230 nm)




20 nm)










CP-C102

45
4.50
5.0
149.72
Indium tin
4.50
7.1
27.63
1.3
162.50
1.3
5.00









oxide
















particles
















(average
















particle
















diameter:
















20 nm)










CP-C103

45
4.50
5.0
150.76
Sb-doped
4.50
6.6
25.87
1.3
163.95
1.3
5.00









tin oxide
















particles
















(average
















particle
















diameter:
















20 nm)










CP-C104
W-doped tin
45
4.50
5.2
153.50
F-doped tin
4.50
6.6
25.90
1.3
163.92
1.3
5.00




oxide-coated




oxide











titanium oxide




particles











particles




(average











(average




particle











particle




diameter:











diameter:




20 nm)











230 nm)















CP-C105
F-doped tin
45
4.50
5.0
150.75

4.50
6.6
25.90
1.3
163.92
1.3
5.00




oxide-coated
















barium sulfate
















particles
















(average
















particle
















diameter:
















230 nm)





















TABLE 44







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)























layer

Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


coating

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-421
Nb-doped
45
4.50
5.1
111.95
Nb-doped
3.60
7.0
3.07
1.3
266.63
1.3
5.00
None


CP-422
tin
45
4.50
5.1
111.95
tin oxide
4.05
7.0
3.07
1.3
266.63
1.3
5.00



CP-423
oxide-
45
4.50
5.1
111.95
particles
4.50
7.0
3.07
1.3
266.63
1.3
5.00



CP-424
coated
45
4.50
5.1
111.95
(average
4.95
7.0
3.07
1.3
266.63
1.3
5.00



CP-425
titanium
45
4.50
5.1
111.95
particle
5.40
7.0
3.07
1.3
266.63
1.3
5.00



CP-426
oxide
45
4.50
5.1
108.30
diameter:
4.50
7.0
7.43
1.3
265.45
1.3
5.00



CP-427
particles
45
4.50
5.1
99.60
20 nm)
3.60
7.0
17.77
1.3
262.72
1.3
5.00



CP-428
(average
45
4.50
5.1
99.60

4.05
7.0
17.77
1.3
262.72
1.3
5.00



CP-429
particle
45
4.50
5.1
99.60

4.50
7.0
17.77
1.3
262.72
1.3
5.00



CP-430
diameter:
45
4.50
5.1
99.60

4.95
7.0
17.77
1.3
262.72
1.3
5.00



CP-431
230 nm)
45
4.50
5.1
99.60

5.40
7.0
17.77
1.3
262.72
1.3
5.00



CP-432

45
4.50
5.1
93.10

4.50
7.0
25.56
1.3
260.57
1.3
5.00



CP-433

45
4.50
5.1
88.92

3.60
7.0
30.51
1.3
259.28
1.3
5.00



CP-434

45
4.50
5.1
88.92

4.05
7.0
30.51
1.3
259.28
1.3
5.00



CP-435

45
4.50
5.1
88.92

4.50
7.0
30.51
1.3
259.28
1.3
5.00



CP-436

45
4.50
5.1
88.92

4.95
7.0
30.51
1.3
259.28
1.3
5.00



CP-437

45
4.50
5.1
88.92

5.40
7.0
30.51
1.3
259.28
1.3
5.00



CP-438

45
4.50
5.1
135.45

4.50
7.0
3.72
1.3
259.28
1.3
5.00



CP-439

45
4.50
5.1
130.90

3.60
7.0
8.98
1.3
225.20
1.3
5.00



CP-440

45
4.50
5.1
130.90

4.05
7.0
8.98
1.3
225.20
1.3
5.00



CP-441

45
4.50
5.1
130.90

4.50
7.0
8.98
1.3
225.20
1.3
5.00



CP-442

45
4.50
5.1
130.90

4.95
7.0
8.98
1.3
225.20
1.3
5.00



CP-443

45
4.50
5.1
130.90

5.40
7.0
8.98
1.3
225.20
1.3
5.00



CP-444

45
4.50
5.1
120.15

3.60
7.0
21.44
1.3
222.35
1.3
5.00



CP-445

45
4.50
5.1
120.15

4.05
7.0
21.44
1.3
222.35
1.3
5.00



CP-446

45
4.50
5.1
120.15

4.50
7.0
21.44
1.3
222.35
1.3
5.00



CP-447

45
4.50
5.1
120.15

4.95
7.0
21.44
1.3
222.35
1.3
5.00



CP-448

45
4.50
5.1
120.15

5.40
7.0
21.44
1.3
222.35
1.3
5.00



CP-449

45
4.50
5.1
112.08

3.60
7.0
30.77
1.3
220.25
1.3
5.00



CP-450

45
4.50
5.1
112.08

4.05
7.0
30.77
1.3
220.25
1.3
5.00



CP-451

45
4.50
5.1
112.08

4.50
7.0
30.77
1.3
220.25
1.3
5.00



CP-452

45
4.50
5.1
112.08

4.95
7.0
30.77
1.3
220.25
1.3
5.00



CP-453

45
4.50
5.1
112.08

5.40
7.0
30.77
1.3
220.25
1.3
5.00



CP-454

45
4.50
5.1
106.95

4.50
7.0
36.70
1.3
218.92
1.3
5.00



CP-455

45
4.50
5.1
171.35

3.60
7.0
4.70
1.3
164.92
1.3
5.00



CP-456

45
4.50
5.1
171.35

4.05
7.0
4.70
1.3
164.92
1.3
5.00



CP-457

45
4.50
5.1
171.35

4.50
7.0
4.70
1.3
164.92
1.3
5.00



CP-458

45
4.50
5.1
171.35

4.95
7.0
4.70
1.3
164.92
1.3
5.00



CP-459

45
4.50
5.1
171.35

5.40
7.0
4.70
1.3
164.92
1.3
5.00



CP-460

45
4.50
5.1
165.37

3.60
7.0
11.35
1.3
163.80
1.3
5.00





















TABLE 45







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)























layer

Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


coating

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-461
Nb-doped
45
4.50
5.1
165.37
Nb-doped
4.05
7.0
11.35
1.3
163.80
1.3
5.00
None


CP-462
tin
45
4.50
5.1
165.37
tin oxide
4.50
7.0
11.35
1.3
163.80
1.3
5.00



CP-463
oxide-
45
4.50
5.1
165.37
particles
4.95
7.0
11.35
1.3
163.80
1.3
5.00



CP-464
coated
45
4.50
5.1
165.37
(average
5.40
7.0
11.35
1.3
163.80
1.3
5.00



CP-465
titanium
45
4.50
5.1
151.30
particle
3.60
7.0
27.00
1.3
161.17
1.3
5.00



CP-466
oxide
45
4.50
5.1
151.30
diameter:
4.05
7.0
27.00
1.3
161.17
1.3
5.00



CP-467
particles
45
4.50
5.1
151.30
20 nm)
4.50
7.0
27.00
1.3
161.17
1.3
5.00



CP-468
(average
45
4.50
5.1
151.30

4.95
7.0
27.00
1.3
161.17
1.3
5.00



CP-469
particle
45
4.50
5.1
151.30

5.40
7.0
27.00
1.3
161.17
1.3
5.00



CP-470
diameter:
45
4.50
5.1
140.84

3.60
7.0
38.66
1.3
159.17
1.3
5.00



CP-471
230 nm)
45
4.50
5.1
140.84

4.05
7.0
38.66
1.3
159.17
1.3
5.00



CP-472

45
4.50
5.1
140.84

4.50
7.0
38.66
1.3
159.17
1.3
5.00



CP-473

45
4.50
5.1
140.84

4.95
7.0
38.66
1.3
159.17
1.3
5.00



CP-474

45
4.50
5.1
140.84

5.40
7.0
38.66
1.3
159.17
1.3
5.00



CP-475

45
4.50
5.1
134.20

3.60
7.0
46.05
1.3
157.92
1.3
5.00



CP-476

45
4.50
5.1
134.20

4.05
7.0
46.05
1.3
157.92
1.3
5.00



CP-477

45
4.50
5.1
134.20

4.50
7.0
46.05
1.3
157.92
1.3
5.00



CP-478

45
4.50
5.1
134.20

4.95
7.0
46.05
1.3
157.92
1.3
5.00



CP-479

45
4.50
5.1
134.20

5.40
7.0
46.05
1.3
157.92
1.3
5.00



CP-480

45
4.50
5.1
197.53

4.50
7.0
5.43
1.3
120.07
1.3
5.00



CP-481

45
4.50
5.1
190.45

3.60
7.0
13.08
1.3
119.12
1.3
5.00



CP-482

45
4.50
5.1
190.45

4.05
7.0
13.08
1.3
119.12
1.3
5.00



CP-483

45
4.50
5.1
190.45

4.50
7.0
13.08
1.3
119.12
1.3
5.00



CP-484

45
4.50
5.1
190.45

4.95
7.0
13.08
1.3
119.12
1.3
5.00



CP-485

45
4.50
5.1
190.45

5.40
7.0
13.08
1.3
119.12
1.3
5.00



CP-486

45
4.50
5.1
173.86

3.60
7.0
31.02
1.3
116.87
1.3
5.00



CP-487

45
4.50
5.1
173.86

4.05
7.0
31.02
1.3
116.87
1.3
5.00



CP-488

45
4.50
5.1
173.86

4.50
7.0
31.02
1.3
116.87
1.3
5.00



CP-489

45
4.50
5.1
173.86

4.95
7.0
31.02
1.3
116.87
1.3
5.00



CP-490

45
4.50
5.1
173.86

5.40
7.0
31.02
1.3
116.87
1.3
5.00



CP-491

45
4.50
5.1
161.54

3.60
7.0
44.35
1.3
115.18
1.3
5.00



CP-492

45
4.50
5.1
161.54

4.05
7.0
44.35
1.3
115.18
1.3
5.00



CP-493

45
4.50
5.1
161.54

4.50
7.0
44.35
1.3
115.18
1.3
5.00



CP-494

45
4.50
5.1
161.54

4.95
7.0
44.35
1.3
115.18
1.3
5.00



CP-495

45
4.50
5.1
161.54

5.40
7.0
44.35
1.3
115.18
1.3
5.00



CP-496

45
4.50
5.1
153.76

4.50
7.0
52.76
1.3
114.13
1.3
5.00



CP-497

45
4.50
5.1
208.14

3.60
7.0
5.72
1.3
101.90
1.3
5.00



CP-498

45
4.50
5.1
208.14

4.05
7.0
5.72
1.3
101.90
1.3
5.00



CP-499

45
4.50
5.1
208.14

4.50
7.0
5.72
1.3
101.90
1.3
5.00



CP-500

45
4.50
5.1
208.14

4.95
7.0
5.72
1.3
101.90
1.3
5.00





















TABLE 46







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)























layer

Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


coating

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-501
Nb-doped tin
45
4.50
5.1
208.14
Nb-doped
5.40
7.0
5.72
1.3
101.90
1.3
5.00
None


CP-502
oxide-coated
45
4.50
5.1
200.62
tin oxide
4.50
7.0
13.76
1.3
101.03
1.3
5.00



CP-503
titanium
45
4.50
5.1
182.95
particles
3.60
7.0
32.64
1.3
99.02
1.3
5.00



CP-504
oxide
45
4.50
5.1
182.95
(average
4.05
7.0
32.64
1.3
99.02
1.3
5.00



CP-505
particles
45
4.50
5.1
182.95
particle
4.50
7.0
32.64
1.3
99.02
1.3
5.00



CP-506
(average
45
4.50
5.1
182.95
diameter:
4.95
7.0
32.64
1.3
99.02
1.3
5.00



CP-507
particle
45
4.50
5.1
182.95
20 nm)
5.40
7.0
32.64
1.3
99.02
1.3
5.00



CP-508
diameter:
45
4.50
5.1
169.87

4.50
7.0
46.62
1.3
97.52
1.3
5.00



CP-509
230 nm)
45
4.50
5.1
161.62

3.60
7.0
55.45
1.3
96.55
1.3
5.00



CP-510

45
4.50
5.1
161.62

4.05
7.0
55.45
1.3
96.55
1.3
5.00



CP-511

45
4.50
5.1
161.62

4.50
7.0
55.45
1.3
96.55
1.3
5.00



CP-512

45
4.50
5.1
161.62

4.95
7.0
55.45
1.3
96.55
1.3
5.00



CP-513

45
4.50
5.1
161.62

5.40
7.0
55.45
1.3
96.55
1.3
5.00
























CP-514

45
4.50
5.1
135.25

3.60
7.0
9.28
1.3
159.12
1.3
40.00
Uncoated
4.2
30.00


CP-515

45
4.50
5.1
135.25

4.05
7.0
9.28
1.3
159.12
1.3
40.00
titanium
4.2
30.00


CP-516

45
4.50
5.1
135.25

4.50
7.0
9.28
1.3
159.12
1.3
40.00
oxide
4.2
30.00


CP-517

45
4.50
5.1
135.25

4.95
7.0
9.28
1.3
159.12
1.3
40.00
particles
4.2
30.00


CP-518

45
4.50
5.1
135.25

5.40
7.0
9.28
1.3
159.12
1.3
40.00
(average
4.2
30.00


CP-519

45
4.50
5.1
124.13

3.60
7.0
22.15
1.3
156.20
1.3
40.00
particle
4.2
30.00


CP-520

45
4.50
5.1
124.13

4.05
7.0
22.15
1.3
156.20
1.3
40.00
diameter:
4.2
30.00


CP-521

45
4.50
5.1
124.13

4.50
7.0
22.15
1.3
156.20
1.3
40.00
210 nm)
4.2
30.00


CP-522

45
4.50
5.1
124.13

4.95
7.0
22.15
1.3
156.02
1.3
40.00

4.2
30.00


CP-523

45
4.50
5.1
124.13

5.40
7.0
22.15
1.3
156.20
1.3
40.00

4.2
30.00


CP-524

45
4.50
5.1
115.80

3.60
7.0
31.79
1.3
154.02
1.3
40.00

4.2
30.00


CP-525

45
4.50
5.1
115.80

4.05
7.0
31.79
1.3
154.02
1.3
40.00

4.2
30.00


CP-526

45
4.50
5.1
115.80

4.50
7.0
31.79
1.3
154.02
1.3
40.00

4.2
30.00


CP-527

45
4.50
5.1
115.80

4.95
7.0
31.79
1.3
154.02
1.3
40.00

4.2
30.00


CP-528

45
4.50
5.1
115.80

5.40
7.0
31.79
1.3
154.02
1.3
40.00

4.2
30.00


CP-529

45
4.50
5.1
170.85

3.60
7.0
11.72
1.3
95.72
1.3
40.00

4.2
30.00


CP-530

45
4.50
5.1
170.85

4.05
7.0
11.72
1.3
95.72
1.3
40.00

4.2
30.00


CP-531

45
4.50
5.1
170.85

4.50
7.0
11.72
1.3
95.72
1.3
40.00

4.2
30.00


CP-532

45
4.50
5.1
170.85

4.95
7.0
11.72
1.3
95.72
1.3
40.00

4.2
30.00


CP-533

45
4.50
5.1
170.85

5.40
7.0
11.72
1.3
95.72
1.3
40.00

4.2
30.00


CP-534

45
4.50
5.1
156.32

3.60
7.0
27.90
1.3
92.97
1.3
40.00

4.2
30.00


CP-535

45
4.50
5.1
156.32

4.05
7.0
27.90
1.3
92.97
1.3
40.00

4.2
30.00


CP-536

45
4.50
5.1
156.32

4.50
7.0
27.90
1.3
92.97
1.3
40.00

4.2
30.00


CP-537

45
4.50
5.1
156.32

4.95
7.0
27.90
1.3
92.97
1.3
40.00

4.2
30.00


CP-538

45
4.50
5.1
156.32

5.40
7.0
27.90
1.3
92.97
1.3
40.00

4.2
30.00


CP-539

45
4.50
5.1
145.50

3.60
7.0
39.95
1.3
90.92
1.3
40.00

4.2
30.00


CP-540

45
4.50
5.1
145.50

4.05
7.0
39.95
1.3
90.92
1.3
40.00

4.2
30.00


















TABLE 47







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
















layer

Coating
Doping



Doping




coating

ratio
ratio

Amount

ratio

Amount


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]





CP-541
Nb-
45
4.50
5.1
145.50
Nb-
4.50
7.0
39.95


CP-542
doped
45
4.50
5.1
145.50
doped
4.95
7.0
39.95


CP-543
tin
45
4.50
5.1
145.50
tin oxide
5.40
7.0
39.95


CP-544
oxide-
45
4.50
5.1
196.78
particles
3.60
7.0
13.50


CP-545
coated
45
4.50
5.1
196.78
(average
4.05
7.0
13.50


CP-546
titanium
45
4.50
5.1
196.78
particle
4.50
7.0
13.50


CP-547
oxide
45
4.50
5.1
196.78
diameter:
4.95
7.0
13.50


CP-548
particles
45
4.50
5.1
196.78
20 nm)
5.40
7.0
13.50


CP-549
(average
45
4.50
5.1
179.62

3.60
7.0
32.05


CP-550
particle
45
4.50
5.1
179.62

4.05
7.0
32.05


CP-551
diameter:
45
4.50
5.1
179.62

4.50
7.0
32.05


CP-552
230 nm)
45
4.50
5.1
179.62

4.95
7.0
32.05


CP-553

45
4.50
5.1
179.62

5.40
7.0
32.05


CP-554

45
4.50
5.1
166.90

3.60
7.0
45.82


CP-555

45
4.50
5.1
166.90

4.05
7.0
45.82


CP-556

45
4.50
5.1
166.90

4.50
7.0
45.82


CP-557

45
4.50
5.1
166.90

4.95
7.0
45.82


CP-558

45
4.50
5.1
166.90

5.40
7.0
45.82


CP-559

45
4.50
5.1
156.32

4.50
7.0
27.90


CP-560

45
4.50
5.0
159.70

4.50
7.0
24.15














(3) Binding material





(phenol resin)













Conductive-

Amount [part(s)]
(4) Silicone resin
(5) Particles except


layer

(resin solid content
particles
(1) to (4)














coating

thereof is 60% by

Amount


Amount


solution
Density
mass of the following)
Density
[part(s)]
Kind
Density
[part(s)]

















