Patent Application
20190214381
The present disclosure relates to an electrostatic discharge (ESD) clamp and, more particularly, to an ESD clamp with reduced off-state power consumption.
Electrostatic discharge (ESD) is the transfer of electrostatic charge between bodies at different electrostatic potentials (voltages). As is known, an ESD event can destroy and seriously impair IC devices, e.g., circuits used in handheld devices such as cellular telephones.
ESD protection devices are often built into IC devices in order to protect the various electronic components with the IC device. Providing ESD protection devices in handheld devices, e.g., cellular telephones, powered by battery are particularly challenging since these devices have to meet stringent power requirements.
RC-triggered power clamps (RC-Clamp) are typically used for ESD protection devices, particularly in handheld devices, e.g., cellular telephones. However, such clamps are large in size and also have high DC leakage, e.g., resulting in a gradual loss of energy. In handheld devices, e.g., cellular telephones, leakage can be problematic as it can drain the battery, amongst other problems.
In an aspect of the disclosure, a structure comprises: one or more inverters connected to a timing circuit; a first transistor receiving an output signal from a last of the one or more inverters and an output signal from the timing circuit; a second transistor with its gate connected to the first transistor, in series; and a voltage node providing a separate voltage to a gate of the second transistor.
In an aspect of the disclosure, a structure comprises: a plurality of inverters which turn “ON” a transistor to protect a circuit during an electrostatic discharge (ESD) event; a second transistor which blocks a signal from the plurality of inverters to the transistor during normal circuit operations; and a negative voltage source which provides a negative voltage to the transistor to reduce leakage during the normal circuit operations.
In an aspect of the disclosure, a method comprises: turning “ON” a first transistor and a second transistor to protect a circuit during an ESD event; turning “OFF” the first transistor to block a signal to the second transistor from a plurality of inverters during normal circuit operations; and providing a negative voltage to the second transistor during the normal circuit operations to reduce leakage current.
The present disclosure is described in the detailed description which follows, in reference to the noted plurality of drawings by way of non-limiting examples of exemplary embodiments of the present disclosure.
The present disclosure relates to an electrostatic discharge (ESD) clamp and, more particularly, to an ESD clamp with reduced off-state power consumption. More specifically, the present disclosure provides an RC-triggered power clamp used for ESD protection devices. Advantageously, by implementing the ESD devices described herein, it is possible to have reduced RC-clamp leakage on a system level while still achieving adequate ESD protection (as in conventional ESD devices).
In embodiments, the ESD circuit described herein includes a plurality of inverters, where the last of the plurality of inverters is connected to a gate of a FET (p-type FET). The p-type FET is connected, in series, to the gate of the ESD clamp (also referred to as the “bigFET”), as well as a timing circuit. In addition, the ESD clamp is connected through a resistor to a negative voltage node. A multiplicity of clamps can share the same negative voltage node. During operation, a negative voltage at the system level (as provided by the negative voltage node) will be used to reduce the leakage.
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The inverters 16a, 16b, 16c each include a pair of FETS, in series. In particular, the plurality of FETs includes a p-type FET and a n-type FET, connected to Vdd and Vss. In a more specific example, the inverter 16a includes p-type FET, TP1, and n-type FET, TN1, inverter 16b includes p-type FET, TP2, and n-type FET, TN2, and inverter 16c includes p-type FET, TP3, and n-type FET TN3. In this way, the output of inverter 16a is fed as an input into the inverter 16b and, similarly, the output of the inverter 16b is fed as an input into the inverter 16c. Each of the inverters 16a, 16b, 16c are also connected to ground, GND and are gated between Vdd and Vss
The ESD clamp 10 further includes a FET, TP0, e.g., p-type FET, in series with the trigger circuit 14, e.g., inverters 16a, 16b, 16c. In embodiments, the trigger circuit 14 generates a trigger pulse which is directly connected to the FET TP0. In embodiments, during an ESD event, for example, the FET TP0 is “ON” and the trigger pulse will drive ESD clamp TN0, e.g., n- type FET.
The ESD clamp TN0 is connected to GND and also a negative voltage source, Vgate. The negative voltage source, Vgate, is connected to the ESD clamp TN0 via a resistor R0. It should be understood that the negative voltage source, Vgate, can be connected to a multiplicity of clamps, i.e., sharing the same negative voltage node. During operation, the negative voltage at the system level will be used to reduce the leakage of the ESD clamp TN0 as described in detail herein.
In operation and under normal conditions (e.g., when there is no ESD event), the output of the RC timing circuit 12 is charged high, e.g., “1” from Vdd. The output signal “1” is provided as an input to the first inverter 16a, e.g., p-type, FET TP1, and the FET TP0. The input signal “1”' will turn OFF the p-type FET TP1, disconnecting the clamp, e.g., FET TN0, from the trigger circuit 14. In addition, in the first inverter 16a, the FET TP0 will be turned OFF and the FET TN1 will be turned ON resulting in a low output signal “0” of the first inventor 16a. The low output signal “0” of the first inventor 16a is fed into the second inverter 16b. With this understanding and as should be understood by those of skill in the art, during normal conditions, the second inverter 16b will have a high output signal “1” which will be the input to the third inverter 16c. In turn, the third inverter 16c will have a low output signal “0”, which is the opposite of the output of the RC timing circuit 12. The FET TP0 will be “OFF, blocking any signals from the inverter 16c. The ESD clamp TN0, e.g., n-type FET, will be OFF and a negative voltage will applied by the negative voltage source, Vgate. The negative voltage will, in turn, reduce the leakage of the ESD clamp TN0.
During an ESD event, the capacitor C1 of the RC timing circuit 12 will not have time to charge, resulting in a low output signal “0”. This output signal “0” is fed into the first inverter 16a and the FET TP0. The low signal output “0” will turn ON the FET TP0 and connect the ESD clamp TN0, e.g., FET, to the trigger circuit 14. Also, the output of the inverter 16b will be a high signal “1”, which is fed into the second inverter 16b. The output signal of the second inverter 16b will be a low signal “0”, fed as an input into the third inverter 16c. In turn, the output of the third inverter is a high signal “1” which will turn ON the ESD clamp TN0, e.g., FET, to discharge the ESD event.
The ESD clamp of the present disclosure can be manufactured in a number of ways using a number of different tools. In general, though, the methodologies and tools are used to form structures with dimensions in the micrometer and nanometer scale. The methodologies, i.e., technologies, employed to manufacture the ESD clamp of the present disclosure have been adopted from integrated circuit (IC) technology. For example, the structures are built on wafers and are realized in films of material patterned by photolithographic processes on the top of a wafer. In particular, the fabrication of the ESD clamp uses three basic building blocks: (i) deposition of thin films of material on a substrate, (ii) applying a patterned mask on top of the films by photolithographic imaging, and (iii) etching the films selectively to the mask.
The method(s) as described above is used in the fabrication of integrated circuit chips. The resulting integrated circuit chips can be distributed by the fabricator in raw wafer form (that is, as a single wafer that has multiple unpackaged chips), as a bare die, or in a packaged form. In the latter case the chip is mounted in a single chip package (such as a plastic carrier, with leads that are affixed to a motherboard or other higher level carrier) or in a multichip package (such as a ceramic carrier that has either or both surface interconnections or buried interconnections). In any case the chip is then integrated with other chips, discrete circuit elements, and/or other signal processing devices as part of either (a) an intermediate product, such as a motherboard, or (b) an end product. The end product can be any product that includes integrated circuit chips, ranging from toys and other low-end applications to advanced computer products having a display, a keyboard or other input device, and a central processor.
The descriptions of the various embodiments of the present disclosure have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
