ELECTROPLATING FLUID DISTURBANCE DEVICE AND OPERATING METHOD THEREOF AND ELECTROPLATING TANK DEVICE

Abstract

An electroplating fluid disturbance device includes a first supporting plate, a linking member, a spout and a pivoting member. The first supporting plate has a pivoting portion. A first portion of the linking member is close to the pivoting portion of the first supporting plate. The spout is located on the linking member. The spout has a nozzle. The nozzle is configured to be immersed in the electroplating fluid. One end of the pivoting member is pivoted to the pivoting portion of the first supporting plate. The other end of the pivoting member connects to the spout and the first portion of the linking member. When the first portion of the linking member moves, the pivoting member rotates relative to the pivoting portion and the spout moves along with the first portion of the linking member, so that the nozzle of the spout rotates to disturb the electroplating fluid.

Description

BACKGROUND OF THE INVENTION

(a) Field of the Invention

The present invention relates to an electroplating fluid disturbance device and an operating method of the electroplating fluid disturbance device and an electroplating tank device.

(b) Description of the Prior Art

In general, electroplating is an importance process in manufacturing a circuit board, and the jet plating method is currently one of the popular electroplating methods. For the jet plating method, in an electroplating tank, electroplating fluid having metal ions is directly sprayed on the circuit board to be plated. However, at present as a nozzle used in the jet plating method sprays head-on and linearly in operation, the spraying range is limited. Therefore, some dead angles on the circuit board cannot be sprayed onto actually with the electroplating fluid, causing blind areas of the jet plating, which affects the entire electroplating quality of the circuit board.

SUMMARY OF THE INVENTION

A technical aspect of the present invention is an electroplating fluid disturbance device.

According to an embodiment of the present invention, the electroplating fluid disturbance device includes a first supporting plate, a linking member, a spout and a pivoting member. The first supporting plate is provided with a pivoting portion, and the linking member is provided with a first portion. The first portion of the linking member is close to the pivoting portion of the first supporting plate. The spout is disposed on the linking member and is provided with a nozzle. The nozzle is configured to be immersed in the electroplating fluid. A first end of the pivoting member is pivoted to the pivoting portion of the first supporting plate, and a second end of the pivoting member, which is opposite to the first end, is connected to the spout and the first portion of the linking member. When the first portion of the linking member moves, the pivoting member rotates relative to the pivoting portion, and the spout moves along with the first portion of the linking member, allowing the nozzle of the spout to swing to disturb the electroplating fluid.

In one embodiment of the present invention, each quantity of the pivoting portion, spout, nozzle, and pivoting member is at least one.

In one embodiment of the present invention, the pivoting portion is disposed on a side of the spout away from the nozzle, and when the first portion of the linking member is driven, the pivoting member drives the second end to rotate against the first end, so that the nozzle on the spout, being immersed in the electroplating fluid, swings back-and-forth in a fan shape.

In one embodiment of the present invention, the abovementioned nozzle is provided with an initial spraying direction, and the nozzle swings to allow the nozzle to have a first predetermined spraying direction. A first included angle between the initial spraying direction and the first predetermined spraying direction is smaller than 30 degrees. In addition, the nozzle swings to allow the nozzle to have a second predetermined spraying direction opposite to the first predetermined spraying direction, and a second included angle between the initial spraying direction and the second predetermined spraying direction is smaller than 30 degrees.

In one embodiment of the present invention, the abovementioned linking member is provided with an initial position, as well as a first extreme position and a second extreme position opposite to two sides of the initial position. The time period in which the linking member moves from the initial position to the first extreme position, from the first extreme position to the second extreme position, and from the second extreme position back to the initial position, is between 3 seconds and 5 seconds.

In one embodiment of the present invention, the abovementioned spout is provided with an opening. The opening of the spout is configured to draw in the electroplating fluid, and the nozzle of the spout is configured to spray out the electroplating fluid. The spout is plural and the nozzle is plural.

In one embodiment of the present invention, the number of pivoting portion is equal to the number of pivoting member.

In one embodiment of the present invention, the abovementioned first supporting plate is provided with a first slide rail, and the first portion of the linking member is disposed in the first slide rail.

In one embodiment of the present invention, the abovementioned electroplating fluid disturbance device also includes a second supporting plate. The second supporting plate is provided with a second slide rail, and the second portion of the linking member is disposed in the second slide rail. The spout is disposed between the first portion and the second portion of the linking member.