CP-541
1.3
90.92
1.3
40.00
Uncoated
4.2
30.00


CP-542
1.3
90.92
1.3
40.00
titanium
4.2
30.00


CP-543
1.3
90.92
1.3
40.00
oxide
4.2
30.00


CP-544
1.3
49.53
1.3
40.00
particles
4.2
30.00


CP-545
1.3
49.53
1.3
40.00
(average
4.2
30.00


CP-546
1.3
49.53
1.3
40.00
particle
4.2
30.00


CP-547
1.3
49.53
1.3
40.00
diameter:
4.2
30.00


CP-548
1.3
49.53
1.3
40.00
210 nm)
4.2
30.00


CP-549
1.3
47.22
1.3
40.00

4.2
30.00


CP-550
1.3
47.22
1.3
40.00

4.2
30.00


CP-551
1.3
47.22
1.3
40.00

4.2
30.00


CP-552
1.3
47.22
1.3
40.00

4.2
30.00


CP-553
1.3
47.22
1.3
40.00

4.2
30.00


CP-554
1.3
45.47
1.3
40.00

4.2
30.00


CP-555
1.3
45.47
1.3
40.00

4.2
30.00


CP-556
1.3
45.47
1.3
40.00

4.2
30.00


CP-557
1.3
45.47
1.3
40.00

4.2
30.00


CP-558
1.3
45.47
1.3
40.00

4.2
30.00


CP-559
1.3
92.97
1.3
40.00

4.2
30.00


CP-560
1.3
93.58
1.3
40.00

4.2
30.00


















TABLE 48







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
















layer

Coating
Doping



Doping




coating

ratio
ratio

Amount

ratio

Amount


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
















CP-C107
Nb-doped tin
45
4.50
5.1
114.55
None


CP-C108
oxide-coated
45
4.50
5.1
175.58



CP-C109
titanium
45
4.50
5.1
213.48

















CP-C110
oxide
45
4.50
5.1
113.25
Nb-doped
4.50
7.0
1.55


CP-C111
particles
45
4.50
5.1
173.45
tin oxide
4.50
7.0
2.37


CP-C112
(average
45
4.50
5.1
210.77
particles
4.50
7.0
2.90


CP-C113
particle
45
4.50
5.1
85.10
(average
4.50
7.0
35.04


CP-C114
diameter:
45
4.50
5.1
128.15
particle
4.50
7.0
52.76


CP-C115
230 nm)
45
4.50
5.1
154.12
diameter:
4.50
7.0
63.46












CP-C116
None
20 nm)
4.50
7.0
136.40


CP-C117


4.50
7.0
195.35


CP-C118


4.50
7.0
228.20
















CP-C119
Nb-doped tin
45
4.50
5.1
83.15

4.50
7.0
2.28


CP-C120
oxide-coated
45
4.50
5.1
80.50

4.50
7.0
5.53


CP-C121
titanium
45
4.50
5.1
74.24

4.50
7.0
13.25


CP-C122
oxide
45
4.50
5.1
69.55

4.50
7.0
19.09


CP-C123
particles
45
4.50
5.1
66.50

4.50
7.0
22.82


CP-C124
(average
45
4.50
5.1
217.47

4.50
7.0
5.98


CP-C125
particle
45
4.50
5.1
209.55

4.50
7.0
14.37


CP-C126
diameter:
45
4.50
5.1
190.95

4.50
7.0
34.06


CP-C127
230 nm)
45
4.50
5.1
177.18

4.50
7.0
48.63


CP-C128

45
4.50
5.1
168.49

4.50
7.0
57.82















(4) Silicone resin
(5) Particles except)


Conductive-
(3) Binding material (phenol resin)
particles
(1) to (4














layer

Amount [part(s)] (resin

Amount


Amount


coating

solid content thereof is 60%

[part


[part


solution
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]















CP-C107
1.3
267.42
1.3
5.00
None


CP-C108
1.3
165.70
1.3
5.00



CP-C109
1.3
102.53
1.3
5.00



CP-C110
1.3
267.00
1.3
5.00



CP-C111
1.3
165.30
1.3
5.00



CP-C112
1.3
102.22
1.3
5.00



CP-C113
1.3
258.10
1.3
5.00



CP-C114
1.3
156.82
1.3
5.00



CP-C115
1.3
95.70
1.3
5.00



CP-C116
1.3
231.00
1.3
5.00



CP-C117
1.3
132.75
1.3
5.00



CP-C118
1.3
78.00
1.3
5.00



CP-C119
1.3
315.95
1.3
5.00



CP-C120
1.3
314.95
1.3
5.00



CP-C121
1.3
312.52
1.3
5.00



CP-C122
1.3
310.60
1.3
5.00



CP-C123
1.3
309.47
1.3
5.00



CP-C124
1.3
85.92
1.3
5.00



CP-C125
1.3
85.13
1.3
5.00



CP-C126
1.3
83.32
1.3
5.00



CP-C127
1.3
81.98
1.3
5.00



CP-C128
1.3
81.15
1.3
5.00


















TABLE 49







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
















layer

Coating
Doping



Doping




coating

ratio
ratio

Amount

ratio

Amount


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]





CP-561
Ta-
45
4.50
5.2
113.20
Ta-
3.60
7.3
3.18


CP-562
doped
45
4.50
5.2
113.20
doped
4.05
7.3
3.18


CP-563
tin
45
4.50
5.2
113.20
tin oxide
4.50
7.4
3.22


CP-564
oxide-
45
4.50
5.2
113.20
particles
4.95
7.4
3.22


CP-565
coated
45
4.50
5.2
113.20
(average
5.40
7.5
3.26


CP-566
titanium
45
4.50
5.2
109.45
particle
4.50
7.4
7.79


CP-567
oxide
45
4.50
5.2
100.60
diameter:
3.60
7.3
18.36


CP-568
particles
45
4.50
5.2
100.60
20 nm)
4.05
7.3
18.36


CP-569
(average
45
4.50
5.2
100.50

4.50
7.4
18.59


CP-570
particle
45
4.50
5.2
100.50

4.95
7.4
18.59


CP-571
diameter:
45
4.50
5.2
100.43

5.40
7.5
18.83


CP-572
230 nm)
45
4.50
5.2
93.80

4.50
7.4
26.70


CP-573

45
4.50
5.2
89.70

3.60
7.3
31.48


CP-574

45
4.50
5.2
89.70

4.05
7.3
31.48


CP-575

45
4.50
5.2
89.57

4.50
7.4
31.87


CP-576

45
4.50
5.2
89.57

4.95
7.4
31.87


CP-577

45
4.50
5.2
89.42

5.40
7.5
32.24


CP-578

45
4.50
5.2
136.70

4.50
7.4
3.90


CP-579

45
4.50
5.2
132.05

3.60
7.3
9.27


CP-580

45
4.50
5.2
132.05

4.05
7.3
9.27


CP-581

45
4.50
5.2
132.00

4.50
7.4
9.40


CP-582

45
4.50
5.2
132.00

4.95
7.4
9.40


CP-583

45
4.50
5.2
131.95

5.40
7.5
9.52


CP-584

45
4.50
5.2
121.10

3.60
7.3
22.10


CP-585

45
4.50
5.2
121.10

4.05
7.3
22.10


CP-586

45
4.50
5.2
120.95

4.50
7.4
22.38














(3) Binding material





(phenol resin)













Conductive-

Amount [part(s)]
(4) Silicone resin
(5) Particles except


layer

(resin solid content
particles
(1) to (4)














coating

thereof is 60% by

Amount


Amount


solution
Density
mass of the following)
Density
[part(s)]
Kind
Density
[part(s)]















CP-561
1.3
264.37
1.3
5.00
None


CP-562
1.3
264.37
1.3
5.00



CP-563
1.3
264.30
1.3
5.00



CP-564
1.3
264.30
1.3
5.00



CP-565
1.3
264.23
1.3
5.00



CP-566
1.3
262.93
1.3
5.00



CP-567
1.3
260.07
1.3
5.00



CP-568
1.3
260.07
1.3
5.00



CP-569
1.3
259.85
1.3
5.00



CP-570
1.3
259.85
1.3
5.00



CP-571
1.3
259.57
1.3
5.00



CP-572
1.3
257.50
1.3
5.00



CP-573
1.3
256.37
1.3
5.00



CP-574
1.3
256.37
1.3
5.00



CP-575
1.3
255.93
1.3
5.00



CP-576
1.3
255.93
1.3
5.00



CP-577
1.3
255.57
1.3
5.00



CP-578
1.3
224.00
1.3
5.00



CP-579
1.3
222.80
1.3
5.00



CP-580
1.3
222.80
1.3
5.00



CP-581
1.3
222.67
1.3
5.00



CP-582
1.3
222.67
1.3
5.00



CP-583
1.3
222.55
1.3
5.00



CP-584
1.3
219.67
1.3
5.00



CP-585
1.3
219.67
1.3
5.00



CP-586
1.3
219.45
1.3
5.00





















TABLE 50







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
(3) Binding material (phenol resin)
(4) Silicone resin particles
(5) Particles except (1) to (4)























layer

Coating
Doping



Doping



Amount [part(s)] (resin

Amount


Amount


coating

ratio
ratio

Amount

ratio

Amount

solid content thereof is 60%

[part


[part


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]
Density
by mass of the following)
Density
(s)]
Kind
Density
(s)]
























CP-601
Ta-doped
45
4.50
5.2
166.40
Ta-doped
4.05
7.3
11.68
1.3
161.53
1.3
5.00
None


CP-602
tin
45
4.50
5.2
166.30
tin oxide
4.50
7.4
11.83
1.3
161.45
1.3
5.00



CP-603
oxide-
45
4.50
5.2
166.30
particles
4.95
7.4
11.83
1.3
161.45
1.3
5.00



CP-604
coated
45
4.50
5.2
166.22
(average
5.40
7.5
11.99
1.3
161.32
1.3
5.00



CP-605
titanium
45
4.50
5.2
152.02
particle
3.60
7.3
27.75
1.3
158.72
1.3
5.00



CP-606
oxide
45
4.50
5.2
152.02
diameter:
4.05
7.3
27.75
1.3
158.72
1.3
5.00



CP-607
particles
45
4.50
5.2
151.83
20 nm)
4.50
7.4
28.09
1.3
158.47
1.3
5.00



CP-608
(average
45
4.50
5.2
151.83

4.95
7.4
28.09
1.3
158.47
1.3
5.00



CP-609
particle
45
4.50
5.2
151.61

5.40
7.5
28.43
1.3
158.27
1.3
5.00



CP-610
diameter:
45
4.50
5.2
141.37

3.60
7.3
39.69
1.3
156.57
1.3
5.00



CP-611
230 nm)
45
4.50
5.2
141.37

4.05
7.3
39.69
1.3
156.57
1.3
5.00



CP-612

45
4.50
5.2
141.10

4.50
7.4
40.15
1.3
156.25
1.3
5.00



CP-613

45
4.50
5.2
141.10

4.95
7.4
40.15
1.3
156.25
1.3
5.00



CP-614

45
4.50
5.2
140.82

5.40
7.5
40.62
1.3
155.93
1.3
5.00



CP-615

45
4.50
5.2
134.60

3.60
7.3
47.24
1.3
155.27
1.3
5.00



CP-616

45
4.50
5.2
134.60

4.05
7.3
47.24
1.3
155.27
1.3
5.00



CP-617

45
4.50
5.2
134.30

4.50
7.4
47.78
1.3
154.87
1.3
5.00



CP-618

45
4.50
5.2
134.30

4.95
7.4
47.78
1.3
154.87
1.3
5.00



CP-619

45
4.50
5.2
133.98

5.40
7.5
48.31
1.3
154.52
1.3
5.00



CP-620

45
4.50
5.2
198.45

4.50
7.4
5.65
1.3
118.17
1.3
5.00



CP-621

45
4.50
5.2
191.27

3.60
7.3
13.43
1.3
117.17
1.3
5.00



CP-622

45
4.50
5.2
191.27

4.05
7.3
13.43
1.3
117.17
1.3
5.00



CP-623

45
4.50
5.2
191.15

4.50
7.4
13.60
1.3
117.08
1.3
5.00



CP-624

45
4.50
5.2
191.15

4.95
7.4
13.60
1.3
117.08
1.3
5.00



CP-625

45
4.50
5.2
191.00

5.40
7.5
13.78
1.3
117.03
1.3
5.00



CP-626

45
4.50
5.2
174.32

3.60
7.3
31.82
1.3
114.77
1.3
5.00



CP-627

45
4.50
5.2
174.32

4.05
7.3
31.82
1.3
114.77
1.3
5.00



CP-628

45
4.50
5.2
174.05

4.50
7.4
32.20
1.3
114.58
1.3
5.00



CP-629

45
4.50
5.2
174.05

4.95
7.4
32.20
1.3
114.58
1.3
5.00



CP-630

45
4.50
5.2
173.78

5.40
7.5
32.58
1.3
114.40
1.3
5.00



CP-631

45
4.50
5.2
161.77

3.60
7.3
45.42
1.3
113.02
1.3
5.00



CP-632

45
4.50
5.2
161.77

4.05
7.3
45.42
1.3
113.02
1.3
5.00



CP-633

45
4.50
5.2
161.42

4.50
7.4
45.95
1.3
112.72
1.3
5.00



CP-634

45
4.50
5.2
161.42

4.95
7.4
45.95
1.3
112.72
1.3
5.00



CP-635

45
4.50
5.2
161.07

5.40
7.5
46.46
1.3
112.45
1.3
5.00



CP-636

45
4.50
5.2
153.46

4.50
7.4
54.60
1.3
111.57
1.3
5.00



CP-637

45
4.50
5.2
209.00

3.60
7.3
5.87
1.3
100.22
1.3
5.00



CP-638

45
4.50
5.2
209.00

4.05
7.3
5.87
1.3
100.22
1.3
5.00



CP-639

45
4.50
5.2
208.92

4.50
7.4
5.96
1.3
100.20
1.3
5.00



CP-640

45
4.50
5.2
208.92

4.95
7.4
5.96
1.3
100.20
1.3
5.00


















TABLE 51







Conductive-
(1) A first metal oxide particle
(2) A second metal oxide particle
















layer

Coating
Doping



Doping




coating

ratio
ratio

Amount

ratio

Amount


solution
Kind
[%]
[%]
Density
[part(s)]
Kind
[%]
Density
[part(s)]





CP-641
Ta-
45
4.50
5.2
208.87
Ta-
5.40
7.5
6.03


CP-642
doped
45
4.50
5.2
201.16
doped
4.50
7.4
14.30


CP-643
tin
45
4.50
5.2
183.27
tin oxide
3.60
7.3
33.45


CP-644
oxide-
45
4.50
5.2
183.27
particles
4.05
7.3
33.45


CP-645
coated
45
4.50
5.2
182.97
(average
4.50
7.4
33.85


CP-646
titanium
45
4.50
5.2
182.97
particle
4.95
7.4
33.85


CP-647
oxide
45
4.50
5.2
182.67
diameter:
5.40
7.5
34.25


CP-648
particles
45
4.50
5.2
169.56
20 nm)
4.50
7.4
48.27


CP-649
(average
45
4.50
5.2
161.58

3.60
7.3
56.71


CP-650
particle
45
4.50
5.2
161.58

4.05
7.3
56.71


CP-651
diameter:
45
4.50
5.2
161.13

4.50
7.4
57.32


CP-652
230 nm)
45
4.50
5.2
161.13

4.95
7.4
57.32


CP-653

45
4.50
5.2
160.68

5.40
7.5
57.94














(3) Binding material





(phenol resin)













Conductive-

Amount [part(s)]
(4) Silicone resin
(5) Particles except


layer

(resin solid content
particles
(1) to (4)














coating

thereof is 60% by

Amount


Amount


solution
Density
mass of the following)
Density
[part(s)]
Kind
Density
[part(s)]















CP-641
1.3
100.17
1.3
5.00
None


CP-642
1.3
99.23
1.3
5.00



CP-643
1.3
97.13
1.3
5.00



CP-644
1.3
97.13
1.3
5.00



CP-645
1.3
96.97
1.3
5.00



CP-646
1.3
96.97
1.3
5.00



CP-647
1.3
96.80
1.3
5.00



CP-648
1.3
95.28
1.3
5.00



CP-649
1.3
94.52
1.3
5.00



CP-650
1.3
94.52
1.3
5.00



CP-651
1.3
94.25
1.3
5.00



CP-652
1.3
94.25
1.3
5.00



CP-653
1.3
93.97
1.3
5.00































TABLE 52

















(3) Binding

















material

















(phenol resin)







































Amount


















[part


















(s)]


















(resin


















solid


















content



















(1) A first metal
(2) A second metal

thereof




Con-
oxide particle
oxide particle

is 60%
(4) Silicone
(5) Particles except




















ductive-

Coat-
Dop-



Dop-



by mass
resin particles
(1) to (4)























layer

ing
ing

Amount

ing

Amount

of the

Amount


Amount


coating

ratio
ratio
Den-
[part

ratio
Den-
[part
Den-
follow-
Den-
[part

Den-
[part


solution
Kind
[%]
[%]
sity
(s)]
Kind
[%]
sity
(s)]
sity
ing)
sity
(s)]
Kind
sity
(s)]


























CP-654
Ta-
45
4.50
5.2
136.45
Ta-
3.60
7.3
9.58
1.3
156.62
1.3
40.00
Uncoated
4.2
30.00


CP-655
doped
45
4.50
5.2
136.45
doped
4.05
7.3
9.58
1.3
156.62
1.3
40.00
titanium
4.2
30.00


CP-656
tin
45
4.50
5.2
136.40
tin
4.50
7.4
9.70
1.3
156.50
1.3
40.00
oxide-
4.2
30.00


CP-657
oxide-
45
4.50
5.2
136.40
oxide-
4.95
7.4
9.70
1.3
156.50
1.3
40.00
particles
4.2
30.00


CP-658
coated
45
4.50
5.2
136.34
particles
5.40
7.5
9.83
1.3
156.38
1.3
40.00
(average
4.2
30.00


CP-659
titanium
45
4.50
5.2
125.10
(average
3.60
7.3
22.83
1.3
153.45
1.3
40.00
particle
4.2
30.00


CP-660
oxide
45
4.50
5.2
125.10
particle
4.05
7.3
22.83
1.3
153.45
1.3
40.00
diameter:
4.2
30.00


CP-661
particles
45
4.50
5.2
124.95
diameter:
4.50
7.4
23.12
1.3
153.22
1.3
40.00
210 nm)
4.2
30.00


