Claims
- 1. An aqueous non-cyanide zinc electroplating bath having a pH of from about 2.0 to about 7.5 containing an amount, effective to provide leveling and brightening, of a primary leveling and brightening agent comprising a bath soluble butyl nicotinate quaternary salt of the formula: ##STR3## Wherein: R is CH.sub.3, C.sub.2 H.sub.5 or C.sub.6 H.sub.5 CH.sub.2, and
- X is R--O--SO.sub.3 or R--SO.sub.3
- 2. An electroplating bath as defined in claim 1, in which there is included an effective brightening amount of a polyether compound as a supporting brightening agent.
- 3. An electroplating bath as defined in claim 2, in which the polyether compound is selected from the group consisting of polyalkylene glycols, polyethylene glycols, polypropylene glycols, polyglycidols, ethoxylated phenols, ethoxylated naphthols, ethoxylated acetylenic glycols, ethoxylated olefin glycols, and mixtures thereof.
- 4. An electroplating bath as defined in claim 1, in which there is included an effective leveling amount of methane sulfonic acid and salts thereof as a supporting leveling agent.
- 5. An electroplating bath as defined in claim 1, in which there is included effective brightening amounts of a polyether compound as a brightening agent and effective leveling amounts of methane sulfonic acid and salts thereof as a supporting leveling agent.
- 6. An electroplating bath as defined in claim 5, in which the butyl nicotinate quaternary salt is present in the amount of about 0.5 mg/l to approximately 10.0 g/l, the polyether compound is present in an amount ranging from 0.25 to 20.0 g/l approximately, and the methane sulfonic acid is present in an amount ranging from about 0.005 to approximately 5.0 g/l.
- 7. An electroplating bath as defined in claim 1, in which the butyl nicotinate quaternary salt is selected from the group consisting of butyl nicotinate dimethyl sulfate quaternary, butyl nicotinate methyl methane sulfonate quaternary, butyl nicotinate diethyl sulfate quaternary, and butyl nicotinate p-methyl tosylate quaternary.
- 8. A process for depositing a bright, smooth, adherent zinc plating on a substrate, which comprises a step of electrodepositing zinc from an aqueous non-cyanide zinc electroplating bath as defined in claim 1.
Parent Case Info
This is a continuation-in-part of application Ser. No. 872,190 filed Jan. 25, 1978, now abandoned.
US Referenced Citations (6)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
872190 |
Jan 1978 |
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