In one embodiment of the present invention, the abovementioned pivoting portion is plural, and these pivoting portions are arranged in a direction parallel to the length of the first portion of the linking member.

A technical aspect of the present invention is an electroplating tank device.

According to an embodiment of the present invention, the electroplating tank device includes the abovementioned electroplating fluid disturbance device and a push rod. The push rod is extended into the electroplating fluid disturbance device, and a third portion of the linking member is connected to one end of the push rod; whereas, the third portion of the linking member is disposed between the first portion and the second portion of the linking member.

In one embodiment of the present invention, the abovementioned electroplating tank device also includes an actuating element. The actuating element is disposed outside the electroplating fluid disturbance device, and is connected to the other end of the push rod.

A technical aspect of the present invention is an operating method of the electroplating fluid disturbance device.

According to an embodiment of the present invention, the operating method of the electroplating fluid disturbance device includes immersing the nozzle of the spout in the electroplating fluid; moving the first portion of the linking member, so that the pivoting member rotates relative to the pivoting portion of the first supporting plate, wherein one end of the pivoting member is pivoted to the pivoting portion of the first supporting plate, the other end of the pivoting member is connected to the spout and the first portion of the linking member, and the first portion of the linking member is close to the pivoting portion of the first supporting plate; and the spout moving along with the first portion of the linking member, so that the nozzle of the spout swings to disturb the electroplating fluid, when the pivoting member rotates relative to the pivoting portion.

In one embodiment of the present invention, the abovementioned method also includes spraying out the electroplating fluid from the nozzle of the spout, wherein the electroplating fluid enters into the spout from the opening of the spout.

In one embodiment of the present invention, the abovementioned spout moves along with the first portion of the linking member, allowing the nozzle to have an initial spraying direction. The nozzle swings to allow the nozzle to have a first predetermined spraying direction, and a first include angle between the initial spraying direction and the first predetermined spraying direction is smaller than 30 degrees. In addition, the nozzle swings to allow the nozzle to have a second predetermined spraying direction opposite to the first predetermined spraying direction, and a second included angle between the initial spraying direction and the second predetermined spraying direction is smaller than 30 degrees.

In one embodiment of the present invention, the abovementioned spout moves along with the first portion of the linking member, allowing the linking member to have an initial position as well as a first extreme position and a second extreme position opposite to two sides of the initial position. The time period in which the linking member moves from the initial position to the first extreme position, from the first extreme position to the second extreme position, and from the second extreme position back to the initial position, is between 3 seconds and 5 seconds.

In the abovementioned embodiments of the present invention, the electroplating tank device drives the pivoting member to rotate relative to the pivoting portion by the linking member of the electroplating fluid disturbance device, allowing the spout to move along with the first portion of the linking member. The nozzle of the spout can then swing. Thus, the nozzle of the electroplating tank device can swing to spray out the electroplating fluid, so as to disturb the electroplating fluid in the electroplating fluid disturbance device and allow the metal ions in the electroplating fluid to be distributed uniformly, thereby improving the entire electroplating quality. Besides, the movement of the nozzle of the spout allows the electroplating fluid to be sprayed out obliquely to increase the spraying range of the nozzle. Therefore, the electroplating fluid can be sprayed onto some dead angles on the circuit board that cannot be sprayed onto easily, allowing the jet plating to cover the circuit board completely, so as to improve the entire electroplating quality.

When read in conjunction with the accompanying illustrations, the following detailed description provides the best understanding of one implementation of the present invention. It should be emphasized that, in accordance with industry-standard practices, various features are not drawn to scale and are intended for illustrative purposes only. In fact, for clarity of description, the sizes of various features may be arbitrarily enlarged or reduced.

To enable a further understanding of the said objectives and the technological methods of the invention herein, the brief description of the drawings below is followed by the detailed description of the preferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a three-dimensional view of an electroplating tank device, according to one embodiment of the present invention.

FIG. 2 shows a cutaway view of the electroplating tank device along the line 2-2 in FIG. 1.

FIG. 3 shows a schematic view of electroplating fluid entering into a spout, according to one embodiment of the present invention.

FIG. 4 shows a local blowup view of the electroplating tank device in a second slide rail in FIG. 1.