CP-662
(aver-
45
4.50
5.2
124.95
20 nm)
4.95
7.4
23.12
1.3
153.22
1.3
40.00

4.2
30.00


CP-663
age
45
4.50
5.2
124.82

5.40
7.5
23.40
1.3
152.97
1.3
40.00

4.2
30.00


CP-664
part-
45
4.50
5.2
116.60

3.60
7.3
32.73
1.3
151.12
1.3
40.00

4.2
30.00


CP-665
icle
45
4.50
5.2
116.60

4.05
7.3
32.73
1.3
151.12
1.3
40.00

4.2
30.00


CP-666
dia-
45
4.50
5.2
116.42

4.50
7.4
33.13
1.3
150.75
1.3
40.00

4.2
30.00


CP-667
meter:
45
4.50
5.2
116.42

4.95
7.4
33.13
1.3
150.75
1.3
40.00

4.2
30.00


CP-668
230
45
4.50
5.2
116.25

5.40
7.5
33.53
1.3
150.37
1.3
40.00

4.2
30.00


CP-669
nm)
45
4.50
5.2
171.92

3.60
7.3
12.06
1.3
93.37
1.3
40.00

4.2
30.00


CP-670

45
4.50
5.2
171.92

4.05
7.3
12.06
1.3
93.37
1.3
40.00

4.2
30.00


CP-671

45
4.50
5.2
171.82

4.50
7.4
12.23
1.3
93.25
1.3
40.00

4.2
30.00


CP-672

45
4.50
5.2
171.82

4.95
7.4
12.23
1.3
93.25
1.3
40.00

4.2
30.00


CP-673

45
4.50
5.2
171.72

5.40
7.5
12.38
1.3
93.17
1.3
40.00

4.2
30.00


CP-674

45
4.50
5.2
157.08

3.60
7.3
28.67
1.3
90.42
1.3
40.00

4.2
30.00


CP-675

45
4.50
5.2
157.08

4.05
7.3
28.67
1.3
90.42
1.3
40.00

4.2
30.00


CP-676

45
4.50
5.2
156.85

4.50
7.4
29.02
1.3
90.22
1.3
40.00

4.2
30.00


CP-677

45
4.50
5.2
156.85

4.95
7.4
29.02
1.3
90.22
1.3
40.00

4.2
30.00


CP-678

45
4.50
5.2
156.64

5.40
7.5
29.37
1.3
89.98
1.3
40.00

4.2
30.00


CP-679

45
4.50
5.2
146.04

3.60
7.3
41.00
1.3
88.27
1.3
40.00

4.2
30.00


CP-680

45
4.50
5.2
146.04

4.05
7.3
41.00
1.3
88.27
1.3
40.00

4.2
30.00


CP-681

45
4.50
5.2
145.76

4.50
7.4
41.48
1.3
87.93
1.3
40.00

4.2
30.00


CP-682

45
4.50
5.2
145.76

4.95
7.4
41.48
1.3
87.93
1.3
40.00

4.2
30.00


CP-683

45
4.50
5.2
145.48

5.40
7.5
41.96
1.3
87.60
1.3
40.00

4.2
30.00


CP-684

45
4.50
5.2
197.62

3.60
7.3
13.86
1.3
47.53
1.3
40.00

4.2
30.00


CP-685

45
4.50
5.2
197.62

4.05
7.3
13.86
1.3
47.53
1.3
40.00

4.2
30.00


CP-686

45
4.50
5.2
197.48

4.50
7.4
14.05
1.3
47.45
1.3
40.00

4.2
30.00


CP-687

45
4.50
5.2
197.48

4.95
7.4
14.05
1.3
47.45
1.3
40.00

4.2
30.00


CP-688

45
4.50
5.2
197.36

5.40
7.5
14.22
1.3
47.37
1.3
40.00

4.2
30.00


CP-689

45
4.50
5.2
180.09

3.60
7.3
32.87
1.3
45.07
1.3
40.00

4.2
30.00


CP-690

45
4.50
5.2
180.09

4.05
7.3
32.87
1.3
45.07
1.3
40.00

4.2
30.00































TABLE 53

















(3) Binding

















material

















(phenol resin)







































Amount


















[part (s)]


















(resin


















solid


















content



















(1) A first metal
(2) A second metal

thereof




Con-
oxide particle
oxide particle

is 60%
(4) Silicone
(5) Particles except




















ductive-

Coat-
Dop-



Dop-



by mass
resin particles
(1) to (4)























layer

ing
ing

Amount

ing

Amount

of the

Amount


Amount


coating

ratio
ratio
Den-
[part

ratio
Den-
[part
Den-
follow-
Den-
[part

Den-
[part


solution
Kind
[%]
[%]
sity
(s)]
Kind
[%]
sity
(s)]
sity
ing)
sity
(s)]
Kind
sity
(s)]





CP-691
Ta-
45
4.50
5.2
179.82
Ta-
4.50
7.4
33.26
1.3
44.87
1.3
40.00
Uncoated
4.2
30.00


CP-692
doped
45
4.50
5.2
179.82
doped
4.95
7.4
33.26
1.3
44.87
1.3
40.00
titanium
4.2
30.00


CP-693
tin
45
4.50
5.2
179.55
tin
5.40
7.5
33.66
1.3
44.65
1.3
40.00
oxide-
4.2
30.00


CP-694
oxide-
45
4.50
5.2
167.15
oxide-
3.60
7.3
46.92
1.3
43.22
1.3
40.00
particles
4.2
30.00


CP-695
coated
45
4.50
5.2
167.15
particles
4.05
7.3
46.92
1.3
43.22
1.3
40.00
(average
4.2
30.00


CP-696
titanium
45
4.50
5.2
166.77
(average
4.50
7.4
47.46
1.3
42.95
1.3
40.00
particle
4.2
30.00


CP-697
oxide
45
4.50
5.2
166.77
particle
4.95
7.4
47.46
1.3
42.95
1.3
40.00
diameter:
4.2
30.00


CP-698
particles
45
4.50
5.2
166.40
diameter:
5.40
7.5
48.00
1.3
42.67
1.3
40.00
210 nm)
4.2
30.00


CP-699
(average
45
4.50
5.2
156.85
20 nm)
4.50
7.4
29.02
1.3
90.22
1.3
40.00

4.2
30.00


CP-700
particle
45
4.50
5.2
160.36

4.50
7.4
25.10
1.3
90.90
1.3
40.00

4.2
30.00



diameter:


















230 nm)































TABLE 54

















(3) Binding

















material

















(phenol resin)







































Amount


















[part (s)]


















(resin


















solid


















content



















(1) A first metal
(2) A second metal

thereof




Con-
oxide particle
oxide particle

is 60%
(4) Silicone
(5) Particles except




















ductive-

Coat-
Dop-



Dop-



by mass
resin particles
(1) to (4)























layer

ing
ing

Amount

ing

Amount

of the

Amount


Amount


coating

ratio
ratio
Den-
[part

ratio
Den-
[part
Den-
follow-
Den-
[part

Den-
[part


solution
Kind
[%]
[%]
sity
(s)]
Kind
[%]
sity
(s)]
sity
ing)
sity
(s)]
Kind
sity
(s)]





















CP-C129
Ta-doped
45
4.50
5.2
115.85
None
1.3
265.25
1.3
5.00
None




















CP-C130
tin oxide-
45
4.50
5.2
176.85

1.3
163.58
1.3
5.00





CP-C131
coated
45
4.50
5.2
214.46

1.3
100.90
1.3
5.00


























CP-C132
titanium
45
4.50
5.2
114.50

4.50
7.4
1.63
1.3
264.78
1.3
5.00





CP-C133
oxide
45
4.50
5.2
174.63

4.50
7.4
2.40
1.3
163.15
1.3
5.00





CP-C134
particles
45
4.50
5.2
211.67

4.50
7.4
3.00
1.3
100.55
1.3
5.00





CP-C135
(average
45
4.50
5.2
85.65

4.50
7.4
36.57
1.3
254.63
1.3
5.00





CP-C136
particle
45
4.50
5.2
128.12

4.50
7.4
54.70
1.3
153.63
1.3
5.00





CP-C137
diameter:
45
4.50
5.2
153.49

4.50
7.4
65.53
1.3
93.30
1.3
5.00






230 nm)


































CP-C138
None
Ta-
4.50
7.4
140.30
1.3
224.50
1.3
5.00





CP-C139

doped
4.50
7.4
198.60
1.3
127.33
1.3
5.00





CP-C140

tin
4.50
7.4
230.50
1.3
74.17
1.3
5.00


























CP-C141
Ta-doped
45
4.50
5.2
84.25
oxide-
4.50
7.4
2.40
1.3
313.92
1.3
5.00





CP-C142
tin oxide-
45
4.50
5.2
81.56
particles
4.50
7.4
5.80
1.3
312.73
1.3
5.00





CP-C143
coated
45
4.50
5.2
75.10
(average
4.50
7.4
13.89
1.3
310.02
1.3
5.00





CP-C144
titanium
45
4.50
5.2
70.28
particle
4.50
7.4
20.00
1.3
307.87
1.3
5.00





CP-C145
oxide
45
4.50
5.2
67.19
diameter:
4.50
7.4
23.90
1.3
306.57
1.3
5.00





CP-C146
particles
45
4.50
5.2
218.17
20 nm)
4.50
7.4
6.20
1.3
84.38
1.3
5.00





CP-C147
(average
45
4.50
5.2
209.94

4.50
7.4
14.95
1.3
83.52
1.3
5.00





CP-C148
particle
45
4.50
5.2
190.80

4.50
7.4
35.30
1.3
81.50
1.3
5.00





CP-C149
diameter:
45
4.50
5.2
176.69

4.50
7.4
50.30
1.3
80.02
1.3
5.00





CP-C150
230 nm)
45
4.50
5.2
167.83

4.50
7.4
59.72
1.3
79.08
1.3
5.00































TABLE 55

















(3) Binding

















material

















(phenol resin)







































Amount


















[part (s)]


















(resin


















solid


















content



















(1) A first metal
(2) A second metal

thereof




Con-
oxide particle
oxide particle

is 60%
(4) Silicone
(5) Particles except




















ductive-

Coat-
Dop-



Dop-



by mass
resin particles
(1) to (4)























layer

ing
ing

Amount

ing

Amount

of the

Amount


Amount


coating

ratio
ratio
Den-
[part

ratio
Den-
[part
Den-
follow-
Den-
[part

Den-
[part


solution
Kind
[%]
[%]
sity
(s)]
Kind
[%]
sity
(s)]
sity
ing)
sity
(s)]
Kind
sity
(s)]
























CP-C151
Nb-
45
4.50
5.1
151.95
P-
4.50
6.7
25.95
1.3
161.83
1.3
5.00
None
























doped




doped













tin




tin













oxide-




oxide-













coated




particles













titanium




(average













oxide




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)

















CP-C152
Ta-
45
4.50
5.2
153.28

4.50
6.7
25.68
1.3
160.07
1.3
5.00






doped


















tin


















oxide-


















coated


















titanium


















oxide


















particles


















(average


















particle


















diameter:


















230 nm)

















CP-C153
P-
45
4.50
5.1
151.30
Nb-
4.50
7.0
27.00
1.3
161.17
1.3
5.00






doped




doped













tin




tin













oxide-




oxide-













coated




particles













titanium




(average













oxide




particle













particles




diameter:













(average




20 nm)












CP-C154
particle
45
4.50
5.1
150.48
Ta-
4.50
7.4
28.38
1.3
160.23
1.3
5.00






diameter:




doped













230 nm)




tin


















oxide-


















particles


















(average


















particle


















diameter:


















20 nm)












CP-C155
Nb-
45
4.50
5.1
150.28
W-
4.50
7.5
28.73
1.3
159.98
1.3
5.00






doped




doped













tin




tin













oxide-




oxide-













coated




particles













titanium




(average













oxide




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)

















CP-C156
Ta-
45
4.50
5.2
151.63

4.50
7.5
28.43
1.3
158.23
1.3
5.00






doped


















tin


















oxide-


















coated


















titanium


















oxide


















particles


















(average


















particle


















diameter:


















230 nm)

















CP-C157
W-
45
4.50
5.2
152.65
Nb-
4.50
7.0
26.72
1.3
159.38
1.3
5.00






doped




doped













tin




tin













oxide-




oxide-













coated




particles













titanium




(average













oxide




particle













particles




diameter:













(average




20 nm)












CP-C158
particle
45
4.50
5.2
151.83
Ta
4.50
7.4
28.08
1.3
158.48
1.3
5.00






diameter:




doped













230 nm)




tin


















oxide-


















particles


















(average


















particle


















diameter:


















20 nm)































TABLE 56

















(3) Binding

















material

















(phenol resin)







































Amount


















[part (s)]


















(resin


















solid


















content



















(1) A first metal
(2) A second metal

thereof




Con-
oxide particle
oxide particle

is 60%
(4) Silicone
(5) Particles except




















ductive-

Coat-
Dop-



Dop-



by mass
resin particles
(1) to (4)























layer

ing
ing

Amount

ing

Amount



Amount


Amount


coating

ratio
ratio
Den-
[part

ratio
Den-
[part
Den-
of the
Den-
[part

Den-
[part


solution
Kind
[%]
[%]
sity
(s)]
Kind
[%]
sity
(s)]
sity
following)
sity
(s)]
Kind
sity
(s)]
























CP-C159
Nb-
45
4.50
5.1
152.15
F-
4.50
6.6
25.60
1.3
162.08
1.3
5.00
None
























doped




doped













tin




tin













oxide-




oxide-













coated




particles













titanium




(average













oxide




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)

















CP-C160
Ta-
45
4.50
5.2
153.50

4.50
6.6
25.32
1.3
160.30
1.3
5.00






doped


















tin


















oxide-


















coated


















titanium


















oxide


















particles


















(average


















particle


















diameter:


















230 nm)

















CP-C161
F-
45
4.50
5.0
149.93
Nb-
4.50
7.0
27.29
1.3
162.97
1.3
5.00






doped




doped













tin




tin













oxide-




oxide-













coated




particles













titanium




(average













oxide




particle













particles




diameter:













(average




20 nm)












CP-C162
particle
45
4.50
5.0
149.10
Ta-
4.50
7.4
28.38
1.3
162.03
1.3
5.00






diameter:




doped













230 nm)




tin


















oxide-


















particles


















(average


















particle


















diameter:


















20 nm)












CP-C163
Oxygen-
45

5.1
152.00

4.50
7.0
26.00
1.3
161.67
1.3
5.00






deficient


















tin


















oxide-


















coated


















titanium


















oxide


















particles


















(average


















particle


















diameter:


















230 nm)

















CP-C164
Oxygen-
45

5.1
152.00
Nb-
4.50
7.0
26.00
1.3
161.67
1.3
5.00






deficient




doped













tin




tin













oxide-




oxide-













coated




particles













barium




(average













sulfate




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)

















CP-C165
Sb-
45
4.50
5.1
152.00

4.50
7.0
26.00
1.3
161.67
1.3
5.00






doped


















tin


















oxide-


















coated


















titanium


















oxide


















particles


















(average


















particle


















diameter:


















230 nm)































TABLE 57

















(3) Binding

















material

















(phenol resin)







































Amount


















[part (s)]


















(resin


















solid


















content



















(1) A first metal
(2) A second metal

thereof




Con-
oxide particle
oxide particle

is 60%
(4) Silicone
(5) Particles except




















ductive-

Coat-
Dop-



Dop-



by mass
resin particles
(1) to (4)























layer

ing
ing

Amount

ing

Amount

of the

Amount


Amount


coating

ratio
ratio
Den-
[part

ratio
Den-
[part
Den-
follow-
Den-
[part

Den-
[part


solution
Kind
[%]
[%]
sity
(s)]
Kind
[%]
sity
(s)]
sity
ing)
sity
(s)]
Kind
sity
(s)]
























CP-C166
Nb-
45
4.50
5.1
152.20
Oxygen-

6.6
25.60
1.3
162.00
1.3
5.00
None
























doped




deficient













tin




tin













oxide-




oxide-













coated




particles













titanium




(average













oxide




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)

















CP-C167

45
4.50
5.1
151.10
Indium
4.50
7.1
27.35
1.3
160.92
1.3
5.00











tin


















oxide-


















particles


















(average


















particle


















diameter:


















20 nm)












CP-C168

45
4.50
5.1
152.20
Sb-
4.50
6.6
25.60
1.3
162.00
1.3
5.00











doped


















tin


















oxide-


















particles


















(average


















particle


















diameter:


















20 nm)












CP-C169
Ta-
45
4.50
5.0
153.30
Nb-
4.50
7.0
25.70
1.3
160.00
1.3
5.00






doped




doped













tin




tin













oxide-




oxide-













coated




particles













titanium




(average













oxide




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)

















CP-C170
Nb-
45
4.50
5.1
150.60
Ta-
4.50
7.0
26.25
1.3
163.58
1.3
5.00






doped




doped













tin




tin













oxide-




oxide-













coated




particles













titanium




(average













oxide




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)

















CP-C171
Nb-
45
4.50
5.1
151.90
Nb-
4.50
7.0
26.00
1.3
161.83
1.3
5.00






doped




doped













tin




tin













oxide-




oxide-













coated




particles













barium




(average













sulfate




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)































TABLE 58

















(3) Binding

















material

















(phenol resin)







































Amount


















[part (s)]


















(resin


















solid


















content



















(1) A first metal
(2) A second metal

thereof




Con-
oxide particle
oxide particle

is 60%
(4) Silicone
(5) Particles except




















ductive-

Coat-
Dop-



Dop-



by mass
resin particles
(1) to (4)























layer

ing
ing

Amount

ing

Amount

of the

Amount


Amount


coating

ratio
ratio
Den-
[part

ratio
Den-
[part
Den-
follow-
Den-
[part

Den-
[part


solution
Kind
[%]
[%]
sity
(s)]
Kind
[%]
sity
(s)]
sity
ing)
sity
(s)]
Kind
sity
(s)]
























CP-C172
Oxygen-
45

5.1
152.00
Ta-
4.50
7.4
26.00
1.3
161.67
1.3
5.00
None
























deficient




doped













tin




tin













oxide-




oxide-













coated




particles













titanium




(average













oxide




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)

















CP-C173
Oxygen-
45

5.1
152.00

4.50
7.4
26.00
1.3
161.67
1.3
5.00






deficient


















tin


















oxide-


















coated


















barium


















sulfate


















particles


















(average


















particle


















diameter:


















230 nm)

















CP-C174
Sb-
45
4.50
5.1
152.00

4.50
7.4
26.00
1.3
161.67
1.3
5.00






doped


















tin


















oxide-


















coated


















titanium


















oxide


















particles


















(average


















particle


















diameter:


















230 nm)

















CP-C175
Ta-
45
4.50
5.2
152.20
Oxygen-

6.6
25.60
1.3
162.00
1.3
5.00






doped




deficent













tin




tin













oxide-




oxide-













coated




particles













titanium




(average













oxide




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)

















CP-C176

45
4.50
5.2
151.10
Indium
4.50
7.1
27.35
1.3
160.92
1.3
5.00











tin


















oxide-


















particles


















(average


















particle


















diameter:


















20 nm)












CP-C177

45
4.50
5.2
152.20
Sb-
4.50
6.6
25.60
1.3
162.00
1.3
5.00











doped


















tin


















oxide-


















particles


















(average


















particle


















diameter:


















20 nm)












CP-C178
Ta-
45
4.50
5.2
151.90
Ta-
4.50
7.0
26.00
1.3
161.83
1.3
5.00






doped




doped













tin




tin













oxide-




oxide-













coated




particles













barium




(average













sulfate




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)

















CP-C179
Oxygen-
45

5.1
152.20
Oxygen-

6.6
25.60
1.3
162.00
1.3
5.00






deficient




deficent













tin




tin













oxide-




oxide-













coated




particles













barium




(average













sulfate




particle













particles




diameter:













(average




20 nm)













particle


















diameter:


















230 nm)









Example 1
Production Example of Electrophotographic Photosensitive Member 1

An aluminum cylinder (JIS-A3003, aluminum alloy) having a length of 251.5 mm, a diameter of 24 mm, and a thickness of 1.0 mm produced by a production method including an extrusion process and a drawing process was used as a support (cylindrical support).


The conductive-layer coating solution CP-1 was applied onto the support under a 22° C./55% RH environment by dip coating, and then the resultant coating film was dried and thermally cured for 30 minutes at 140° C. to form a conductive layer having a thickness of 20 μm.


The volume resistivity of the conductive layer was measured to be 2.2×1013 Ω·cm.


Next, 4.5 parts of N-methoxymethylated nylon (trade name: Toresin EF-30T, manufactured by Teikoku Chemical Industry Co., Ltd.) and 1.5 parts of a copolymerized nylon resin (trade name: Amilan CM8000, manufactured by Toray Industries, Inc.) were dissolved in a mixed solvent of 65 parts of methanol and 30 parts of n-butanol to prepare an undercoat-layer coating solution. The undercoat-layer coating solution was applied onto the conductive layer by dip coating, and then the resultant coating film was dried for 6 minutes at 70° C. to form an undercoat layer having a thickness of 0.85 μm.