FIG. 5 shows a flow diagram of an operating method of an electroplating fluid disturbance device, according to an embodiment of the present invention.

FIG. 6 shows a schematic view of the spout at a position when the electroplating tank device operates, according to an embodiment of the present invention.

FIG. 7 shows a schematic view of the spout at another position when the electroplating tank device operates, according to an embodiment of the present invention.

FIG. 8 shows a schematic view of the spout at still another position when the electroplating tank device operates, according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The implementation methods disclosed below provide numerous distinct implementations or examples of the different features used to achieve the provided subject matter. Specific examples of components and configurations are described below to simplify the description of present invention. Of course, these examples are provided for illustrative purposes only and are not intended to be limiting. Moreover, the components symbols and/or letters may be repeated across various examples in the description of present invention. Such repetition is intended for convenience and clarity and does not in itself specify relationships between the various implementations and/or configurations described.

Spatial relative terms such as “beneath,” “below,” “lower,” “above,” “upper,” and the like may be used herein for the purpose of convenience in describing the relationship between one component or feature and another component or feature as illustrated in the accompanying drawings. These spatial relative terms are intended to encompass different orientations of the device in use or operation beyond the orientations shown in the drawings. The device may be oriented differently (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein should be interpreted accordingly.

FIG. 1 shows a three-dimensional view of an electroplating tank device 200, according to one embodiment of the present invention; whereas, FIG. 2 shows a cutaway view of the electroplating tank device 200 along the line 2-2 in FIG. 1. As shown in FIG. 1 and FIG. 2, the electroplating tank device 200 can be applied to an electroplating process. The electroplating tank device 200 comprises an electroplating fluid disturbance device 100, and the electroplating fluid disturbance device 100 comprises a first supporting plate 110, a linking member 120, a spout 130 and a pivoting member 140. The first supporting plate 110 is provided with a pivoting portion 112, wherein the pivoting portion 112 is fixed on the first supporting plate 110. For example, the pivoting portion 112 of the first supporting plate 110 can, but not limited to, be in a circular shape. The linking member 120 is provided with a first portion 122, and the first portion 122 of the linking member 120 is close to the pivoting portion 112 of the first supporting plate 110. In the present embodiment, the first portion 122 of the linking member 120 can be disposed on one side of the pivoting portion 112 and is not in contact with the pivoting portion 112.

In some embodiments, the spout 130 is disposed above the first portion 122 of the linking member 120. The spout 130 is provided with a nozzle 132, and the nozzle 132 is configured to be immersed in electroplating fluid L (referring to FIG. 6 for detailed description). One end of the pivoting member 140 (also called the first end) is pivoted to the pivoting portion 112 of the first supporting plate 110, and the other end of the pivoting member 140 (also called the second end opposite to the first end) is connected to the spout 130 and the first portion 122 of the linking member 120. When the first portion 122 of the linking member 120 moves, the pivoting member 140 can be driven to rotate relative to the pivoting portion 112, and the spout 130 can move along with the first portion 122 of the linking member 120, allowing the nozzle 132 of the spout 130 to swing, so as to disturb the electroplating fluid L in the electroplating fluid disturbance device 100, which allows metal ions in the electroplating fluid L to be distributed uniformly to improve the entire electroplating quality.

In some embodiments, the spout 130 of the electroplating fluid disturbance device 100 can be plural. For example, the electroplating fluid disturbance device 100 is provided with eleven spouts 130, and these eleven spouts 130 are disposed on the first portion 122 of the linking member 120 correspondingly. Besides, the nozzle 132 of the spout 130 can be plural. For example, there can be, but not limited to, eight or nine nozzles 132 on a single spout 130. The numbers of spout 130 and nozzle 132 are not limited, and the nozzles 132 can be distributed evenly on the spout 130, so as to increase the disturbance area of the nozzles 132. Moreover, the linking member 120 is provided with a second portion 124, and the second portion 124 of the linking member 120 is parallel to the first portion 122 of the linking member 120. The spout 130 is disposed between the first portion 122 and the second portion 124 of the linking member 120.

In some embodiments, the number of pivoting portion 112 of the first supporting plate 110 can be equal to the number of pivoting member 140, and the pivoting portion 112 can be plural. For example, there can be eleven pivoting portions 112 of the first supporting plate 110, and these pivoting portions 112 are configured opposite to each other. The number of pivoting member 140 is also eleven, and these pivoting members 140 are configured opposite to each other. In details, a single spout 130 fits with one pivoting member 140 and one pivoting portion 112, forming a mechanism to move the spout 130. Furthermore, these pivoting portions 112 are configured in a direction of arrangement D1 parallel to a direction along the length D2 of the first portion 122 of the linking member 120.

Specifically, the electroplating fluid disturbance device 100 in the electroplating tank device 200 can drive the pivoting member 140 to rotate relative to the pivoting portion 112 by the linking member 120, and the spout 130 can move along with the first portion 122 of the linking member 120, allowing the nozzle 132 of the spout 130 to swing. Therefore, the nozzle 132 of the electroplating fluid disturbance device 100 can swing to spray out the electroplating fluid L, so as to disturb the electroplating fluid L in the electroplating fluid disturbance device 100, allowing the metal ions in the electroplating fluid L to be distributed uniformly to improve the entire electroplating quality. Furthermore, the movement of the nozzle 132 of the spout 130 allows the electroplating fluid L to be sprayed out obliquely, which increases the disturbance range of the nozzle 132. Therefore, the electroplating fluid L can be sprayed onto some dead angles on a circuit board W that cannot be sprayed onto easily (referring to FIG. 6 for detailed description), allowing the jet plating to cover the circuit board W completely.

In some embodiments, the pivoting portion 112 is disposed on a side of the spout 130 away from the nozzle 132, and when the first portion 122 of the linking member 120 is driven, the pivoting member 140 drives the second end to rotate against the first end, so that the nozzle 132 on the spout 130, being immersed in the electroplating fluid L, swings back-and-forth in a fan shape.

In some embodiments, the electroplating tank device 200 also includes a push rod 210. The push rod 210 is extended into the electroplating fluid disturbance device 100, and a third portion 126 of the linking member 120 is connected to one end of the push rod 210. The third portion 126 of the linking member 120 is disposed between the first portion 122 and the second portion 124 of the linking member 120. The electroplating tank device 200 also includes an actuating element 220, and the actuating element 220 is disposed outside the electroplating fluid disturbance device 100 and is connected to the other end of the push rod 210.

FIG. 3 shows a schematic view of the electroplating fluid entering into the spout, according to one embodiment of the present invention. Referring to FIG. 2 and FIG. 3, the first supporting plate 110 of the electroplating fluid disturbance device 100 is provided with a first slide rail 114. The first slide rail 114 of the first supporting plate 110 is close to the pivoting portion 112 of the first supporting plate 110. In the present embodiment, the first portion 122 of the linking member 120 is disposed in the first slide rail 114 of the first supporting plate 110. The first portion 122 of the linking member 120 can move in the first slide rail 114, and the spout 130 can move back and forth on the first slide rail 114. Besides, the spout 130 is also provided with an opening 134, and the electroplating fluid L can enter into the spout 130 from the opening 134 of the spout 130 by an external pump; whereas, the electroplating fluid L that is drawn in can be sprayed out from the nozzle 132 of the spout 130, so as to disturb the electroplating fluid L outside the spout 130.

FIG. 4 shows a local blow up view of the electroplating tank device 200 in a second slide rail 154 in FIG. 1. Referring to FIG. 2 and FIG. 4, the electroplating fluid disturbance device 100 also includes a second supporting plate 150. The second supporting plate 150 is provided with the second slide rail 154, and the second portion 124 of the linking member 120 is disposed in the second slide rail 154 of the second supporting plate 150. The second portion 124 of the linking member 120 can move in the second slide rail 154, and the spout 130 can move back and forth on the second slide rail 154 to disturb the electroplating fluid L in the electroplating fluid disturbance device 100. The spout 130 is disposed between the first portion 122 and the second portion 124 of the linking member 120. The first portion 122 of the linking member 120 is perpendicular to the third portion 126 of the linking member 120, and the second portion 124 of the linking member 120 is perpendicular to the third portion 126 of the linking member 120. In other words, the third portion 126 of the linking member 120 is disposed between the first portion 122 and the second portion 124 of the linking member 120. The third portion 126 of the linking member 120 is connected to the push rod 210. When the actuating element 220 pushes the push rod 210 to move, the linking member 120 connecting the push rod 210 can drive the pivoting member 140 to rotate relative to the pivoting portion 112, and the spout 130 can move on the first slide rail 114 along with the first portion 122 of the linking member 120. In addition, the spout 130 can also move on the second slide rail 154 along with the second portion 124 of the linking member 120, thereby disturbing the electroplating fluid L in the electroplating fluid disturbance device 100.