Next, 10 parts of a hydroxygallium phthalocyanine crystal (charge-generating substance) in a crystal form having strong peaks at Bragg angles)(2θ±0.2° in CuKα-characteristic X-ray diffraction of 7.5°, 9.9°, 16.3°, 18.6°, 25.1°, and 28.3°, 5 parts of a polyvinyl butyral (trade name: S-LEC BX-1, manufactured by SEKISUI CHEMICAL, CO., LTD.), and 250 parts of cyclohexanone were loaded into a sand mill using glass beads each having a diameter of 1 mm, and were then subjected to a dispersion treatment under the condition of a dispersion treatment time of 3 hours. After the dispersion treatment, 250 parts of ethyl acetate were added to the treated product to prepare a charge-generating-layer coating solution. The charge-generating-layer coating solution was applied onto the undercoat layer by dip coating, and then the resultant coating film was dried for 10 minutes at 100° C. to form a charge-generating layer having a thickness of 0.12 μm.


Next, 56 parts of an amine compound (charge-transporting substance) represented by the following formula (CT-1):




embedded image


24 parts of an amine compound (charge-transporting substance) represented by the following formula (CT-2):




embedded image


90 parts of a polycarbonate (trade name: Z200, manufactured by Mitsubishi Engineering-Plastics Corporation), 10 parts of a siloxane-modified polycarbonate having a repeating structural unit represented by the following formula (B-1) and a repeating structural unit represented by the following formula (B-2) ((B-1):(B-2)=98:2 (molar ratio)):




embedded image



and 0.9 part of a siloxane-modified polycarbonate having a repeating structural unit represented by the following formula (B-3) and a repeating structural unit represented by the following formula (B-4), and having a terminal structure represented by the following formula (B-5) ((B-3):(B-4)=95:5 (molar ratio)):




embedded image



were dissolved in a mixed solvent of 300 parts of o-xylene, 250 parts of dimethoxymethane, and 27 parts of methyl benzoate to prepare a charge-transporting-layer coating solution. The charge-transporting-layer coating solution was applied onto the charge-generating layer by dip coating, and then the resultant coating film was dried for 30 minutes at 120° C. to form a charge-transporting layer having a thickness of 18.5 μm. Thus, an electrophotographic photosensitive member 1 including the charge-transporting layer as a surface layer was produced.


With regard to the electrophotographic photosensitive member 1, the abundance ratio of phosphorus to tin oxide in the P-doped tin oxide-coated titanium oxide particles and the abundance ratio of phosphorus to tin oxide in the P-doped tin oxide particles were each determined from an atomic ratio by employing the foregoing method.


Next, the volume of the P-doped tin oxide-coated titanium oxide particles and the volume of the P-doped tin oxide particles were measured by identifying the P-doped tin oxide-coated titanium oxide particles and the P-doped tin oxide particles based on their difference in contrast of the slice and view of the FIB-SEM by employing the foregoing method. The same holds true for the following examples.


Examples 2 to 700 and Comparative Examples 1 to 179
Production Examples of Electrophotographic Photosensitive Members 2 to 700 and C1 to C179

Electrophotographic photosensitive members 2 to 700 and C1 to C179 were produced by the same operations as those of Example 1 (production example of the electrophotographic photosensitive member 1) except that the conductive-layer coating solution was changed as shown in Tables 22 to 43 and Tables 59 to 73.


(Evaluation)


An evaluation for a crack was performed by observing the surface of a conductive layer at the stage of the formation of the conductive layer on a support with an optical microscope and by observing an image output from an electrophotographic apparatus (laser beam printer) mounted with a produced electrophotographic photosensitive member.


The image observation was performed as described below.


The produced electrophotographic photosensitive member was mounted on a laser beam printer manufactured by Hewlett-Packard Company (trade name: LaserJet P2055dn) as an evaluation apparatus. The resultant was placed under a normal-temperature and normal-humidity (23° C./50% RH) environment, and then a solid black image, a solid white image, and a half-tone image of a one-dot keima pattern were output, followed by the observation of the output images. The half-tone image of a one-dot keima pattern is a half-tone image of a pattern illustrated in FIG. 5.


The degrees of the occurrence of the crack were classified into ranks based on the observation of the images and the following microscopic observation of the conductive layer as described below.


The case where the observation of the surface of the conductive layer with the optical microscope could not confirm the occurrence of any crack was defined as a rank 3. In addition, the case where the observation of the surface of the conductive layer with the optical microscope was able to confirm the occurrence of a crack but an image defect due to the crack was not observed on any one of the solid black image, the solid white image, and the half-tone image of a one-dot keima pattern was defined as a rank 2. In addition, the case where the observation of the surface of the conductive layer with the optical microscope was able to confirm the occurrence of a crack, and an image defect probably due to the crack was observed on any one of the solid black image, the solid white image, and the half-tone image of a one-dot keima pattern was defined as a rank 1. The half-tone image of a one-dot keima pattern is a half-tone image of a pattern illustrated in FIG. 5.


An evaluation for a residual potential and an evaluation for a pattern memory were also performed with a laser beam printer manufactured by Hewlett-Packard Company (trade name: LaserJet P2055dn) as an evaluation apparatus.


The evaluation for a pattern memory was performed as described below.


A produced electrophotographic photosensitive member was mounted on the laser beam printer manufactured by Hewlett-Packard Company. The resultant was placed under a low-temperature and low-humidity (15° C./7% RH) environment, and then a durability test involving continuously outputting 15,000 images of a 3-dot and 100-space vertical line pattern in a repeated manner was performed. The degrees of the occurrence of a pattern memory were classified into six ranks as shown in Table 74 according to the manner in which vertical streaks resulting from the hysteresis of the vertical lines were observed on each of four kinds of half-tone images and a solid black image shown in Table 74 output after the test. The number of the rank becomes larger as the extent to which the pattern memory is suppressed improves. It should be noted that the four kinds of half-tone images are a half-tone image of a one-dot keima pattern, a half-tone image with one-dot and one-space lateral lines, a half-tone image with two-dot and three-space lateral lines, and a half-tone image with one-dot and two-space lateral lines.


The evaluation for a residual potential was performed as described below.


Before and after the durability test, residual potentials after continuous output of three solid white images and five solid black images were measured. An increase in residual potential of 10 V or less was defined as a rank 4. In addition, an increase of more than 10 V and 20 V or less was defined as a rank 3. In addition, an increase of more than 20 V and 30 V or less was defined as a rank 2. In addition, an increase of more than 30 V was defined as a rank 1.


Tables 22 to 43 and Tables 59 to 73 show the results.


















TABLE 22













Volume







Production



resistivity






Conductive-
example of



of


















layer
electrophotographic
{(V2/VT)/
{(V1/VT)/

conductive
Result of evaluation

















coating
photosensitive
(V1/VT) ×
(V2/VT) ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 1
CP-1
1
2
15
0.8
2.2 × 1013
4
3
3


Example 2
CP-2
2
2
15
0.9
2.2 × 1013
5
3
3


Example 3
CP-3
3
2
15
1.0
2.2 × 1013
5
3
3


Example 9
CP-4
4
2
15
1.1
2.2 × 1013
5
3
3


Example 5
CP-5
5
2
15
1.2
2.2 × 1013
4
3
3


Example 6
CP-6
6
5
15
1.0
2.1 × 1013
6
3
3


Example 7
CP-7
7
13
15
0.8
2.0 × 1013
5
3
3


Example 8
CP-8
8
13
15
0.9
2.0 × 1013
6
3
3


Example 9
CP-9
9
13
15
1.0
2.0 × 1013
6
3
3


Example 10
CP-10
10
13
15
1.1
2.0 × 1013
6
3
3


Example 11
CP-11
11
13
15
1.2
2.0 × 1013
5
3
3


Example 12
CP-12
12
20
15
1.0
1.9 × 1013
6
3
3


Example 13
CP-13
13
25
15
0.8
1.8 × 1013
3
3
3


Example 14
CP-14
14
25
15
0.9
1.8 × 1013
4
3
3


Example 15
CP-15
15
25
15
1.0
1.8 × 1013
4
3
3


Example 16
CP-16
16
25
15
1.1
1.8 × 1013
4
3
3


Example 17
CP-17
17
25
15
1.2
1.8 × 1013
3
3
3


Example 18
CP-18
16
2
20
1.0
6.6 × 1012
5
4
3


Example 19
CP-19
19
5
20
0.8
6.3 × 1012
5
4
3


Example 10
CP-20
20
5
20
0.9
6.3 × 1012
6
4
3


Example 21
CP-21
21
5
20
1.0
6.3 × 1012
6
4
3


Example 22
CP-22
22
5
20
1.1
6.3 × 1012
6
4
3


Example 23
CP-23
23
5
20
1.2
6.3 × 1012
5
4
3


Example 29
CP-24
24
13
20
0.8
5.8 × 1012
5
4
3


Example 25
CP-25
25
13
20
0.9
5.8 × 1012
6
4
3


Example 26
CP-26
26
13
20
1.0
5.8 × 1012
6
4
3


Example 27
CP-27
27
13
20
1.1
5.8 × 1012
6
4
3


Example 28
CP-28
28
13
20
1.2
5.8 × 1012
5
4
3


Example 29
CP-29
29
20
20
0.8
5.4 × 1012
5
4
3


Example 30
CP-30
30
20
20
0.9
5.5 × 1012
6
4
3


Example 31
CP-31
31
20
20
1.0
5.5 × 1012
6
4
3


Example 32
CP-32
32
20
20
1.1
5.5 × 1012
6
4
3


Example 33
CP-33
33
20
20
1.2
5.5 × 1012
5
4
3


Example 34
CP-34
34
25
20
1.0
5.2 × 1012
4
4
3


Example 35
CP-35
35
2
30
0.8
3.6 × 1011
4
4
3


Example 36
CP-36
36
2
30
0.9
3.6 × 1011
5
4
3


Example 37
CP-37
37
2
30
1.0
3.6 × 1011
5
4
3


Example 38
CP-38
38
2
30
1.1
3.6 × 1011
5
4
3


Example 39
CP-39
39
2
30
1.2
3.6 × 1011
4
4
3


Example 40
CP-40
40
5
30
0.2
3.4 × 1011
5
4
3

























TABLE 23













Volume







Production



resistivity






Conductive-
example of



of


















layer
electrophotographic
{(V2/VT)/
{(V1/VT)/

conductive
Result of evaluation

















coating
photosensitive
(V1/VT) ×
(V2/VT) ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 41
CP-41
41
5
30
0.9
3.4 × 1011
6
4
3


Example 42
CP-42
42
5
30
1.0
3.4 × 1011
6
4
3


Example 43
CP-43
43
5
30
1.1
3.4 × 1011
6
4
3


Example 44
CP-44
44
5
30
1.2
3.4 × 1011
5
4
3


Example 45
CP-45
45
13
30
0.8
2.9 × 1011
5
4
3


Example 46
CP-46
46
13
30
0.9
3.0 × 1011
6
4
3


Example 47
CP-47
47
13
30
1.0
3.0 × 1011
6
4
3


Example 48
CP-48
48
13
30
1.1
3.0 × 1011
6
4
3


Example 49
CP-49
49
13
30
1.2
3.0 × 1011
5
4
3


Example 50
CP-50
50
20
30
0.8
2.6 × 1011
5
4
3


Example 51
CP-51
51
20
30
0.9
2.6 × 1011
6
4
3


Example 52
CP-52
52
20
30
1.0
2.6 × 1011
6
4
3


Example 53
CP-53
53
20
30
1.1
2.6 × 1011
6
4
3


Example 54
CP-54
54
20
30
1.2
2.6 × 1011
5
4
3


Example 55
CP-55
55
25
30
0.8
2.4 × 1011
3
4
3


Example 56
CP-56
56
25
30
0.9
2.5 × 1011
4
4
3


Example 57
CP-57
57
25
30
1.0
2.5 × 1011
4
4
3


Example 58
CP-58
56
25
30
1.1
2.5 × 1011
4
4
3


Example 59
CP-59
59
25
30
1.2
2.5 × 1011
3
4
3


Example 60
CP-60
60
2
40
1.0
7.7 × 109
5
4
3


Example 61
CP-61
61
5
40
0.8
6.9 × 109
5
4
3


Example 62
CP-62
62
5
40
0.9
7.0 × 109
6
4
3


Example 63
CP-63
63
5
40
1.0
7.0 × 109
6
4
3


Example 69
CP-64
64
5
40
1.1
7.0 × 109
6
4
3


Example 65
CP-65
65
5
40
1.2
7.0 × 109
5
4
3


Example 66
CP-66
66
13
40
0.8
5.4 × 109
5
4
3


Example 67
CP-67
67
13
40
0.9
5.5 × 109
6
4
3


Example 68
CP-68
62
13
40
1.0
5.5 × 109
6
4
3


Example 69
CP-69
69
13
40
1.1
5.5 × 109
6
4
3


Example 70
CP-70
70
13
40
1.2
5.5 × 109
5
4
3


Example 71
CP-71
71
20
40
0.8
4.5 × 109
5
4
3


Example 72
CP-72
72
20
40
0.9
4.6 × 109
6
4
3


Example 73
CP-73
73
20
40
1.0
4.6 × 109
6
4
3


Example 74
CP-74
74
20
40
1.1
4.8 × 109
6
4
3


Example 75
CP-75
75
20
40
1.2
4.6 × 109
5
4
3


Example 76
CP-76
76
25
40
1.0
4.1 × 109
4
4
3


Example 77
CP-77
77
2
45
0.8
6.4 × 108
4
4
2


Example 78
CP-78
78
2
45
0.9
6.6 × 108
5
4
2


Example 79
CP-79
79
2
45
1.0
6.6 × 108
5
4
2


Example 80
CP-80
20
2
45
1.1
6.6 × 108
5
4
2

























TABLE 24













Volume







Production



resistivity






Conductive-
example of



of


















layer
electrophotographic
{(V2/VT)/
{(V1/VT)/

conductive
Result of evaluation

















coating
photosensitive
(V1/VT) ×
(V2/VT) ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 81
CP-81
81
2
45
1.2
6.6 × 108
4
4
2


Example 82
CP-82
82
5
45
1.0
5.8 × 108
6
4
2


Example 83
CP-83
83
13
45
0.8
4.2 × 108
5
4
2


Example 84
CP-84
84
13
45
0.9
4.4 × 108
6
4
2


Example 85
CP-85
85
13
45
1.0
4.4 × 108
6
4
2


Example 86
CP-26
26
13
45
1.1
4.4 × 108
6
4
2


Example 87
CP-87
87
13
45
1.2
4.4 × 108
5
4
2


Example 88
CP-88
88
20
45
1.0
3.5 × 108
6
4
2


Example 89
CP-89
89
25
45
0.8
3.0 × 108
3
4
2


Example 90
CP-90
90
25
45
0.9
3.1 × 108
4
4
2


Example 91
CP-91
91
25
45
1.0
3.1 × 108
4
4
2


Example 92
CP-92
92
25
45
1.1
3.1 × 108
4
4
2


Example 93
CP-93
93
25
45
1.2
3.1 × 108
3
4
2


Example 94
CP-94
94
5
20
0.8
4.8 × 1012
5
4
3


Example 95
CP-95
95
5
20
0.9
4.8 × 1012
6
4
3


Example 96
CP-96
96
5
20
1.0
4.2 × 1012
6
4
3


Example 97
CP-97
97
5
20
1.1
4.8 × 1012
6
4
3


Example 98
CP-98
98
5
20
1.2
4.8 × 1012
5
4
3


Example 99
CP-99
99
13
20
0.8
4.3 × 1012
5
4
3


Example 100
CP-100
100
13
20
0.9
4.4 × 1012
6
4
3


Example 101
CP-101
101
13
20
1.0
4.4 × 1012
6
4
3


Example 102
CP-102
102
13
20
1.1
4.4 × 1012
6
4
3


Example 103
CP-103
103
13
20
1.2
4.4 × 1012
5
4
3


Example 104
CP-104
104
20
20
0.8
4.0 × 1012
5
4
3


Example 105
CP-105
105
20
20
0.9
4.1 × 1012
6
4
3


Example 106
CP-106
106
20
20
1.0
4.1 × 1012
6
4
3


Example 107
CP-107
107
20
20
1.1
4.1 × 1012
6
4
3


Example 108
CP-108
108
20
20
1.2
4.1 × 1012
5
4
3


Example 109
CP-109
109
5
30
0.8
1.7 × 1011
5
4
3


Example 110
CP-110
110
5
30
0.9
1.8 × 1011
6
4
3


Example 111
CP-111
111
5
30
1.0
1.8 × 1011
6
4
3


Example 112
CP-112
112
5
30
1.1
1.8 × 1011
6
4
3


Example 113
CP-113
113
5
30
1.2
1.2 × 1011
5
4
3


Example 114
CP-114
114
13
30
0.8
1.4 × 1011
5
4
3


Example 115
CP-115
115
13
30
0.9
1.5 × 1011
6
4
3


Example 116
CP-116
116
13
30
1.0
1.5 × 1011
6
4
3


Example 117
CP-117
117
13
30
1.1
1.5 × 1011
6
4
3


Example 118
CP-118
118
13
30
1.2
1.5 × 1011
5
4
3


Example 119
CP-119
119
20
30
0.8
1.3 × 1011
5
4
3


Example 120
CP-120
120
20
30
0.9
1.3 × 1011
6
4
3

























TABLE 25













Volume







Production



resistivity






Conductive-
example of



of


















layer
electrophotographic
{(V2/VT)/
{(V1/VT)/

conductive
Result of evaluation

















coating
photosensitive
(V1/VT) ×
(V2/VT) ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 121
CP-121
121
20
30
1.0
1.3 × 1011
6
4
3


Example 122
CP-122
122
20
30
1.1
1.3 × 1011
6
4
3


Example 123
CP-123
123
20
30
1.2
1.3 × 1011
5
4
3


Example 124
CP-124
124
5
40
0.8
1.6 × 109
5
4
3


Example 125
CP-125
125
5
40
0.9
1.6 × 109
6
4
3


Example 126
CP-126
126
5
40
1.0
1.6 × 109
6
4
3


Example 127
CP-127
127
5
40
1.1
1.6 × 109
6
4
3


Example 128
CP-128
128
5
40
1.2
1.6 × 109
5
4
3


Example 129
CP-129
129
13
40
0.8
1.2 × 109
5
4
3


Example 130
CP-130
130
13
40
0.9
1.2 × 109
6
4
3


Example 131
CP-131
131
13
40
1.0
1.2 × 109
6
4
3


Example 132
CP-132
132
13
40
1.1
1.2 × 109
6
4
3


Example 133
CP-133
133
13
40
1.2
1.2 × 109
5
4
3


Example 134
CP-134
134
20
40
0.8
9.5 × 108
5
4
3


Example 135
CP-135
135
20
40
0.9
9.9 × 108
6
4
3


Example 136
CP-136
136
20
40
1.0
9.9 × 108
6
4
3


Example 137
CP-137
137
20
40
1.1
9.9 × 108
6
4
3


Example 138
CP-138
138
20
40
1.2
9.9 × 108
5
4
3


Example 139
CP-139
139
13
30
1.0
2.5 × 1011
6
4
3


Example 140
CP-140
140
13
30
1.0
5.5 × 1011
6
4
3

























TABLE 26













Volume







Production



resistivity






Conductive-
example of



of


















layer
electrophotographic
{(V2/VT)/
{(V1/VT)/

conductive
Result of evaluation

















coating
photosensitive
(V1/VT) ×
(V2/VT) ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω · cm]
memory
potential
Crack





Comparative Example 1
CP-C1
C1



2.2 × 1013
1
3
3


Comparative Example 2
CP-C2
C2



3.8 × 1011
1
4
3


Comparative Example 3
CP-C3
C3



7.1 × 108
1
4
2


Comparative Example 9
CP-C4
C4
1
15
1.0
2.2 × 1013
2
3
3


Comparative Example 5
CP-C5
C5
1
30
1.0
3.7 × 1011
2
4
3


Comparative Example 6
CP-C6
C6
1
45
1.2
6.8 × 108
2
4
2


Comparative Example 7
CP-C7
C7
30
15
1.0
1.8 × 1013
2
3
3


Comparative Example 8
CP-C8
C8
30
30
1.0
2.3 × 1011
2
4
3


Comparative Example 9
CP-C9
C9
30
45
1.0
2.7 × 108
2
4
2


Comparative Example 10
CP-C10
C10



9.0 × 1012
1
3
3


Comparative Example 11
CP-C11
C11



4.3 × 1010
1
4
3


Comparative Example 12
CP-C12
C12



1.1 × 107
1
4
2


Comparative Example 13
CP-C13
C13
2
10
1.0
6.3 × 1013
5
1
3


Comparative Example 14
CP-C14
C14
5
10
1.0
6.2 × 1013
6
1
3


Comparative Example 15
CP-C15
C15
13
10
1.0
5.9 × 1013
6
1
3


Comparative Example 16
CP-C16
C16
20
10
1.0
5.8 × 1013
6
1
3


Comparative Example 17
CP-C17
C17
25
10
1.0
5.7 × 1013
4
1
3


Comparative Example 18
CP-C18
C18
2
50
1.0
3.4 × 107
5
4
1


Comparative Example 19
CP-C19
C19
5
50
1.0
3.0 × 107
6
4
1


Comparative Example 20
CP-C20
C20
13
50
1.0
2.1 × 107
6
4
1


Comparative Example 21
CP-C21
C21
20
50
1.0
1.6 × 107
6
4
1


Comparative Example 22
CP-C22
C22
25
50
1.0
1.4 × 107
4
4
1

























TABLE 27













Volume







Production



resistivity






Conductive-
example of



of


















layer
electrophotographic
{(V2/VT)/
{(V1/VT)/

conductive
Result of evaluation

















coating
photosensitive
(V1/VT) ×
(V2/VT) ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω · cm]
memory
potential
Crack





Comparative Example 23
CP-023
C23



2.9 × 1011
1
4
3


Comparative Example 29
CP-C24
C24



2.9 × 1011
1
4
3


Comparative Example 25
CP-C25
C25



2.9 × 1011
1
4
3


Comparative Example 26
CP-C26
C26



3.0 × 1011
1
4
3


Comparative Example 27
CP-C27
C27



2.8 × 1011
1
4
3


Comparative Example 28
CP-020
C28



3.0 × 1011
1
4
3


Comparative Example 29
CP-C29
C29



2.6 × 1011
1
4
3

























TABLE 28













Volume







Production



resistivity






Conductive-
example of



of


















layer
electrophotographic
{(V2/VT)/
{(V1/VT)/

conductive
Result of evaluation

















coating
photosensitive
(V1/VT) ×
(V2/VT) ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω · cm]
memory
potential
Crack





Comparative Example 30
CP-C3C
C30



3.3 × 1011
1
4
3


Comparative Example 31
CP-C31
C31



2.6 × 1011
1
4
3


Comparative Example 32
CP-C32
C32



3.0 × 1011
1
4
3


Comparative Example 33
CP-C33
C33



3.0 × 1011
1
4
3


Comparative Example 34
CP-C34
C34



3.0 × 1011
1
4
3


Comparative Example 35
CP-C35
C35



3.0 × 1011
1
4
3

























TABLE 29













Volume







Production



resistivity






Conductive-
example of



of


















layer
electrophotographic
{(V2/VT)/
{(V1/VT)/

conductive
Result of evaluation

















coating
photosensitive
(V1/VT) ×
(V2/VT) ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 141
CP-141
141
2
15
0.9
2.0 × 1013
4
3
3


Example 142
CP-142
142
2
15
0.9
2.0 × 1013
5
3
3


Example 143
CP-143
143
2
15
1.0
2.0 × 1013
5
3
3


Example 144
CP-144
144
2
15
1.1
2.0 × 1013
5
3
3


Example 145
CP-145
145
2
15
1.2
2.0 × 1013
4
3
3


Example 146
CP-146
146
5
15
1.0
2.0 × 1013
6
3
3


Example 147
CP-147
147
13
15
0.8
1.8 × 1013
5
3
3


Example 148
CP-148
143
13
15
0.9
1.8 × 1013
6
3
3


Example 149
CP-149
149
13
15
1.0
1.8 × 1013
6
3
3


Example 150
CP-150
150
13
15
1.1
1.8 × 1013
6
3
3


Example 151
CP-151
151
13
15
1.2
1.8 × 1013
5
3
3


Example 152
CP-152
152
20
15
1.0
1.7 × 1013
6
3
3


Example 153
CP-153
153
25
15
0.8
1.6 × 1013
3
3
3


Example 154
CP-154
154
25
15
0.9
1.6 × 1013
4
3
3


Example 155
CP-155
155
25
15
1.0
1.6 × 1013
4
3
3


Example 156
CP-156
156
25
15
1.1
1.6 × 1013
4
3
3


Example 157
CP-157
157
25
15
1.2
1.6 × 1013
3
3
3


Example 158
CP-158
158
2
20
1.0
6.0 × 1012
5
4
3


Example 159
CP-159
159
5
20
0.8
5.8 × 1012
5
4
3


Example 160
CP-160
160
5
20
0.9
5.7 × 1012
6
4
3


Example 161
CP-161
161
5
20
1.0
5.7 × 1012
6
4
3


Example 162
CP-162
162
5
20
1.1
5.7 × 1012
6
4
3


Example 163
CP-163
163
5
20
1.2
5.7 × 1012
5
4
3


Example 164
CP-164
164
13
20
0.8
5.1 × 1012
5
4
3


Example 165
CP-165
165
13
20
0.9
5.1 × 1012
6
4
3


Example 166
CP-166
166
13
20
1.0
5.1 × 1012
6
4
3


Example 167
CP-167
167
13
20
1.1
5.0 × 1012
6
4
3


Example 168
CP-168
168
13
20
1.2
5.0 × 1012
5
4
3


Example 169
CP-169
169
20
20
0.8
4.7 × 1012
5
4
3


Example 170
CP-170
170
20
20
0.9
4.6 × 1012
6
4
3


Example 171
CP-171
171
20
20
1.0
4.6 × 1012
6
4
3


Example 172
CP-172
172
20
20
1.1
4.5 × 1012
6
4
3


Example 173
CP-173
173
20
20
1.2
4.5 × 1012
5
4
3


Example 174
CP-174
174
25
20
1.0
4.3 × 1012
4
4
3


Example 175
CP-175
175
2
30
0.8
3.1 × 1011
4
4
3


Example 176
CP-176
176
2
30
0.9
3.1 × 1011
5
4
3


Example 177
CP-177
177
2
30
1.0
3.1 × 1011
5
4
3


Example 178
CP-178
178
2
30
1.1
3.1 × 1011
5
4
3


Example 179
CP-179
179
2
30
1.2
3.1 × 1011
4
4
3


Example 180
CP-180
180
5
30
0.B
2.9 × 1011
5
4
3

























TABLE 30













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 181
CP-181
181
5
30
0.9
2.9 × 1011
6
4
3


Example 182
CP-182
182
5
30
1.0
2.9 × 1011
6
4
3


Example 183
CP-183
183
5
30
1.1
2.9 × 1011
6
4
3


Example 189
CP-184
184
5
30
1.2
2.9 × 1011
5
4
3


Example 185
CP-185
185
13
30
0.8
2.4 × 1011
5
4
3


Example 186
CP-186
196
13
30
0.9
2.3 × 1011
6
4
3


Example 187
CP-187
187
13
30
1.0
2.3 × 1011
6
4
3


Example 188
CP-188
183
13
30
1.1
2.3 × 1011
6
4
3


Example 189
CP-189
189
13
30
1.2
2.3 × 1011
5
4
3


Example 190
CP-190
190
20
30
0.8
2.0 × 1011
5
4
3


Example 191
CP-191
191
20
30
0.9
2.0 × 1011
6
4
3


Example 192
CP-192
192
20
30
1.0
2.0 × 1011
6
4
3


Example 193
CP-193
193
20
30
1.1
1.9 × 1011
6
4
3


Example 194
CP-194
194
20
30
1.2
1.9 × 1011
5
4
3


Example 195
CP-195
195
25
30
0.8
1.8 × 1011
3
4
3


Example 196
CP-196
196
25
30
0.9
1.8 × 1011
4
4
3


Example 197
CP-197
197
25
30
1.0
1.8 × 1011
4
4
3


Example 198
CP-198
198
25
30
1.1
1.7 × 1011
4
4
3


Example 199
CP-199
199
25
30
1.2
1.7 × 1011
3
4
3


Example 200
CP-200
200
2
40
1.0
6.0 × 109
5
4
3


Example 201
CP-201
201
5
40
0.8
5.3 × 109
5
4
3


Example 202
CP-202
202
5
40
0.9
5.3 × 109
6
4
3


Example 203
CP-203
203
5
40
1.0
5.3 × 109
6
4
3


Example 209
CP-204
204
5
40
1.1
5.2 × 109
6
4
3


Example 205
CP-205
205
5
40
1.2
5.2 × 109
5
4
3


Example 206
CP-206
206
13
40
0.8
3.9 × 109
5
4
3


Example 207
CP-207
207
13
40
0.9
3.8 × 109
6
4
3


Example 208
CP-208
208
13
40
1.0
3.9 × 109
6
4
3


Example 209
CP-209
209
13
40
1.1
3.7 × 109
6
4
3


Example 210
CP-210
210
13
40
1.2
3.7 × 109
5
4
3


Example 211
CP-211
211
20
40
0.8
3.1 × 109
5
4
3


Example 212
CP-212
212
20
40
0.9
3.0 × 109
6
4
3


Example 213
CP-213
213
20
40
1.0
3.0 × 109
6
4
3


Example 214
CP-214
214
20
40
1.1
2.9 × 109
6
4
3


Example 215
CP-215
215
20
40
1.2
2.9 × 109
5
4
3


Example 216
CP-216
216
25
40
1.0
2.5 × 109
4
4
3


Example 217
CP-217
217
2
45
0.8
4.9 × 108
4
4
2


Example 218
CP-218
218
2
45
0.9
4.9 × 108
5
4
2


Example 219
CP-219
219
2
45
1.0
4.9 × 108
5
4
2


Example 220
CP-220
220
2
45
1.1
4.9 × 108
5
4
2

























TABLE 31













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 221
CP-221
221
2
45
1.2
4.9 × 108
4
4
2


Example 222
CP-222
222
5
45
1.0
4.2 × 108
6
4
2


Example 223
CP-223
223
13
45
0.8
2.9 × 108
5
4
2


Example 224
CP-224
224
13
45
0.9
2.8 × 108
6
4
2


Example 225
CP-225
225
13
45
1.0
2.8 × 108
6
4
2


Example 226
CP-226
226
13
45
1.1
2.7 × 108
6
4
2


Example 227
CP-227
227
13
45
1.2
2.7 × 108
5
4
2


Example 228
CP-228
228
20
45
1.0
2.0 × 108
6
4
2


Example 229
CP-229
229
25
45
0.8
1.8 × 108
3
4
2


Example 230
CP-230
230
25
45
0.9
1.7 × 108
4
4
2


Example 231
CP-231
231
25
45
1.0
1.7 × 108
4
4
2


Example 232
CP-232
232
25
45
1.1
1.6 × 108
4
4
2


Example 233
CP-233
233
25
45
1.2
1.6 × 108
3
4
2

























TABLE 32













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 234
CP-234
234
5
20
0.8
4.3 × 1012
5
4
3


Example 235
CP-235
235
5
20
0.9
4.3 × 1012
6
4
3


Example 236
CP-236
236
5
20
1.0
4.3 × 1012
6
4
3


Example 237
CP-237
237
5
20
1.1
4.3 × 1012
6
4
3


Example 238
CP-238
238
5
20
1.2
4.3 × 1012
5
4
3


Example 239
CP-239
239
13
20
0.8
3.8 × 1012
5
4
3


Example 240
CP-240
240
13
20
0.9
3.7 × 1012
6
4
3


Example 241
CP-241
241
13
20
1.0
3.7 × 1012
6
4
3


Example 242
CP-242
242
13
20
1.1
3.7 × 1012
6
4
3


Example 243
CP-243
243
13
20
1.2
3.7 × 1012
5
4
3


Example 244
CP-244
244
20
20
0.8
3.4 × 1012
5
4
3


Example 245
CP-245
245
20
20
0.9
3.4 × 1012
6
4
3


Example 246
CP-246
246
20
20
1.0
3.4 × 1012
6
4
3


Example 247
CP-247
247
20
20
1.1
3.3 × 1012
6
4
3


Example 248
CP-248
243
20
20
1.2
3.3 × 1012
5
4
3


Example 249
CP-249
249
5
30
0.8
1.4 × 1011
5
4
3


Example 250
CP-250
250
5
30
0.9
1.4 × 1011
6
4
3


Example 251
CP-251
251
5
30
1.0
1.4 × 1011
6
4
3


Example 252
CP-252
252
5
30
1.1
1.4 × 1011
6
4
3


Example 253
CP-253
253
5
30
1.2
1.4 × 1011
5
4
3


Example 254
CP-254
254
13
30
0.8
1.1 × 1011
5
4
3


Example 255
CP-255
255
13
30
0.9
1.1 × 1011
6
4
3


Example 256
CP-256
256
13
30
1.0
1.1 × 1011
6
4
3


Example 257
CP-257
257
13
30
1.1
1.1 × 1011
6
4
3


Example 258
CP-258
258
13
30
1.2
1.1 × 1011
5
4
3


Example 259
CP-259
259
20
30
0.8
9.5 × 1010
5
4
3


Example 260
CP-260
260
20
30
0.9
9.2 × 1010
6
4
3


Example 261
CP-261
261
20
30
1.0
9.2 × 1010
6
4
3


Example 262
CP-262
262
20
30
1.1
9.0 × 1010
6
4
3


Example 263
CP-263
263
20
30
1.2
9.0 × 1010
5
4
3


Example 269
CP-264
264
5
40
0.8
1.2 × 109
5
4
3


Example 265
CP-265
265
5
40
0.9
1.2 × 109
6
4
3


Example 266
CP-266
266
5
40
1.0
1.2 × 109
6
4
3


Example 267
CP-267
267
5
40
1.1
1.1 × 109
6
4
3


Example 268
CP-268
268
5
40
1.2
1.1 × 109
5
4
3


Example 269
CP-269
269
13
40
0.8
7.9 × 108
5
4
3


Example 270
CP-270
270
13
40
0.9
7.6 × 108
6
4
3

























TABLE 33













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack





Example 271
CP-271
271
13
40
1.0
7.6 × 108
6
4
3


Example 272
CP-272
272
13
40
1.1
7.3 × 108
6
4
3


Example 273
CP-273
273
13
40
1.2
7.3 × 108
5
4
3


Example 274
CP-274
274
20
40
0.8
5.9 × 108
5
4
3


Example 275
CP-275
275
20
40
0.9
5.6 × 108
6
4
3


Example 276
CP-276
276
20
40
1.0
5.6 × 108
6
4
3


Example 277
CP-277
277
20
40
1.1
5.3 × 108
6
4
3


Example 278
CP-278
278
20
40
1.2
5.3 × 108
5
4
3


Example 279
CP-279
279
13
30
1.0
2.1 × 1011
6
4
3


Example 280
CP-280
280
13
30
1.0
5.1 × 1011
6
4
3























TABLE 34













Volume









resistivity of





Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack





Comparative Example 42
CP-C42
C42



2.1 × 1013
1
3
3


Comparative Example 43
CP-C43
C43



3.3 × 1011
1
4
3


Comparative Example 44
CP-C44
C44



5.5 × 108
1
4
2


Comparative Example 45
CP-C45
C45
1
15
1.0
2.1 × 1013
2
3
3


Comparative Example 46
CP-C46
C46
1
30
1.0
3.2 × 1011
2
4
3


Comparative Example 47
CP-C47
C47
1
45
1.0
5.2 × 108
2
4
2


Comparative Example 48
CP-C48
C48
30
15
1.0
1.6 × 1013
2
3
3


Comparative Example 49
CP-C49
C49
30
30
1.0
1.6 × 1011
2
4
3


Comparative Example 50
CP-C50
C50
30
45
1.0
1.4 × 108
2
4
2


Comparative Example 51
CP-C51
C51



5.8 × 1012
1
3
3


Comparative Example 52
CP-C52
C52



1.5 × 1010
1
4
3


Comparative Example 53
CP-C53
C53



1.5 × 106
1
4
2


Comparative Example 54
CP-C54
C54
2
10
1.0
6.0 × 1013
5
1
3


Comparative Example 55
CP-C55
C55
5
10
1.0
5.9 × 1013
6
1
3


Comparative Example 56
CP-C56
C56
13
10
1.0
5.6 × 1013
6
1
3


Comparative Example 57
CP-C57
C57
20
10
1.0
5.4 × 1013
6
1
3


Comparative Example 58
CP-C58
C58
25
10
1.0
5.2 × 1013
4
1
3


Comparative Example 59
CP-C59
C59
2
50
1.0
2.4 × 107
5
4
1


Comparative Example 60
CP-C60
C60
5
50
1.0
2.0 × 107
6
4
1


Comparative Example 61
CP-C61
C61
13
50
1.0
1.2 × 107
6
4
1


Comparative Example 62
CP-C62
C62
20
50
1.0
8.3 × 106
6
4
1


Comparative Example 63
CP-C63
C63
25
50
1.0
6.5 × 106
4
4
1

























TABLE 35













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack





Comparative Example 64
CP-C64
C64



2.6 × 1011
1
4
3


Comparative Example 65
CP-C65
C65



2.6 × 1011
1
4
3


Comparative Example 66
CP-C66
C66



2.3 × 1011
1
4
3


Comparative Example 67
CP-C67
C67



2.7 × 1011
1
4
3


Comparative Example 68
CP-C68
C68



2.5 × 1011
1
4
3


Comparative Example 69
CP-C69
C69



2.7 × 1011
1
4
3


Comparative Example 70
CP-C70
C70



3.0 × 1011
1
4
3


Comparative Example 71
CP-C71
C71



2.3 × 1011
1
4
3

























TABLE 36













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 281
CP-281
281
2
15
0.8
2.3 × 1013
4
3
3