The following description explains the operating method of the electroplating fluid disturbance device. The previously mentioned connections between components, materials, and functions will not be disclosed again, and this is hereby clarified.

FIG. 5 shows a flow diagram of an operating method of the electroplating fluid disturbance device, according to one embodiment of the present invention. The operating method of the electroplating fluid disturbance device includes following steps. First of all, in step a), the nozzle of the spout is immersed in the electroplating fluid S1. Next, in step b), the first portion of the linking member moves, allowing the pivoting member to rotate relative to the pivoting portion of the first supporting plate, wherein one end of the pivoting member is pivoted to the pivoting portion of the first supporting plate, the other end is connected to the spout and the first portion of the linking member, and the first portion of the linking member is close to the pivoting portion of the first supporting plate S2. Then, in step c), when the pivoting member rotates relative to the pivoting portion, the spout moves along with the first portion of the linking member, allowing the nozzle of the spout to swing, so as to disturb the electroplating fluid S3. Each abovementioned step is disclosed in details in the following description.

FIGS. 6 to 8 show schematic views of the spout 130 at different positions when the electroplating tank device 200 operates, according to one embodiment of the present invention. Referring to FIG. 2 and FIGS. 6 to 8, first of all, the linking member 120 is provided with an initial position, and the nozzle 132 of the spout 130 is provided with an initial spraying direction D3, meaning that when the linking member 120 is disposed at the initial position, the nozzle 132 of the spout 130 will spray out the electroplating fluid L head-on onto the circuit board W, as shown in FIG. 6. Next, the electroplating fluid L is filled into the entire tank of the electroplating fluid disturbance device 100 by a pump; therefore, the nozzle 132 of the spout 130 can be immersed in the electroplating fluid L. After the nozzle 132 of the spout 130 is immersed in the electroplating fluid L, the push rod 210 is pushed to move forward by the actuating element 220, so that the third portion 126 of the linking member 120 connecting the push rod 210 can drive the first portion 122 and the second portion 124 to move forward (the linking member 120 is away from the initial position and moves to the first extreme position). The first portion 122 of the linking member 120 can drive the pivoting member 140 to rotate relative to the pivoting portion 112 of the first supporting plate 110. One end of the pivoting member 140 is pivoted to the pivoting portion 112 of the first supporting plate 110, the other end of the pivoting member 140 is connected to the spout 130 and the first portion 122 of the linking member 120, and the first portion 122 of the linking member 120 is close to the pivoting portion 112 of the first supporting plate 110.

When the first portion 122 of the linking member 120 drives the pivoting member 140 to rotate relative to the pivoting portion 112 of the first supporting plate 110, the spout 130 that is disposed between the first portion 122 and the second portion 124 of the linking member 120 can move forward along with the first portion 122 and the second portion 124, allowing the nozzle 132 of the spout 130 to face rightward. The nozzle 132 that faces rightward allows the nozzle 132 of the spout 130 to have a first predetermined spraying direction D4, and a first included angle θ1 between the initial spraying direction D3 and the first predetermined spraying direction D4 is smaller than 30 degrees. The forward-moving linking member 120 moves to the first extreme position relative to the initial position. The electroplating fluid L can enter into the spout 130 from the opening 134 of the spout 130 (as shown in FIG. 3), allowing the nozzle 132 of the spout 130 to spray out the electroplating fluid L rightward, so as to disturb the electroplating fluid L in the electroplating fluid disturbance device 100. The electroplating fluid L can enter into the spout 130 from the opening 134 of the spout 130 by, but not limited to, an external pump. The electroplating fluid L can be sprayed out from the nozzle 132 to disturb the electroplating fluid L outside the spout 130, so as to distribute the metal ions in the electroplating fluid L uniformly. In FIG. 6, the nozzle 132 sprays out the electroplating fluid L rightward in an oblique direction, which can increase the disturbance area of the nozzle 132. Therefore, the metal ions in the electroplating fluid L can be sprayed onto the dead angles on the right side of the circuit board W that cannot be sprayed onto easily.