Example 282
CP-282
282
2
15
0.9
2.3 × 1013
5
3
3


Example 283
CP-283
283
2
15
1.0
2.3 × 1013
5
3
3


Example 289
CP-284
284
2
15
1.1
2.3 × 1013
5
3
3


Example 285
CP-285
285
2
15
1.2
2.3 × 1013
4
3
3


Example 286
CP-286
286
5
15
1.0
2.2 × 1013
6
3
3


Example 287
CP-287
287
13
15
0.8
2.1 × 1013
5
3
3


Example 288
CP-288
283
13
15
0.9
2.1 × 1013
6
3
3


Example 289
CP-289
289
13
15
1.0
2.1 × 1013
6
3
3


Example 290
CP-290
290
13
15
1.1
2.1 × 1013
6
3
3


Example 291
CP-291
291
13
15
1.2
2.1 × 1013
5
3
3


Example 292
CP-292
292
20
15
1.0
2.0 × 1013
6
3
3


Example 293
CP-293
293
25
15
0.8
1.9 × 1013
3
3
3


Example 294
CP-294
294
25
15
0.9
1.9 × 1013
4
3
3


Example 295
CP-295
295
25
15
1.0
2.0 × 1013
4
3
3


Example 296
CP-296
296
25
15
1.1
2.0 × 1013
4
3
3


Example 297
CP-297
297
25
15
1.2
2.0 × 1013
3
3
3


Example 298
CP-290
298
2
20
1.0
7.1 × 1012
5
4
3


Example 299
CP-299
299
5
20
0.8
6.9 × 1012
5
4
3


Example 300
CP-300
300
5
20
0.9
6.9 × 1012
6
4
3


Example 301
CP-301
301
5
20
1.0
6.9 × 1012
6
4
3


Example 302
CP-302
302
5
20
1.1
6.9 × 1012
6
4
3


Example 303
CP-303
303
5
20
1.2
6.9 × 1012
5
4
3


Example 309
CP-304
304
13
20
0.8
6.3 × 1012
5
4
3


Example 305
CP-305
305
13
20
0.9
6.3 × 1012
6
4
3


Example 306
CP-306
306
13
20
1.0
6.3 × 1012
6
4
3


Example 307
CP-307
307
13
20
1.1
6.3 × 1012
6
4
3


Example 308
CP-300
308
13
20
1.2
6.3 × 1012
5
4
3


Example 309
CP-309
309
20
20
0.8
5.8 × 1012
5
4
3


Example 310
CP-310
310
20
20
0.9
5.8 × 1012
6
4
3


Example 311
CP-311
311
20
20
1.0
5.9 × 1012
6
4
3


Example 312
CP-312
312
20
20
1.1
5.9 × 1012
6
4
3


Example 313
CP-313
313
20
20
1.2
5.9 × 1012
5
4
3


Example 314
CP-314
314
25
20
1.0
5.7 × 1012
4
4
3


Example 315
CP-315
315
2
30
0.8
4.1 × 1011
4
4
3


Example 316
CP-316
316
2
30
0.9
4.1 × 1011
5
4
3


Example 317
CP-317
317
2
30
1.0
4.2 × 1011
5
4
3


Example 318
CP-318
318
2
30
1.1
4.2 × 1011
5
4
3


Example 319
CP-319
319
2
30
1.2
4.2 × 1011
4
4
3


Example 320
CP-320
320
5
30
0.6
3.9 × 1011
5
4
3

























TABLE 37













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 321
CP-321
321
5
30
0.9
3.9 × 1011
6
4
3


Example 322
CP-322
322
5
30
1.0
3.9 × 1011
6
4
3


Example 323
CP-323
323
5
30
1.1
3.9 × 1011
6
4
3


Example 329
CP-324
324
5
30
1.2
3.9 × 1011
5
4
3


Example 325
CP-325
325
13
30
0.8
3.3 × 1011
5
4
3


Example 326
CP-326
326
13
30
0.9
3.3 × 1011
6
4
3


Example 327
CP-327
327
13
30
1.0
3.4 × 1011
6
4
3


Example 328
CP-328
323
13
30
1.1
3.4 × 1011
6
4
3


Example 329
CP-329
329
13
30
1.2
3.4 × 1011
5
4
3


Example 330
CP-330
330
20
30
0.8
3.0 × 1011
5
4
3


Example 331
CP-331
331
20
30
0.9
3.0 × 1011
6
4
3


Example 332
CP-332
332
20
30
1.0
3.0 × 1011
6
4
3


Example 333
CP-333
333
20
30
1.1
3.0 × 1011
6
4
3


Example 334
CP-334
334
20
30
1.2
3.0 × 1011
5
4
3


Example 335
CP-335
335
25
30
0.8
2.7 × 1011
3
4
3


Example 336
CP-336
336
25
30
0.9
2.7 × 1011
4
4
3


Example 337
CP-337
337
25
30
1.0
2.8 × 1011
4
4
3


Example 338
CP-330
338
25
30
1.1
2.8 × 1011
4
4
3


Example 339
CP-339
339
25
30
1.2
2.8 × 1011
3
4
3


Example 340
CP-340
340
2
40
1.0
9.5 × 109
5
4
3


Example 341
CP-341
341
5
40
0.8
8.4 × 109
5
4
3


Example 342
CP-342
342
5
40
0.9
8.4 × 109
6
4
3


Example 343
CP-343
343
5
40
1.0
8.6 × 109
6
4
3


Example 349
CP-344
344
5
40
1.1
8.6 × 109
6
4
3


Example 345
CP-345
345
5
40
1.2
8.6 × 109
5
4
3


Example 346
CP-346
346
13
40
0.8
6.7 × 109
5
4
3


Example 347
CP-347
347
13
40
0.9
6.7 × 109
6
4
3


Example 348
CP-340
348
13
40
1.0
6.0 × 109
6
4
3


Example 349
CP-349
349
13
40
1.1
6.0 × 109
6
4
3


Example 350
CP-350
350
13
40
1.2
6.8 × 109
5
4
3


Example 351
CP-351
351
20
40
0.8
5.6 × 109
5
4
3


Example 352
CP-352
352
20
40
0.9
5.6 × 109
6
4
3


Example 353
CP-353
353
20
40
1.0
5.7 × 109
6
4
3


Example 354
CP-354
354
20
40
1.1
5.7 × 109
6
4
3


Example 355
CP-355
355
20
40
1.2
5.7 × 109
5
4
3


Example 356
CP-356
356
25
40
1.0
5.1 × 109
4
4
3


Example 357
CP-357
357
2
45
0.8
8.4 × 108
4
4
2


Example 358
CP-358
358
2
45
0.9
8.4 × 108
5
4
2


Example 359
CP-359
359
2
45
1.0
8.5 × 108
5
4
2


Example 360
CP-360
360
2
45
1.1
8.5 × 108
5
4
2

























TABLE 38













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 361
CP-361
361
2
45
1.2
8.5 × 108
4
4
2


Example 362
CP-362
362
5
45
1.0
7.6 × 108
6
4
2


Example 363
CP-363
363
13
45
0.8
5.6 × 108
5
4
2


Example 364
CP-364
364
13
45
0.9
5.6 × 108
6
4
2


Example 365
CP-365
365
13
45
1.0
5.7 × 108
6
4
2


Example 366
CP-366
366
13
45
1.1
5.7 × 108
6
4
2


Example 367
CP-367
367
13
45
1.2
5.7 × 108
5
4
2


Example 368
CP-368
368
20
45
1.0
4.7 × 108
6
4
2


Example 369
CP-369
369
25
45
0.8
3.8 × 108
3
4
2


Example 370
CP-370
370
25
45
0.9
3.8 × 108
4
4
2


Example 371
CP-371
371
25
45
1.0
4.1 × 108
4
4
2


Example 372
CP-372
372
25
45
1.1
4.1 × 108
4
4
2


Example 373
CP-373
373
25
45
1.2
4.1 × 108
3
4
2

























TABLE 39













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 374
CP-374
374
5
20
0.8
5.2 × 1012
5
4
3


Example 375
CP-375
375
5
20
0.9
5.2 × 1012
6
4
3


Example 376
CP-376
376
5
20
1.0
5.2 × 1012
6
4
3


Example 377
CP-377
377
5
20
1.1
5.2 × 1012
6
4
3


Example 378
CP-378
378
5
20
1.2
5.2 × 1012
5
4
3


Example 379
CP-379
379
13
20
0.9
4.7 × 1012
5
4
3


Example 380
CP-380
380
13
20
0.9
4.7 × 1012
6
4
3


Example 381
CP-381
381
13
20
1.0
4.8 × 1012
6
4
3


Example 382
CP-382
382
13
20
1.1
4.8 × 1012
6
4
3


Example 383
CP-383
383
13
20
1.2
4.2 × 1012
5
4
3


Example 384
CP-384
384
20
20
0.6
4.4 × 1012
5
4
3


Example 385
CP-385
385
20
20
0.9
4.4 × 1012
6
4
3


Example 386
CP-386
386
20
20
1.0
4.4 × 1012
6
4
3


Example 387
CP-387
387
20
20
1.1
4.4 × 1012
6
4
3


Example 388
CP-388
388
20
20
1.2
4.4 × 1012
5
4
3


Example 389
CP-389
399
5
30
0.8
2.0 × 1011
5
4
3


Example 390
CP-390
390
5
30
0.9
2.0 × 1011
6
4
3


Example 391
CP-391
391
5
30
1.0
2.1 × 1011
6
4
3


Example 392
CP-392
392
5
30
1.1
2.1 × 1011
6
4
3


Example 393
CP-393
393
5
30
1.2
2.1 × 1011
5
4
3


Example 394
CP-394
394
13
30
0.8
1.7 × 1011
5
4
3


Example 395
CP-395
395
13
30
0.9
1.7 × 1011
6
4
3


Example 396
CP-396
396
13
30
1.0
1.7 × 1011
6
4
3


Example 397
CP-397
397
13
30
1.1
1.7 × 1011
6
4
3


Example 398
CP-398
393
13
30
1.2
1.7 × 1011
5
4
3


Example 399
CP-399
399
20
30
0.8
1.5 × 1011
5
4
3


Example 400
CP-400
400
20
30
0.9
1.5 × 1011
6
4
3


Example 401
CP-401
401
20
30
1.0
1.5 × 1011
6
4
3


Example 402
CP-402
402
20
30
1.1
1.5 × 1011
6
4
3


Example 403
CP-403
403
20
30
1.2
1.5 × 1011
5
4
3


Example 404
CP-404
404
5
40
0.8
2.1 × 109
5
4
3

























TABLE 40













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 405
CP-405
405
5
40
0.9
2.1 × 109
6
4
3


Example 406
CP-406
406
5
40
1.0
2.1 × 109
6
4
3


Example 407
CP-407
407
5
40
1.1
2.1 × 109
6
4
3


Example 408
CP-408
408
5
40
1.2
2.1 × 109
5
4
3


Example 409
CP-409
409
13
40
0.8
1.6 × 109
5
4
3


Example 410
CP-410
410
13
40
0.9
1.6 × 109
6
4
3


Example 411
CP-411
411
13
40
1.0
1.6 × 109
6
4
3


Example 412
CP-412
412
13
40
1.1
1.6 × 109
6
4
3


Example 413
CP-413
413
13
40
1.2
1.6 × 109
5
4
3


Example 414
CP-414
414
20
40
0.8
1.2 × 109
5
4
3


Example 415
CP-415
415
20
40
0.9
1.2 × 109
6
4
3


Example 416
CP-416
416
20
40
1.0
1.3 × 109
6
4
3


Example 417
CP-417
417
20
40
1.1
1.3 × 109
6
4
3


Example 418
CP-418
418
20
40
1.2
1.3 × 109
5
4
3


Example 419
CP-419
419
13
30
1.0
2.7 × 1011
6
4
3


Example 420
CP-420
420
13
30
1.0
5.8 × 1011
6
4
3

























TABLE 41













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack





Comparative Example 76
CP-C76
C76



2.3 × 1013
1
3
3


Comparative Example 77
CP-C77
C77



4.4 × 1011
1
4
3


Comparative Example 78
CP-C78
C73



9.2 × 108
1
4
2


Comparative Example 79
CP-C79
C79
1
15
1.0
2.3 × 1013
2
3
3


Comparative Example 80
CP-C80
C80
1
30
1.0
4.3 × 1011
2
4
3


Comparative Example 81
CP-C81
C81
1
45
1.2
2.8 × 108
2
4
2


Comparative Example 82
CP-C82
C82
30
15
1.0
1.9 × 1013
2
3
3


Comparative Example 83
CP-C83
C83
30
30
1.0
2.6 × 1011
2
4
3


Comparative Example 84
CP-C84
C84
30
45
1.0
3.5 × 108
2
4
2


Comparative Example 85
CP-C85
C85



9.6 × 1012
1
3
3


Comparative Example 86
CP-C86
C86



5.0 × 1010
1
4
3


Comparative Example 87
CP-C87
C87



1.5 × 107
1
4
2


Comparative Example 88
CP-C88
C83
2
10
1.0
6.5 × 1013
5
1
3


Comparative Example 89
CP-C89
C89
5
10
1.0
6.4 × 1013
6
1
3


Comparative Example 90
CP-C90
C90
13
10
1.0
6.1 × 1013
6
1
3


Comparative Example 91
CP-C91
C91
20
10
1.0
6.0 × 1013
6
1
3


Comparative Example 92
CP-C92
C92
25
10
1.0
5.8 × 1013
4
1
3


Comparative Example 93
CP-C93
C93
2
50
1.0
4.8 × 107
5
4
1


Comparative Example 94
CP-C94
C94
5
50
1.0
4.1 × 107
6
4
1


Comparative Example 95
CP-C95
C95
13
50
1.0
2.9 × 107
6
4
1


Comparative Example 96
CP-C96
C96
20
50
1.0
2.2 × 107
6
4
1


Comparative Example 97
CP-C97
C97
25
50
1.0
1.9 × 107
4
4
1

























TABLE 42













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack





Comparative Example 98
CP-C98
C98



3.0 × 1011
1
4
3


Comparative Example 99
CP-C99
C99



3.0 × 1011
1
4
3


Comparative Example 100
CP-C100
C100



2.7 × 1011
1
4
3


Comparative Example 101
CP-C101
C101



3.4 × 1011
1
4
3


Comparative Example 102
CP-C102
C102



3.1 × 1011
1
4
3


Comparative Example 103
CP-C103
C103



3.4 × 1011
1
4
3


Comparative Example 109
CP-C104
C104



2.7 × 1011
1
4
3


Comparative Example 105
CP-C105
C105



3.4 × 1011
1
4
3

























TABLE 43













Volume























resistivity of





Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack





Comparative Example 36
CP-C36
C36



8.0 × 106
1
4
3


Comparative Example 37
CP-C37
C37



1.0 × 107
1
4
3


Comparative Example 38
CP-C38
C38



4.4 × 1010
1
4
3


Comparative Example 39
CP-C39
C39



2.0 × 1013
1
4
3


Comparative Example 40
CP-C40
C40



2.1 × 109
1
4
3


Comparative Example 41
CP-C41
C41



3.1 × 109
1
4
3


Comparative Example 72
CP-C72
C72



3.5 × 1010
1
4
3


Comparative Example 73
CP-C73
C73



2.0 × 1013
1
4
3


Comparative Example 74
CP-C74
C74



4.0 × 109
1
4
3


Comparative Example 75
CP-C75
C75



5.8 × 109
1
4
3


Comparative Example 106
CP-C106
C106



3.5 × 1010
1
4
3

























TABLE 59













Volume











resistivity of



















Production example of



conductive
Result of evaluation

















Conductive-layer
electrophotographic
{(V2/VT)/(V1/
{(V1/VT)/(V2/

layer
Pattern
Residual




coating solution
photosensitive member
VT)} × 100
VT)} × 100
R2/R1
[Ω · cm]
memory
potential
Crack



















Example 421
CP-421
421
2
15
0.9
2.2 × 1013
4
3
3


Example 422
CP-422
422
2
15
0.9
2.2 × 1013
5
3
3


Example 423
CP-423
423
2
15
1.0
2.2 × 1013
5
3
3


Example 429
CP-424
424
2
15
1.1
2.2 × 1013
5
3
3


Example 425
CP-425
425
2
15
1.2
2.2 × 1013
4
3
3


Example 426
CP-426
426
5
15
1.0
2.1 × 1013
6
3
3


Example 427
CP-427
427
13
15
0.8
2.0 × 1013
5
3
3


Example 428
CP-428
423
13
15
0.9
2.0 × 1013
6
3
3


Example 429
CP-429
429
13
15
1.0
2.0 × 1013
6
3
3


Example 430
CP-430
430
13
15
1.1
2.0 × 1013
6
3
3


Example 431
CP-431
431
13
15
1.2
2.0 × 1013
5
3
3


Example 432
CP-432
432
20
15
1.0
1.9 × 1013
6
3
3


Example 433
CP-433
433
25
15
0.8
1.8 × 1013
3
3
3


Example 434
CP-434
434
25
15
0.9
1.8 × 1013
4
3
3


Example 435
CP-435
435
25
15
1.0
1.8 × 1013
4
3
3


Example 436
CP-436
436
25
15
1.1
1.8 × 1013
4
3
3


Example 437
CP-437
437
25
15
1.2
1.8 × 1013
3
3
3


Example 438
CP-438
438
2
20
1.0
6.6 × 1012
5
4
3


Example 439
CP-439
439
5
20
0.8
6.3 × 1012
5
4
3


Example 440
CP-440
440
5
20
0.9
6.3 × 1012
6
4
3


Example 441
CP-441
441
5
20
1.0
6.3 × 1012
6
4
3


Example 442
CP-442
442
5
20
1.1
6.3 × 1012
6
4
3


Example 443
CP-443
443
5
20
1.2
6.3 × 1012
5
4
3


Example 444
CP-444
444
13
20
0.8
5.7 × 1012
5
4
3


Example 445
CP-445
445
13
20
0.9
5.7 × 1012
6
4
3


Example 446
CP-446
446
13
20
1.0
5.7 × 1012
6
4
3


Example 447
CP-447
447
13
20
1.1
5.7 × 1012
6
4
3


Example 448
CP-448
448
13
20
1.2
5.7 × 1012
5
4
3


Example 449
CP-449
449
20
20
0.8
5.3 × 1012
5
4
3


Example 450
CP-450
450
20
20
0.9
5.3 × 1012
6
4
3


Example 451
CP-451
451
20
20
1.0
5.3 × 1012
6
4
3


Example 452
CP-452
452
20
20
1.1
5.3 × 1012
6
4
3


Example 453
CP-453
453
20
20
1.2
5.3 × 1012
5
4
3


Example 454
CP-454
454
25
20
1.0
5.0 × 1012
4
4
3


Example 455
CP-455
455
2
30
0.8
3.6 × 1011
4
4
3


Example 456
CP-456
456
2
30
0.9
3.6 × 1011
5
4
3


Example 457
CP-457
457
2
30
1.0
3.6 × 1011
5
4
3


Example 458
CP-458
458
2
30
1.1
3.6 × 1011
5
4
3


Example 459
CP-459
459
2
30
1.2
3.6 × 1011
4
4
3


Example 460
CP-460
460
5
30
0.6
3.4 × 1011
5
4
3

























TABLE 60









Production



Volume






Conductive
example of



resistivity of


















layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
Result of evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Example 461
CP-461
461
5
30
0.9
3.4 × 1011
6
4
3


Example 962
CP-462
462
5
30
1.0
3.4 × 1011
6
4
3


Example 463
CP-463
463
5
30
1.1
3.4 × 1011
6
4
3


Example 969
CP-464
464
5
30
1.2
3.4 × 1011
5
4
3


Example 965
CP-465
465
13
30
0.8
2.8 × 1011
5
4
3


Example 466
CP-466
466
13
30
0.9
2.9 × 1011
6
4
3


Example 967
CP-467
467
13
30
1.0
2.8 × 1011
6
4
3


Example 468
CP-468
463
13
30
1.1
2.8 × 1011
6
4
3


Example 469
CP-469
469
13
30
1.2
2.5 × 1011
5
4
3


Example 470
CP-470
470
20
30
0.3
2.5 × 1011
5
4
3


Example 471
CP-471
471
20
30
0.9
2.5 × 1011
6
4
3


Example 472
CP-472
472
20
30
1.0
2.5 × 1011
6
4
3


Example 473
CP-473
473
20
30
1.1
2.5 × 1011
6
4
3


Example 474
CP-474
474
20
30
1.2
2.5 × 1011
5
4
3


Example 475
CP-475
475
25
30
0.3
2.3 × 1011
3
4
3


Example 476
CP-476
476
25
30
0.9
2.3 × 1011
4
4
3


Example 477
CP-477
477
25
30
1.0
2.3 × 1011
4
4
3


Example 478
CP-478
478
25
30
1.1
2.3 × 1011
4
4
3


Example 479
CP-479
479
25
30
1.2
2.3 × 1011
3
4
3


Example 480
CP-480
480
2
40
1.0
7.6 × 109
5
4
3


Example 481
CP-481
481
5
40
0.3
6.8 × 109
5
4
3


Example 482
CP-482
482
5
40
0.9
6.8 × 109
6
4
3


Example 483
CP-483
483
5
40
1.0
6.8 × 109
6
4
3


Example 989
CP-484
484
5
40
1.1
6.8 × 109
6
4
3


Example 985
CP-485
485
5
40
1.2
6.8 × 109
5
4
3


Example 486
CP-486
486
13
40
0.3
5.2 × 109
5
4
3


Example 987
CP-487
487
13
40
0.9
5.2 × 109
6
4
3


Example 488
CP-498
488
13
40
1.0
5.2 × 109
6
4
3


Example 989
CP-489
989
13
90
1.1
5.2 × 109
6
4
3


Example 990
CP-490
490
13
40
1.2
5.2 × 109
5
4
3


Example 991
CP-491
491
20
40
0.8
4.2 × 109
5
4
3


Example 492
CP-492
492
20
40
0.9
4.2 × 109
6
4
3


Example 993
CP-493
493
20
40
1.0
4.2 × 109
6
4
3


Example 494
CP-494
499
20
40
1.1
4.2 × 109
6
4
3


Example 495
CP-495
495
20
40
1.2
4.2 × 109
5
4
3


Example 996
CP-496
496
25
40
1.0
3.7 × 109
4
4
3


Example 497
CP-497
497
2
45
0.8
6.5 × 108
4
4
2


Example 998
CP-498
498
2
45
0.9
6.5 × 108
5
4
2


Example 999
CP-499
499
2
45
1.0
6.5 × 108
5
4
2


Example 500
CP-500
500
2
45
1.1
6.5 × 108
5
4
2

























TABLE 61









Production



Volume






Conductive
example of



resistivity of


















layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
Result of evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Example 501
CP-501
501
2
45
1.2
6.5 × 108
4
4
2


Example 502
CP-502
502
5
45
1.0
5.7 × 108
6
4
2


Example 503
CP-503
503
13
45
0.8
4.1 × 108
5
4
2


Example 504
CP-504
504
13
45
0.9
4.1 × 108
6
4
2


Example 505
CP-505
505
13
45
1.0
4.1 × 108
6
4
2


Example 506
CP-506
506
13
45
1.1
4.1 × 108
6
4
2


Example 507
CP-507
507
13
45
1.2
4.1 × 108
5
4
2


Example 508
CP-508
508
20
45
1.0
3.2 × 108
6
4
2


Example 509
CP-509
509
25
45
0.8
2.7 × 108
3
4
2


Example 510
CP-510
510
25
45
0.9
2.7 × 108
4
4
2


Example 511
CP-511
511
25
45
1.0
2.7 × 108
4
4
2


Example 512
CP-512
512
25
45
1.1
2.7 × 108
4
4
2


Example 513
CP-513
513
25
45
1.2
2.7 × 108
3
4
2


Example 514
Cl-514
514
5
20
0.8
4.8 × 1012
5
4
3


Example 515
CP-515
515
5
20
0.9
4.8 × 1012
6
4
3


Example 516
CP-516
516
5
20
1.0
4.2 × 1012
6
4
3


Example 517
CP-517
517
5
20
1.1
4.8 × 1012
6
4
3


Example 518
CP-518
518
5
20
1.2
4.8 × 1012
5
4
3


Example 519
CP-519
519
13
20
0.8
4.3 × 1012
5
4
3


Example 520
CP-520
520
13
20
0.9
4.3 × 1012
6
4
3


Example 521
CP-521
521
13
20
1.0
4.3 × 1012
6
4
3


Example 522
CP-522
522
13
20
1.1
4.3 × 1012
6
4
3


Example 523
CP-523
523
13
20
1.2
4.3 × 1012
5
4
3


Example 524
CP-524
524
20
20
0.8
3.9 × 1012
5
4
3


Example 525
CP-525
525
20
20
0.9
3.9 × 1012
6
4
3


Example 526
CP-526
526
20
20
1.0
3.9 × 1012
6
4
3


Example 527
CP-527
527
20
20
1.1
3.9 × 1012
6
4
3


Example 528
CP-528
528
20
20
1.2
3.9 × 1012
5
4
3


Example 529
CP-529
529
5
30
0.8
1.7 × 1011
5
4
3


Example 530
CP-530
530
5
30
0.9
1.7 × 1011
6
4
3


Example 531
CP-531
531
5
30
1.0
1.7 × 1011
6
4
3


Example 532
CP-532
532
5
30
1.1
1.7 × 1011
6
4
3


Example 533
CP-533
533
5
30
1.2
1.7 × 1011
5
4
3


Example 539
CP-534
534
13
30
0.8
1.4 × 1011
5
4
3


Example 535
CP-535
535
13
30
0.9
1.4 × 1011
6
4
3


Example 536
CP-536
536
13
30
1.0
1.4 × 1011
6
4
3


Example 537
CP-537
537
13
30
1.1
1.4 × 1011
6
4
3


Example 538
CP-538
538
13
30
1.2
1.4 × 1011
5
4
3


Example 539
CP-539
539
20
30
0.8
1.2 × 1011
5
4
3


Example 540
CP-540
540
20
30
0.9
1.2 × 1011
6
4
3

























TABLE 62









Production



Volume






Conductive
example of



resistivity of


















layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
Result of evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Example 541
CP-541
541
20
30
1.0
1.2 × 1011
6
4
3


Example 542
CP-542
542
20
30
1.1
1.2 × 1011
6
4
3


Example 543
CP-543
543
20
30
1.2
1.2 × 1011
5
4
3


Example 544
CP-544
544
5
40
0.8
1.6 × 109
5
4
3


Example 545
CP-545
545
5
40
0.9
1.6 × 109
6
4
3


Example 546
CP-546
546
5
40
1.0
1.6 × 109
6
4
3


Example 547
CP-547
547
5
40
1.1
1.6 × 109
6
4
3


Example 548
CP-548
548
5
40
1.2
1.6 × 109
5
4
3


Example 549
CP-549
549
13
40
0.8
1.1 × 109
5
4
3


Example 550
CP-550
550
13
40
0.9
1.1 × 109
6
4
3


Example 551
CP-551
551
13
40
1.0
1.1 × 109
6
4
3


Example 552
CP-552
552
13
40
1.1
1.1 × 109
6
4
3


Example 553
CP-553
553
13
40
1.2
1.1 × 109
5
4
3


Example 554
CP-554
554
20
40
0.8
8.7 × 1011
5
4
3


Example 555
CP-555
555
20
40
0.9
8.7 × 1011
6
4
3


Example 556
CP-556
556
20
40
1.0
8.7 × 1011
6
4
3


Example 557
CP-557
557
20
40
1.1
8.7 × 1011
6
4
3


Example 558
CP-550
558
20
40
1.2
8.7 × 1011
5
4
3


Example 559
CP-559
559
13
30
1.0
1.4 × 1011
6
4
3


Example 560
CP-560
560
11
30
1.0
4.8 × 1011
6
4
3

























TABLE 63









Production



Volume


















Conductive
example of



resistivity of
Result of



layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Comparative Example 107
CP-C107
C107



2.2 × 1013
1
3
3


Comparative Example 108
CP-C108
C108



3.8 × 1011
1
4
3


Comparative Example 109
CP-C109
C109



7.2 × 108
1
4
2


Comparative Example 110
CP-C11C
C110
1
15
1.0
2.2 × 1011
2
3
3


Comparative Example 111
CP-C111
C111
1
30
1.0
3.7 × 1011
2
4
3


Comparative Example 112
CP-C112
C112
1
45
1.0
6.8 × 108
2
4
2


Comparative Example 113
CP-C113
C113
30
15
1.0
1.7 × 1011
2
3
3


Comparative Example 114
CP-C114
C114
30
30
1.0
2.1 × 1011
2
4
3


Comparative Example 115
CP-C115
C115
30
45
1.0
2.3 × 108
2
4
2


Comparative Example 116
CP-C116
C116



7.7 × 1012
1
3
3


Comparative Example 117
CP-C117
C117



2.9 × 1011
1
4
3


Comparative Example 118
CP-C119
C118



5.3 × 106
1
4
2


Comparative Example 119
CP-C119
C119
2
10
1.0
6.3 × 1013
5
1
3


Comparative Example 120
CP-C120
C120
5
10
1.0
6.1 × 1013
6
1
3


Comparative Example 121
CP-C121
C121
13
10
1.0
5.9 × 1011
6
1
3


Comparative Example 122
CP-C122
C122
20
10
1.0
5.7 × 1011
6
1
3


Comparative Example 123
CP-C123
C123
25
10
1.0
5.5 × 1013
4
1
3


Comparative Example 124
CP-C124
C124
2
50
1.0
3.4 × 107
5
4
1


Comparative Example 125
CP-C125
C125
5
50
1.0
2.9 × 107
6
4
1


Comparative Example 126
CP-C126
C126
13
50
1.0
1.9 × 107
6
4
1


Comparative Example 127
CP-C127
C127
20
50
1.0
1.4 × 107
6
4
1


Comparative Example 128
CP-C128
C128
25
50
1.0
1.2 × 107
4
4
1

























TABLE 64









Production



Volume


















Conductive
example of



resistivity of
Result of



layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Example 561
CP-561
561
2
15
0.8
2.0 × 1013
4
3
3


Example 562
CP-562
562
2
15
0.9
2.0 × 1013
5
3
3


Example 563
CP-563
563
2
15
1.0
2.0 × 1013
5
3
3


Example 569
CP-564
564
2
15
1.1
2.0 × 1013
5
3
3


Example 565
CP-565
565
2
15
1.2
2.0 × 1013
4
3
3


Example 566
CP-566
566
5
15
1.0
2.0 × 1013
6
3
3


Example 567
CP-567
567
13
15
0.8
1.8 × 1013
5
3
3


Example 568
CP-568
568
13
15
0.9
1.8 × 1013
6
3
3


Example 569
CP-569
569
13
15
1.0
1.8 × 1013
6
3
3


Example 570
CP-570
570
13
15
1.1
1.8 × 1013
6
3
3


Example 571
CP-571
571
13
15
1.2
1.8 × 1013
5
3
3


Example 572
CP-572
572
20
15
1.0
1.7 × 1013
6
3
3


Example 573
CP-573
573
25
15
0.8
1.7 × 1013
3
3
3


Example 574
CP-574
574
25
15
0.9
1.7 × 1013
4
3
3


Example 575
CP-575
575
25
15
1.0
1.6 × 1013
4
3
3


Example 576
CP-576
576
25
15
1.1
1.6 × 1013
4
3
3


Example 577
CP-577
577
25
15
1.2
1.6 × 1013
3
3
3


Example 578
CP-578
578
2
20
1.0
6.0 × 1012
5
4
3


Example 579
CP-579
579
5
20
0.8
5.8 × 1012
5
4
3


Example 580
CP-580
580
5
20
0.9
5.8 × 1012
6
4
3


Example 581
CP-581
581
5
20
1.0
5.8 × 1012
6
4
3


Example 582
CP-582
582
5
20
1.1
5.8 × 1012
6
4
3


Example 583
CP-583
583
5
20
1.2
5.7 × 1012
5
4
3


Example 589
CP-584
584
13
20
0.8
5.2 × 1012
5
4
3


Example 585
CP-585
585
13
20
0.9
5.2 × 1012
6
4
3


Example 586
CP-586
586
13
20
1.0
5.1 × 1012
6
4
3


Example 587
CP-587
587
13
20
1.1
5.1 × 1012
6
4
3


Example 588
CP-580
588
13
20
1.2
5.1 × 1012
5
4
3


Example 589
CP-589
589
20
20
0.8
4.7 × 1012
5
4
3


Example 590
CP-590
590
20
20
0.9
4.7 × 1012
6
4
3


Example 591
CP-591
591
20
20
1.0
4.7 × 1012
6
4
3


Example 592
CP-592
592
20
20
1.1
4.7 × 1012
6
4
3


Example 593
CP-593
593
20
20
1.2
4.6 × 1012
5
4
3


Example 594
CP-594
594
25
20
1.0
4.4 × 1012
4
4
3


Example 595
CP-595
595
2
30
0.8
3.1 × 1011
4
4
3


Example 596
CP-596
596
2
30
0.9
3.1 × 1011
5
4
3


Example 597
CP-597
597
2
30
1.0
3.1 × 1011
5
4
3


Example 598
CP-598
598
2
30
1.1
3.1 × 1011
5
4
3


Example 599
CP-599
599
2
30
1.2
3.1 × 1011
4
4
3


Example 600
CP-600
600
5
30
0.6
2.9 × 1011
5
4
3

























TABLE 65









Production



Volume


















Conductive
example of



resistivity of
Result of



layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Example 601
CP-601
601
5
30
0.9
2.9 × 1011
6
4
3


Example 602
CP-602
602
5
30
1.0
2.9 × 1011
6
4
3


Example 603
CP-603
603
5
30
1.1
2.9 × 1011
6
4
3


Example 609
CP-604
604
5
30
1.2
2.9 × 1011
5
4
3


Example 605
CP-605
605
13
30
0.8
2.4 × 1011
5
4
3


Example 606
CP-606
606
13
30
0.9
2.4 × 1011
6
4
3


Example 607
CP-607
607
13
30
1.0
2.4 × 1011
6
4
3


Example 608
CP-608
608
13
30
1.1
2.4 × 1011
6
4
3


Example 609
CP-609
609
13
30
1.2
2.3 × 1011
5
4
3


Example 610
CP-610
610
20
30
0.8
2.1 × 1011
5
4
3


Example 611
CP-611
611
20
30
0.9
2.1 × 1011
6
4
3


Example 612
CP-612
612
20
30
1.0
2.0 × 1011
6
4
3


Example 613
CP-613
613
20
30
1.1
2.0 × 1011
6
4
3


Example 614
CP-614
614
20
30
1.2
2.0 × 1011
5
4
3


Example 615
CP-615
615
25
30
0.8
1.9 × 1011
3
4
3


Example 616
CP-616
616
25
30
0.9
1.9 × 1011
4
4
3


Example 617
CP-617
617
25
30
1.0
1.8 × 1011
4
4
3


Example 618
CP-618
618
25
30
1.1
1.8 × 1011
4
4
3


Example 619
CP-619
619
25
30
1.2
1.8 × 1011
3
4
3


Example 620
CP-620
620
2
40
1.0
6.1 × 109
5
4
3


Example 621
CP-621
621
5
40
0.8
5.4 × 109
5
4
3


Example 622
CP-622
622
5
40
0.9
5.4 × 109
6
4
3


Example 623
CP-623
623
5
40
1.0
5.3 × 109
6
4
3


Example 629
CP-624
624
5
40
1.1
5.3 × 109
6
4
3


Example 625
CP-625
625
5
40
1.2
5.3 × 109
5
4
3


Example 626
CP-626
626
13
40
0.8
4.0 × 109
5
4
3


Example 627
CP-627
627
13
40
0.9
4.0 × 109
6
4
3


Example 628
CP-628
628
13
40
1.0
3.9 × 109
6
4
3


Example 629
CP-629
629
13
40
1.1
3.9 × 109
6
4
3


Example 630
CP-630
630
13
40
1.2
3.8 × 109
5
4
3


Example 631
CP-631
631
20
40
0.8
3.2 × 109
5
4
3


Example 632
CP-632
632
20
40
0.9
3.2 × 109
6
4
3


Example 633
CP-633
633
20
40
1.0
3.1 × 109
6
4
3


Example 634
CP-634
634
20
40
1.1
3.1 × 109
6
4
3


Example 635
CP-635
635
20
40
1.2
3.0 × 109
5
4
3


Example 636
CP-636
636
25
40
1.0
2.6 × 109
4
4
3


Example 637
CP-637
637
2
45
0.8
5.0 × 108
4
4
2


Example 638
CP-638
638
2
45
0.9
5.0 × 108
5
4
2


Example 639
CP-639
639
2
45
1.0
5.0 × 108
5
4
2


Example 640
CP-640
640
2
45
1.1
5.0 × 108
5
4
2

























TABLE 66









Production



Volume


















Conductive
example of



resistivity of
Result of



layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Example 641
CP-641
641
2
45
1.2
4.9 × 108
4
4
2


Example 642
CP-642
642
5
45
1.0
4.2 × 108
6
4
2


Example 643
CP-643
643
13
45
0.8
3.0 × 108
5
4
2


Example 644
CP-644
644
13
45
0.9
2.9 × 108
6
4
2


Example 645
CP-645
645
13
45
1.0
2.9 × 108
6
4
2


Example 646
CP-646
646
13
45
1.1
2.9 × 108
6
4
2


Example 647
CP-647
647
13
45
1.2
2.8 × 108
5
4
2


Example 648
CP-648
648
20
45
1.0
2.1 × 108
6
4
2


Example 649
CP-649
649
25
45
0.8
1.9 × 108
3
4
2


Example 650
CP-650
650
25
45
0.9
1.9 × 108
4
4
2


Example 651
CP-651
651
25
45
1.0
1.8 × 108
4
4
2


Example 652
CP-652
652
25
45
1.1
1.8 × 108
4
4
2


Example 653
CP-653
653
25
45
1.2
1.7 × 108
3
4
2

























TABLE 67









Production



Volume


















Conductive
example of



resistivity of
Result of



layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Example 654
CP-654
654
5
20
0.8
4.3 × 1012
5
4
3