Next, after the nozzle 132 sprays out the electroplating fluid L rightward (the first predetermined spraying direction D4), the actuating element 220 can pull back the push rod 210, allowing the third portion 126 of the linking member 120 connecting the push rod 210 to drive the first portion 122 and the second portion 124 to move backward (the linking member 120 is away from the first extreme position and moves to the second extreme position). The first portion 122 of the linking member 120 can drive the pivoting member 140 to rotate relative to the pivoting portion 112 of the first supporting plate 110. When the first portion 122 of the linking member 120 drives the pivoting member 140 to rotate relative to the pivoting portion 112 of the first supporting plate 110, the spout 130 that is disposed between the first portion 122 and the second portion 124 of the linking member 120 can move backward along with the first portion 122 and the second portion 124, allowing the nozzle 132 of the spout 130 to face leftward. The leftward-facing nozzle 132 allows the nozzle 132 of the spout 130 to have a second predetermined spraying direction D5 opposite to the first predetermined spraying direction D4, and a second include angle θ2 between the initial spraying direction D3 and the second predetermined spraying direction D5 is smaller than 30 degrees. The backward-moving linking member 120 passes through the initial position and moves to the second extreme position opposite to the first extreme position. The electroplating fluid L can enter into the spout 130 from the opening 134 of the spout 130 (as shown in FIG. 3), allowing the nozzle 132 of the spout 130 to spray out the electroplating fluid L leftward, so as to disturb the electroplating fluid L in the electroplating fluid disturbance device 100. In FIG. 8, the nozzle 132 sprays out the electroplating fluid L leftward, which can increase the disturbance area of the nozzle 132. Therefore, the metal ions in the electroplating fluid L can be sprayed onto the dead angles on the left side of the circuit board W that cannot be sprayed onto easily.

In some embodiments, the actuating element 220 can push the push rod 210 back and forth, allowing the third portion 126 of the linking member 120 connecting the push rod 210 to drive the first portion 122 and the second portion 124 to move back and forth. Therefore, the spout 130 that is disposed between the first portion 122 and the second portion 124 can move back and forth, allowing the nozzle 132 of the spout 130 to swing back and forth to spray out the electroplating fluid L (toward the initial spraying direction D3, the first predetermined spraying direction D4, and the second predetermined spraying direction D5 in the back-and-forth manner). The electroplating fluid L can be sprayed onto the dead angles on the circuit board W that cannot be sprayed onto easily, allowing the jet plating to cover the circuit board W completely. Therefore, the metal ions in the electroplating fluid L can be distributed uniformly on the circuit board W, thereby improving the electroplating quality of the circuit board W. Furthermore, the time period in which the linking member 120 moves from the initial position to the first extreme position, from the first extreme position to the second extreme position, and from the second extreme position back to the initial position, is between 3 seconds and 5 seconds, e.g. 4 seconds. In other words, it will take about 4 seconds to complete a single round of swinging for the nozzle 132 of the spout 130.

It is of course to be understood that the embodiments described herein is merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.

Claims

1. An electroplating fluid disturbance device, comprising a first supporting plate, which is provided with at least a pivoting portion, wherein the pivoting portion is fixed on the first supporting plate;a linking member, which is provided with a first portion, wherein the first portion is close to the pivoting portion of the first supporting plate;at least a spout, which is disposed on the linking member and is provided with at least a nozzle, wherein the nozzle is configured to be immersed in an electroplating fluid; andat least a pivoting member, a first end of which is pivoted to the pivoting portion of the first supporting plate, and a second end opposite to the first end is connected to the spout and the first portion of the linking member, wherein when the first portion of the linking member moves, the pivoting member rotates relative to the pivoting portion, and the spout moves along with the first portion of the linking member, allowing the nozzle of the spout to disturb the electroplating fluid;wherein the pivoting portion is disposed on a side of the spout away from the nozzle, and when the first portion of the linking member is driven, the pivoting member drives the second end to rotate against the first end, so that the nozzle on the spout swings back-and-forth in a fan shape.