Example 655
CP-655
655
5
20
0.9
4.3 × 1012
6
4
3


Example 656
CP-656
656
5
20
1.0
4.3 × 1012
6
4
3


Example 657
CP-657
657
5
20
1.1
4.3 × 1012
6
4
3


Example 658
CP-658
656
5
20
1.2
4.3 × 1011
5
4
3


Example 659
CP-659
659
13
20
0.8
3.2 × 1012
5
4
3


Example 660
CP-660
660
13
20
0.9
3.8 × 1012
6
4
3


Example 661
CP-661
661
13
20
1.0
3.8 × 1012
6
4
3


Example 662
CP-662
662
13
20
1.1
3.8 × 1012
6
4
3


Example 663
CP-663
663
13
20
1.2
3.7 × 1012
5
4
3


Example 664
CP-664
664
20
20
0.8
3.5 × 1012
5
4
3


Example 665
CP-665
665
20
20
0.9
3.5 × 1012
6
4
3


Example 666
CP-666
666
20
20
1.0
3.4 × 1012
6
4
3


Example 667
CP-667
667
20
20
1.1
3.4 × 1012
6
4
3


Example 668
CP-668
668
20
20
1.2
3.4 × 1012
5
4
3


Example 669
CP-669
669
5
30
0.8
1.5 × 1011
5
4
3


Example 670
CP-670
670
5
30
0.9
1.5 × 1011
6
4
3


Example 671
CP-671
671
5
30
1.0
1.4 × 1011
6
4
3


Example 672
CP-672
672
5
30
1.1
1.4 × 1011
6
4
3


Example 673
CP-673
673
5
30
1.2
1.4 × 1011
5
4
3


Example 674
CP-674
674
13
30
0.8
1.2 × 1011
5
4
3


Example 675
CP-675
675
13
30
0.9
1.2 × 1011
6
4
3


Example 676
CP-676
676
13
30
1.0
1.1 × 1011
6
4
3


Example 677
CP-677
677
13
30
1.1
1.1 × 1011
6
4
3


Example 678
CP-678
678
13
30
1.2
1.1 × 1011
5
4
3


Example 679
CP-679
679
20
30
0.8
9.8 × 1010
5
4
3


Example 680
CP-680
680
20
30
0.9
9.8 × 1010
6
4
3


Example 681
CP-691
621
20
30
1.0
9.5 × 1010
6
4
3


Example 682
CP-692
682
20
30
1.1
9.5 × 1010
6
4
3


Example 683
CP-683
683
20
30
1.2
9.3 × 1010
5
4
3


Example 689
CP-684
684
5
40
0.8
1.2 × 109
5
4
3


Example 685
CP-685
685
5
40
0.9
1.0 × 109
6
4
3


Example 686
CP-686
686
5
40
1.0
1.2 × 109
6
4
3


Example 687
CP-697
687
5
40
1.1
1.2 × 109
6
4
3


Example 688
CP-688
688
5
40
1.2
1.0 × 109
5
4
3


Example 689
CP-689
689
13
40
0.8
8.2 × 108
5
4
3


Example 690
CP-690
690
13
40
0.9
8.2 × 108
6
4
3

























TABLE 68









Production



Volume


















Conductive
example of



resistivity of
Result of



layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Example 691
CP-691
691
13
40
1.0
8.0 ×108
6
4
3


Example 692
CP-692
692
13
40
1.1
8.0 × 108
6
4
3


Example 693
CP-693
693
13
40
1.2
7.7 × 108
5
4
3


Example 694
CP-694
694
20
40
0.8
6.2 × 108
5
4
3


Example 695
CP-695
695
20
40
0.9
6.2 × 108
6
4
3


Example 696
CP-696
696
20
40
1.0
5.9 × 108
6
4
3


Example 697
CP-697
697
20
40
1.1
5.9 × 108
6
4
3


Example 698
CP-698
698
20
40
1.2
5.6 × 108
5
4
3


Example 699
CP-699
699
13
30
1.0
1.1 × 1011
6
4
3


Example 700
CP-700
700
13
30
1.0
4.7 ×1011
6
4
3

























TABLE 69









Production



Volume


















Conductive
example of



resistivity of
Result of



layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Comparative Example 129
CP-C129
C129



2.1 × 1013
1
3
3


Comparative Example 130
CP-C130
C130



3.3 × 1011
1
4
3


Comparative Example 131
CP-C131
C131



5.5 × 108
1
4
2


Comparative Example 132
CP-C132
C132
1
15
1.0
2.1 × 1013
2
3
3


Comparative Example 133
CP-C133
C133
1
31
1.0
3.2 × 1011
2
4
3


Comparative Example 134
CP-C134
C134
1
47
1.0
5.2 × 108
2
4
2


Comparative Example 135
CP-C135
C135
30
15
1.0
1.6 × 1013
2
3
3


Comparative Example 136
CP-C136
C136
30
31
1.0
1.7 × 1011
2
4
3


Comparative Example 137
CP-C137
C137
30
47
1.0
1.5 × 108
2
4
2


Comparative Example 138
CP-C138
C133



6.1 × 1012
1
3
3


Comparative Example 139
CP-C139
C139



1.7 × 1010
1
4
3


Comparative Example 140
CP-C140
C140



1.9 × 106
1
4
2


Comparative Example 141
CP-C141
C141
2
10
1.0
6.0 × 1013
5
1
3


Comparative Example 142
CP-C142
C142
5
10
1.0
5.9 × 1013
6
1
3


Comparative Example 143
CP-C143
C143
13
10
1.0
5.6 × 1013
6
1
3


Comparative Example 144
CP-C144
C144
20
10
1.0
5.4 × 1013
6
1
3


Comparative Example 145
CP-C145
C145
25
10
1.0
5.2 × 1013
4
1
3


Comparative Example 146
CP-C146
C146
2
52
1.0
2.4 × 107
5
4
1


Comparative Example 147
CP-C147
C147
5
52
1.0
2.0 × 107
6
4
1


Comparative Example 148
CP-C148
C143
13
52
1.0
1.3 × 107
6
4
1


Comparative Example 149
CP-C149
C149
20
52
1.0
8.8 × 106
6
4
1


Comparative Example 150
CP-C150
C150
25
52
1.0
7.0 × 106
4
4
1

























TABLE 70









Production



Volume


















Conductive
example of



resistivity of
Result of



layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Comparative Example 151
CP-C151
C151



3.0 × 1011
1
4
3


Comparative Example 152
CP-C152
C152



2.6 × 1011
1
4
3


Comparative Example 153
CP-C153
C153



2.8 × 1011
1
4
3


Comparative Example 154
CP-C154
C154



2.7 × 1011
1
4
3


Comparative Example 155
CP-C155
C155



2.6 × 1011
1
4
3


Comparative Example 156
CP-C156
C156



2.3 × 1011
1
4
3


Comparative Example 157
CP-C157
C157



2.5 × 1011
1
4
3


Comparative Example 158
CP-C158
C153



2.4 × 1011
1
4
3

























TABLE 71









Production



Volume


















Conductive
example of



resistivity of
Result of



layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Comparative Example 159
CP-C159
C159



3.0 × 1011
1
4
3


Comparative Example 160
CP-C160
C160



2.7 × 1011
1
4
3


Comparative Example 161
CP-C161
C161



3.2 × 1011
1
4
3


Comparative Example 162
CP-C162
C162



3.0 × 1011
1
4
3


Comparative Example 163
CP-C163
C163



2.9 × 1011
1
4
3


Comparative Example 164
CP-C164
C164



2.9 × 1011
1
4
3


Comparative Example 165
CP-C165
C165



2.9 × 1011
1
4
3

























TABLE 72









Production



Volume


















Conductive
example of



resistivity of
Result of



layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Comparative Example 166
CP-C166
C166



3.0 × 1011
1
4
3


Comparative Example 167
CP-C167
C167



2.8 × 1011
1
4
3


Comparative Example 168
CP-C168
C168



3.0 × 1011
1
4
3


Comparative Example 169
CP-C169
C169



2.6 × 1011
1
4
3


Comparative Example 170
CP-C170
C170



3.3 × 1011
1
4
3


Comparative Example 171
CP-C171
C171



3.0 × 1011
1
4
3

























TABLE 73









Production



Volume


















Conductive
example of



resistivity of
Result of



layer-
electrophotographic
{ (V2/VT)/
{ (V2/VT) +

conductive
evaluation

















coating
photo-sensitive
V1/VT) } ×
(V2/VT) } ×

layer
Pattern
Residual




solution
member
100
100
R2/R1
[Ω·cm]
memory
potential
Crack



















Comparative Example 172
CP-C172
C172



2.9 × 1011
1
4
3


Comparative Example 173
CP-C173
C173



2.9 × 1011
1
4
3


Comparative Example 174
CP-C174
C174



2.9 × 1011
1
4
3


Comparative Example 175
CP-C175
C175



3.0 × 1011
1
4
3


Comparative Example 176
CP-C176
C176



2.8 × 1011
1
4
3


Comparative Example 177
CP-C177
C177



3.0 × 1011
1
4
3


Comparative Example 178
CP-C178
C178



3.0 × 1011
1
4
3


Comparative Example 179
CP-C179
C179



1.9 × 1012
1
4
3


















TABLE 74









Rank of pattern memory
















6
5
4
3
2
1






Solid black image
Unobservable
Observable
Observable
Observable
Observable
Observable



One-dot keima pattern
Unobservable
Unobservable
Observable
Observable
Observable
Observable


Half-tone
One-dot and one-space lateral line
Unobservable
Unobservable
Unobservable
Observable
Observable
Observable


image
Two-dot and three-space lateral line
Unobservable
Unobservable
Unobservable
Unobservable
Observable
Observable



One-dot and two-space lateral line
Unobservable
Unobservable
Unobservable
Unobservable
Unobservable
Observable









While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.


This application claims the benefit of Japanese Patent Applications No. 2012-189532, filed on Aug. 30, 2012, No. 2013-077617, filed on Apr. 3, 2013, and No. 2013-177141, filed on Aug. 28, 2013, which are hereby incorporated by reference herein in its entirety.


REFERENCE SIGNS LIST


1 electrophotographic photosensitive member



2 axis



3 charging device (primary charging device)



4 exposure light (image exposure light)



5 developing device



6 transferring device (such as transfer roller)



7 cleaning device (such as cleaning blade)



8 fixing device



9 process cartridge



10 guiding device



11 pre-exposure light


P transfer material (such as paper)

Claims
  • 1. An electrophotographic photosensitive member, comprising: a support;a conductive layer formed on the support; anda photosensitive layer formed on the conductive layer,wherein:the conductive layer comprises:a titanium oxide particle coated with tin oxide doped with phosphorus,a tin oxide particle doped with phosphorus, anda binding material; andwhen a total volume of the conductive layer is represented by VT, a total volume of the titanium oxide particle coated with tin oxide doped with phosphorus in the conductive layer is represented by V1P, and a total volume of the tin oxide particle doped with phosphorus in the conductive layer is represented by V2P, the VT, the V1P, and the V2P satisfy the following expressions (1) and (2) 2≦{(V2P/VT)/(V1P/VT)}×100≦25  (1)15≦{(V1P/VT)+(V2P/VT)}×100≦45  (2).
  • 2. The electrophotographic photosensitive member according to claim 1, wherein the VT, the V1P, and the V2P satisfy the following expression (3) 5≦{(V2P/VT)/(V1P/VT)}×100≦20  (3).
  • 3. The electrophotographic photosensitive member according to claim 1, wherein the VT, the V1P, and the V2P satisfy the following expression (4) 20≦{(V1P/VT)+(V2P/VT)}×100≦40  (4).
  • 4. The electrophotographic photosensitive member according to claim 1, wherein when an abundance ratio of phosphorus to tin oxide in the titanium oxide particle coated with tin oxide doped with phosphorus is represented by R1P [atom %] and an abundance ratio of phosphorus to tin oxide in the tin oxide particle doped with phosphorus is represented by R2P [atom %], the R1P and the R2P satisfy the following expression (5) 0.9≦R2P/R1P≦1.1  (5).
  • 5. A process cartridge detachably mountable to a main body of an electrophotographic apparatus, wherein the process cartridge integrally supports: the electrophotographic photosensitive member according to claim 1; andat least one device selected from the group consisting of a charging device, a developing device, a transferring device, and a cleaning device.
  • 6. An electrophotographic apparatus, comprising: the electrophotographic photosensitive member according to claim 1;a charging device;an exposing device;a developing device; anda transferring device.
  • 7. An electrophotographic photosensitive member, comprising: a support;a conductive layer formed on the support; anda photosensitive layer formed on the conductive layer,wherein:the conductive layer comprises:a titanium oxide particle coated with tin oxide doped with tungsten,a tin oxide particle doped with tungsten, anda binding material; andwhen a total volume of the conductive layer is represented by VT, a total volume of the titanium oxide particle coated with tin oxide doped with tungsten in the conductive layer is represented by V1W, and a total volume of the tin oxide particle doped with tungsten in the conductive layer is represented by V2W, the VT, the V1W, and the V2W satisfy the following expressions (6) and (7) 2≦{(V2W/VT)/(V1W/VT)}×100≦25  (6)15≦{(V1W/VT)+(V2W/VT)}×100≦45  (7).
  • 8. The electrophotographic photosensitive member according to claim 7, wherein the VT, the V1W, and the V2W satisfy the following expression (8) 5≦{(V2W/VT)/(V1W/VT)}×100≦20  (8).
  • 9. The electrophotographic photosensitive member according to claim 7, wherein the VT, the V1W, and the V2W satisfy the following expression (9) 20≦{(V1W/VT)+(V2W/VT)}×100≦40  (9).
  • 10. The electrophotographic photosensitive member according to claim 7, wherein when an abundance ratio of tungsten to tin oxide in the titanium oxide particle coated with tin oxide doped with tungsten is represented by R1W [atom %] and an abundance ratio of tungsten to tin oxide in the tin oxide particle doped with tungsten is represented by R2W [atom %], the Riw and the R2W satisfy the following expression (10) 0.9≦R2W/R1W≦1.1  (10).
  • 11. An electrophotographic photosensitive member, comprising: a support;a conductive layer formed on the support; anda photosensitive layer formed on the conductive layer,wherein:the conductive layer comprises:a titanium oxide particle coated with tin oxide doped with fluorine,a tin oxide particle doped with fluorine, anda binding material; andwhen a total volume of the conductive layer is represented by VT, a total volume of the titanium oxide particle coated with tin oxide doped with fluorine in the conductive layer is represented by V1F, and a total volume of the tin oxide particle doped with fluorine in the conductive layer is represented by V2F, the VT, the V1F, and the V2F satisfy the following expressions (11) and (12) 2≦{(V2F/VT)/(V1F/VT)}×100≦25  (11)15≦{(V1F/VT)+(V2F/VT)}×100≦45  (12).
  • 12. The electrophotographic photosensitive member according to claim 11, wherein the VT, the V1F, and the V2F satisfy the following expression (13) 5≦{(V2F/VT)/(V1F/VT)}×100≦20  (13).
  • 13. The electrophotographic photosensitive member according to claim 11, wherein the VT, the V1F, and the V2F satisfy the following expression (14). 20≦{(V1F/VT)+(V2F/VT)}×100≦40  (14).
  • 14. The electrophotographic photosensitive member according to claim 11, wherein when an abundance ratio of fluorine to tin oxide in the titanium oxide particle coated with tin oxide doped with fluorine is represented by R1F [atom %] and an abundance ratio of fluorine to tin oxide in the tin oxide particle doped with fluorine is represented by R2F [atom %], the R1F and the R2F satisfy the following expression (15) 0.9≦R2F/R1F≦1.1  (15).
  • 15. An electrophotographic photosensitive member, comprising: a support;a conductive layer formed on the support; anda photosensitive layer formed on the conductive layer,wherein:the conductive layer comprises:a titanium oxide particle coated with tin oxide doped with niobium,a tin oxide particle doped with niobium, anda binding material; andwhen a total volume of the conductive layer is represented by VT, a total volume of the titanium oxide particle coated with tin oxide doped with niobium in the conductive layer is represented by V1Nb, and a total volume of the tin oxide particle doped with niobium in the conductive layer is represented by V2Nb, the VT, the V1Nb, and the V2Nb satisfy the following expressions (16) and (17) 2≦{(V2Nb/VT)/(V1Nb/VT)}×100≦25  (16)15≦{(V1Nb/VT)+(V2Nb/VT)}×100≦45  (17).
  • 16. The electrophotographic photosensitive member according to claim 15, wherein the VT, the V1Nb, and the V2Nb satisfy the following expression (18) 5≦{(V2Nb/VT)/(V1Nb/VT)}×100≦20   (18).
  • 17. The electrophotographic photosensitive member according to claim 15, wherein the VT, the V1Nb, and the V2Nb satisfy the following expression (19) 20≦{(V1Nb/VT)+(V2Nb/VT)}×100≦40  (19).
  • 18. The electrophotographic photosensitive member according to claim 15, wherein when an abundance ratio of niobium to tin oxide in the titanium oxide particle coated with tin oxide doped with niobium is represented by R1Nb [atom %] and an abundance ratio of niobium to tin oxide in the tin oxide particle doped with niobium is represented by R2Nb [atom %], the R1Nb and the R2Nb satisfy the following expression (20) 0.9≦R2Nb/R1Nb≦1.1  (20).
  • 19. An electrophotographic photosensitive member, comprising: a support;a conductive layer formed on the support; anda photosensitive layer formed on the conductive layer,wherein:the conductive layer comprises:a titanium oxide particle coated with tin oxide doped with tantalum,a tin oxide particle doped with tantalum, anda binding material; andwhen a total volume of the conductive layer is represented by VT, a total volume of the titanium oxide particle coated with tin oxide doped with tantalum in the conductive layer is represented by V1Ta, and a total volume of the tin oxide particle doped with tantalum in the conductive layer is represented by V2Ta, the VT, the V1Ta, and the V2Ta satisfy the following expressions (21) and (22) 2≦{(V2Ta/VT)/(V1Ta/VT)}×100≦25  (21)15≦{(V1Ta/VT)+(V2Ta/VT)}×100≦45  (22).
  • 20. The electrophotographic photosensitive member according to claim 19, wherein the VT, the V1TA, and the V2Ta satisfy the following expression (23) 5≦{(V2Ta/VT)/(V1Ta/VT)}×100≦20  (23).
  • 21. The electrophotographic photosensitive member according to claim 19, wherein the VT, the V1Ta, and the V2Ta satisfy the following expression (24) 20≦{(V1Ta/VT)+(V2Ta/VT)}×100≦40  (24).
  • 22. The electrophotographic photosensitive member according to claim 19, wherein when an abundance ratio of tantalum to tin oxide in the titanium oxide particle coated with tin oxide doped with tantalum is represented by R1Ta [atom %] and an abundance ratio of tantalum to tin oxide in the tin oxide particle doped with tantalum is represented by R2Ta [atom %], the R1Ta and the R2Ta satisfy the following expression (25) 0.9≦R2Ta/R1Ta≦1.1  (25).
Priority Claims (3)
Number Date Country Kind
2012-189532 Aug 2012 JP national
2013-077617 Apr 2013 JP national
2013-177141 Aug 2013 JP national
PCT Information
Filing Document Filing Date Country Kind
PCT/JP2013/073860 8/29/2013 WO 00
Publishing Document Publishing Date Country Kind
WO2014/034960 3/6/2014 WO A
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Related Publications (1)
Number Date Country
20150205218 A1 Jul 2015 US