2. The electroplating fluid disturbance device according to claim 1, wherein the nozzle is provided with an initial spraying direction, the nozzle swings to allow the nozzle to have a first predetermined spraying direction, a first included angle between the initial spraying direction and the first predetermined spraying direction is smaller than 30 degrees, the nozzle swings to allow the nozzle to have a second predetermined spraying direction opposite to the first predetermined spraying direction, and a second included angle between the initial spraying direction and the second predetermined spraying direction is smaller than 30 degrees.

3. The electroplating fluid disturbance device according to claim 1, wherein the linking member is provided with an initial position, as well as a first extreme position and a second extreme position opposite to two sides of the initial position, with that the time period in which the linking member moves from the initial position to the first extreme position, from the first extreme position to the second extreme position, and from the second extreme position back to the initial position, is between 3 seconds and 5 seconds.

4. The electroplating fluid disturbance device according to claim 1, wherein the spout is provided with an opening, the opening is configured to draw in the electroplating fluid, the nozzle of the spout is configured to spray out the electroplating fluid, the spout is plural, and the nozzle is plural.

5. The electroplating fluid disturbance device according to claim 1, wherein the number of the pivoting portion is equal to the number of the pivoting member.

6. The electroplating fluid disturbance device according to claim 1, wherein the first supporting plate is provided with a first slide rail, and the first portion of the linking member is disposed in the first slide rail.

7. The electroplating fluid disturbance device according to claim 1, further comprising a second supporting plate which is provided with a second slide rail, wherein the linking member is provided with a second portion and the second portion is disposed in the second slide rail, and the spout is disposed between the first portion and the second portion of the linking member.

8. The electroplating fluid disturbance device according to claim 1, wherein the pivoting portion is plural, and the pivoting portion is arranged in a direction parallel to a direction along the length of the first portion of the linking member.

9. An electroplating tank device, comprising the electroplating fluid disturbance device described in claim 1; anda push rod, which is extended into the electroplating fluid disturbance device, wherein the linking member is provided with a second portion and a third portion and the third portion is connected to one end of the push rod, and the third portion of the linking member is disposed between the first portion and the second portion of the linking member.

10. The electroplating tank device according to claim 9, further comprising an actuating element, which is disposed outside the electroplating fluid disturbance device and is connected to the other end of the push rod.

11. An operating method of the electroplating fluid disturbance device, comprising the steps of: a) immersing a nozzle of a spout in an electroplating fluid;b) moving a first portion of a linking member, allowing a pivoting member to rotate relative to a pivoting portion of a first supporting plate, wherein the pivoting portion is fixed on the first supporting plate, a first end of the pivoting member is pivoted to the pivoting portion of the first supporting plate, a second end which is opposite to the first end is connected to the spout and the first portion of the linking member, and the first portion of the linking member is close to the pivoting portion of the first supporting plate; andc) when the pivoting member rotates relative to the pivoting portion, the spout moving along with the first portion of the linking member, allowing the nozzle of the spout to swing to disturb the electroplating fluid, wherein the pivoting portion is disposed on a side of the spout away from the nozzle, and when the first portion of the linking member is drive, the pivoting member drives the second end to rotate against the first end, so that the nozzle on the spout, being immersed in the electroplating fluid, swings back-and-forth in a fan shape.

12. The operating method of the electroplating fluid disturbance device according to claim 11, wherein, at least of the nozzle of the spout spraying out the electroplating fluid, wherein the electroplating fluid enters into at least of the spout from an opening of the spout.

13. The operating method of the electroplating fluid disturbance device according to claim 11, wherein the spout moves along with the first portion of the linking member to allow the nozzle to have an initial spraying direction; the nozzle swings to allow the nozzle to have a first predetermined spraying direction, a first included angle between the initial spraying direction and the first predetermined spraying direction is smaller than 30 degrees, the nozzle swings to allow the nozzle to have a second predetermined spraying direction opposite to the first predetermined spraying direction, and a second included angle between the initial spraying direction and the second predetermined spraying direction is smaller than 30 degrees.

14. The operating method of the electroplating fluid disturbance device according to claim 11, wherein the nozzle moves along with the first portion of the linking member to allow the linking member to have an initial position as well as a first extreme position and a second extreme position opposite to the initial position, and the time period in which the linking member moves from the initial position to the first extreme position, from the first extreme position to the second extreme position, and from the second extreme position back to the initial position, is between 3 seconds and 5 seconds.